(US4567598-A)      A metallic stud provides an electrical connection to one of the device electrodes. A heat sink mounting block for the device is electrically connected to the stud. The device is mounted on the block so that the optical axis of the device is aligned with the stud axis. The block has a annular bottom coaxial with the stud axis so that thermal stress generated between the stud and the block will be balanced and deviation of the optical axis of the device will be minimised.    A gap can be provided in the annular bottom to accommodate an electrical lead to which the other of the device electrodes is connected. Alternatively, the annular bottom is continuous and the electrical lead passes through the central passage provided in the stud. (7pp)R    (EP87167-B)      An optoelectronic semiconductor device package comprising: an optoelectronic semiconductor device having a pair of electrodes; a stud for providing electric connection to one electrode of said optoelectronic semiconductor device; a lead penetrating said stud for providing electric connection to the other electrode of said device; an insulating means for electrically insulating said lead from said stud, said insulating means maintaining hermetic sealing for said lead and stud; a mounting block having a higher thermal conductivity than that of said stud, comprising an annular bottom secured to and electrically connected to said stud and a protruding portion extending from said annular bottom toward opposite side of said stud, said protruding portion being positioned to electrically and thermally attach said optoelectronic semiconductor device to provide light propagation to or from said device in a direction substantially in parallel with the axis of said stud, said annular bottom having inner and outer edges substantially coaxial to said stud; and a cap with a window substantially transparent to light directed to or from said device, said cap being secured to said stud to form a sealed enclosure for said device. (9pp)