(US5265670-A)      The system for convective transfer from a workpiece to a flowing fluid has a gap formed between the workpiece and a facesheet contg fluid supply nozzles and fluid return nozzles. A manifold coupled to the facesheet for guiding fluid to and from the nozzles is disposed in close proximity to the coldsheet so that a gap is formed between facesheet and coldsheet.    The fluid fed to the supply nozzles, travels a short distance within the gap adjacent to the facesheet, and exits via return nozzles. The flow cross section and flow density facilitate heat transfer at a moderate flow rate and low fluid pressure.    USE/ADVANTAGE -   For intense heat transfer using coldsheet with simpler structure, simpler fabrication and wider choice of materials. Intense heat transfer can be achieved over a large coldsheet area with low fluid pressure and low fluid flow. Applicable for chemical transfer such as plating or etching PCB and for transfer through a semi-permeable membrane, and to processes which involve forced convection, like indirect cooling of IC chips by thermal conduction.    (US5310440-A)      The system includes a fluid which chemically reacts with the workpiece, supply nozzles, return nozzles, a facesheet coupled to the supply and the return nozzles and disposed opposite the workpiece for forming a gap through which the fluid flows.    Material is added to the workpiece from the fluid flowing through the supply nozzles, the gap and the return nozzles.    USE/ADVANTAGE -   For fabricating pattern on printed circuit board eg plating or etching. Achieves intense heat transfer using simple structure, simple fabrication, and wide choice of materials, and when using low fluid pressure, and providing uniform transfer over large coldsheet area.    (JP3097144-B2)      A connection type heat transfer system comprises fluid supply nozzles (18) and fluid return nozzles (20) coupled to a facesheet and the workpiece (10) allowing the flow of fluid along a short distance between adjacent supply and return nozzles by the action of pumps and conduits.    The cold fluid supplied absorbs heat from the workpiece and warm fluid is returned to a supply tank. The spacing of the nozzles minimises the length of contact with the coldsheet to maximise heat transfer.    USE/ADVANTAGE -   Applicable to chemical transfers such as plating or etching PCB's, for transfer through semi-permeable membranes and in desalination plants, kidney dialysis machine and electrochemical fuel cell. Uses low fluid pressure and flow to achieve intense heat transfer over large surface area.