(FR2687845-A1)      Prodn. of a linear wiring having a linear strength of less than 100 microns and a specific resistance of 10-6 ohm.cm on a substrate or base comprises maintaining a metal of low melting pt. in its molten state, conveying the molten metal (1) by capillary to a point of a signal head (3) arranged near to the substrate (4) or touches the base (4), applying the metal to the base/substrate, whilst moving the head (3), and cooling and solidifying the linear wiring.    Also claimed are: (i) appts. for prodn. of the wiring; and (ii) solar cell contg. the wiring.    ADVANTAGE -   Prodn. yield is significantly improved.    (US5328520-A)      Linear pattern, less than 100 mu wide and with resistivity of the order of 10 power(-6) ohm.cm, is formed by applying low m.pt. metal, e.g. In (1), through a drawing head (3), connected to the storage tank (2) by capillary grooves (7,8), which is contacted with the substrate (4) to apply the linear pattern. The method is carried out under a cover (6), into which inert gas is supplied (5). The pattern forms an electrode for a solar cell with microcrystalline or amorphous Si active layer.    ADVANTAGE -   Simple method, increasing effective power generation area.    (US5389573-A)      Narrow electrically conductive patterns are formed on a substrate using a capillary tip to deposit a line of melt less than 100 microns wide onto a substrate. A second capillary tip is used to deliver a second line of melt, with a lower m.pt. than the first metal. The second line(s) intersecting the first line(s) pref. In-Sn (alloys), In-Pb or In is used opt. contg. Ag, Au, Cu or Pt metal powder.    USE/ADVANTAGE -   Forming connecting structures esp. for solar cells. Large areas can be covered with low resistance conductors.    (DE4304858-C2)      Prodn. of a linear wiring having a linear strength of less than 100 microns and a specific resistance of 10-6 ohm.cm on a substrate or base comprises maintaining a metal of low melting pt. in its molten state, conveying the molten metal (1) by capillary to a point of a signal head (3) arranged near to the substrate (4) or touches the base (4), applying the metal to the base/substrate, whilst moving the head (3), and cooling and solidifying the linear wiring.    Also claimed are: (i) appts. for prodn. of the wiring; and (ii) solar cell contg. the wiring.    ADVANTAGE -   Prodn. yield is significantly improved.