(JP8041625-A)      The metal body comprises: (a) at least one vapour-deposited treatment layer overlying and adhered to at least one side of the metal body; and (b) a layer of adhesion-promoting material suitable for enhancing adhesion between the body and another substrate, overlying and adhered to at least one treatment layer; provided that when two treatment layers are deposited on one side of the body and the first layer is vapour-deposited Zn, the second layer is not vapour-deposited silica or alumina.    Also claimed are: (i) electro-deposited or wrought Cu foils; (ii) a metal body having at least one side which has been chemically or physically treated to etch the side or to deposit a metal coating electrochemically; (iii) a laminate; (iv) an etched laminate; and (v) a multi-layer etched laminate.    USE -   The metal bodies, e.g. Cu foils are useful in the mfr. of e.g. batteries, EMI/RFI shielding gaskets and panels, and printed circuit boards (PCBs) used as substrate in the mfr. of electronic devices, e.g. radios, televisions and computers. The treated Cu foils are useful for the prodn. of PCBs by lamination of prepreg and foil webs.    ADVANTAGE -   Metallic bodies are obtd. which maintain, e.g. a bright Cu tone during long storage and throughout lamination under heat and pressure, while retaining solderability and/or solder wettability. Because improved adhesion, which does not rely on surface roughening of the metal foil (claimed), is obtd., problems of poor PCB performance resulting from surface roughening procedures used in prior art to enhance adhesion can be avoided. PCBs prepd. using the above Cu foils allow for hotter and faster processing, give enhanced oxidn. resistance and acid undercutting resistance and more than double initial peel strength.    (US5709957-A)      The metal body comprises: (a) at least one vapour-deposited treatment layer overlying and adhered to at least one side of the metal body; and (b) a layer of adhesion-promoting material suitable for enhancing adhesion between the body and another substrate, overlying and adhered to at least one treatment layer; provided that when two treatment layers are deposited on one side of the body and the first layer is vapour-deposited Zn, the second layer is not vapour-deposited silica or alumina.    Also claimed are: (i) electro-deposited or wrought Cu foils; (ii) a metal body having at least one side which has been chemically or physically treated to etch the side or to deposit a metal coating electrochemically; (iii) a laminate; (iv) an etched laminate; and (v) a multi-layer etched laminate.    USE -   The metal bodies, e.g. Cu foils are useful in the mfr. of e.g. batteries, EMI/RFI shielding gaskets and panels, and printed circuit boards (PCBs) used as substrate in the mfr. of electronic devices, e.g. radios, televisions and computers. The treated Cu foils are useful for the prodn. of PCBs by lamination of prepreg and foil webs.    ADVANTAGE -   Metallic bodies are obtd. which maintain, e.g. a bright Cu tone during long storage and throughout lamination under heat and pressure, while retaining solderability and/or solder wettability. Because improved adhesion, which does not rely on surface roughening of the metal foil (claimed), is obtd., problems of poor PCB performance resulting from surface roughening procedures used in prior art to enhance adhesion can be avoided. PCBs prepd. using the above Cu foils allow for hotter and faster processing, give enhanced oxidn. resistance and acid undercutting resistance and more than double initial peel strength.    (US6248401-B1)      The metal body comprises: (a) at least one vapour-deposited treatment layer overlying and adhered to at least one side of the metal body; and (b) a layer of adhesion-promoting material suitable for enhancing adhesion between the body and another substrate, overlying and adhered to at least one treatment layer; provided that when two treatment layers are deposited on one side of the body and the first layer is vapour-deposited Zn, the second layer is not vapour-deposited silica or alumina.    Also claimed are: (i) electro-deposited or wrought Cu foils; (ii) a metal body having at least one side which has been chemically or physically treated to etch the side or to deposit a metal coating electrochemically; (iii) a laminate; (iv) an etched laminate; and (v) a multi-layer etched laminate.    USE -   The metal bodies, e.g. Cu foils are useful in the mfr. of e.g. batteries, EMI/RFI shielding gaskets and panels, and printed circuit boards (PCBs) used as substrate in the mfr. of electronic devices, e.g. radios, televisions and computers. The treated Cu foils are useful for the prodn. of PCBs by lamination of prepreg and foil webs.    ADVANTAGE -   Metallic bodies are obtd. which maintain, e.g. a bright Cu tone during long storage and throughout lamination under heat and pressure, while retaining solderability and/or solder wettability. Because improved adhesion, which does not rely on surface roughening of the metal foil (claimed), is obtd., problems of poor PCB performance resulting from surface roughening procedures used in prior art to enhance adhesion can be avoided. PCBs prepd. using the above Cu foils allow for hotter and faster processing, give enhanced oxidn. resistance and acid undercutting resistance and more than double initial peel strength.