TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The filler is electrically and thermally conductive, preferably in form of natural graphite flake or synthetic graphite, and low viscosity thermosetting binder resin system comprises epoxy vinyl ester resin system; or low molecular weight phenolic resin and, optionally, an amine curing agent; or a combination of low viscosity epoxy resin A and a low molecular weight phenolic resin curing agent B, at stoichiometric ratio of the latter to the former as 60-110%. The composition may further contain (wt.%) a suitable catalyst system (0.001-3), an internal release agent (0.001-2), and binder resin system solvent (0.001-15), and it substantially cures in no more than 60 seconds at suitable curing conditions.Low viscosity epoxy resin A is selected from solid or liquid forms of epoxidised and non-epoxidised phenolic and cresolic novolak-based resins, bi-phenyl-based epoxy resin, dicyclopentadiene-based epoxy resins, bis F-type epoxy resins, bis -A type epoxy resin, and their combinations, it has viscosity preferably 1400-50000 centipoise at 52degreesC, and epoxy equivalent weight (EEW) 165-250. Low molecular weight phenolic resin curing agent B preferably has softening point 60-90degreesC, molecular weight less than 600, and hydroxy equivalent weight (HEW) 95-115. Alternatively, epoxy resin A can be a mixture of bis -F type epoxy resins, each having EEW 172-181, while phenolic resin curing agent B has HEW 103-107, and is used at stoichiometric ratio to epoxy resin A equal 70%.Preferred Catalyst: The catalyst system includes 0.001-5 wt.% of urea-based catalyst, preferably diuron, and 0.001-0.5 wt.% of imidazole-based catalyst, preferably 2-phenyl-4-methyl imidazole. Preparation: Molding composition is made by mixing low viscosity thermosetting binder resin system and a filler, under conditions selected in such way as to preserve the integrity of the filler and ensure wetting-out of the conductive filler with the binder resin system.    TECHNOLOGY FOCUS - ELECTRICAL POWER AND ENERGY - Preferred Method: Electrically and thermally conductive structure is made of thermosetting molding composition as claimed by molding the composition into desired shape and subjecting to curing under suitable conditions, with the time of curing preferably no more than 60 seconds. Preferred Product: The structure comprises at least one thin wall section having a thickness 0.012-0.200 inches, a strength sufficient to avoid cracking under flexural stress up to 2500 psi, an electrical resistivity 0.0001-0.01 Ohm cm, and thermal conductivity at least 3 (W/m) K. EXAMPLE - Thermosetting molding composition was made by adding low viscosity epoxy resin (DEN 431TM) to mixing bowl of Hobart Mixer Model No. A200, setting the mixer to operate at speed setting 3, adding slowly low molecular weight phenolic resin (HRJ-1166), dissolved in binder resin system solvent (acetone), and adding slowly, one at a time, a first internal release agent (Carnuba wax), a urea-based catalyst (diuron), and a second internal release agent (zinc stearate). Obtained mixture, providing complete low viscosity thermosetting binder resin system, was removed from mixer and set aside, while a specified conductive filler (e.g. natural graphite flake) was added to mixer bowl. This was followed by adding slowly previously prepared thermosetting binder resin to the conductive filler in the mixer, and mixing until the conductive filler was wetted out by the binder resin system (e.g. 3 minutes for 2500 g batch size). Obtained wet thermosetting molding composition was tray-dried (e.g. oven dried) at 180degreesF until such time as the binder solvent level (acetone) was below 3 wt.% as measured by volatile loss of a sample of the molding composition when heated to 325degreesF for 20 minutes. The composition contained (in wt.%): DEN 431TM liquid epoxy resin (13.08 +/- 2), HRJ 1166 phenolic novolak (3.41 +/-1), Carnuba wax (0.51 +/- 0.1), diuron (0.51+/-0.1), zinc stearate (0.34 +/- 0.1), acetone (carrier/diluent solvent) (8.68 +/- 0.5), and natural flake graphite (73.06 (-5 to +15)).