TECHNOLOGY FOCUS - POLYMERS - Preferred process: The electric field is applied to the encapsulant resin member by:(i) charging a surface thereof, or(ii) stacking an organic polymer resin member subjected to corona discharge or plasma discharge treatment on a surface thereof.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred materials: In (a), the additive is a silane coupling agent and its concentration is higher on the side of the organic polymer resin member in contact with the front surface member or the photovoltaic element, or the additive is an ultraviolet absorbing agent and its concentration is higher on the light-incidence side of the encapsulant resin member. In (b), the additive is a silane coupling agent or an ultraviolet absorbing agent and its concentration is higher on the light-incidence side of the encapsulated resin member. In (c) and (d), the semiconductor element is a photovoltaic element. The additive is a silane coupling agent and/or an ultraviolet absorbing agent, or an adhesive. The additive concentration may be higher either near to or remote from the semiconductor element. EXAMPLE - A back surface encapsulant resin (integral laminate of 230 micron EVA/100 micron PET/230 micron EVA), a photovoltaic element (amorphous silicon semiconductor), a front surface encapsulant resin (460 micron EVA), a front surface protecting/reinforcing material (glass fibre non woven fabric of basis weight 40 g/m2 prepared by bonding glass fibres of diameter 10 micron and length 13 mm with an acrylic binder, and a front surface member (50 micron ethylene-tetrafluoroethylene copolymer) (ETFE) were stacked in order on a back surface member comprising a GALVALUME (TM: 55% aluminium-zinc alloy coated steel sheet) with a 0.4 mm polyester coating. The EVA used was obtained by blending 1.5 pts.wt. 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane crosslinking agent, 0.5 pts.wt. gamma-(2-aminoethyl)aminopropyltrimethoxysilane silane coupling agent, 0.15 pts.wt. 2-hydroxy-4-n-octoxybenzophenone ultraviolet absorbing agent, 0.1 pts.wt. bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate light stabilizer and 0.2 pts.wt. tris(mono-nonylphenyl) phosphite oxidation inhibitor with 100 pts.wt. EVA resin (vinyl acetate content 33 wt.%). The ETFE was subjected to plasma discharge treatment on the adhesive surface side to increase adhesion to the EVA. The stack was placed with the ETFE film side up on the plate (301) of a laminating apparatus as in the figure. a silicone rubber sheet (302) and a plate-like electrode (307) being laid thereon. Evacuation to 700 Pa was conducted for 5 min. The plate (301) was heated to 140 degreesC by a heater (303) buried in the plate and the temperature maintained for 15 min., resulting in melting and crosslinking of the EVA. During heating an electric field of 3 kV/mm was applied between the electrode (307) and the plate (301). The plate was then cooled to 40 degreesC by a cooling fan, evacuation stopped, and the solar cell module removed. The solar cell module had good appearance without bubbles, and exhibited good adhesion between the EVA and the back surface member and good weather resistance.