SEMICONDUCTORS - Preferred Material: The low melting point material is phosphorus, sulfur, bismuth, indium, lead, tin, selenium, gallium, cadmium and/or zinc. The material with high melting point is silver, arsenic, gold, aluminum, copper antimony, silicon, tellurium, nickel, zinc, iron, germanium, molybdenum, manganese, cobalt, magnesium, titanium, tungsten, cuprous and cupric sulfide, bismuth tellurium (Bi2Te3), bismuth selenium (Bi2Se3) and/or lead tellurium (PbTe). Preferred Condition: At least one of the finely divided particles has melting point greater than 300 degrees C. Preferred Size: The particle size of the finely divided particles is 1 microns - 1 mm. The particle size of dopant powder is 1-100 microns. Preferred Additive: The binder system comprises solvent(s) , fluxing agent or polymer resin system. Preferred Solvent: The solvent is ketone, alcohol, glycol, aromatic ester or ether. Preferred Resin: The polymer resin is epoxy, phenolic, novolak, polyurethane, polyimide, bismaleimide, maleimide, cyanate ester, polyester, polyvinyl alcohol or polyurea. Preferred Dopant: The dopant is silver sulfide or antimony iodide. Preferred Composition: The amount of low melting point of material is 5-100 wt. %, high melting point material is 0-85 wt. %, binder system 0-85 , and dopant 0.10 wt. % Preferred Method: The composition is applied to a substrate and subjected to pressing, molding, screen printing, stencil printing, pressure filling, dispensing, electrostatic transfer or doctor blading. Pattern is formed on the insulator layer by photo imaging and a subsequently developing by plasma etching, sand blasting, laser drilling, chemical etching or mechanical drilling. A patternable insulator layer and thermoelectric paste is deposited by laminating screen printing, curtain coating, doctor blading, spraying, spin coating, roller coating, extrusion or stencil printing. A conductive traces is fabricated on an insulating plane to form first trace containing layer on which layer of thermoelectric element is formed. Preferred Paste: The thermoelectric paste is polymer thick film or ceramic thick film paste. The ceramic paste comprises ceramic thermoelectric material or precursor suitable solvent and optional organic binder, glass frit. The copolymer thick film paste comprises thermoelectric material or precursor, polymeric binder and optional solvent. Preferred Insulator: The insulator is photopatternable epoxies, epoxy acrylates, polyimide resin, epoxy resins, thermoplastics, methacrylates, cyclic hydrocarbons and phenolic resiEXAMPLE - (In weight percentage) The thermoelectric composition formed by mixing low melting point powders such as selenium (28), bismuth tin (BiSn) (56), were dispersed in organic binder (16) which comprised epoxy resin (18.9), protected curing agent (54.2), solvent (25.2) and rheolgoical modifier (1.7) to form a paste. The paste was deposited on an epoxy glass substrate with doctor blading and dried at 120 degrees C for 15 minutes and cured at 215 degrees C for 15 minutes in vapor phase condensation to form thermoelectric material which had See back Coefficient of +20 and resistivity of 0.5 ohm.cm