TECHNOLOGY FOCUS - POLYMERS - Preferred Rheological Modifier: The composition contains 0.5-15 wt.%, preferably 2-8 wt.% of a rheological modifier (RM). When RM comprises magnesium oxide and/or calcium oxide, composition contains 0.1-2 wt.% or 0.5-20 phr of RM. When RM contains one or more of aziridine, carbodiamide and polyisocyanate, the composition contains 1-10 wt.% or 0.5-20 phr of RM. When RM contains polytetrafluoroethylene and/or perfluoropolyether, composition contains 0.1-5 wt.% or 0.5-20 phr of RM. When RM is polyisocyanate, composition contains 2-8 wt.% or 0.5-20 phr of RM.The RM is contained in an amount effective to prevent cracking of the product molded at pressure of 400-2000 psi and to a thickness of 0.05-0.2 inches.Preferred Prepolymer Resin: The unsaturated prepolymer resin is one or more resins chosen from the group of epoxy vinyl resin, bisphenol fumarate resin, modified bisphenol fumarate polyester resin, unsaturated polyester resin, urethane modified vinyl ester resin, bisphenol-epoxy vinyl ester resin, elastomer-modified vinyl ester resin, epoxy novolac vinyl ester resin and unsaturated isocyanurate vinyl ester resin.Preferred Copolymerizable Monomer: The copolymerizable monomer is preferably styrene or methyl methacrylate.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Filler: The composition contains 60 wt.% or at least 250 phr of conductive filler when it is a particulate or flake filler or composition contains 65 wt.% or at least 275 phr of the conductive filler when it is a synthetic crystalline graphite particle. The conductive composition further comprises carbon black and reinforcing filler.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Initiator: The composition contains 0.05-20 phr of an initiator chosen from peroxide, hydroperoxide, redox systems, diazo compounds, persulfates and perbenzoate.    TECHNOLOGY FOCUS - MECHANICAL ENGINEERING - Preferred Method: The conductive composition is molded by compression or injection molding. EXAMPLE - A conductive molding composition was prepared by adding 15.63 g of an unsaturated polyester resin diluted to 55 wt.% solids with styrene, 0.4 g of Triginox BPIC (RTM: t-butyl peroxy isopropyl carbonate), 0.1 g of inhibitor, 1.2 g of mold release, 78 g of synthetic crystalline graphite and 4.67 g of modifier polyisocyanate (rheological modifier) to high shear cowels disperser and blending for 2 minutes. A conductive filler was added to the mixture in a Baker Perkin Mixer and mixed for 15 min. On completion of mixing the composition was placed in a suitable barrier bag and matured for 1 day before molding. The composition was molded at 290degreesF for 3 min. The molded bipolar plates were found to have bulk conductivity of 90 S/cm, areal conductivity of 260 S/cm2, tensile of 3600 psi, flexural of 4300 psi and resistivity of 87.50 ohms/m2.