(CN1260250-A)   NOVELTY - A method of treating waste printed circuit boards comprises heating up for dry-distilling the waste boards having copper foil retaining solder at 250-500 deg.C, pulverizing the dry-distilled material obtained in the heating step and separating the pulverized material into a board resin component and a metal component.    USE - Treating waste printed circuit boards in an environmentally friendly manner so as to efficiently recover into separate portions the solder and metal components from board resin.    ADVANTAGE - Metal components are separated from waste printed circuit boards where solder contamination into the recovered board resin is surpressed and with harmful substances made harmless before disposal.    (JP2000294919-A)   NOVELTY - A method of treating waste printed circuit boards comprises heating up for dry-distilling the waste boards having copper foil retaining solder at 250-500 deg.C, pulverizing the dry-distilled material obtained in the heating step and separating the pulverized material into a board resin component and a metal component.    USE - Treating waste printed circuit boards in an environmentally friendly manner so as to efficiently recover into separate portions the solder and metal components from board resin.    ADVANTAGE - Metal components are separated from waste printed circuit boards where solder contamination into the recovered board resin is surpressed and with harmful substances made harmless before disposal.    (JP2000301131-A)   NOVELTY - A method of treating waste printed circuit boards comprises heating up for dry-distilling the waste boards having copper foil retaining solder at 250-500 deg.C, pulverizing the dry-distilled material obtained in the heating step and separating the pulverized material into a board resin component and a metal component.    USE - Treating waste printed circuit boards in an environmentally friendly manner so as to efficiently recover into separate portions the solder and metal components from board resin.    ADVANTAGE - Metal components are separated from waste printed circuit boards where solder contamination into the recovered board resin is surpressed and with harmful substances made harmless before disposal.    (JP2001049355-A)   NOVELTY - A method of treating waste printed circuit boards comprises heating up for dry-distilling the waste boards having copper foil retaining solder at 250-500 deg.C, pulverizing the dry-distilled material obtained in the heating step and separating the pulverized material into a board resin component and a metal component.    USE - Treating waste printed circuit boards in an environmentally friendly manner so as to efficiently recover into separate portions the solder and metal components from board resin.    ADVANTAGE - Metal components are separated from waste printed circuit boards where solder contamination into the recovered board resin is surpressed and with harmful substances made harmless before disposal.    (JP2001050518-A)   NOVELTY - A method of treating waste printed circuit boards comprises heating up for dry-distilling the waste boards having copper foil retaining solder at 250-500 deg.C, pulverizing the dry-distilled material obtained in the heating step and separating the pulverized material into a board resin component and a metal component.    USE - Treating waste printed circuit boards in an environmentally friendly manner so as to efficiently recover into separate portions the solder and metal components from board resin.    ADVANTAGE - Metal components are separated from waste printed circuit boards where solder contamination into the recovered board resin is surpressed and with harmful substances made harmless before disposal.