NOVELTY - A copper source precursor for use in the chemical vapor deposition of films comprising copper, contains a mixture of a ligand-stabilized copper (I)beta-diketonate precursor and a copper (II)beta-diketonate precursor.    USE - For use in chemical vapor deposition of copper-based films. The precursors may also be used for coating substrates such as stainless steel, glass, plastic and polymers for applications such as anti-reflective coatings, cosmetic coatings and for coating substrates such as copper alloys for flat panel display and solar cell device applications.    ADVANTAGE - The copper source precursor incorporates both copper atoms from the disproportionation reaction in the growing copper film. The use of the precursor mixture provides copper growth process which is independent of the type of substrate used. The copper source chemistry provides planarized and void-free copper fill of aggressive sub-quarter-micron structures with as-deposited resistivity near the bulk resistivity. It has high volatility, significant vapor pressure, high vaporization and sublimation rate to ensure an industrially acceptable wafer throughput. It is economical to use with respect to synthesis, mass production, disposal and cost of start-up materials. It can be utilized as synthesized without the time and yield loss associated with distillation and doping, thus reducing overall process cost. The copper source is chemically and environmentally stable and allows for extended shelf life and ease in transport and handling.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for chemical vapor deposition of copper-based film on a substrate, comprising:    (a) introducing, into a deposition chamber, (i) a substrate; (ii) copper source precursor in a vapor state, the precursor comprising a ligand-stabilized copper (I)beta-diketonate precursor and copper(II)beta-diketonate precursor; and (iii) transport gas; and    (b) maintaining a reaction substrate temperature of 50-500degreesC for a time sufficient to deposit copper-based film on the substrate.