NOVELTY - Encapsulated microelectronic device (100) comprises: a semiconductor substrate (105); a microelectronic device (110, 115) adjacent to the substrate; and at least one first barrier stack (120) comprising at least one first barrier layer (125) and at least one first polymer layer (130). The first barrier stack is adjacent to and encapsulates the microelectronic device.    USE - Encapsulated microelectronic device e.g., integrated circuit, charged coupled devices, light emitting diodes, light emitting polymers, organic light emitting devices, metal sensor pads, micro-disk lasers, electrochromic devices, photochromic devices, microelectromechanical systems and solar cells (claimed).    ADVANTAGE - The encapsulation process provides improved encapsulation of microelectronic devices on semiconductor substrates. In addition to the improved barrier properties, the chemical resistance, thermal and shock resistance, mechanical robustness, and coating quality are also improved. As a result, the lifetime of the encapsulated microelectronic devices is significantly increased.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following:    (a) an encapsulated microelectronic device comprising: at least one first barrier stack comprising at least one first barrier layer and at least one first polymer layer; a microelectronic device adjacent to the first barrier stack; and at least one second barrier stack comprising at least one second barrier layer and at least one second polymer layer. The first barrier stack and the second barrier stack encapsulate the microelectronic device; and    (b) a method of making an encapsulated microelectronic device comprising: providing a semiconductor substrate having a microelectronic device on it; and placing at least one first barrier stack comprising at least one first barrier layer and at least one first polymer layer on the microelectronic device to encapsulate the device.    DESCRIPTION OF DRAWING(S) - The drawing shows a cross-section of an encapsulated microelectronic device.    Encapsulated microelectronic device (100)    Semiconductor substrate (105)    Microelectronic devices (110, 115)    Barrier stack (120)    First barrier layer (125)    Polymer layer (130)