NOVELTY - A device is encapsulated by positioning a layer of a fluoropolymer material on a layer of an adhesive material having a release liner to form a pair of fluoropolymer laminates; positioning the formed pair of laminates in a laminator apparatus; removing the release liner of each pair of fluoropolymer laminates; and passing the device to be encapsulated through the laminator apparatus.    USE - The method is used for encapsulating a device e.g., solar cell.    ADVANTAGE - The process provides a device, e.g. a solar cell module laminate structure that can be utilized in hostile environments, e.g. space applications. It results in a hermetically sealed solar cell module laminate structure that is flexible and very durable. It provides a high power to weight ratio solar cell arrays which provide protection of the array from adverse environmental conditions. It encapsulates the device without adversely affecting its operation and efficiency while protecting it from adverse environmental conditions.    DETAILED DESCRIPTION - Encapsulation of a device without adversely affecting the operation and efficiency of the device while protecting it from adverse environmental conditions includes forming a pair of fluoropolymer laminates comprising three layers by positioning only a layer of fluoropolymer material (12, 13, 16) on a layer of adhesive material (14, 15) having a release liner on its opposite side; positioning the formed pair of laminates in a laminator apparatus; removing the release liner of each of the pair of fluoropolymer laminates; and passing the device to be encapsulated through the laminator apparatus, such that the adhesive material and the fluoropolymer material of each of the pair of laminates are secured on opposite sides of the device.    DESCRIPTION OF DRAWING(S) - The figure shows a cross-sectional view of a five layer solar array laminate structure.    Solar cells (11)    Layer of a fluoropolymer material (12, 13, 16)    Layer of adhesive material (14, 15)