TECHNOLOGY FOCUS - POLYMERS - Preferred Process: The molding step is an injection and/or compression molding. Preferred Composition: The composition is a molded thermosetting resin composition having an intricate fuel flow pattern molded and having a thickness of 0.05-0.2 inches and a bulk conductivity of at least 55 S/cm. It comprises carbon black, reinforcing fillers, 10-50 (preferably 30-40) wt.% low profile additive, and 0.5-15, preferably 2-8 or 0.1-2 wt.% rheological modifier to prevent phase separation between the resin and conductive filler during molding. It is Group II oxides and hydroxides, carbodiamides, aziridines, isocyanate (preferably), polyisocyanates, polytetrafluoroethylene, perfluoropolyether, polyethylene, and/or fumed silica. It prevents cracking of a part molded at 100-5000 psi and to a thickness of 0.05-2 inches. The unsaturated prepolymer resin is epoxy vinyl resin, bisphenol fumarate resin, modified fumarate bisphenol polyester resin, unsaturated polyester resin, urethane modified vinyl ester resin, bisphenol-epoxy vinylester resin, elastomer-modified vinyl ester resin, epoxy novolac vinyl ester resin, and/or unsaturated isocyanurate vinyl ester resin. The copolymerizable material is monomer(s) from styrene, alpha-methyl styrene, chloro-styrene, vinyl toluene, divinyl benzene, diallylphthalate, and/or methyl methacrylate. The initiator is a free radical initiator. It can be peroxides, hydroperoxides, redox systems, diazo compounds, persulfates, or perbenzoates. It is present at 0.05-5 wt.%. The low profile additive is homopolymers of ethylene, styrene, vinyl toluene, alkyl methacrylates, polyethylene ether, polyphenylene oxide, alkyl acrylates, vinyl chloride, vinyl acetate, acrylonitrile, or butadiene. It can be copolymers of vinyl chloride and vinyl acetate, styrene and acrylonitrile, methyl methacrylate and styrene, methyl methacrylate and acrylamide, or styrene-butadiene-styrene block copolymers. A mold release agent comprising calcium stearate and/or zinc stearate is also included.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Component: The conductive filler is a particulate filler or graphite and is at least 60, preferably at least 65 wt.%. It is a synthetic crystalline graphite particle and/or a crystalline graphite particle. The rheological modifier comprises magnesium oxide, calcium oxide, magnesium hydroxide, and/or calcium hydroxide. EXAMPLE - A compression molded plate was made from a composition comprising a resin 42-2641 (17.13 g), tert-butyl peroxy isopropyl carbonate (0.4 g), 2,6-di-tertbutyl-p-cresol (0.1), mold release agent (1.2), graphite 4012 (75 g), and thickener (6.17). It had glass fibers bulk conductivity (85 S/cm), areal conductivity (260 S/cm), tensile strength (3700 psi), flexural modulus (5500 psi), and resistivity (70.9 ohms/m2).