NOVELTY - Substrate processing, comprising forming layer of material having high surface area to volume ratio of 1-10000, on substrate, and removing portions of formed layer from substrate, is new.    USE - For forming cavity structures used in fabrication of micro-electro-mechanical devices, field emission sources, bolometric structures, accelerometers, light trapping, resonance, field shaping, transmission, acoustic trapping, display micro-mirror formation, biomedical and medical devices, sorting structures for functions such as DNA and proteomic sorting, cell nutrition and/or growth control, capillary functions, gettering regions for solid phase crystallization or silicon on insulator structures, interlayer stress control, optical waveguide and optical device applications, fluid channel for electrical, chemical and electrochemical sensors, chromatography, chemical reactant/product transport, fuel cells, displays, and molecular sorting.    ADVANTAGE - The method enables fabrication of novel materials having high surface to volume and thickness greater than 10 nm, on wide range of substrate such as plastics, glass, insulators, semiconductor containing material, and metal foils. The method allows control of the void size and void fraction of material deposited, without varying void-column network morphology along thickness direction. The method allows deposition of material having uniform pores, at low temperature without any back contact and anodization-based wet processing. The large surface to volume ratio, insures a large empty region between material regions allowing easy access by etching chemicals and easy reaction product removal, uniformly wets material leading to a very uniform attack and removal, and leads to a mechanically weakened material for which mechanical agitation can be helpful in removal or for which gas trapped in this material may be used to enhance removal. The method allows production of a substrate which can be reliably used for sacrificial, release and separation layer applications. The large surface area assures efficient chemical attack of material when exposed for removing chemicals.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following:    (a) transferring system of materials from substrate;    (b) creating cavity structure;    (c) producing at least one contract region between material systems over a substrate;    (d) fabricating chemical transport/chemical catalytic assembly; and    (e) fabricating fuel cells.    DESCRIPTION OF DRAWING(S) - The drawing shows the removal of columnar void layer or sacrificial layer for separating device from substrate.