TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Composition: The copolymerizable material is monomers chosen from styrene, alpha-methyl styrene, chloro-styrene, vinyl toluene, divinyl benzene, diallyl phthalate and methyl methacrylate, preferably styrene or methyl methacrylate. The initiator is a free radical initiator chosen from peroxides, hydroperoxides, redox systems, diazo compounds, persulfates, and perbenzoates, and is present in an amount of 0.05-5 wt.% based on the total weight of the system.Preferred Additives: The composition further comprises a mold release agent containing calcium stearate or zinc stearate. The rheology modifier is an aziridine, carbodiamide or, preferably, isocyanate and is present in an amount of 1-10 wt.%, preferably 2-8 wt.%.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The conductive filler is a particulate filler, preferably (synthetic) crystalline graphite particles in an amount of at least 60 wt.%, preferably 65 wt.%.Preferred Additives: The rheology modifier is a composition(s) chosen from Group II oxides and hydroxides and fumed silica, preferably magnesium oxide, calcium oxide, magnesium hydroxide and/or calcium hydroxide at 0.1-2 wt.%.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The unsaturated prepolymer resin is chosen from epoxy vinyl resin, bisphenol fumarate resin, modified bisphenol fumarate polyester resin, unsaturated polyester resin, urethane modified vinyl ester resin, bisphenol-epoxy vinyl ester resin, elastomer-modified vinyl ester resin, epoxy novolac vinyl ester resin and unsaturated isocyanurate vinyl ester resin. The copolymerizable material is monomers chosen from styrene, alpha-methyl styrene, chloro-styrene, vinyl toluene, divinyl benzene, diallyl phthalate and methyl methacrylate, preferably styrene or methyl methacrylate.Preferred Additives: The composition further comprises a low profile additive chosen from homopolymers of ethylene, styrene, vinyl toluene, alkyl methacrylates, polyethylene ether, polyphenylene oxide and alkyl acrylates, vinyl chloride, vinyl acetate, acrylonitrile and butadiene. The low profile additive is chosen from copolymers of vinyl chloride and vinyl acetate, styrene and acrylonitrile, methyl methacrylate and alkylesters of acrylic acid, methyl methacrylate and styrene, methyl methacrylate and acrylamide, and styrene butadiene styrene block copolymers. The additive is present in 10-50, preferably 30-40 wt.% based on the total weight of the additive and the resin and monomers. The field plate further comprises a rheology modifier to prevent phase separation between the resin and conductive filler during molding. The plate contains 0.5-15% of the rheological modifier by the total weight of the system. The rheological modifier is polyisocyanate, polytetrafluoroethylene, perfluoropolyether or polyethylene, preferably comprising polytetrafluoroethylene and perfluoropolyether and is present in an amount of 0.1-5 wt.%. Rheology modifiers prevents cracking of a portion molded at a pressure of 100-5000 psi and to a thickness of 0.05-0.2 inches.Preferred Construction: The molding is an injection and/or compression molding. EXAMPLE - A composition containing Dion 6694 (in g) (19.95) diluted in styrene to form 55 wt.% of solid was used as modified bisphenol fumarate polyester, tert-butyl peroxyisopropyl carbonate (0.4), 2,6-di-tertbutyl-p-cresol (0.1) as an inhibitor, a mold releasing agent (1.2), Graphite 4012 (78) and a thickener (0.35) was blended for 2 minutes. The composition was matured and molded at 295degreesF for 3 minutes. The plate obtained had a bulk conductivity of 90 S/cm, areal conductivity of 260 S/cm2, tensile strength of 3100 psi, flexural strength of 3500 psi and resistivity of 71.2 OMEGA/m2. The plate obtained had improved surface characteristics.