TECHNOLOGY FOCUS - ELECTRONICS - Preferred Material: The embedded material comprises material(s) from glass scrim, glass beads or insulating mesh.Preferred Component: The photoactive layer comprises photovoltaic device. The photovoltaic device comprises material from cadmium-indium-gallium diselenide device, amorphous silicon, cadmium telluride or thin film silicon.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Component: The substrate comprises conductor from metal, stainless steel, titanium, tantalum, Kovar (RTM: vacuum melted, iron-nickel-cobalt, low expansion alloy ) or molybdenum. The insulator layer comprises silicon dioxide, aluminum nitride, alumina or silicon nitride. The grid comprises conductor, metal, aluminum, silver, titanium, multiple layers, strike layer, conductive layer or protective layer. The strike layer comprises titanium. The grid further includes a bus in triangular shape. The discharge layer comprises material from indium tin oxide, tin oxide, cadmium tin oxide or zinc oxide.Preferred Process: The photoactive layer step comprises thermal evaporation, sputtering or electron beam evaporation. The first insulator layer step comprises chemical vapor deposition, plasma enhanced chemical vapor deposition or sputtering. The manufacture of thin film photovoltaic cells further includes depositing second insulator layer (150), depositing electrostatic discharge layer (160) to grid and second side, providing electrical contact (170) point on substrate, providing spacer on portion of substrate, providing mechanical bond connected to portion of substrate and providing embedded material in mechanical bond. The providing step includes masking portion of photoactive layer, etching unmasked portion, removing unmasked portion and exposing portion of substrate. The masking step includes technique from applying low adhesion tape or applying physical contact mask. The etching step comprises applying solution of hydrochloric acid or bromine or methyl hydroxide.Preferred Dimension: The strike layer has a thickness of 500 Angstrom. The conductive layer has a thickness of 2 microns. The protective layer has a thickness of 500 Angstrom.    TECHNOLOGY FOCUS - POLYMERS - Preferred Component: The substrate comprises conductor from polyimide or Kapton (RTM: polyimide film from pyromellitic anhydride). The insulator layer comprises bonded polyimide. The spacer comprises a polyimide.