NOVELTY - Non-oxide powder comprises at least 40 mass% of several tightly agglomerated composition. The tightly agglomerated composition comprises several tightly agglomerated primary particles having average size of 1-500 nm.    USE - For capacitors, metal matrix composite (both claimed), chemical mechanical planarization for planarizing wafer in integrated circuit and electronic component fabrication, sputtering targets and fuel cells. Metal matrix composite is used in aerospace application (engine components e.g. air frames, casing, compressor blade, fan and turbine discs, landing gears, space structures and stator vanes), thermal management, wear applications, automotive application (such as bearings, break components e.g. disc rotors, connecting rods, cylinder liners, drive shafts, gears, pistons, pump components, rocker arms, valves and wheels), recreational application (such as structural bike component, golf clubs, tennis racquets, skis, fishing poles and exercise equipment), electronic application (such as electronic packages, heat sinks and structural electronic bags), military application (such as armor, avionic electronics, armor penetrators, tank track shoes, torpedo shells, gun barrels, temporary bridges, kinetic energy weapons, ship antennas, and ship propellers), precision machine application (machine tools, motion controls, mirrors, platforms, photolithography machines, and coordinated measuring machines), ship hulls, masts, high energy density batteries and power storage, food chemical sensors, catalytic materials, chemical getters, lubricants, pharmaceuticals, personal care products, coatings, inks and toners. The semiconductors are used in desktop, laptop and palmtop computers, automobile electronics, cellular phones and telecommunication switch boards. The sputtering targets are used for depositing thin films in electronic industries to form magnetic storage, and printer heads, glass and optic industries. The thin films are used as decorative and wear resistant coating. The fuel cells are used for vehicular propulsions and stationary power generation    ADVANTAGE - The tight agglomerate has high surface area and large flowability. The secondary particles encapsulate and protect primary particle, hence the encapsulated agglomerations have high purity.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) a method of producing agglomerated submicron particles, which involves nucleating several primary particles in an environment comprising vaporous secondary material at preset temperature, forming mixture of encapsulated primary particles and un-encapsulated primary particles by condensing secondary material upon a fraction (1/5 or less) of primary particles once at least two of primary particles have grown to a size of 1-500 nm, controlling temperature of environment while encapsulated primary particles scavenge un-encapsulated primary particles, to form encapsulated primary particle cluster comprising co-encapsulated primary particles and co-encapsulated primary particles clusters sinter;    (2) powder comprising primary particles having size of 1-500 nm and secondary material with in which at least some of primary particles are encapsulated;    (3) capacitor-grade powder of which at least 40 mass% is comprised of several tight agglomerates of primary particles. Each agglomerate comprises 20 primary particles having average size of 1-200 nm. At least 60% of primary particles are with in 2.25 dN1/3 nm of at least 60% of its other constituent primary particle, where N represents the number of primary particles in the tightly agglomerated composition and d represents the average size of primary particles in tightly agglomerated composition;    (4) production of metal matrix composite which involves synthesizing discrete primary particles in the presence of vaporous secondary material, with in gaseous environment, thermodynamically controlling the condensation of secondary material to encapsulate a fraction of primary particles once at least 2 of primary particles have grown to 1-500 nm, to form mixture of encapsulated and un-encapsulated primary particles, exposing un-encapsulated primary particles to environment reactive with un-encapsulated primary particles to react with reactive gas to form dispersion particles, exposing encapsulated primary particles and dispersion particles to non-reactive environment, removing secondary material from encapsulated primary particle in non-reactive environment and consolidating primary particles with dispersion to form metal matrix composite; and    (5) metal matrix composite comprising 50 mass% of encapsulated primary particle agglomerates and remaining dispersion particle agglomerations comprising agglomerated primary particles combined with dispersion material.    DESCRIPTION OF DRAWING(S) - The figure shows evaluation of particles in sodium/halide flame encapsulation process