TECHNOLOGY FOCUS - IMAGING AND COMMUNICATION - Preferred Process: The photosensing device arrays are formed on the semiconductor substrate by:(a) providing a semiconductor substrate in which light receiving regions and charge transmitting regions are defined;(b) forming optical diode in the respective light receiving regions;(c) forming charge transmissions electrodes in the respective transmitting regions;(d) forming light shielding films so that the light receiving regions are exposed;(e) isolating the charge transmitting electrodes and the light shielding films from each other by an insulating film so that the charge transmission electrodes are insulated from the light shielding films;(f) forming pads on predetermined portions of the insulating film;(g) forming first and second planarizing films in the resultant surface of the substrate on which the pads are formed; and(h) forming color filters between the first and second planarizing films so as to correspond to the light receiving regions.The microlenses are formed by:(i) forming a material for forming microlenses on the resultant surface of the semiconductor substrate;(ii) forming a lens pattern by exposing and developing a predetermined portion of the material for forming the microlenses;(iii) irradiating ultraviolet (UV) rays to improve transmissivity of the lens pattern; and(iv) forming microlenses by supplying thermal energy so that the surface of the lens pattern has a radius of curvature.Preferred Component: The light is a deep ultraviolet (DUV) ray with a bandwidth of 200-400 nm.Preferred Condition: Light is irradiated into the microlenses until the pencil hardness of the microlenses reaches 7-10. The DUV rays are irradiated into the microlenses so that an optical energy of 600-1000 mJ/cm2 is supplied to the microlenses. The energy of the irradiated UV rays is 500-2000 mJ/cm2.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Material: The first and second planarizing films, and the microlenses are formed of a transparent organic material.