NOVELTY - Modular power converter comprises a thermal support partially defining an electric reference plane and configured to receive and circulate a coolant stream for heat extraction, an interface plate contacting the coolant stream during operation, and at least one power electronic device subassembly disposed on the interface plate and having a power electronic device and contact pads for transmitting signals to and from the power electronics device.    USE - The modular power converter is used for e.g., industrial power electronics applications or vehicular applications.    ADVANTAGE - The invention improves performance, and offers smaller, lighter, and more efficient configurations of the power electronic devices and their drive circuitry. It provides good thermal management while preventing the degradation of the packaging and circuitry due to thermal expansion and contraction. It provides more effective shielding from electromagnetic interference/radio frequency interference. Better high frequency grounds may be achieved by low inductance connection mechanism integrated into the thermal support.    DETAILED DESCRIPTION - Modular power converter comprises a thermal support (12) at least partially defining an electric reference plane and configured to receive and circulate a coolant stream (22, 24) for extraction of heat, an interface plate secured to the thermal support and contacting the coolant stream during operation, and at least one power electronic device subassembly (92) disposed on the interface plate and comprising a power electronic device and contact pads for transmitting signals to and from the power electronics device.    The interface place and the electronics device subassembly are at least partially thermally matched to create a desired thermal gradient to remove heat from the power electronics device during operation via the substrate and the thermal support.    DESCRIPTION OF DRAWING(S) - The figure is an exploded perspective view of an exemplary power electronics module and its associated packaging components.    Thermal support (12)    Coolant stream (22, 24)    Power electronic device subassembly (92)    Conductors (106, 108)