TECHNOLOGY FOCUS - CERAMICS AND GLASS - Preferred Composite: Preferably, the under side of TS is releasably bound to the top side of CS through BM. TS has a thickness of less than 0.3 mm. There is a separation layer between TS and CS. The separation layer is between the underside of TS and the top side of CS. (I) is temperature resistant at -40 to 250 degreesC. TS is bound fully and flat on CS. TS is bound to CS through one or more of the following forces: adhesive forces, electrostatic forces, and vacuum.Preferred Thin Substrate: TS comprises one of the following: (i) thin glass; (ii) polymer-thin glass composite; (iii) synthetic film or foil; (iv) synthetic film-thin glass-composite; (v) thin ceramic substrate; (vi) metal foil; (vii) thin substrate based on mineral oxides or oxide mixture; or (viii) thin substrates derived from composite materials from thin substrates as in (i)-(vii).Preferred Carrier Substrate: CS has a thickness of 0.3-0.5 mm. CS has indentations for taking up BM. The indentations in CS are around the edge of TS (i.e. when TS is in contact with CS). CS comprises one or more of the following substrates: (1) glass substrate; (2) glass ceramic substrate; (3) ceramic substrate; (4) metal substrate; and (5) synthetic substrate. The surface of CS is even, structured, porous, or it has one or more holes.Preferred Binding Material: BM is an adhesive, especially a silicon-, epoxide-, polyimide-, or arylate-based adhesive. BM is an adhesive which can be hardened by ultra-violet light, heat or air. BM is heat resistant up to a temperature of 400 (preferably up to 230, especially up to 250) degreesC. BM is selected such that it can be degassed up to a vacuum of 10-7 (preferably up to 10-3) mbar without being affected. BM is selected from one of the following materials: (1) an adhesive with filler; (2) adhesive with aggregate; (3) adhesive tape which sticks on only one side; (4) adhesive tape which sticks on both sides; (5) kapton with silicon adhesive; (6) adhesive tape as an adhesive frame; (7) polymer; and (8) putty. The hardened adhesive and/or adhesive band has microholes, where the size of the microholes is such that air trapped in between TS and CS escape and no solvent can enter between TS and CS.Preferred Method: The method in (B) comprises: (1) releasably binding the top or underside of TS to the top side of CS using BM to give (I); (2) treating and/or processing and/or transporting (I); and (3) releasing TS from CS. Alternatively, the method may comprise: (a1) placing the under side of TS on a separation layer; (b1) placing the separation layer on the top side of CS, so that the separation layer lies in between TS and CS to give (I); (c1) treating and/or processing and/or transporting (I); and (d1) releasing TS from CS. The underside of TS and the top side of CS which come into contact with BM are hydrophobized before bringing in contact with BM. The separation layer is discarded after step (d1).    TECHNOLOGY FOCUS - POLYMERS - TS may comprise a polymer-thin glass composite, synthetic film or foil, or synthetic film-thin glass-composite. BM may be a polymer.