NOVELTY - Forming grid contact on silicon solar cell wafer by subjecting silicon nitride coating to air plasma jet produced by plasma ionization of air, direct printing a grid contact pattern on silicon nitride coating using an ink, and heating silicon solar cell wafer in oxygen-containing atmosphere to cause glass frit to penetrate silicon nitride to form ohmic contact with first surface.    USE - For forming grid contact on silicon solar cell, e.g. photovoltaic cells wafer.    ADVANTAGE - The invention solves problem encountered in producing front grid-type contacts by printing a thick film grid contact pattern on the silicon nitride. It increases contact angle of ink relative to the silicon nitride, thus increases adherence or bond strength of the ink to the silicon nitride. It eliminates peeling, thus increases performance of finished solar cells. It reduces or eliminates the tendency of narrow mechanisms of wet ink contact pattern of the type to peel away from underlying silicon nitride layer. It does not require other modifications of the sequence. It provides contact pattern that remains intact throughout the high temperature firing to create bonded high performance electrical contact.    DETAILED DESCRIPTION - Forming grid contact on silicon solar cell wafer comprises subjecting the silicon nitride coating to air plasma jet produced by plasma ionization of air; direct printing on the silicon nitride coating a grid contact pattern using an ink containing silver particles, glass frits and organic vehicle; and heating silicon solar cell wafer in oxygen-containing atmosphere to temperature for a time to cause the glass frit to penetrate the silicon nitride so that the silicon particles will engage and form an ohmic contact with the first surface. The solar cell wafer comprises silicon substrate with oppositely facing two surfaces, p-n junction adjacent the first surface, and silicon nitride coating on the first surface.    DESCRIPTION OF DRAWING(S) - The figure shows the process for making contacts on solar cell wafers.