NOVELTY - A micropump device is manufactured by providing a sensing cavity having a surface(s); providing a sensing area disposed on at least a portion of the sensing cavity surface(s), where the sensing area is capable of at least partial mechanical deformation; and providing piezoresistors (130, 150) disposed within the sensing cavity.    USE - The invention is for manufacture of a micropump device useful for a microfluidic pumping system, where the micropumps are in common fluidic communication (claimed). It is useful for fuel cell fuel delivery and/or partitioning applications.    ADVANTAGE - The invention achieves improvement of pumping efficiency, reduction of device weight, reduction of device form factor, improved sample loading in microfluidic assays, improvement in sample throughput, sample multiplexing and/or parallel sample processing, integration with micro-array techniques and/or systems, and fabrication cost savings.    DETAILED DESCRIPTION - Manufacture of a micropump device comprises providing a substrate including a first surface and fluidic channels, which comprise an inlet channel (640), an outlet channel (610), and a pumping cavity, the inlet channel adapted to receive fluid for transport through the micropump device, the outlet channel adapted to purge fluid from the micropump device; providing a first valve (650) for permitting flow of fluid from the inlet channel to the pumping cavity, the first valve restricting backflow of purged fluid from the pumping cavity to the inlet, and the first valve deposited through a first opening on the first surface of the substrate; providing a second valve for permitting flow of fluid from the pumping cavity to the outlet channel, the second valve restricting backflow of purged fluid from the outlet channel to the pumping cavity, and the second valve deposited through a second opening on the first surface of the substrate; disposing a pump actuator over the first opening; disposing a cover over the second opening; providing a sensing cavity having a surface(s); providing a sensing area disposed on at least a portion of the sensing cavity surface(s), where the sensing area is capable of at least partial mechanical deformation; providing piezoresistors disposed within the sensing cavity; providing contact pads; providing conductive pathways communicably connecting the piezoresistors and the contact pads; and providing monolithic device package, where the sensing cavity is internally disposed within the micropump device package.    DESCRIPTION OF DRAWING(S) - The figure representatively depicts a cross-section, elevation view of an assembled and sealed micropump device package.    Piezoresistors (130, 150)    Outlet channel (610)    Piezoelectric membrane (630)    Inlet channel (640)    Valve (650)