TECHNOLOGY FOCUS - CERAMICS AND GLASS - Preferred Composite: The voltage required to build the electrostatic force is less than 3000 (preferably less than 1000, especially less than 500) V based on mass. (I) comprises a sealing and fixing for TS. TS is bound flat to CS and at the edge by the sealing or fixing. The sealing and the fixing support the electrostatic forces between TS and CS, and allow TS to be flat and releasably attached to CS. (I) is temperature resistant at -75 to 400 (preferably -40 to 250, especially 0-100) degreesC. TS is held onto CS at least partly by electrostatic force.Preferred Thin Substrate: TS is a pure substrate without any surface coating, or it may be coated on the under side. The coating is a weakly conducting coating or an insulating coating. TS comprises one of the following: (i) thin glass; (ii) polymer coated thin glass; (iii) polymer-thin glass composite; (iv) synthetic film or foil; (v) synthetic film-thin glass-composite; (vi) thin ceramic substrate; (vii) metal foil; (viii) thin substrate based on mineral oxides or oxide mixture; or (ix) thin substrates derived from composite materials from thin substrates as in (i)-(viii).Preferred Carrier Substrate: The thickness of CS is more than 0.3 (especially 0.3-0.5) mm. The entire CS, an insulated area on CS, or an inner part of CS acts as an electrostatic plate. CS comprises an arrangement for holding TS using a vacuum. CS comprises one or more of the following substrates: (1) a glass, glass-ceramic, ceramic, stone or synthetic substrate, partially or fully coated on a surface with a material for building electrostatic force, with a transparent conductive oxide (TCO) coating (especially an Indium Tin Oxide (ITO) coating), or with a metal film; and (2) (partly insulated) metal substrate. The surface of CS is even, structured, porous, or it has one or more holes.Preferred Sealing/Fixing: The sealing or fixing is an adhesive, especially a silicon-, epoxide-, polyimide-, or arylate-based adhesive. The sealing or fixing is an adhesive which can be hardened by ultra-violet light, heat or air. The sealing or fixing is selected from one of the following materials: (b1) an adhesive with filler; (b2) adhesive with aggregate; (b3) adhesive tape which sticks on only one side; (b4) adhesive tape which sticks on both sides; (b5) kapton with silicon adhesive; (b6) adhesive tape as an adhesive frame; (b7) polymer; (b8) putty; or (b9) wax.Preferred Methods: In (A), (I) is prepared as follows: (c1) pretreating the surfaces of CS and TS which will come into contact with each other; and (c2) placing TS on CS after switching on the electrostatic field, so that TS is held onto CS through electrostatic force. The pretreatment comprises: (i') cleaning; (ii') plasma pretreatment; or (iii') UV and/or UV/ozone pretreatment. Bringing TS and CS together comprises: (1) sliding TS on CS; (2) sliding CS on TS; (3) placing TS on CS; (4) placing TS on CS followed by pressing using homogenous area weight or rolling up with progressive pressing using a weight. An elastic-compensating medium is applied onto CS before placing TS on CS. A fixing or sealing is applied on TS. An adhesive is applied onto a localized area or onto an entire surface of CS. (I) is assembled in vacuum or with the help of a vacuum support.In (B), the method comprises: (d1) releasably binding the underside of TS to the top side of CS through electrostatic force to give (I); (d2) treating and/or processing and/or transporting (I); and (d3) releasing TS from CS. Releasing TS is conducted using mechanical removal, ultrasound, compressed air, radiant heat, visible radiation, cutting, suction, burning, chemicals, and/or by applying a repelling electrostatic potential.    TECHNOLOGY FOCUS - POLYMERS - TS may comprise a polymer coated thin glass, polymer-thin glass composite, synthetic film or foil, or synthetic film-thin glass-composite. The sealing or fixing may be a polymer.