NOVELTY - Composite (I) comprises: (a) a thin substrate (TS) having a thickness of less than 0.3 mm and a top side as well as an under side; and (b) a carrier substrate (CS) having a top side and an underside, where the top side of TS and the top side of CS and/or the edge of TS and CS are releasably bound through a bonding material (BM). BM is temperature resistant at -75 to 400 degreesC.    USE - For use in the display industry, for manufacturing electronic or optoelectronic components, in polymer electronics, in photovoltaic industry, in sensors, in biotechnology and in medicine (all claimed). (I) is useful in the treatment, processing and transporting of extremely thin substrates having a thickness of less than 0.3 mm, e.g. glass or polymer films for use in digital and analog displays including OLED's (organic light emitting diodes).    ADVANTAGE - (I) allows extremely thin substrates which are less than 0.3 mm thick to be treated, processed and transported without damage. (I) is resistant to temperature (from -75 to 400 degreesC), cleaning processes (e.g. with brush, ultrasound and/or spraying), chemicals for coating (e.g. liquid coating procedures using photoresists/lacquers), ultrahigh vacuum, high vacuum, vacuum, sputtering, chemical vapor deposition (CVD), plasma vapor deposition (PVD), plasma and thermal evaporation processes, short dry etching processes and is also storage stable. Individual (I)'s may be transported in the vertical and horizontal positions, rotated or cut without problem. (I) is also ozone and light resistant (UV, VIS, IR) and may be coated and structured without damage. (I) does not release any gas or releases gas to a negligible extent and therefore does not affect vacuum processes. (I) keeps TS flat minimizing self-deflection. Unlike prior art composites, (I) comprises a single fully flat layer of adhesion avoiding problems of different coefficient expansion in multilayer composites, especially during high temperature processing such as Indium Tin Oxide (ITO) coating (cf. 3-layer composite of JP20000252342 which is unsuitable for ITO coating).    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following:    (A) composite (I') comprising a TS and a CS, where TS is releasably bound to CS through one or more of the following forces: adhesive forces, electrostatic forces, vacuum and the force of a BM;    (B) treatment and/or processing and/or transport of TS.    DESCRIPTION OF DRAWING(S) - The figure shows a composite comprising a carrier substrate and several thin substrates arranged on it.    Carrier substrate (1)    Topside of carrier substrate (1.1.1)    Thin substrates (2.1-2.6)    Topside of thin substrate (2.1.1)    Adhesive stripes at edge of thin substrates (4.1-4.4)    Projecting adhesive band for pulling adhesive band mechanically (6)