TECHNOLOGY FOCUS - POLYMERS - Preferred Particle: The particulate substance in the adhesive agent, is chosen from inorganic particle, metal particle, elastomer particle, alkali-soluble resin particle, and resin particle which is soluble in a solvent.Preferred Process: Alternately, adhesive agent is formed by dispersing a resin liquid (island) to a resin matrix (sea), and forms sea-island structure, before performing hardening process. During hardening of resin matrix, phase-separation of resin liquid is carried out.Preferred Resin: The functional group of thermosetting resin is partially substituted by the photosensitive group of photosensitive resin.Preferred Layer: The adhesive layer is alternately formed from the resin composite, which is formed by hardening the adhesive agent. EXAMPLE - Cresol novolak group epoxy-resin EOCN-104S (in wt.pts) (65) having molecular weigh of 5000 and epoxy equivalent of 220, polyether sulfone Victrex (40) having molecular weight of 17000, imidazole group hardener 2E4MZ-CN (5), rubber group resin fine powder (20) having average particle diameter of 5.5 mum and rubber group resin fine powder (10) having average particle diameter of 0.5 mum, were mixed by adding N-methyl pyrrolidone (NMP). The resulting mixture was kneaded with three rolls, to obtain adhesive-agent solution having viscosity of 2-5 Pa.seconds at room temperature. The obtained adhesive agent solution was coated on glass epoxy insulation board which was not adhered with copper foil, and hardened to form adhesive layer of 20 mum thickness. The insulation board with the adhesive layer was then immersed in aqueous solution of chromium oxide, such that the surface of adhesive layer was roughened. Subsequently, the board was washed with water after immersing in neutralizing solution. The roughness of the surface of adhesive layer was measured and found to be 10 mum according to JIS-B-0601. The surface of adhesive layer was activated by providing metal catalyst. Subsequently, a metal-plating resist was provided, and immersed in electroless-plating liquid for 11 hours, to form non-electrolytic copper plating of 25 mum thickness. Thus, printed wiring board was manufactured. The peeling strength of the non-electrolytic copper plating film and insulation resistance of the printed wiring board were evaluated and found to be 2.2 kg/cm and 108 OMEGA or more, respectively. The printed wiring board had favorable heat resistance.