NOVELTY - A thin profile battery bonding method (M1) involves: interposing a curable adhesive composition (A1) between a thin profile battery and a substrate to which the thin profile battery is to be conductively connected; and curing (A1) into an electrically conductive bond electrically interconnecting the battery and the substrate. (A1) Comprises an epoxy terminated silane.    USE - For thin profile battery bonding, which is useful in a battery powerable apparatus, a radio frequency communication device, and an electric circuit; and for conductively interconnecting electronic components (claimed).    ADVANTAGE - The epoxy-terminated silane significantly improves the wetting characteristics relative to the metal surfaces such as nickel-clad stainless steel in a conductive epoxy system.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (A) a method (M2) of conductively interconnecting electronic components involving interposing (A1) between the first and second electronic components to be conductively connected with one another; and curing the adhesive into an electrically conductive bond electrically interconnecting the first and second components;    (B) a battery powerable apparatus comprising: a substrate having a surface comprising at least one node location; a thin profile battery mounted over the substrate and node location; and a conductive adhesive mass (A2) electrically interconnecting the thin profile battery with the node location. (A2) comprises the epoxy terminated silane;    (C) a radio frequency communication device comprising: a substrate having conductive paths including an antenna, at least one integrated circuit chip mounted to the substrate and in electrical connection with a first portion of the substrate conductive paths, and a thin profile battery conductively bonded with a second portion of the substrate conductive paths by (A2);    (D) an electric circuit comprising first and second electric components electrically connected with one another through (A2).