NOVELTY - Composite (I) comprises: (a) a thin substrate (TS) having less than 0.3 mm thickness and a top side as well as an under side; and (b) a carrier substrate (CS) with a top side and an underside, where the underside of TS is releasably bound to the topside of CS. TS is an insulator and is held onto CS through electrostatic force.    USE - For use in the display industry, for manufacturing electronic or optoelectronic components (particularly organic light emitting diode (OLED)), in polymer electronics, in photovoltaic industry, in sensors and in biotechnology (all claimed). (I) is useful in the treatment, processing and transporting of extremely thin substrates having a thickness of less than 0.3 mm, e.g. glass or polymer films for use in digital and analog displays.    ADVANTAGE - (I) allows extremely thin substrates which are less than 0.3 mm thick to be treated, processed and transported without damage. TS may be released from (I) allowing TS to be processed separately from CS when required. (I) is resistant to heat (up to a temperature of 400 degreesC), cleaning processes (e.g. with brush, ultrasound and/or spraying), chemicals for coating (e.g. liquid coating procedures using photoresists/lacquers), ultrahigh vacuum, high vacuum, vacuum, sputtering, chemical vapor deposition (CVD), plasma vapor deposition (PVD), plasma and thermal evaporation processes, short dry etching processes and is also storage stable. Individual (I)'s may be transported in the vertical and horizontal positions, rotated or cut without problem. (I) is also ozone and light (UV, VIS, IR) resistant and may be coated and structured without damage.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following:    (A) preparation of (I);    (B) treatment and/or processing and/or transport of TS.    DESCRIPTION OF DRAWING(S) - The figure shows the thin substrate (TS) directly on the entire surface of the carrier substrate (CS).    Thin substrate (TS) (3)    Carrier substrate (CS) (5)    Positioning element (13)