TECHNOLOGY FOCUS - CHEMICAL ENGINEERING - Preferred Method: Forming a conductive layer comprises releasing a conductive material toward the electrolyte layer in a direction perpendicular to the electrolyte layer to form the conductive layer that is thinner than the electrolyte layer or releasing a conductive material toward the electrolyte layer at a specific angle that prevents the conductive material from being deposited on surface of the hydrogen-permeable metal layer, which is exposed on the pores present in the electrolyte layer, to form the conductive layer. It is implemented by adopting a vacuum deposition technique. Forming the conductive layer further comprises forming a dielectric layer in the pores present in the electrolyte layer, where the dielectric layer is mainly made of an insulating material and the dielectric layer blocks off a connection between surface of the hydrogen-permeable metal layer, which is exposed on the pores present in the electrolyte layer, and outside of the pores; and coating the electrolyte layer and the dielectric layer formed in the pores of the electrolyte layer with the conductive layer. Forming a dielectric layer is implemented by filling the pores of the electrolyte layer with dielectric fine particles to form the dielectric layer; or coating inside of the pores of the electrolyte layer with an insulating material by plating to form the dielectric layer. Forming a dielectric layer further comprises coating inside of the pores of the electrolyte layer with a metal, which is oxidized to an insulating material, to form a metal coat layer; and oxidizing the metal coat layer to form the dielectric layer. Forming a conductive layer may comprise filling the pores present in the electrolyte layer with fine particles; forming the conductive layer on the electrolyte layer having the pores filled with the fine particles; and removing the fine particles from the pores, subsequent to forming the conductive layer on the electrolyte layer. Removing the fine particles is implemented by adopting a chemical technique or a physical technique. A protective layer made of an insulating material having proton conductivity may be formed to cover the electrolyte layer and the conductive layer may be formed on the protective layer. Subsequently, the protective layer is removed and the conductive layer is fixed to the electrolyte layer. Forming a conductive layer by coating the electrolyte layer with electrically conductive particles having a greater particle diameter than a width of the pores present in the electrolyte layer is implemented by arc ion plating, emulsion deposition or cluster beam deposition technique. Forming a conductive layer may also be implemented by applying a paste, containing an electrically conductive material and having a predetermined level of viscosity for effectively preventing invasion of the paste into the pores present in the electrolyte layer, onto the electrolyte layer. It may comprise forming an electrically conductive film and transferring the conductive film onto the electrolyte layer.    TECHNOLOGY FOCUS - ELECTRICAL POWER AND ENERGY - Preferred Components: The conductive layer is an electrode (24).