TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The metal of the conductive material is chosen from titanium, nickel and/or aluminum. The electroconductive particles in the organic film are chosen from indium-tin oxide, zinc oxide and/or aluminum-tin oxide particles. The semiconductor film contains tin oxide (SnO2), titania, zinc oxide and/or nickel pentoxide. The inorganic protective films contains transparent oxide chosen from titania, magnesium oxide, silica and/or alumina, and is formed by dry-type formation method.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Process: Passivation of the surface of mesh-shaped conductive material is carried out by oxidation. An oxide film, an organic film containing an electroconductive material, a semiconductor film or a protective film is formed on the electrode as outer most layer. The oxide film is formed by plasma processing in metal anode processing, oxidation gas atmosphere or ultraviolet irradiation in oxidation gas atmosphere. The organic film has crosslinked structure. The surface of electroconductive particle is chemically modified. The protective film is an organic or inorganic film. Preferred Arrangement: The mesh-shaped conductive material is formed on the transparent conductive film, or between the transparent conductive film and base material. The protective film covers the surface portion of the mesh-shaped conductive material.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Composition: The metal of the conductive material is chosen from titanium, nickel and/or aluminum. The electroconductive particles in the organic film are chosen from indium-tin oxide, zinc oxide and/or aluminum-tin oxide particles. The semiconductor film contains tin oxide (SnO2), titania, zinc oxide and/or nickel pentoxide. The inorganic protective films contains transparent oxide chosen from titania, magnesium oxide, silica and/or alumina, and is formed by dry-type formation method.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The organic film containing the electroconductive particles and the organic protective film are formed of an acrylic type resin, a polyester type resin and/or polyurethane type resin. The organic film has a crosslinked structure. The base material contains a high polymer film.