TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Process: The mold formation method involves performing patternization by lithography method using a radiation sensitive composition. The solid base material is removed before, after or simultaneously while removing the mold. A portion of the metal oxide nano structure is covered with an organic compound layer. The formation of metal oxide layer involves performing process (A) and process (B) at least one time. Process (A) involves contacting a material containing metallic compound having functional group which carries out condensation reaction to hydroxyl group, and a functional group which produces hydroxyl group by hydrolysis, on the surface of mold or metal oxide layer formed on the mold. Process (B) comprises hydrolyzing the metallic compound and forming metal oxide layer. Oxygen plasma process is performed on the mold surface before performing process (A). The mold is removed by plasma, ozone oxidation, elution and/or baking process.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Process: The mold formation method involves performing patternization by lithography method using a radiation sensitive composition. The solid base material is removed before, after or simultaneously while removing the mold. A portion of the metal oxide nano structure is covered with an organic compound layer. The formation of metal oxide layer involves performing process (A) and process (B) at least one time. Process (A) involves contacting a material containing metallic compound having functional group which carries out condensation reaction to hydroxyl group, and a functional group which produces hydroxyl group by hydrolysis, on the surface of mold or metal oxide layer formed on the mold. Process (B) comprises hydrolyzing the metallic compound and forming metal oxide layer. Oxygen plasma process is performed on the mold surface before performing process (A). The mold is removed by plasma, ozone oxidation, elution and/or baking process.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Compound: Organic compound has molecular weight of preferably more than 2000, and phenolic hydroxyl group equivalent of 0.2 or more. Alternately, organic compound is a resin comprising a unit having phenolic hydroxyl group (50 mol% or more) and a unit which has an acid-dissociative dissolution-inhibiting group. The mass mean molecular weight of the resin is 2000-30000. The unit having phenolic hydroxyl group is derived from hydroxy styrene. The composition for metal oxide nano material formation further contains an acid-generating agent. EXAMPLE - Polymeric organic compound (in mass parts) (100) of formula (8) having mass mean molecular weight of 8000, polymeric organic compound (100) of formula (9) having mass mean molecular weight of 8000, acid generating agent (6.5) of formula (10), salicylic acid (0.227), triethanol amine (0.108), dimethyl acetamide (5.42) and propylene glycol monomethyl ether acetate (730) were mixed to form a composition. The obtained composition was applied on a silicon substrate and prebaked at 90degreesC for 90 seconds. The obtained film was exposed to KrF excimer laser and developed using 2.38 mass% tetramethyl ammonium hydroxide aqueous solution to form a mold with pattern. The mold was subjected to oxygen plasma process and immersed sequentially in titanium n-butoxide solution for 2 minutes and heptane for 1 minute. Titanium n-butoxide on the surface was hydrolyzed and dried with nitrogen gas. The substrate was subjected to oxygen plasma and the substrate was removed. The scanning type electronic microscopic image of the obtained nano structure showed titania nano tube structure with thickness of 10 mm.