NOVELTY - A thermoelectric structure comprises solid metal electrode (104), thermo element (102) thermally coupled to the solid material electrode, and phonon conduction impeding medium coupled with the thermo element. The phonon conduction-impeding medium is thermally insulated from the solid metal electrode.    USE - For use in fabricating thermoelectric devices.    ADVANTAGE - The method allows reduction in value of thermal conductivity by reducing phonon thermal conductivity without significantly affecting electron thermal conductivity. It provides improve figure-of-merit.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) thermoelectric device comprising first solid metal electrode, thermo element thermally coupled to the first solid metal electrode, phonon conduction impeding medium, and second solid metal electrode thermally coupled the phonon conduction impending medium; and    (2) a method of fabricating thermoelectric device comprising forming first base structure, disposing first thermo element on base structure, disposing first phonon conduction impeding medium on first thermo element, disposing the second phonon conduction impeding medium on the first metal electrode, forming second base structure, and combining the second base structure with the resulting structure after executing the fourth step. The first base structure comprises silicon dioxide coated silicon wafer and first solid metal electrode. The second base structure comprises silicon dioxide coated silicon wafer, second metal electrode, third metal electrode, and second thermo element. The polarity of the second thermo element is opposite the polarity of the first thermo element. The combination results in the formation of thermoelectric device.    DESCRIPTION OF DRAWING(S) - The figure shows a cross section of basic non-equilibrium asymmetric thermoelectric device structure.    Thermo element (102)    Solid metal electrode (104)    Liquid metal electrode (106)