TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Filler: The filler has average particle diameter of 1 nm-100 mum. The filler is inorganic oxide chosen from soda glass, alkali free glass, silica, titanium dioxide, antimony oxide, alumina, zirconia and tungsten oxide.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Filler: The filler has average particle diameter of 1 nm-100 mum. The filler is inorganic oxide chosen from soda glass, alkali free glass, silica, titanium dioxide, antimony oxide, alumina, zirconia and tungsten oxide.    TECHNOLOGY FOCUS - POLYMERS - Preferred Resin: The epoxy resin having terpene type structure is of formula (1).(MK1) n=degree of polymerization, preferably 0-5.The epoxy resin further contains cycloaliphatic epoxy resin. The layer (B) contains epoxy resin having terpene type structure. Preferred Composition: The layer (A) contains epoxy resin (in wt.%) (9-60) and filler (10-90) with respect to all epoxy resin. Preferred Layer: The filler dispersed resin sheet further has hard coat layer containing urethane resin, and gas barrier layer. Preferred Properties: The filler dispersed resin sheet has surface roughness of 2 nm or less, glass transition temperature of 170degreesC or more, light transmittance of 88% or more, fracture strength of more than 20 N and coefficient of linear expansion of less than 5x10-5/degreesC at 25-160degreesC. The ratio (d1/d2) of thickness (d1) of epoxy resin layer (A) and thickness (d2) of the sheet is 0.15-0.9. EXAMPLE - Terpene type epoxy resin (in wt.pts) (26.6), 3,4-epoxy cyclohexyl methyl-3,4-epoxy cyclohexane carboxylate (26.6), methyl hexahydro phthalic anhydride (48.5) and tetra-n-butyl phosphonium o,o-diethyl phosphoro dithioate (1) were stir-mixed to obtain epoxy resin liquid. Glass beads (340) with average particle diameter of 30 mum were added to the epoxy resin liquid (840), and stir-mixed to obtain filler-containing resin liquid. The obtained liquid was flow-spread and dried to form filler-containing epoxy resin layer (A) with thickness of 300 mum. Similarly, resin liquid which does not contain the filler was applied on the surfaces of the formed layer and hardened at 150degreesC for 10 minutes to form epoxy resin layer (B) with thickness of 50 mum and filler dispersed resin sheet was obtained. The obtained sheet had coefficient of linear expansion of 4x10-5/degreesC, light transmittance of 89%, glass transition temperature of 212degreesC, fracture strength of 45N and excellent curl resistance. The sheet had excellent workability and heat-resisting property.