NOVELTY - An electroconductive pastes contains an electroconductive powder, and a binder resin having phthalic acid group glycidyl ester-type epoxy resin. The phthalic acid group glycidyl ester-type epoxy resin is specific glycidyl ester of phthalic acid (1), glycidyl ester of dihydro phthalic acid (2), glycidyl ester of tetrahydro phthalic acid (3) and/or glycidyl ester of hexahydro phthalic acid (4).    USE - Used for forming electrically conductive film in circuit board (claimed) such as printed circuit, electrode used in solar cell (claimed) and chip type ceramic electronic component (claimed) such as capacitor, inductor and actuator. Also for forming through-hole conductor, additive circuit, jumper circuit, protection circuit, conductor circuit of touch panel, resistance terminal, electromagnetic shielding.    ADVANTAGE - The electrically conductive film formed using the electroconductive paste has excellent electroconductivity and adhesivity. Electrode formed using the electroconductive paste has high conductivity and high efficiency.    DETAILED DESCRIPTION - An electroconductive paste contains an electroconductive powder, and a binder resin having phthalic acid group glycidyl ester-type epoxy resin. The phthalic acid group glycidyl ester-type epoxy resin is glycidyl ester of phthalic acid of formula (1), glycidyl ester of dihydro phthalic acid of formula (2), glycidyl ester of tetrahydro phthalic acid of formula (3) and/or glycidyl ester of hexahydro phthalic acid of formula (4).    R1,R2=H, CH3, C2H5, C3H7 or C4H9;and    R3=H or 1-12C alkyl.    INDEPENDENT CLAIMS are included for the following:    (1) circuit board having electrically conductive film formed by applying and heat processing the electroconductive paste, on a substrate. The electroconductive film has specific resistance of 2x10-5 ohm.cm;    (2) solar cell having electrode which is formed using the electroconductive paste; and    (3) chip-type ceramic electronic component having electrode which is formed using the electroconductive paste.