TECHNOLOGY FOCUS - ELECTRONICS - Preferred Method: The encapsulant layer is obtained by laminating the separable layer, filling layer formed of a resin composition different from that of the separable layer, and the separable layer (preferably separable layer). The removing process is carried out by physical cleaning physically removing the encapsulant layer and/or chemical cleaning of chemically removing the layer. The separating process involves rear face protecting sheet separating process of separating a rear face protecting sheet from the module. Preferred Components: The separable layer is placed to contact with the both surfaces of the photovoltaic cell and the transparent front face substrate.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The separable layer contains silicon (8 - 3500)parts per million in terms of polymerized Si amount.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The separable layer contains silicon (8 - 3500)parts per million in terms of polymerized Si amount.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The thermoplastic resin is a copolymer of a polyethylene for polymerization and an ethylenically unsaturated silane compound. The thermoplastic resin further comprises a polyethylene for addition. The gel fraction of the separable layer is less than or equal to30%. The separable layer further comprises at least one additive selected from photo-stabilizers, ultraviolet absorber, thermo-stabilizers and antioxidants. EXAMPLE - Straight chain low density polyethylene (100 parts by weight (pbw)) (having a Vicat softening temperature, measured based on JIS standard K7206 of 80degreesC, a melting temperature of 90degreesC, a melt mass flow rate of 2 g/10 min at 190degreesC and a density of 0.898 g/cm3), vinyltrimethoxysilane (2 pbw) and tert-butyl-peroxy isobutyrate (0.1 pbw) as a free radical generator were mixed and graft-polymerized at 200degreesC to form silane-modified straight chain low density polyethylene (a). Hindered amine-based photo-stabilizer (3.75 pbw), benzotrizole-based ultraviolet absorber (3.75 pbw) and phosphorous-based thermal stabilizer (0.5 pbw) were mixed based in (a) (100pbw) and melt-processed to obtain master batch (b). To (a) (20 pbw) having a silane modification ratio of 0.3%, straight chain low density polyethylene (80 pbw) (having a Vicat softening temperature of 70degreesC, a melting temperature of 90degreesC, a MFR of 3.5 g/10 min at 190degreesC and a density of 0.900 g/cm3) and (b) (5 pbw) were added and mixed. By using a film molding machine, a film is formed called encapsulant layer. The layer formation was conducted without problems. The appearance and total ray transmittance of the layer was excellent. The polymerized Si amount of the layer was 600 parts per million (ppm).