TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Component: The monomer having ethylenically unsaturated double bond, is an aromatic vinyl monomer.    TECHNOLOGY FOCUS - POLYMERS - Preferred Properties: The resin (A) having ethylenically unsaturated double bond, has hydroxyl value of 30-130, and double bond equivalent of 190-500. Heat deformation temperature of molded product formed by curing the conductive resin composition is 200degreesC or more. The ratio of total number of moles of hydroxyl group of resin (A) and unsaturated monomer, with respect to that of isocyanate group of polyisocyanate compound, is 1/0.5-1/1.5. Preferred Component: The epoxy resin has epoxy equivalent of 200 or more, and is phenol novolak-type epoxy resin, cresol novolak-type epoxy resin and/or epoxy resin having biphenyl structure. The thickener is a polyisocyanate compound. Preferred Composition: The electroconductive resin composition further contains a shrinkage reduction agent. Content of electroconductive filler in the conductive resin composition is 60-95 wt.%. EXAMPLE - An unsaturated resin having hydroxyl value of 80 and double bond equivalent of 263, was prepared using methacrylic acid, methacrylic acid anhydride, t-butyl hydroquinone, Epiclon HP-7200 (dicyclopentadiene phenol novolak-type epoxy resin having epoxy equivalent of 260) and tris dimethyl amino phenol. K-100 (synthetic graphite having average particle diameter of 300 micron) (in weight parts) (75), unsaturated resin (13), DVB-810 (divinyl benzene having purity of 81%) (2.9), styrene monomer (5.8), ISONATE143LJ (modified liquid compound of diphenyl methane diisocyanate and having isocyanate content of 29%) (2.9), BIC-75 (organic peroxide having half life of 10 hours at 97degreesC) (0.2), p-benzoquinone (0.01) and carnauba wax (0.2) were mixed at room temperature, to obtain a conductive resin composition. The resin composition had favorable handleability and moldability. A high-quality fuel cell separator was obtained using the resin composition, and had bending strength of 33 MPa measured according to JIS K-6911, volume resistivity of 5 m(Omega).cm measured according to JIS C-2525, heat deformation temperature of 285degreesC measured according to JIS K-7207, favorable heat resistance, practicability, water resistance and exterior, without defects such as crack, swelling, curvature, surface greasiness and peelability.