TECHNOLOGY FOCUS - ELECTRONICS - Preferred Component: The other portion of the first object, which is located outside the electrodeposition chamber, is a center portion (12) of the first object. The portion of the first object, which is located in the electrodeposition chamber, is an outer end portion of the first object, which is located around the center portion of the first object. The first frame body and the second frame body form the annular electrodeposition chamber. The electrodeposition coating device further comprises a third frame body which is provided between a second object and the first object on each of which electrodeposition coating is performed, where the first frame body, the second frame body, and the third frame body form, along with the first object and the second object, the electrodeposition chamber which stores the electrodeposition solution, and the first frame body, the second frame body, and the third frame body form the annular electrodeposition chamber while a center portion of the second object is located outside the electrodeposition chamber and an outer end portion of the second object, which is around the center portion of the second object, is located in the electrodeposition chamber. The electrodeposition coating device further comprises a cleaning portion which circulates a cleaning fluid in the electrodeposition chamber, thus cleaning the portions of the first object and the second object, which are located in the electrodeposition chamber. The electrodeposition coating device further comprises a drying portion which circulates heated air in the electrodeposition chamber, thus drying inner walls of the first frame body, the second frame body and the third frame body that form the electrodeposition chamber, and the portions of the first object and the second object, which are located in the electrodeposition chamber.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Method: The method includes applying a voltage to the portion of the separator substrate, which is located in the electrodeposition chamber, while supplying an electrodeposition solution to the electrodeposition chamber. The method further comprises collecting the electrodeposition solution from the electrodeposition chamber; circulating a cleaning fluid in the electrodeposition chamber, thus cleaning the portion of the separator substrate, which is located in the electrodeposition chamber; and circulating heated air in the electrodeposition chamber, thus drying inner walls that form the electrodeposition chamber, and the portion of the separator substrate, which is located in the electrodeposition chamber. In the first step, the separator substrate is sandwiched between a first frame body and a second frame body of the electrodeposition coating device, where the electrodeposition chamber is formed by the first frame body, the second frame body, and the separator substrate. The method also comprises removing the first frame body and the second frame body from each other, and taking the separator substrate out of the electrodeposition coating device. Preferred Property: The electrodeposition coating layer that is formed by the electrodeposition coating has an insulation property.    TECHNOLOGY FOCUS - METALLURGY - Preferred Material: The separator substrate is made of metal.    TECHNOLOGY FOCUS - POLYMERS - Preferred Component: An electrodeposition coating layer that is formed on the separator substrate by the electrodeposition coating is a primer for providing adhesion between a resin or rubber seal member formed on the separator substrate and the separator substrate.