TECHNOLOGY FOCUS - ELECTRONICS - Preferred Arrangement: A cladding material (5) consisting of the organic material with carbon and hydrocarbon structure, covers at least one portion of the electric-power generation portion.Preferred Electrodes: The electrodes (1,3) consist of carbon structure, amorphous carbon and/or glassy carbon, and have shape of plate, thin film, mesh or fiber.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Mediums: The acid and basic mediums preferably contain reaction substance, which is hydrogen peroxide. The reaction substance contained in acid and basic mediums are same. The reaction substance is a solid or liquid substance, or solid or liquid which discharge the reaction substance by chemical change. The acid medium contains aqueous acid chosen from sulfuric acid, methane sulfonic acid, hydrochloric acid, hydroiodic acid, hydrobromic acid, perchloric acid, periodic acid, ortho phosphoric acid, polyphosphoric acid, tetrafluoro boric acid, hydrogen hexafluorosilicate, hexafluoro phosphate, acetic acid, citric acid, oxalic acid, salicylic acid, tartaric acid, maleic acid, malonic acid, phthalic acid and/or fumaric acid. The basic medium contains basic aqueous solution having base and an alkali metal salt. The base is sodium hydroxide, potassium hydroxide, calcium hydroxide, barium hydroxide, magnesium hydroxide, ammonium hydroxide, hydrated tetramethyl ammonium, hydrated tetraethyl ammonium, hydrated tetrapropyl ammonium and/or hydrated tetrabutyl ammonium. The alkali metal salt is sodium carbonate, sodium hydrogen carbonate, potassium carbonate, potassium hydrogen carbonate, sodium borate, potassium borate, silicate, potassium silicate, sodium tripolyphosphate, potassium tripolyphosphate, sodium aluminate and/or potassium aluminate.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Mediums: The acid and basic mediums preferably contain reaction substance, which is hydrogen peroxide. The reaction substance contained in acid and basic mediums are same. The reaction substance is a solid or liquid substance, or solid or liquid which discharge the reaction substance by chemical change. The acid medium contains aqueous acid chosen from sulfuric acid, methane sulfonic acid, hydrochloric acid, hydroiodic acid, hydrobromic acid, perchloric acid, periodic acid, ortho phosphoric acid, polyphosphoric acid, tetrafluoro boric acid, hydrogen hexafluorosilicate, hexafluoro phosphate, acetic acid, citric acid, oxalic acid, salicylic acid, tartaric acid, maleic acid, malonic acid, phthalic acid and/or fumaric acid. The basic medium contains basic aqueous solution having base and an alkali metal salt. The base is sodium hydroxide, potassium hydroxide, calcium hydroxide, barium hydroxide, magnesium hydroxide, ammonium hydroxide, hydrated tetramethyl ammonium, hydrated tetraethyl ammonium, hydrated tetrapropyl ammonium and/or hydrated tetrabutyl ammonium. The alkali metal salt is sodium carbonate, sodium hydrogen carbonate, potassium carbonate, potassium hydrogen carbonate, sodium borate, potassium borate, silicate, potassium silicate, sodium tripolyphosphate, potassium tripolyphosphate, sodium aluminate and/or potassium aluminate.    TECHNOLOGY FOCUS - POLYMERS - Preferred Material: The cladding material (5) consists of polymer resin, carbon structure, amorphous carbon and/or glassy carbon. Preferred Composition: The acid and basic mediums contain acidic and basic ion exchange components, respectively. The ion exchange component is polyvinyl styrene group ion exchange resin, polyfluoro hydrocarbon polymer group polymeric electrolyte film, polyvinyl styrene group ion exchange membrane or fibrous polystyrene group ion exchange filter paper. The acid medium contains acidic ionic conductive gel, which gelatinizes aqueous acid by cross-linking polyacrylic acid, agar or its salts. The basic medium contains basic ionic conductive gel, which gelatinizes basic aqueous solution by carboxy methyl cellulose, crosslinking polyacrylic acid or its salts. The acid medium and basic medium are respectively arranged with respect to electrodes (1,3), by non-electrolytic plating, vapor deposition or sputtering method.