TECHNOLOGY FOCUS - ELECTRONICS - Preferred Parameters: The particles are sintered at temperature greater than the non-structured regions of the substrate. A temperature in the region of the non-structured regions of the substrate remains less than a sintering temperature of the particles.Preferred Components: Each structure comprises at least two free surfaces a distance between corresponding to less than or equal to 5x the thickness of the structures. The structures are arranged at openings (4) extending through the substrate. The structures are membranes, tongues or bridges. The substance Y comprises oxygen or nitrogen. The final compound comprises an oxide or nitride composition of the metal. The precursor compound comprises a chloride or fluoride compound. The metal is tin. The precursor compound is deposited on the substrate and then reacts with the substance Y. The precursor compound reacts with the substance Y prior to hitting the substrate so the final compound is formed and then hits the substrate in the form of solid particles or droplets. The precursor compound is introduced into the reactor by nozzle. An electric voltage is applied between the nozzle and the substrate. The particles have a diameter of less than or equal to100, preferably 10 nm. The substrate comprises integrated heaters heated during deposition. The integrated heaters are arranged in or at the structures. The substrate is a semiconductor wafer. The particles are applied from a first side to the substrate, and the substrate is heated from a second side opposite the first side. The substrate is brought into contact with a cooling device. The structures are not in direct contact with the cooling device. The structures on a first side of the substrate are arranged over openings. The openings extend to a second side of the substrate. The second side of the substrate is brought into contact with the cooling device. The substrate is provided with a coating in the region of the structures. The coating encourages a deposition of the particles and/or that the substrate is provided with a coating outside the structures. The coating hinders a deposition of the particles.Preferred Methods: The substrate is heated by electromagnetic radiation. A temporal temperature gradient is generated within the substrate by changing the temperature of the substrate. The method preferably comprises arranging the substrate in a reactor (11), providing a precursor compound comprising a metal and feeding the precursor compound to the reactor, feeding a compound Y to the reactor, carrying out a reaction inside the reactor where the metal of the precursor compound is transformed to a final compound. The layer on the substrate is (partially) polarized by applying an electric or magnetic field. A flame synthesis is carried out in the reactor, where the final compound is generated and in the substrate is heated by the flame synthesis. The substrate is heated by heated particles, gas, plasma, and/or a flame (16). The method includes synthesizing said final compound or material in a flame during a flame pyrolysis process and heating substrate by flame. The method includes manufacturing sensor(s), preferably substance sensors from substrate, applying a mask over substrate for structuring the layer and applying several layers on substrate.