NOVELTY - Fabrication of photovoltaic cell comprises providing semiconductor substrate having surface region, cleave region, and first thickness of material; coupling the surface region to first surface region of an optically transparent substrate; cleaving the substrate to remove the first thickness of material from the substrate, while the surface region remains coupled to the first surface region, to cause formation of a cleaved surface region; and forming a second thickness of semiconductor material overlying the cleaved surface region to form a resulting thickness of semiconductor material.    USE - For fabrication of photovoltaic cell for three-dimensional packaging of integrated semiconductor devices, photonic devices, piezoelectronic devices, flat panel displays, microelectromechanical systems, nano-technology structures, sensors, actuators, integrated circuits, and biological and biomedical devices.    ADVANTAGE - The method provides a thickening process using silane type species having desired deposition rate and thermal budget for the manufacture of photovoltaic devices. Large substrates are manufacture in cost effective and efficient manner.    DETAILED DESCRIPTION - The fabrication of photovoltaic cell comprises providing semiconductor substrate having surface region, cleave region, and first thickness of material to be removed between the surface and cleave regions; coupling the surface region to a first surface region of an optically transparent substrate having first and second surface regions; cleaving the substrate to remove the first thickness of material from the substrate, while the surface region remains coupled to the first surface region, to cause formation of a cleaved surface region; and forming a second thickness of semiconductor material overlying the cleaved surface region to form a resulting thickness of semiconductor material. INDEPENDENT CLAIMS are included for:    (1) a photovoltaic cell device comprising optically transparent substrate, first thickness of material, optical coupling material, and second thickness of semiconductor material;    (2) a method of fabricating substrates for photovoltaic materials comprising providing donor substrate, transferring first thickness of silicon material to a handle substrate surface region of a handle substrate, supplying a gas including a silane species into a reaction chamber, using the silane species to cause silicon deposition condition on the handle substrate surface region of the handle substrate, and forming second thickness of material;    (3) a photovoltaic device comprising handle substrate, interface material, layer transferred film, and deposited thickness of single crystal silicon or single crystal germanium material;    (4) a method for fabricating solar cell for use with solar module(s), comprising providing support unit, forming releasable material overlying a surface region of the support unit, transferring first thickness of semiconductor material from first donor substrate, forming second thickness of semiconductor material, separating the total thickness of material from the releasable material, and forming photovoltaic devices onto portions of the total thickness of material; and    (5) a system for fabricating the solar cell.    DESCRIPTION OF DRAWING(S) - The figure is a view showing a step in fabricating the photovoltaic device.