NOVELTY - The method involves bonding a semiconductor unit formed over a substrate to a interposer (105) having conductive films (106, 107) at both end portions via an anisotropic conductive adhesive agent (108), so that the semiconductor unit is electrically connected to the films via the agent. The semiconductor unit can be electrically connected to a side electrode of an interposer, where the semiconductor unit and the interposer are bonded in an aspect of entire surface facing each other.    USE - Used for manufacturing a semiconductor device e.g. optical sensor, which is utilized for optimally adjusting brightness of a display and a backlight luminance, and for saving a battery in a cellular phone, a laptop personal computer, a digital camera, a gaming machine, a car navigation, a portable audio equipment, for controlling ON and OFF of a backlight LED and a cold cathode tube or for saving a battery in a key switch of a cellular phone, and handy audio-video (AV) equipment, as a flash dimmer control or for an aperture control in a digital camera, a film camera, and an instant camera, for controlling airflow or temperature in a room air-conditioner, a car air-conditioner, and a ventilation and air conditioning equipment, for adjusting a position of a scanning line e.g. positioning of RGB scanning lines, in a display of a cathode ray tube (CRT) type projection television (TV), for controlling ON and OFF of various lightning equipment and lightning facilities such as various domestic lightning equipment, an outdoor lamp, a street light, an unmanned public utility, an athletic field, a car and a calculator, and in other electronic devices such as an electric pot.    ADVANTAGE - The method allows the connection of the semiconductor unit and the interposer to be strong since they are bonded in an aspect of entire surface facing each other and reduces the manufacturing cost of the device since they are connected by using anisotropic conductive adhesive agent having high fixing strength. The method thus enables manufacture of the semiconductor device having high breaking strength. The semiconductor unit can be electrically connected to a side electrode of the interposer, so that an area to be joined to the wiring substrate is increased to raise the mounting intensity of the semiconductor device. The method hence enhances the reliability of mounting on a wiring substrate during the manufacture of the semiconductor device. The semiconductor unit is formed over a substrate, such that the semiconductor device can be highly integrated and down sized over the wiring substrate.    DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of an optical sensor.    Optical sensor (100)    Plastic substrate (101)    Interposer (105)    Conductive films (106, 107)    Adhesive agent (108)