NOVELTY - Resin layers (c-1) are laminated on sacrificial layer formed on substrate (b). A cavity (e-3) demarcating peripheral portion of micromachine component and micromachine component is formed. A laminated structure of photosensitive resin composition cured-material layer (c-2) is formed, and dry-film-resist (f-1) is laminated. A dry-film-resist cured-material layer (f-2) having cavity which demarcates peripheral portion of shroud layer and shroud layer, is formed. The sacrificial layer is removed, and micromachine component is detached from substrate.    USE - For manufacturing resin-made micromachine components, such as micro impellers (claimed) and micro air pumps used for supplying air to small fuel cells.    ADVANTAGE - The method enables convenient, economical and accurate manufacture of resin-made micromachine components by a simple method.    DETAILED DESCRIPTION - A sacrificial layer is formed on a substrate (b), and two or more photosensitive resin composition layers (c-1) are laminated on the sacrificial layer. Photolithography corresponding to the internal structure of the target micromachine component with respect to each resin layer, is carried out and a cavity (e-3) which demarcates the peripheral portion of micromachine component and micromachine component is formed. A laminated structure of photosensitive resin composition cured-material layer (c-2) is formed, and a dry-film-resist (f-1) is laminated on the structure. A dry-film-resist cured-material layer (f-2) in which a cavity which demarcates the peripheral portion of shroud layer and shroud layer is formed by photolithography corresponding to the structure of the shroud layer, is formed. The sacrificial layer is removed, and the micromachine component consisting of the laminated structure of photosensitive resin composition cured-material layer and dry-film-resist cured-material layer, and demarcated peripheral portion, is detached from the substrate.    DESCRIPTION OF DRAWING(S) - The figure shows the sectional drawing explaining the manufacture of resin-made micromachine components.    Substrate (b)    Photosensitive resin composition layer (c-1)    Photosensitive resin composition cured-material layer (c-2)    Cavity (e-3)    Dry-film-resist (f-1)    Dry-film-resist cured-material layer (f-2)