NOVELTY - Bifacial photovoltaic arrangement comprises a bifacial cell including a semiconductor layer having two surfaces. First and second passivation layers (219-1, 219-2) are formed on the first and second surfaces of the semiconductor layer, respectively. Metallizations are formed on the passivation layers and connected to the two surfaces of the semiconductor layer. Some metallizations comprise an elongated metal structure having small width and large height extending upward from the passivation layers.    USE - The bifacial photovoltaic arrangement, e.g. bifacial solar cell module, is used for converting solar power into electrical energy useful in bifacial photovoltaic device.    ADVANTAGE - The arrangement is produced without rinsing and drying steps thus enabling the rapid and successive processing of the contact opening followed by the metallization. It permits for the mechanical moments matched even closer by tailoring respective widths of the metallizations on each side of the semiconductor layer to equalize the mechanical moments; the respective thicknesses on each side of the semiconductor layer of the metallizations to equalize the mechanical moments; and the respective volumes of the metallizations on each side of the semiconductor layer to equalize the mechanical moments. The backside of the semiconductor layer, one with aluminum nickel silver layered metallization produces the desired matching mechanical moment to silver metallization on the front side of the semiconductor layer.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for producing a bifacial photovoltaic device (211-1) comprising forming a blanket passivation layer on each first and second surfaces of the semiconductor. A direct-write metallization apparatus arrangement is used to deposit the conductive lines to contact the doped regions of the semiconductor layer. The device has doped region(s), and conductive lines disposed over the surfaces and contacting the doped regions at the two surfaces. It includes a metallic integrated reflector. The metallizations cover less than 10% of the two surfaces. The direct-write metallization apparatus is an inkjet-type printhead, or a dispensing nozzle. The conductive lines have an aspect ratio exceeding 2:1. They cover less than 10% of the two surfaces.    DESCRIPTION OF DRAWING(S) - The figure is a perspective view showing a bifacial photovoltaic device.    Bifacial photovoltaic device (211-1)    Passivation layers (215-1, 215-2)    Gridlines (219-1, 219-2)