NOVELTY - Fabrication of photovoltaic cell comprises providing reusable substrate having surface region, cleave region, and total thickness of material; coupling the surface region to first surface region of optically transparent substrate having first and second surface regions; and subjecting voltage differential between the first and second regions of the reusable substrate to cause an increase in energy at portion(s) of the cleave region to facilitate removal of the first thickness of material from the reusable substrate.    USE - The method is for fabrication of photovoltaic cell, e.g. solar cell and solar panel. The technique embodied in the method can also be applied to other types of applications such as for three-dimensional packaging of integrated semiconductor devices, photonic devices, piezoelectric devices, flat panel displays, microelectromechanical systems, nano-technology structures, sensors, actuators, integrated circuits, and biological and biomedical devices.    ADVANTAGE - The method uses controlled energy and selected conditions to preferentially cleave a thin photovoltaic film onto a glass substrate, and provides high quality photovoltaic material on glass which can be used as portion of packaging material. Single crystal silicon is provided from a larger reusable bulk substrate to provide efficient power using photovoltaic cells.    DETAILED DESCRIPTION - The fabrication of photovoltaic cell comprises:    (A) providing reusable substrate having surface region, cleave region, and total thickness of material being N times greater than a first thickness of material to be removed between the surface and cleave regions;    (B) coupling the surface region to first surface region of optically transparent substrate having first and second surface regions; and    (C) subjecting voltage differential between the first and second regions of the reusable substrate to cause an increase in energy at portion(s) of the cleave region to facilitate removal of the first thickness of material from the reusable substrate, while the surface region remains coupled to the first surface region, to form a cleaved surface region coupled to the first surface region of the optically transparent substrate.    INDEPENDENT CLAIMS are included for:    (1) a reusable silicon substrate device for use with layer transfer process;    (2) a cluster tool apparatus comprising first chamber having the reusable silicon substrate device;    (3) a method fabricating semiconductor substrates comprising providing the reusable substrate;    (4) a method of fabricating a module comprising individual photovoltaic cells; and    (5) an apparatus comprising substrate support, voltage source, first conducting contact in electrical communication with the voltage source, and second conducting contact in electrical communication with the voltage source, such that application of potential difference between the first and second contacts produces a thermal gradient in a substrate supported on the substrate support.    DESCRIPTION OF DRAWING(S) - The figure is a si9mplified diagram of a method using integrated layer transfer tool.