NOVELTY - Metal contact and wiring on sheet formation comprises depositing antireflective coating layer on sheet surface, forming photoresist material pattern for contact metallization on sheet surface, curing photoresist material, etching antireflective coating layer through photoresist material pattern, depositing film stack on sheet surface inside a physical vapor deposition chamber, stripping the photoresist material off the sheet surface, annealing the sheet for forming good contact between the film stack and sheet, and depositing bulk metal material on the sheet surface.    USE - The method is useful for forming metal contact and wiring on sheet useful in fabricating photovoltaic or solar cell and solar panel.    ADVANTAGE - Provides improved and less expensive process. The method allows maintaining vacuum integrity of process volume. The method provides effective junction formation and eliminates gaseous diffusion steps, difficult gas sources, and liquid sources, or any complex clean up steps that are required before and after sheet process as compared to prior art phosphorus diffusion processes. The method provides good contact with reduced contact resistance. The method can be readily incorporated into the existing processes.    DETAILED DESCRIPTION - The film stack has two metal materials. The antireflective coating layer comprises silicon nitride inside a chamber. The chamber is plasma enhanced chemical vapor deposition chamber, and physical vapor deposition chamber. The pattern of photoresist material is formed by inkjet printing. The bulk metal material is deposited on the surface of the sheet inside a process chamber. The process chamber is physical vapor deposition chamber, electroplating cell, and/or electroless deposition chamber. The stripping of photoresist material is performed after the bulk metal material is deposited on the sheet surface. The annealing is performed inside rapid thermal processing chamber, or annealing furnace. The method includes deposition of passivation layer on sheet surface, filling features with metal materials, forming pattern of second photoresist material after depositing the bulk metal material on sheet surface, and forming features before the antireflective coating layer deposited on the sheet surface.    DESCRIPTION OF DRAWING(S) - The figure shows process flow diagram.