TECHNOLOGY FOCUS - CERAMICS AND GLASS - Preferred Materials: The precursor composition further comprises metal oxide particles or glass particles. The conductive feature comprises indium tin oxide or antimony tin oxide. The substrate comprises a ceramic or glass. The conductive feature may comprise a metal-glass composition.    TECHNOLOGY FOCUS - ELECTRONICS - Preferred Properties: The conductive feature has a resistivity that is not greater than 4 (preferably not greater than 2) times the resistivity of the equivalent pure metal. Preferred Components: The conductive feature comprises a set of finger lines and collector lines deposited at a right angle to the finger lines. The parallel finger lines and/or the collector lines have width less than 200 (preferably less than 100) microns. The conductive feature has a thickness greater than 5 microns.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Method: Direct printing comprises syringe printing, aerosol jet deposition or ink jet printing. The composition is heated to not greater than 350degreesC to form the conductive feature on the substrate. Heating sinters adjacent particles to one another. The precursor composition is subjected to high shear mixing. The substrate is surface modified with a laser. Preferred Materials: The metal is silver, palladium, copper, gold, platinum, or nickel. The metallic particles may comprise a cap or coating of silica. Preferred Properties: The metallic particles have a volume median particle size of not greater than 100 nm or not greater than 0.3 microns.    TECHNOLOGY FOCUS - POLYMERS - Preferred Materials: The metallic particles may comprise a cap or coating comprising an intrinsically conductive polymer, a sulfonated perfluorohydrocarbon polymer, polystyrene, polystyrene/methacrylate, sodium bis(2-ethylhexyl) sulfosuccinate, tetra-n-octyl ammonium bromide, or alkane thiolate. The cap or coating may comprise polyvinylpyrrolidone (PVP). EXAMPLE - A paste composition was formulated using spherical silver powder (80 g), silver trifluoroacetate (9.0 g), palladium trifluoroacetate (1.0 g), dimethylacetamide (3.17 g), and alpha-terpineol (6.35 g). The paste was doctor bladed onto a glass slide to form a feature in the form of a narrow line. The feature was heated in air at 250degreesC for 10 minutes. The metal line was subsequently dipped in liquid solder at 250degreesC for 15 seconds. The solder dip did not have any significant effect on the width of the deposited line, indicating good solder leach resistance.