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MATER. CHEM.; JOURNAL OF MATERIALS CHEMISTRY OCTOBER 2003, vol. 13, no. 10, October 2003 (2003-10), pages 2414-2421, XP002477358 cited in the application;  HUI-MIN WU ET AL: "Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads" JOURNAL OF ELECTRONIC MATERIALS TMS; IEEE USA, vol. 34, no. 11, November 2005 (2005-11), pages 1385-1390, XP002477359 ISSN: 0361-5235 cited in the application