TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Process: In the process (P1), depositing copper, zinc and tin monolayer involves electrolytically depositing copper, zinc and tin monolayers, respectively. Depositing at least one chalcogen to at least one of monolayer involves sulfurizing either at least one of monolayer with a sulfur plating species or sulfurizing copper-zinc-tin sandwich layer by contacting same with a sulfur plating species. Depositing at least one chalcogen to at least one of monolayers comprises depositing a selenium monolayer onto the sandwich layer. Depositing at least one chalcogen to at least one of monolayers comprises selenizing the sandwich layer by contacting same with a reducing atmosphere containing a selenium compound. The process (P2) further involves sulfurizing the copper-zinc-tin alloy by contacting same with a sulfur plating species (where the sulfur plating species is selected from elemental sulfur and a reducing atmosphere containing a sulfur compound); depositing a selenium monolayer onto the alloy; and selenizing the copper-zinc-tin alloy by contacting same with a reducing atmosphere containing a selenium compound. Preferred Composition: The composition (C1) further comprises a buffer system (preferably hydrogenphosphate/phosphate). The composition (C1) (such as copper plating composition) comprises a water-soluble copper salt, supporting electrolyte, buffer system and complexing agent. The composition (C1) (such as zinc plating composition) comprises a water-soluble zinc salt and a supporting electrolyte The composition (such as tin plating composition) comprises a water-soluble tin salt, supporting electrolyte and an antioxidant for tin(II) species. In the composition (C1), the molar ratio of copper:zinc:tin is 1:0.1-10:0.1-4 (preferably 1:2-8:0.4-1. When p is greater than zero and Ch1 is sulfur and at least one chalcogen plating species is a sulfur plating species then sulfur plating species is selected from thiosulfates, thiosulfonic acids, di(thiosulfonic) acids, sulfur sulfides, thiourea, organic disulfides, organic polysulfides, colloidal elemental sulfur and compounds forming colloidal elemental sulfur. When q is greater than zero and Ch2 is selenium and at least one chalcogen plating species is a selenium plating species then selenium plating species is selected from selenates, selenosulfites, diselenides and polyselenides. Preferred Components: The copper-zinc-tin alloy is of formula CuxZnySnz(Ch1)p(Ch2)q alloy. The copper plating species are copper phosphates or copper pyrophosphates. The zinc plating species are zinc phosphates or zinc pyrophosphates. The tin plating species are tin stannates.Ch1=first chalcogen;Ch2=second chalcogen;x=1.5-2.5;y=0.9-1.5;z=0.5-1.1;p=0-4.2;q=0-4.2.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The complexing agent is selected from oxalate, citrate and gluconate compounds. Preferred Definitions:    R1 and R2=COOH, COOCH2CH2OH, COOCH2CH3, COOCH3, NH2 or CHO;    R1+R2=CO-NH-SO2.    SPECIFIC COMPOUNDS - Use of 10 compounds are disclosed as the disubstituted benzene compound (I) e.g. potassium hydrogen terephthalic acid (Ia), 4-hydroxybenzoic acid, terephthalic acid methyl ester, sulfanilic acid and terephthalic acid.    EXAMPLE - An electroless copper was deposited using Printoganth MV Plus (RTM: electroless copper bath based on tartrate complexing agent) and Noviganth TU (RTM: electroless copper baths based on tartrate complexing agent. The solution make-up was performed using the instruction manual of the baths in beaker (5 l). The solution was agitated with air and by using a magnetic stirrer. It was heated on a hot plate to the working temperature at slightly greater than 30degreesC. A molybdenum coated glass substrate was used to be plated clamped by using a copper wire as a holder. The sample was immersed into the electrolyte and electroless plating was initiated by applying a short 3 V pulse between the sample holder and a copper wire anode. The sample was then treated for a period of time sufficient to achieve the desired layer thickness. Then, tin was electroplated from Stannopure HSM (RTM: chemical plating bath). This composition was an acidic methane sulfonic acid (MSA) electrolyte. Thus, pure tin was deposited. Then, zinc was electroplated from Zylite (RTM: mild acid chloride zinc electrolyte contains zinc chloride, potassium chloride, boric acid and additives) using a soluble zinc anode. For both, zinc and tin electroplating, the electrolyte was contained in a polypropylene (PP) tank and was continuously filtered. The anodes were enveloped. The process was run at room temperature. A stainless steel sample holder was used. Sample movement was provided by hand or by motor to obtain a copper, zinc and tin sandwich layer.