TECHNOLOGY FOCUS - IMAGING AND COMMUNICATION - Preferred Process: In the removing step, the resist ink disperses in the aqueous alkali to form a solution in which less than 5 wt.% of the resist ink is in the form of particles which would be retained by a 10 micron filter. In the process, the etching or plating step involves etching the substrate with an aqueous acid medium. The method etches a metal using a phosphoric acid, acetic acid, water and nitric acid (PAWN) etching solution; using a solution comprising sulphuric acid and hydrogen peroxide; or using a solution comprising hydrofluoric acid. Preferred Components: The ink comprises alkali soluble components in an amount of greater than or equal to 95 wt.%. The ink comprises an alkali soluble resin (preferably colorant, especially fluorescent agent). Preferred Components: The ink has melt viscosity of less than or equal to 100 mPas at 125degrees C.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The alkali soluble wax present in amount of 50-95% wt.%. The alkali soluble wax has a melting point of 45-60degrees C. EXAMPLE - A test ink composition comprising (wt.%): myristic acid (98.5), Orasol black RLI (RTM: dye) (1), and Tween 80 (RTM: wetting agent) (0.5) was prepared. The test ink composition had a viscosity of 8.1 mPas. A comparative ink composition comprising (wt.%): Unilin 425 (RTM: baker petrolite) (79.5), Ennesin M57W (RTM: Rosin Ester Resin) (19), Orasol black RLI (RTM: dye) (1), and Tween 80 (RTM: wetting agent) (0.5) was prepared. The comparative ink composition showed viscosity of 11.9 mPas. The test and comparative inks were tested for alkali wash ability as follows: a piece of copper sheet was taken; and coated half the copper with the test/comparative ink with a layer of ink approximately 15-30 microns thick. The coated copper weighed, and the coated copper was dipped into a beaker containing 5% potassium hydroxide (KOH) in water, at 50degrees C. The slide was agitated in the solution for 5 minutes by side to side motion of the copper in the KOH solution. The copper was removed from the KOH solution and rinse under running water, and rinse water was collected in a beaker. The copper was dried in an oven at 40degrees C for 30 minutes, and copper was weighed. The alkali wash ability was calculated in test/comparative was calculated and found to be 100/0%, respectively. The test and comparative inks were tested for water wash ability as follows: a piece of copper sheet was taken; and coated half the copper with the test/comparative ink with a layer of ink approximately 15-30 microns thick. The coated copper weighed, and the coated copper was dipped into a beaker containing water, at 50degrees C. The slide was agitated in the solution for 5 minutes by side to side motion of the copper in the water. The copper was removed from the water and rinse under running water, and rinse water was collected in a beaker. The copper was dried in an oven at 40degrees C for 30 minutes, and copper was weighed. The alkali wash ability was calculated in test/comparative was calculated and found to be 0/0%, respectively. Thus the test ink composition has a melt viscosity for ink jet printing, and were highly alkali washable but not water water washable; whereas comparative ink composition was conventional ink composition and not alkali removable, and not be removable from a substrate by washing with aqueous alkali.