NOVELTY - A two-step solder comprising a low-melt solder component disposed on a base solder component, is disposed on or between some portion of two or more electrical components. The low-melt solder component is melted at preset temperature to form a solder alloy or intermetallic from the low-melt component and base solder component. The solder alloy or intermetallic is soldered to provide an electrical connection between the electrical components.    USE - Provision of electrical connection between electrical components in electrical devices, such as printed circuit boards, ball grid arrays, and pin grid arrays. The method is also used for providing electrical connection during production of solar cell assemblies (all claimed) and photovoltaic cells.    ADVANTAGE - The method uses a two-step solder which reduces stresses on the materials used in the production of electrical devices. The solder allows the reduction of assembly temperatures and mismatch of coefficient of thermal expansion between solder and interconnects. The two-step solder can be used for both fragile thin wafer assemblies and thick photovoltaic semiconductor assemblies.    DETAILED DESCRIPTION - A two-step solder comprising a low-melt solder component disposed on a base solder component, is disposed on or between some portion of two or more electrical components. The low-melt solder component is melted at preset temperature to form a solder alloy or intermetallic from the low-melt component and base solder component. The solder alloy or intermetallic is soldered to provide an electrical connection between the electrical components. The low-melt solder is tin (42)/bismuth (58), tin (30-50)/bismuth (70-30), tin (42)/bismuth (57)/silver (1), tin (30-50)/bismuth (70-30)/silver (0-5), tin (50)/indium (50), tin (30-50)/indium (70-30), indium (97)/silver (3), indium (90-100)/silver (0-10), tin (50)/lead (32)/cadmium (18), tin (30-60)/lead (20-40)/cadmium (10-30), tin (43)/lead (43)/bismuth (14), and/or tin (30-50)/lead (30-50)/bismuth (5-20). The two-step solder is tin/silver/copper alloy, tin (90-100)/silver (0-5)/copper (0-5), tin (96.5)/silver (3.5), tin (90-95)/silver (0-5), tin (99)/copper (1), tin (95-100)/copper (0-5), tin (100), tin (63)/lead (37), tin (20-80)/lead (0-20), tin (62)/lead (36)/silver (2), tin (50-70)/lead (30-50)/silver (0-5), tin (60)/lead (38)/copper (2), and/or tin (50-70)/lead (30-50)/copper (0-5).    DESCRIPTION OF DRAWING(S) - The drawing shows the cross-sectional view of a solar cell assembly.    Photovoltaic cell (400)    Backing (410)    P-type semiconductor layer (420)    N-type semiconductor layer (430)    Contact grid (440)