NOVELTY - Forming (p1) a photovoltaic conductive feature involves printing a precursor composition (C1) onto a substrate by lithographic printing, gravure printing, flexo printing, or drop on demand printing, where the composition (C1) comprises metallic nanoparticles containing a metal; and heating the composition (C1) to form the photovoltaic conductive feature on the substrate, where the conductivity of the photovoltaic conductive feature is not less than 10% the conductivity of the equivalent pure metal.    USE - For preparing a photovoltaic conductive feature e.g. a solar cell conductive feature (claimed) useful in electronics, displays, electronic circuit elements and complete electronic circuits fabricated on inexpensive, thin and/or flexible substrates such as paper, using high volume printing techniques such as reel-to-reel printing or direct write methods such as ink-jet deposition; also useful in organic thin film transistor (TFT) technology and organic light emitting device (OLED) technology; for fabricating transparent antennas for radio frequency tags, smart cards and cellular telephones; for printing disposable electronics such as for games included in magazines; for flat panel display such as field emission display, plasma display panels, liquid crystal display, paper like visual display e.g. gyricon display and thin film electroluminescent (TFFL) display, and organic field effect transistors (OFET) or organic thin film transistors (OTFT); in a wide variety of devices such as low cost or disposable light-emitting diodes, solar cells, portable computers, pagers, cell phones and internet compatible devices such as personal organizers and web-enabled cellular phones; in a variety of areas including coupon redemption, inventory security, currency security, compact disk security, driver's license, passport security, desktop publishing and color-photocopiers; for producing low cost, high volume, highly customizable electronic circuits; for making printed writing board (PWBs) and printed circuit board (PCBs).    ADVANTAGE - The process for forming the electronic feature has a resistivity of not greater than 4 (preferably 2) times the resistivity of the equivalent pure metal and has a thickness greater than 5 mu m. The process using a low viscosity precursor composition has a low conversion temperature to enable low-temperature treatment of the precursors to form conductive electronic features on a variety of substrates; has a low viscosity to enable the deposition of the compositions; has a low processing temperatures to allow deposition onto organic substrates and subsequent heat treatment; provides electronic features with adequate electrical and mechanical properties; provides conductive features such as high conductivity, high resistivity, solder leaching, oxidation and good adhesion to the substrate; enables a wide variety of security and authentication applications; provides faster production time and the flexibility to produce prototypes and low-volume production applications; exhibits high resolution, high density and dimensional stability.