TECHNOLOGY FOCUS - CERAMICS AND GLASS - Preferred Material: The bonding layer comprises oxide ceramic, nitride ceramic, carbide ceramic, silicate based glass, non-silicate based glass, and/or fiber-glass. The first electrical contact is a conductor or an insulating layer with a conducting insert. The insulating layer comprises ceramic including beryllium oxide, boron oxide, boron nitride, borate glass, aluminum oxide, aluminum nitride, silicon oxide, silicon nitride, silicate glass, scandium oxide (ScOx), titanium oxide (TiOx), vanadium oxide (VOx), chromium oxide (CrOx), iron oxide (FeOx), zirconium oxide (ZrOx), niobium oxide (NbOx), molybdenum oxide (MoOx), hafnium oxide (HfOx), tantalum oxide (TaOx), and/or tungsten oxide (WOx).    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Material: The embedded conductor comprises lithium, boron, graphitic carbon, aluminum, silicon, scandium, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, yttrium, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, silver, indium, tin, hafnium, tantalum, tungsten, rhenium, osmium, iridium, platinum, gold, lead, and/or their alloys, or stainless steel. The conducting material may comprise solder-type alloys, carbon, nickel, copper, gold, silver, or metallic powders.    TECHNOLOGY FOCUS - POLYMERS - Preferred Material: The bonding layer comprises adhesive material(s) including thermoplastic, thermally set, ethylene methacrylic acid (E/MAA) copolymer, E/MAA metallate copolymer, cyano-acrylates, epoxies, fluoro-acrylates, polyimides containing ether linkages, urea-formaldehyde resins, vinyl chlorides, or low-density polyethylene. It further comprises polyamides, polyimides, polyethylene terephthalates, para-aramids, polyethylenes, high-density polytheylenes, Ultra High Molecular Weight polyethylenes, polypropylenes, acrylics, polycarbonates, polyvinyl chlorides, acetal delrin, phenolics, fluoroplastics, polyurethanes, polystyrenes, acrylonitrile-butadiene-styrenes, polyether ether ketone, and/or Tenite(RTM: cellulose resins). The bonding layer comprises an isotropic or anisotropic conductive adhesive comprising conducting material including gold-coated polymer spheres.