NOVELTY - Production of conductive material (10) involves electrifying base material (32) that is plated and having conductive metal portion, in an electrolytic solution that is free of plating substances, where the conductive metal portion is used as cathode; and then subjecting the base material to plating treatment to form conductive layer.    USE - For producing conductive material (claimed) which is used for light-transmittable, electromagnetic-shielding films, radio antennas, fuel cell electrodes, electric bilayer capacitors, biosensor electrodes, and organic transistor electrodes.    ADVANTAGE - In the method, the electrifying step is carried out prior to the plating treatment, hence an oxide or sulfide generated on the conductive metal portion are removed, and the surface of the conductive metal portion is activated. Thus, the plating rate is increased without chemical activating treatments, and plating unevenness is reduced. As a result, the base material is rapidly plated, and uniform conductive materials are mass-produced. Also the method increases the plating activity of the conductive metal portion and rapidly carrying out the plating treatment. As a result in the method the supply or removal is nor required, thus production equipment is simplified and production cost is lowered.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an apparatus for subjecting the base material to plating treatment to form conductive layer and to produce conductive material comprising an electrifying unit and plating unit disposed downstream of electrifying unit. The electrifying unit comprises feed roller (180a, 180b) for feeding electricity to conductive metal portion in contact with it and an electrifying bath for electrifying the conductive metal portion in an electrolytic solution, disposed downstream of the feed roller in the direction of conveying the base material. The plating unit comprises plating bath (174) for plating conductive metal portion.    DESCRIPTION OF DRAWING(S) - The figure shows schematic view of black electroplating treatment section.    Conductive material (10)    Base material (32)    Electroplating treatment section (111)    Plating bath (174)    Feed rollers (180a and 180b)    Guide rollers (178a, 178b)    Draining roller (182)    Anode plates (186a, 186b)    Third plating solution. (192)