NOVELTY - A mounting assembly for a photovoltaic device (100) comprises a metal substrate (110) having a front surface and a back surface; a first mold compound (130) encapsulating at least a portion of the metal substrate; at least one photovoltaic device coupled to the front surface of the metal substrate to effectuate transfer of current through the device; and a second mold compound encapsulating at least a portion of the first mold compound, and having an opening to receive a solar concentrator that concentrates light onto the photovoltaic cell.    USE - For a photovoltaic device useful for converting solar energy into electric power.    ADVANTAGE - The mounting assembly enhances rigidity added to the photovoltaic (PV) assembly by the second mold and because of the protection it offers to the components encapsulated. The mounting assembly provides high accuracy of a standard semiconductor packaging molding process, and the opening can be placed on top of the PV cell to an accuracy of 30 microns or better without the need for additional technology development. In addition to concentration light energy from the sun, optical rod in mounting assembly also concentrates heat that is preferably harvested away from the assembly for optimum performance and durability. The photovoltaic assembly is able to be assembled using existing mature semiconductor packaging technologies. The copper substrate is thick to effectuate the transfer of waste heat collected as a byproduct of the optical rod. To further prevent electrical contact between the PV cell and heat sink, the back surface of the copper substrate can be oxidized or covered with a high thermal conductivity mold compound.    DETAILED DESCRIPTION - A mounting assembly for a photovoltaic device (100) comprises a metal substrate (110) having a front surface and a back surface; a first mold compound (130) encapsulating at least a portion of the metal substrate; at least one photovoltaic device coupled to the front surface of the metal substrate to effectuate transfer of current through the device; and a second mold compound encapsulating at least a portion of the first mold compound, and having an opening to receive a solar concentrator that concentrates light onto the photovoltaic cell. The photovoltaic device comprises an anode side and a cathode side, and is coupled to the metal substrate on its cathode side. The anode side of the photovoltaic device is coupled to at least one current bus (120) by at least one bondwire. The mold compounds are applied using a molding procedure. The photovoltaic device is mounted on a non-encapsulated portion. The mounting assembly further comprises a protection diode (127); and is mounted on a passive heat sink or on an active heat sink. The mounting assembly is liquid cooled. An INDEPENDENT CLAIM is included for assembling the photovoltaic device involving applying a first mold compound to a metal substrate; mounting at least one photovoltaic device on the front surface of the metal substrate; applying a second mold compound and encapsulating at least a portion of the first mold compound; forming an opening in the second mold compound configured to receive a solar concentrator; and mounting a solar concentrator configured to concentrate light on the photovoltaic device.    DESCRIPTION OF DRAWING(S) - The figure shows a cross section of the photovoltaic (PV) assembly with a solar concentrator.    PV Assembly (10)    PV cell (100)    Metal substrate (110)    Current bus (120)    Protection diode (127)    First mold compound (130)    Second mold (140)    Opening (145)    Optical rod (150)    Sunlight. (151)