NOVELTY - A pattern is formed on a substrate (S) by depositing first layer (E1) of opaque material on upper surface of substrate. A photosensitive layer (R) is deposited such that part of photosensitive layer covers at least part of first layer. The photosensitive layer is exposed to a light beam (L) impinging on lower surface of substrate under oblique angle of incidence. The exposed region of photosensitive layer is removed. A second layer (E2) is deposited such that part of second layer covers remaining region of photosensitive layer. Then, remaining region of the photosensitive layer is removed.    USE - Method of forming a pattern on a substrate for an organic FET for electronic device comprising organic solar cell (claimed).    ADVANTAGE - The method offers a resolution of down to sub-micrometer range, registration accuracy, robustness, cost-effectiveness and throughput, which is suitable for large-area and/or low-cost electronic components. Further, a submicron gap can be realized between the conductive layers by reproducing one edge to create a parallel aligned pattern that merges with the adjacent conductive layer. The larger the contact size the higher is the sensitivity and the signal-to-noise ratio of the electronic device.    DETAILED DESCRIPTION - Forming a pattern on a substrate (S) with an upper surface and a lower surface comprises depositing a first layer (E1) of opaque material on one or more parts of the upper surface of the substrate. A photosensitive layer (R) is deposited such that part of the photosensitive layer covers at least part of the first layer. The photosensitive layer is exposed to a light beam (L) impinging on the lower surface of the substrate under an oblique angle of incidence. The exposed region of the photosensitive layer is removed. A second layer (E2) is deposited such that part of the second layer covers a remaining region of the photosensitive layer, where the second layer has a thickness that allows its lifting off when removing at least a part of the remaining region of the photosensitive layer. Then, at least a part of the remaining region of the photosensitive layer is removed. INDEPENDENT CLAIMS are included for:    (1) a method for forming a thin-film field effect transistor; and    (2) an electronic device, comprising a substrate which is transparent to a light beam, preferably a UV-light beam; a first layer and a second layer located adjacent to each other on upper surface of the substrate, where part(s) of the first layer and of the second layer are spaced apart by a gap (G) and where the first layer is opaque with respect to the light beam.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a schematic representation of the steps for forming a pattern on a substrate.    First layer (E1)    Second layer (E2)    Gap (G)    Light beam (L)    Photosensitive layer (R)    Substrate (S)