TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Material: The non-polymeric material comprises silicon oxide.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Component: The precursor material comprises an organo-silicon compound(s) including hexamethyl disiloxane or dimethyl siloxane. The organo-silicon compound comprises methylsilane; dimethylsilane; vinyl trimethylsilane; trimethylsilane; tetramethylsilane; ethylsilane; disilanomethane; bis (methylsilano) methane; 1,2-disilanoethane; 1,2-bis (methylsilano)ethane; 2,2-disilanopropane; 1,3,5-trisilano-2,4,6-trimethylene; dimethylphenylsilane; diphenylmethylsilane; dimethyldimethoxysilane; 1,3,5,7- tetramethylcyclotetrasiloxane; 1,3-dimethyldisiloxane; 1,1,3,3-tetramethyldisiloxane; 1,3-bis(silanomethylene)disiloxane; bis(1-methyldisiloxanyl)methane; 2,2-bis(1-methyldisiloxanyl)propane; 2,4,6,8- tetramethylcyclotetrasiloxane; octamethylcyclotetrasiloxane; 2,4,6,8,10-pentamethylcyclopentasiloxane; 1,3,5,7-tetrasilano-2,6-dioxy-4,8-dimethylene; hexamethylcyclotrisiloxane; 1,3,5,7,9-pentamethylcyclopentasiloxane; hexamethoxydisiloxane; hexamethyldisilazane; divinyltetramethyldisilizane; hexamethylcyclotrisilazane; dimethylbis(N-methylacetamido)silane; dimethylbis-(N-ethylacetamido)silane; methylvinylbis(N-methylacetamido)silane; methylvinylbis(N-butylacetamido)silane; methyltris(N-phenylacetamido) silane; vinyltris(N-ethylacetamido)silane; tetrakis(N-methylacetamido)silane; diphenylbis(diethylaminoxy) silane; methyltris(diethylaminoxy)silane; or bis (trimethylsilyl)carbodiimide.    TECHNOLOGY FOCUS - POLYMERS - Preferred Material: The polymeric material is silicone polymer. Preferred Property: The first layer has a wetting contact angle of a water droplet at 60-115 degrees (preferably 75-115 degrees ), and a nano-indentation hardness of 0.2-2 GPa. The second layer has a wetting contact angle of a water droplet at 0-60 degrees , and a nano-indentation hardness of 10-20 GPa. One of layers has a surface roughness (root-mean-square) of 0.1-10 nm. One of the layers, when deposited as a 4 mu m layer on a 50 mu m thick polyimide foil, is flexible that no microstructural changes are observed after at greater than or equal to 55000 rolling cycles on a 1 inch diameter roll at a tensile strain of 0.2%, and no cracks appear under a tensile strain of greater than or equal to 0.35%.