NOVELTY - A removal composition comprises at least one etchant; at least one surfactant; and optionally at least one organic solvent, at least one chelating agent, at least one oxidizing agent, at least one chloride source and water.    USE - For removing at least one material selected from post-etch residue, low-k dielectric, high-k dielectric, etch stop material, metal stack material, barrier layer material, ferroelectric material, silicide material, nitride material, oxide material, photoresist, bottom anti-reflective coating (BARC), sacrificial anti-reflective coating (SARC), polymer-containing buildup, miscellaneous materials and/or doped regions from microelectronic device structure having the material on it, useful for recycling microelectronic device structure (preferably semiconductor substrates, solar cells (photovoltaics), flat panel displays, and microelectromechanical systems (MEMS)) (claimed), and for reclaiming reworking, recycling and reuse of the structure.    ADVANTAGE - The composition achieves removal of the materials that are removed while not damaging the layers that are restained, for reclaiming, reworking, recycling and/or reuse of the structure. The composition complies with local regulatory standards associated with the disposal of the composition.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for recycling microelectronic device structure involving contacting microelectronic device structure comprising microelectronic device substrate and at least one removable material (m1) selected from post-etch residue, low-k dielectric, high-k dielectric, etch stop material, metal stack material, barrier layer material, ferroelectric material, silicide material, nitride material, oxide material, photoresist, bottom anti-reflective coating (BARC), sacrificial anti-reflective coating (SARC), polymer-containing buildup, miscellaneous materials and/or doped regions, with the removal composition for sufficient time and under sufficient conditions to remove at least one material from the microelectronic device structure to yield recyclable or reusable microelectronic device substrate.