WO2007145524-A1  ROY KNECHTEL: 'MICROSYSTEM TECHNOLOGIES; MICRO AND NANOSYSTEMS', vol. 12, 01 December 2005, SPRINGER-VERSLAG article 'Glass frit bonding: an universal technology for wafer level encapsulation and packaging', pages 63 - 68;  DOUGLAS SPARKS ET AL: "Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs" JOURNAL OF MICROMECHANICS & MICROENGINEERING, INSTITUTE OF PHYSICS PUBLISHING, BRISTOL, GB, vol. 15, no. 8, 1 August 2005 (2005-08-01), pages 1560-1564, XP020091650 ISSN: 0960-1317;  KNECHTEL R ET AL: "Wafer level encapsulation of microsystems using glass frit bonding" MICROSYSTEM TECHNOLOGIES ; MICRO AND NANOSYSTEMS INFORMATION STORAGE AND PROCESSING SYSTEMS, SPRINGER-VERLAG, BE, vol. 12, no. 5, 1 April 2006 (2006-04-01), pages 468-472, XP019349560 ISSN: 1432-1858;  ROY KNECHTEL: "Glass frit bonding: an universal technology for wafer level encapsulation and packaging" MICROSYSTEM TECHNOLOGIES ; MICRO AND NANOSYSTEMS INFORMATION STORAGE AND PROCESSING SYSTEMS, SPRINGER-VERLAG, BE, vol. 12, no. 1-2, 1 December 2005 (2005-12-01), pages 63-68, XP019349513 ISSN: 1432-1858;  DOUGLAS SPARKS ET AL: "Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs" JOURNAL OF MICROMECHANICS&MICROENGINEERING, INSTITUTE OF PHYSICS PUBLISHING, BRISTOL, GB, vol. 15, no. 8, 1 August 2005 (2005-08-01), pages 1560-1564, XP020091650 ISSN: 0960-1317NL2000104-C2  DOUGLAS SPARKS ET AL: "Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs" JOURNAL OF MICROMECHANICS & MICROENGINEERING, INSTITUTE OF PHYSICS PUBLISHING, BRISTOL, GB, deel 15, nr. 8, 1 augustus 2005 (2005-08-01), bladzijden 1560-1564, XP020091650 ISSN: 0960-1317;  KNECHTEL R ET AL: "Wafer level encapsulation of microsystems using glass frit bonding" MICROSYSTEM TECHNOLOGIES ; MICRO AND NANOSYSTEMS INFORMATION STORAGE AND PROCESSING SYSTEMS, SPRINGER-VERLAG, BE, deel 12, nr. 5, 1 april 2006 (2006-04-01), bladzijden 468-472, XP019349560 ISSN: 1432-1858;  ROY KNECHTEL: "Glass frit bonding: an universal technology for wafer level encapsulation and packaging" MICROSYSTEM TECHNOLOGIES ; MICRO AND NANOSYSTEMS INFORMATION STORAGE AND PROCESSING SYSTEMS, SPRINGER-VERLAG, BE, deel 12, nr. 1-2, 1 december 2005 (2005-12-01), bladzijden 63-68, XP019349513 ISSN: 1432-1858;  DOUGLAS SPARKS ET AL: "Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs" JOURNAL OF MICROMECHANICS&MICROENGINEERING, INSTITUTE OF PHYSICS PUBLISHING, BRISTOL, GB, deel 15, nr. 8, 1 augustus 2005 (2005-08-01), bladzijden 1560-1564, XP020091650 ISSN: 0960-1317;  ROY KNECHTEL: "Glass frit bonding: an universal technology for wafer level encapsulation and packaging", MICROSYSTEM TECHNOLOGIES ; MICRO AND NANOSYSTEMS INFORMATION STORAGE AND PROCESSING SYSTEMS, SPRINGER-VERLAG, BE, vol. 12, no. 1-2, 1 December 2005 (2005-12-01), pages 63 - 68, XP019349513, ISSN: 1432-1858,relevantClaims[1-3,6-14,16],relevantPassages[&lt;pp&gt;W&lt;/pp&gt;];  KNECHTEL R ET AL: "Wafer level encapsulation of microsystems using glass frit bonding", MICROSYSTEM TECHNOLOGIES ; MICRO AND NANOSYSTEMS INFORMATION STORAGE AND PROCESSING SYSTEMS, SPRINGER-VERLAG, BE, vol. 12, no. 5, 1 April 2006 (2006-04-01), pages 468 - 472, XP019349560, ISSN: 1432-1858,relevantClaims[1,8,9,14,16],relevantPassages[&lt;pp&gt;W&lt;/pp&gt;];  DOUGLAS SPARKS ET AL: "Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs", JOURNAL OF MICROMECHANICS & MICROENGINEERING, INSTITUTE OF PHYSICS PUBLISHING, BRISTOL, GB, vol. 15, no. 8, 1 August 2005 (2005-08-01), pages 1560 - 1564, XP020091650, ISSN: 0960-1317,relevantClaims[1,8,9],relevantPassages[&lt;pp&gt;W&lt;/pp&gt;]CN101490853-B  Roy Knechtel.Glass frit bonding: an universal technology for waferlevel encapsulation and packaging.Microsyst Technol 12.2005,(12),63-68.