NOVELTY - An electronic device module comprises: at least one electronic device, and an polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprises a polyolefin copolymer; optionally, free radical initiator or a photoinitiator (at least 0.05 wt.%); and optionally, a co-agent (at least 0.05 wt.%).    USE - As an electronic device module (claimed).    ADVANTAGE - The polymeric material is in contact with at least one surface of the device or other article in a similar manner as a coating is in contact with a substrate and the face of the device and with the material exhibits good to excellent adhesion to the face of the device. The device module allows for the use of higher processing temperatures which, in turn, allows for faster production rates without unwanted gel formation in the encapsulating polymer due to extended contact with the metal surfaces of the processing equipment. The polymeric material further comprises a graft polymer to enhance its adhesive property relative to the at least one of the electronic device and glass cover sheet. The polyolefin copolymers have a 2% secant modulus of less than or equal to 150 (preferably 140, especially 100) mPa as measured by the procedure of ASTM D-882-02. Low modulus polyolefin copolymers provide stability under stress, e.g. less prone to crack upon stress or shrinkage. The polyolefin has alpha -olefin content of 15-50 wt.%. Greater the alpha -olefin content of the interpolymer, the lower the density and the more amorphous the interpolymer, and this translates into desirable physical and chemical properties for the protective polymer component of the module.    DETAILED DESCRIPTION - An electronic device module comprises: at least one electronic device, and an polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprises a polyolefin copolymer with at least one property of (a) a density of less than or equal to 0.90 g/cc, (b) a 2% secant modulus of less than or equal to 150 megaPascal (mPa) as measured by ASTM D-882-02, (c) a melt point of less than or equal to 95C, (d) an alpha -olefin content of 15-50 wt.%, (e) a glass transition temperature (Tg) of less than or equal to -35C, and (f) a short chain branch distribution index (SCBDI) of at least 50%; optionally, free radical initiator or a photoinitiator (at least 0.05 wt.%); and optionally, a co-agent (at least 0.05 wt.%).