TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Component: The rheology modifier comprises magnesium oxide.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Component: The conductive filler comprises graphite powder, carbon fiber, carbon black, coke, and/or carbon nanotubes.    TECHNOLOGY FOCUS - POLYMERS - Preferred Component: The block copolymer is copolymerized in the presence of a radical initiator, and comprises 1-50 wt.% rubber; 10-60 wt.% vinyl ester resin; and 10-40 wt.% crosslinking agent. The radical initiator comprises tert-butylperoxybenzoate or peroxybenzoate. The rubber comprises poly butadiene, nature rubber, polyisoprene, styrene-butadiene rubber, butadiene nitrile rubber, ethylene-propylene, polychloroprene, chlorinated polyethylene, silicone, and/or fluorocarbon. The vinyl ester resin has functional groups comprising bisphenol A epoxy-based methacrylate, bisphenol A epoxy-based acrylate, tetrabromo bisphenol A epoxy-based methacrylate, or phenol-novalac epoxy-based acrylate. The electrically conductive composite comprises a rheology modifier or a demolding agent comprising fluorine wax, metal soap, hydrocarbon wax, polyethylene, amide wax, fatty acid, fatty alcohol, or fatty ester. Preferred Parameter: The rubber has a molecular weight of 1000-10000, preferably 4500-5500. Preferred Compound: The rubber is poly acrynitrile butadiene copolymer. The crosslinking agent is a vinyl monomer, which comprises alpha-methyl styrene monomer, chlorostyrene monomer, divinyl benzene, vinyl toluene, divinyl toluene, diallylphthalate monomer, methylmethacrylate, and/or acrylic nitrile monomer. EXAMPLE - Styrene (8-16%) was added with rubber enforced vinyl ester resin (12-24%) (40% of a styrene monomer), tert-butylperoxybenzoate (1-3 parts/100 parts resin (phr)), and fluorine wax (2-6 phr). The mixture was stirred for 20-30 minutes, and sealed during stirring to prevent vaporization of styrene. The mixture and graphite powder (60-80%) were then kneaded for 30-40 minutes. Before hot embossing, a mold was heated to 140-190degreesC. The kneaded mixture was then charged into cavities of the mold. The mold was subsequently pressurized to 100-150 kg/cm2 for 5-10 minutes to harden the kneaded mixture. After demolding, the hardened mixture was charged at 140-190degreesC for 24 hours to ensure complete hardening. The resulting exhibited tensile strength of 3450 psi, flexural strength of 6100 psi, conductivity of 150 S/cm, and good hermiticity.