NOVELTY - The solar cell texturing method comprises coating an ink containing metal particles on a surface of a substrate, drying the ink to attach the metal particles to the surface of the substrate, and differentially etching the surface of the substrate using the metal particles as a catalyst to form an uneven portion. The coating takes place using a screen printing method, a spray coating method, and a spin coating method. The surface of the substrate is etched by performing a wet etching process using an etchant in which hydrogen fluoride, hydrogen peroxide and water are mixed.    USE - The method is useful for texturing a solar cell.    ADVANTAGE - The method is capable of simply texturing the solar cell by wet etching the substrate using a metal catalyst and reducing a reflectance of light incident on the substrate and recombination of carriers thus improving the energy conversion efficiency of the solar cell.    DETAILED DESCRIPTION - The solar cell texturing method comprises coating an ink containing metal particles on a surface of a substrate, drying the ink to attach the metal particles to the surface of the substrate, and differentially etching the surface of the substrate using the metal particles as a catalyst to form an uneven portion. The coating takes place using a screen printing method, a spray coating method, and a spin coating method. The surface of the substrate is etched by performing a wet etching process using an etchant in which hydrogen fluoride, hydrogen peroxide and water are mixed. A depth of the uneven portion depends on a composition ratio of the etchant. The ink includes nanosized metal particles and water. Each of the metal particles has a diameter of 100-300 nm. The remaining metal particles are removed after etching the surface of the substrate and after forming the uneven portion. The metal particles are removed: using an aqueous solution obtained by mixing iodine with potassium iodine, where the remaining metal particles are formed of gold; using nitrate-based aqueous solution, where the remaining metal particles are formed of silver; using bromide-based, chloride-based, nitrate-based and sulfate-based aqueous solutions or a mixed aqueous solution, where metal particles are formed of copper; using an aqueous solution obtained by mixing sulfuric acid with nitric acid, where the remaining metal particles are formed of aluminum; and using chloride-based and nitrate-based aqueous solutions or a mixed aqueous solution, where the remaining metal particles are formed of platinum or palladium. Conductive type impurities are injected into the surface of the substrate, before and after coating the ink on the surface of the substrate. The conductive type is opposite to a conductive type of the substrate. An INDEPENDENT CLAIM is included for a solar cell.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of a solar cell.    Substrate (10)    P-type semiconductor (101)    N-type semiconductor (102)    Electrodes (103, 104)    Uneven portions. (205)