NOVELTY - The method involves forming a liquid film (31) containing silicone material and electroconductive particles (32) on a base material (21) with the wiring pattern (212). A base material (22) with the wiring pattern (222) is placed on the liquid film to obtain a temporarily joined structure (5). The electric field or magnetic field is applied to the liquid film so that the electroconductive particles are distributed unevenly between the wiring patterns. The liquid film is dried and a joining film (3) is formed in between the base materials to obtain a permanently joined structure (1).    USE - Joining method of two base materials to obtain joined structure (claimed) e.g. electric circuit comprising drive integrated circuit (IC) package joined to wiring board in transmissive LCD. Can also be used in joining of other elements such as transistor, diode, quartz oscillator, diffraction grating, optical filter, pressure sensor, acceleration sensor, fuel cell to corresponding boards in manufacture of organic electroluminescent element, electrophoretic display element, fuel cell system, and other electronic circuits.    ADVANTAGE - As the base materials are joined under low temperature condition, generation of the thermal stress in the joining interface is prevented and the strength of the joint interface is improved. The base materials are firmly joined and the wiring patterns are electrically connected through the electroconductive particles easily while reducing the electrical resistance between the electrically conductive film. Generation of the curvature and the peeling of the base material are prevented easily. The joined structure facilitates assembling of the electric circuit without loss and short circuit. The joining film exhibiting the excellent anisotropic conductivity can be produced efficiently.    DETAILED DESCRIPTION - The liquid film contains electroconductive particles and silicone material. The silicone material contains polymethylsiloxane with silanol group. The electroconductive particles comprise substrate particles covered by metal films. The substrate particles are made of resin. The electroconductive particles can be made of ferromagnetic material e.g. iron, cobalt or nickel. The average particle diameter of the electroconductive particle is 0.5-100micrometers. The electroconductive particle has resilience. The joining film having average thickness of about 100nm-100micrometers is formed by drying of the liquid film and contains 1-50 mass% of the electroconductive particles. The electrically conductive films (212a,222a) of the wiring patterns formed on the base materials on both sides of the liquid film contain nickel, copper or gold as main material. The energy beam e.g. ultraviolet rays having wavelength of about 136-300nm is irradiated onto the joining film in atmospheric condition and compressive force of about 0.2-10MPa is applied to the joining film after heating the joining film to 25-100?0C, to form the permanently joined structure. An INDEPENDENT CLAIM is included for joined structure.    DESCRIPTION OF DRAWING(S) - The drawing shows cross-sectional views explaining formation of the joined structure. (Drawing includes non-English language text)    Joined structure (1)    Temporarily joined structure (5)    Base materials (21,22)    Liquid film (31)    Electroconductive particles (32)    Wiring patterns (212,222)    Electrically conductive films (212a,222a)