NOVELTY - Method for patterning a substrate, comprises: disposing a molecular resist composition comprising an organic amine on a substrate, where the organic amine adheres to the substrate by a non-covalent interaction in a pattern having at least one lateral dimension of 500 mu m or less; and reacting a portion of the substrate not covered by the pattern to form a feature on it, where the feature has a lateral dimension defined by the pattern.    USE - The method is useful for: patterning the substrate (all claimed), where the substrate is e.g. electronic elements, fabrics, display devices, packaging, windows, mirrors, optical elements, watch crystals, holograms, optical filters, data storage devices (e.g. compact discs, digital versatile discs and Blu-ray discs), flat panel displays (e.g. liquid crystal displays, plasma displays, light-emitting diode (LED) displays, organic LED displays), personal music devices and touch-screen displays (e.g. computer touch screens, cellular phone touch screens and personal data assistants), solar cells, photovoltaic, lighting, flexible electronics, flexible displays (e.g. electronic paper and electronic books), cellular phones, global positioning systems, calculators, diagnostics, sensors, resist layers, biological interfaces, antireflection coatings, graphic articles (e.g. signage), batteries, fuel cells, antennas, motor vehicles, artwork (e.g. sculptures, paintings and lithographs) and jewelry.    ADVANTAGE - The method provides patterning of the substrate in cost-effective and reproducible manner. The molecular resist compositions provide significant benefits over traditional polymer-based etch resists, where polymeric etch resists are typically deposited by blanket deposition methods such as spin-coating or spraying that require a flat or planar substrate, but the molecular resist compositions can be patterned on any substrate irrespective of geometry and curvature. Additionally, the molecular etch resists can form a pattern via self-assembly without the need for exposure using a costly lithographic apparatus.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for:    (1) a product prepared by the process;    (2) a method for patterning a substrate, comprising contacting a substrate with a stamp having a surface including at least one indentation in it to provide a first pattern on the substrate defined by the at least one indentation, disposing a molecular resist composition comprising an organic amine on the substrate, where the organic amine adheres by a non-covalent interaction to an area of the substrate not covered by the first pattern and etching the area of the substrate covered by the first pattern to form a feature on it;    (3) a molecular resist composition comprising an organic amine (0.01-5 wt.%), a first solvent (80 wt.% or greater) having a boiling below 100 degrees C, at least one second solvent (15 wt.% or less) having a boiling point greater than or equal to 100 degrees C and an optional surfactant or a stabilizer; and    (4) a composition comprising either a substrate having a surface either comprising the pattern comprising an organic amine, and a thin film comprising a self-assembled monolayer-forming species adjacent to the pattern and covers the area of the surface not covered by the pattern or a substrate having a surface including at least one etched indentation in it, the etched indentation forming a pattern in the surface and having a thin film comprising an organic amine adhered to the substrate by a non-covalent interaction on the raised areas of the pattern, where the etched indentation is free from the organic amine.    DESCRIPTION OF DRAWING(S) - The figure shows the cross-sectional view of method of patterning the substrate.