TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The amount of the graphite filler is of 50-90 (preferably 70-90) vol.% by volume of the composition. The graphite filler is graphite powder with an average particle diameter of 30-100 (preferably 40-80) mu m.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Method: The composition (C1) is prepared at 0-60 degrees C (preferably at room temperature). The viscosity of the prepared composition (C1) is 100-200 cPs. The composition (C1) is molded at temperature of 120-190 (preferably 170-190) degrees C. The composition (C1) is molded under a mould pressure of greater than 30 (preferably greater than 40) MPa. The composition (C1) is formed into a precursor before the molding. The precursor is pre-compacted and degassed before it is molded into the bipolar plate. Preferred Components: The metal amine complex is boron trifluoride or boron trichloride-based amine complex. The metal amine complex is boron trichloride monoethylamine complex. The composition comprises the metal amine complex in a quantity of 2-10 (preferably 2-8) parts by weight of the composition. The epoxy resin is bisphenol A and/or bisphenol F. The composition comprises epoxidized castor oil. The composition comprises epoxidized 1,6-hexanediolb. EXAMPLE - A bipolar plate composition comprising: resin containing bisphenol F (30 parts by hundred (phr)), bisphenol A (60 phr), and epoxidized 1,6-hexanediol as reactive viscosity cutter (10 phr); curing agent containing boron trichloride monoethyl amine (8 phr); and graphite filler having D90 value of 60-80 microns, was prepared. The resin composition and the curing agent are mixed and after that the mixed resin/curing agent mixture was combined with a ratio of 20 vol.% with 80 vol.% of graphite filler. This mixture was combined to receive a uniform mass. The prepared mass was then applied in the compression mold and pressed into bipolar plate in elevated temperature and cured at 180-190 degrees C for less than 360 (preferably less than 180) seconds. The applied mold pressure was exceed 30 (preferably 40) MPa to gain dense and low-porosity plate. The electrical conductivity of such a plate was around 100 S/cm. The plate was less than 10 mm thick and having a flexural strength of around 40 MPa.