NOVELTY - Applying a metal layer to a substrate by deposition of a metal from a metallic salt solution, is claimed, where the substrate surface comprises exfoliated graphite.    USE - The exfoliated graphite is useful for applying a metal layer on a substrate. The substrate surface is useful: for conducting an electric current, heat, as decorative metal surface, for screening an electromagnetic radiation and for the magnetization; as a printed circuit board, radio frequency identification-antenna, transponder antenna, other antenna structure, heated seats, flat cable, foil ladder, solid-state smart card, conducting path in solar cell or in liquid-crystal display- and/or plasma screens or for the manufacture of chemically and/or galvanically coated products in any form. The metallized molded part is useful as electrically conductive components, electromagnetic interference-shielding like absorbers, shock absorbers or reflectors for electromagnetic radiation, gas barrier, and decorative parts, preferably in the automobiles, sanitary ware, toys, household and office area (all claimed).    ADVANTAGE - The process provides the plastic moldings with good mechanical properties, preferably good toughness, ductility, and good processing properties e.g. in molding processes for the production of complexly formed component, without extensive pretreatment of the plastic surface and also improved property combination of low weight and high electrical conductivity. The process provides the metal layer with good adhesion to the substrate in short galvanizing time inexpensively and with good quality on a substrate deposited. The process provides: homogeneous and uniform metal coatings on electrically non-conductive materials; and the molded parts with very good toughness, dimensional stability, thermal conductivity, dispersibility, flowability and faster metallization.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for:    (1) the substrate surface at least partially exhibiting an electrically conductive metal layer, obtained by the above process;    (2) a thermoplastic molding mass for the manufacture of currentless and/or galvanically metallizable molded part, comprising 20-98 wt.% of thermoplastic polymers A, 1-30 wt.% of the exfoliated graphite as a component B, 1-70 wt.% of an electrically conductive particle with an average particle diameter of 0.01-100 mu m as a component C, 0-10 wt.% of a dispersing agent as a component D, and 0-40 wt.% of fiber or particulate filler or its mixture as a component E;    (3) preparing the currentless and/or galvanically metallized molded part, comprising melt mixing the thermoplastic molding mass, extruding or injection molding, optionally followed by one or more further forming processes, and subsequently currentless and/or galvanically depositing a metal layer from a metal salt solution, where optionally before the currentless and/or galvanic metal separations, a surface activation of the thermoplastic molding mass is carried out;    (4) the metallized molded part, obtained by the above process;    (5) a dispersion for applying a metal layer on the electrically non-conductive substrate, comprising 0.1-99.8 wt.% of an organic binding component A, 0.1-30 wt.% of exfoliated graphite B, 0.1-70 wt.% of electrically conductive particle C, 0-99.7 wt.% of a solvent component D and optionally further at least one of the components of 0.1-20 wt.% of a dispersing agent component E and 0.1-40 wt.% of an additive F;    (6) preparing the dispersion, comprising mixing the components A-D, and optionally E, F and further components, and dispersing the mixture; and    (7) producing a metal layer on at least a portion of the surface of a non-electrically conductive substrate, comprising (i) at least partially applying the dispersion on the substrate; (ii) at least partially drying and/or partially hardening the applied dispersion layer on the substrate; and (iii) currentless and/or galvanically depositing the metal on the partially dried and/or partially hardened dispersion layer under the formation of a metal layer, where optionally a surface activation of the partially dried and/or partially hardened dispersion layer, is carried out in step (ii) and (iii).