NOVELTY - Depositing a material on a receiving substrate (1) involves providing a source substrate (6) having a back surface carrying at least one piece of coating material, and a front surface; providing a receiving substrate positioned adjacent to the source substrate and facing the coating material; and radiating light towards the front surface of the source substrate, to remove at least one piece of the coating material from the source substrate and deposit the removed at least one piece onto the receiving substrate as a whole.    USE - For depositing a material on a receiving substrate. For a solar cell which is useful in a solar flat panel (claimed). The material is e.g. conductors, in a patterned form onto a receiving substrate.    ADVANTAGE - The trenches provide easier and faster filling of the source substrate with the coating material. An additional advantage of trenches is that it is easier to produce a source substrate with a relatively thick coating (e.g. having a height more than 1) and more accurate dimensions when the coating material is provided in trenches. The method coats the sidewalls of the trenches with a low adhesion or low surface energy material, thus reduces adhesion of that the coating material to the sidewalls to ensure that the material is deposited from the source substrate when the back surface of the coating material is released from the source substrate. The back of the trench is coated with a high adhesion material or is textured (e.g. rough) to provide good adhesion of the coating material in the trench, preferably eliminating bubbles in the filled trench. The textured surface increases the surface energy of the surface and ensures that the material will be filled in the trench despite the low surface energy material at the sidewalls.    DETAILED DESCRIPTION - Depositing a material on a receiving substrate (1) involves providing a source substrate (6) having a back surface carrying at least one piece of coating material, and a front surface; providing a receiving substrate positioned adjacent to the source substrate and facing the coating material; and radiating light towards the front surface of the source substrate, to remove at least one piece of the coating material from the source substrate and deposit the removed at least one piece onto the receiving substrate as a whole. The step of radiating light towards the front surface of the source substrate involves heating the coating material thus volatizing volatile material between the back surface of the source substrate and the coating material, which provides a force for removing the coating material from the back surface of the source substrate. The radiating light comprises radiating with a continuous laser radiation, high repetition pulsed laser, or broadband flash light beam. The method further involves cleaning the source substrate at a portion from which the coating material was deposited to the receiving substrate; radiating light towards the receiving substrate, to ablate openings in the receiving substrate; and aligning the source and receiving substrate such that radiating light radiated towards the source substrate will cause the removed piece of coating material to be deposited in the ablated opening in the receiving substrate. INDEPENDENT CLAIMS are included for the following:    (1) a solar cell made of a silicon wafer carrying conductor lines on at least one side of the wafer, where the conductor lines are deposited by the depositing method; and    (2) a system (100) for producing a receiving substrate, comprising: a source substrate carrying patterned coating material which coats less than an entire surface of the source substrate; a receiving substrate positioned adjacent the source substrate and facing the coating material; and a depositing light source adapted to radiate light towards the source substrate such that coating material will be deposited on the receiving substrate.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of a scanning system.    Receiving substrate (1)    Source substrate (6)    Laser beams (9a, 9b and 9c)    Laser source (12)    Controller (39)    Scanning system (100)