TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The powder material is oxide of aluminum, barium, beryllium, bismuth, calcium, cerium, cobalt, chromium, copper, dysprosium, erbium, iron, gallium, germanium, gadolinium, lanthanum, indium, magnesium, molybdenum, manganese, neodymium, niobium, nickel, praseodymium, lead, silicon, samarium, strontium, scandium, tin, antimony, selenium, tantalum, titanium, tellurium, thorium, tungsten, yttrium, ytterbium or zirconium, or their salt. The solute contains organic or inorganic metallic salt of formula: MxB'y(a).The porous substrate is sintered in atmosphere of air, oxygen, nitrogen, argon gas, hydrogen, ammonia gas or helium gas.M=aluminum, barium, beryllium, bismuth, calcium, cerium, cobalt, chromium, copper, dysprosium, erbium, iron, gallium, germanium, gadolinium, lanthanum, indium, magnesium, molybdenum, manganese, neodymium, niobium, nickel, praseodymium, lead, silicon, samarium, strontium, scandium, tin, antimony, selenium, tantalum, titanium, tellurium, thorium, tungsten, yttrium, ytterbium or zirconium;B'=NO3-1, CO3-2 or organic anion;x=1-4;andy=1-5.Preferred Properties: The powder material has average particle diameter of 0.01 to 10 mu m. The powder material is calcined at 800-1400 degrees C. The porosity of porous substrate is 30-50%, after calcination. The density of deposit solution is 0.01-1 mol/L. The container having deposit solution and porous substrate is at 10-200 degrees C and pressure of 0.1-0.4 MPa. The solute in the substrate material pore canal is washed by volatilization process for 2 hours. The temperature of oven is 40-150 degrees C. The porous substrate is dried for 0.5-10 hours. The porous substrate is sintered at 500 degrees C with 1-5 degrees C/minute, and at 800-1600 degrees C with 5-10 degrees C/minute. The porous substrate is sintered for 2-50 hours. The porous substrate is cooled to room temperature. Preferred Process: The powder material is subjected to pressing, casting, extrusion, grouting, pricking film, slurry forming or silk screen printing process to obtain porous substrate material. The peripheral sealing of porous substrate is mechanical sealing or chemical sealing, and the solution contacts with the porous substrate.    TECHNOLOGY FOCUS - MECHANICAL ENGINEERING - Preferred Apparatus: The container is a device which seals the periphery of the porous substrate.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Compound: The solvent is methanol, ethanol, benzene, toluene, dimethylbenzene, cinnamene, acetone, ethyl ketone, ethyl benzene, ethyl acetate, chloroform, tetrahydrofuran or water.