TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The average distance between adjacent through holes is 5-30 or 8-130 nm. The through holes have polygon-like cross sections, preferably pentagon and hexagon cross sections. The copper source solution is a copper salt solution or a cuprous salt solution. The chelating agent is a bidentate chelating agent (preferred), a tridentate chelating agent, a tetradentate chelating agent or a hexadentate chelating agent. The bidentate chelating agent is an acid compound of formula (HOOC-(CR1R2)n-COOH) or amine compound of formula (R3R4N-(CR1R2)n-NR3aR4a), preferably ethylmalonic acid, N,N-dimethylethylenediamine, trimethylenediamine or ethylenediamine. The tridentate chelating agent is amine compound of formula (NR3R4-(CR1R2)n-NR5R6-(CR1aR2a)m-NR3aR4a), (R3N((CR1R2)nCOOH)2) or (R3N((CR1R2)nOH)2), preferably diethanolamine, diethylenetriamine or aminodiacetic acid. The tetradentate chelating agent is amine substituted acid compound of formula (N((CR1R2)nCOOH)3) or (N((CR1R2)nOH)3), preferably triethanolamine or ammoniatriacetic acid. The hexadentate chelating agent is acid compound of formula (2(HOOC-(CR3R4)n)N-(CR1R2)m-N((CR3aR4a)rCOOH)2), preferably EDTA. The first sulfur-based reducing agent is sodium hydrogen sulfite or sodium sulfide, and the second sulfur-based reducing agent is sodium sulfide or sodium thiosulfate. The concentrations of the copper source, chelating agent, first sulfur-based reducing agent and the second sulfur-based reducing agent in the mixture solution are 0.05-1 M.R1-R4, R3a, R4a = H or 1-6C alkyl; andn, m, r = 1-6.Preferred Method: The method further comprises a step for filtrating, washing and drying after the reaction is accomplished. EXAMPLE - Copper sulfide solution (0.05 M) was prepared and heated until the temperature reaches 65 degrees C. Then, at the same temperature, ethylenediamine was added into the copper sulfide solution and stirred to form a mixture solution. The concentration of ethylenediamine in the mixture solution was 0.05 M. Subsequently, sodium hydrogen sulfite and sodium sulfide were added in the mixture solution in sequence to perform reaction for 5 seconds at 65 degrees C. The concentrations of sodium hydrogen sulfite and sodium sulfide in the mixture solution were 0.05 M, respectively. The obtained powder-like product was filtered, washed with deionized water and dried to give porous copper sulfide nano/micrometer hollow sphere.