TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The vinyl monomer is of formula (R1-S(O)-)a1-L1-(Het1-C(O)-C(R2)=CH2)a2 (I) or (R11-S(O)2)a11-L11-(Het11-C(O)-C(R12)=CH2)a12 (II) (1-80 wt.%).R1=T1;T1=alkyl, aryl, aralkyl, or alkylaryl;R11=T1 (preferably alkyl or aryl);R2,R12=T2;T2=hydrogen atom or alkyl (preferably hydrogen atom);L1,L11=linking group;Het1,Het11=T3;T3=oxygen atom or imino group (preferably oxygen atom);a1,a2,a11,a12=1-4.Provided that the compound (I) contains a tertiary carbon atom in R1 or L1; the compound (II) contains a tertiary carbon atom in R11 or L11. In the vinyl monomer (II), at least one tertiary carbon atom is positioned at the alpha -position or beta -position relative to the sulfonyl group.    TECHNOLOGY FOCUS - POLYMERS - Preferred Method: The inorganic layer is formed on the organic layer so that it is in contact with the organic layer; or is formed after plasma treatment of the surface of the organic layer. Preferred Components: The polymer has a structural unit of formula (R21-S(O))a21-L21-(Het21-C(O)-C(R22)(CH2-))a22- (Ib) or (R31-S(O)2)a31-L31-(Het31-C(O)-C(R32)(CH2-))a32- (Ic) (1-80 mass.%).R21,R31=T1;R22,R32=T2;L21,L31=linking group;Het21,Het31=T3;a21,a22,a31,a32=1-4.Provided that the structural unit (Ib) contains a tertiary carbon atom in R21 or L21; the structural unit (Ic) contains a tertiary carbon atom in R31 or L31. In compound (Ib) or (Ic), at least one tertiary carbon atom is positioned at the alpha -position or beta -position relative to the sulfonyl group. Preferred Film: The barrier film substrate (S1) has the barrier layer on both surfaces of the plastic film; has, on the plastic film, at least two pairs of composite layers each containing an inorganic layer and organic layer that are adjacent to each other; has a water vapor permeability at 40 degrees C and a relative humidity of 90% of less than 0.01 g/m2/day. SPECIFIC COMPOUNDS - 28 Compounds are disclosed as the vinyl monomer e.g. CH3-CH(CH3)-S(O)-CH2-C(O)-O-CH2-CH2-NH-C(O)-C(CH3)=CH2; CH3-CH(CH3)-S(O)-CH2-C(O)-O-CH2-CH2-O-C(O)-C(CH3)=CH2; CH3-S(O)-CH(CH3)-C(O)-CH2-CH2-O-C(O)-CH=CH2; (CH3)2CH-S(O)-CH2-C(O)-O-CH2-CH2-NH-C(O)-CH=CH2; and (CH3)2CH-S(O)-CH2-C(O)-O-CH2-CH2-O-C(O)-CH=CH2.    EXAMPLE - Barrier film substrate was prepared as follows: A first inorganic layer, first organic layer, second inorganic layer, second organic layer, third inorganic layer, third organic layer and fourth inorganic layer were formed on a plastic film, thus producing a barrier film substrate. The first inorganic layer was prepared as follows: Using a sputtering apparatus, a first inorganic layer (aluminum oxide) was formed on Teonex Q65FA (RTM: polyethylene naphthalate film having a thickness of 125 mu m), aluminum was used as the target, argon was as the discharge gas and oxygen was as the reaction gas. The film formation pressure was 0.1 Pa, and the ultimate film thickness was 50 nm. The first organic layer was prepared as follows: Onto the first inorganic layer formed on the plastic film, applied was a mixture solution of monomer having a compound of formula H2C=CH-COO-CH2-C(C2H5)(C4H9)-CH2-OCO-CH=CH2 (BEPGA) (66 mass.%), CH2=CH-C(O)-O-CH2-C(CH2CH3)(CH2-O-C(O)-CH=CH2)-CH2-O-C(O)-CH=CH2 (TMPTA) (14 mass.%) and compound of formula CH3-S(O)-CH(CH3)-C(O)-CH2-CH2-O-C(O)-CH=CH2 (S3) (20 mass.%) (20 g), Irgacure 907 (RTM: UV polymerization initiator) (0.6 g) and 2-butanone (200 g) to a liquid thickness of 5 mu m, using a wire bar. This was dried at room temperature for 2 hours, then cured through irradiation with UV rays from a high-pressure mercury lamp (total irradiation dose, 2 J/cm2) thus forming a first organic layer. In every case, the film thickness was about 500 nm. The first organic layer was processed for plasma treatment, attained, using a sputtering apparatus at an inner pressure of 0.5 Pa (argon/oxygen=9/1) and a power of 50 W for 5 minutes. The second inorganic layer was prepared as follows: A second inorganic layer was formed on the first organic layer according to the same process as that for the first inorganic layer. The second organic layer was prepared as follows: A second organic layer was formed on the second inorganic layer according to the same process as that for the first organic layer. The second organic layer was similarly processed for plasma treatment. The third inorganic layer was prepared as follows: A third inorganic layer was formed on the second organic layer according to the same process as that for the first inorganic layer. The third organic layer was prepared as follows: A third organic layer was formed on the third inorganic layer according to the same process as that for the first organic layer. The third organic layer was similarly processed for plasma treatment. The fourth inorganic layer was prepared as follows: A fourth inorganic layer was formed on the third organic layer according to the same process as that for the first inorganic layer. The obtained barrier film substrate with vinyl monomer containing sulfonyl group content of 20% was evaluated for water vapor permeability and adhesiveness and found to be less than 0.01 and 95%.