TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Method: The method further comprises: (d) washing the silicon material with optionally ultrasonic aids; (e) drying the silicon material; (f) etching the silicon material; and (g) drying the silicon material. The prepared silicon material is melted. The preparation of the silicon material comprises at least the process steps (a), (b), (c), (f) and (g). The material mixture distributed on a first vibrating groove, is applied on a filter mechanism, which is preferably shifted during vibration, for removing extraneous material adhered on the surface of the material mixture. The extraneous materials such as hairs or other light articles, are removed by vacuum extraction. A metal separator is used for separating the electrically conductive coarse particles such as metal chips, graphite parts, screws, metallic mechanical parts and/or pinheads. The material mixture enriched with the silicon material that is laminarly distributed after the process step (b), is applied on conveying equipment like conveying band, from which parts such as tape, strongly oxidized silicon material and/or other non- metallic parts which can be removed manually or automatically, are separated out. The stimulation of the material mixture with the first vibration groove, the filter mechanism and the conveying equipment, is regulated by a constant or almost constant flow of materials. The silicon material taken from the conveying equipment is supplied to a cleaning bath, in which a cleaning liquid such as ultra-pure water, distilled water or deionized water is present, where the cleaning liquid is optionally added with surfactant and alcohol. The cleaning liquid is conducted through the cleaning bath in a circular flow and is cleaned and/or filtered from outside of the cleaning bath. The ultrasound aid is coupled in the cleaning liquid existing in the cleaning bath. The silicon material is transported through the cleaning bath by a vibrating device or a conveyor, preferably sieve-like conveyor. The silicon material that is laminarly distributed on the vibrating equipment, is treated according to the cleaning steps described above. The silicon material in the cleaning bath is arranged on a perforated belt, which is shifted during vibration. The silicon material is dried after leaving the cleaning bath. The silicon material is dried in a centrifuge. The silicon material laminarly distributed on a second vibrating groove as the vibrating equipment is dried by hot-air and/or by infra red radiation. The silicon material in the form of a single-layer, is transported after the washing process, to a transporting equipment like second vibration groove by a drying tunnel. The silicon material is subjected to microwaves, during the transport through the drying tunnel. The silicon material is applied during the drying process. The silicon material is transported over a transporting equipment for drying. The silicon material preferably washed with the cleaning fluid is supplied batch-wisely to an etching bath. The silicon material preferably washed with the cleaning fluid is stimulated by an etching bath. The silicon material is etched with an etching liquid such as nitric acid and/or hydrogen fluoride. The silicon material after leaving the etching bath is supplied to a neutralization bath. A neutralization liquid such as water is continuously supplied to the neutralization bath. The neutralization liquid is flowed in a circular path and is cleaned outside of the neutralization bath. The silicon material is transported by the etching bath by a vibration mechanism. The silicon material is laminarly distributed on the vibration mechanism. The silicon material is rinsed and dried after etching. The silicon material is collected after passing through the etching process and following the drying process and a manufacturing process for semiconductor components such as solar cells is performed. Preferred Components: The interior of the silicon material exhibits a contamination of 10 ppt to 300 ppb. Preferred Components: The filter mechanism comprises several filter grooves, which are arranged to each other in a stepwise manner, so that during the transition of a filter grooves to the following filter grooves, a rotation of parts of the material mixture takes place. The first vibration groove is dimensioned in such a manner that it serves as a material storage. The conveying equipment is variable in its transportation speed. The vibrating equipment is arranged at an ascending incline in the cleaning bath or the cleaning bath is held in a diagonally aligned vibrating groove. The perforated belt in the cleaning bath has an angle ( alpha ) of 5-45 degrees , preferably approximately 15 degrees . The perforated belt or the filter attached in a vibrating groove exits in the cleaning bath by the vibrating equipment, over which the silicon material is transported out of the cleaning bath. The vibration mechanism exhibits a perforated belt or a filter band as transportation surface. The vibration mechanism is arranged at an ascending incline in the etching bath. EXAMPLE - No suitable example given.