TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The inorganic dopant is selected from one or combination of the following components: oxide, orthophosphate, condensed phosphate, polyacid, polyacid salt and its hydrate, silicate, sulfate, selenite and arsenide; grain diameter of the inorganic dopant is 0.005-50 mu m and weight ratio of it to the fluoric ion exchange resin is 0.1-100:100. The inorganic dopant is selected from: silicon dioxide (SiO2), zirconium dioxide (ZrO2), titanium dioxide (TiO2), H3PW12O40, cesium bisulfate (CsHSO4), H-montmorillonte, cesium dihydrogen phosphate (CsH2PO4), H-mordenite powder, boron phosphate (BPO4), cerium bi-hydrogen phosphate (Ce(HPO4)2), HTaWO6, zirconium tetraphosphate (Zr3(PO4)4), zirconium bi-hydrogen phosphate (Zr(HPO4)2), hydrogen zirconium triphosphate (HZr(PO4)3), titanium biphosphate (Ti(PO4)2) or dizirconium hydrogen biphosphite (Zr2H(P3O10)2), grain diameter of the inorganic dopant is 0.005-25 micrometers and weight ratio of it to the fluoric ion exchange resin is 0.5-50:100. Preferred Conditions: The fluoric ion exchange resin is formed through copolymerization of fluoric olefin, one or more fluoric olefin monomers with functional radical and one or more fluoric olefin monomers with cross-linking site, or mixture of the copolymer; the fluoric olefin is selected from one or more of tetrafluoroethylene, chlorotrifluoroethylene, trifluoroethylene, hexafluoropropylene and/or polyvinylidene fluoride, optimally, the fluoric olefin is selected from tetrafluoroethylene or chlorotrifluoroethylene; the fluoric olefin monomer with functional radical is selected from one or more of structure showed in the following Formulas (VI), (VII) and/or (VIII); the fluoric olefin monomer with cross-linking site is selected from one or more structure showed in the following formulas (IX) and/or (X). The equivalent weight (EW) value of the fluoric ion exchange resin is 700-1200 mmol/g, there are 2-10 layers of membranes, and the total thickness is 10-50 micrometers.a, b, v=integers between 0 and 1, but they can not be zero at the same time;d=an integer between 0 and 5;n=0 or 1;Rf1, Rf2 and Rf3=respectively selected from perfluoroalkyl or chlorofluoroalkyl;X=selected from F, Cl, Br or I;Y1, Y2, Y3=selected from SO2M, COOR3 or PO(OR4)(OR5);M=selected from Br, F, Cl, OR or NR1R2;R=selected from methyl, ethyl or propyl, H, Na, Li, K or ammonium;R1 and R2=respectively selected from H, methyl, ethyl or propyl;R3=selected from H, Na, Li, K, ammonium, methyl, ethyl or propyl;R4 and R5=respectively selected from H, Na, Li, K, ammonium, methyl, ethyl or propyl;Y4, Y5=respectively selected from Cl, Br, I or CN; a', b', c'=respectively are 0 or 1, but a'+b'+c'is not equal to 0;X1=selected from F, Cl, Br or I;n'=0 or 1; andRf4, Rf5, Rf6=respectively selected from perfluoroalkyl.Preparation: Preparation of the inorganic doped cross-linking multilayer fluoric ion membrane comprises utilizing the pouring, extrusion, heat pressing, spin coating, casting, screen painting technologies, spray finishing or impregnating technology of solution or melt is as follows: (a) scattering fluoric ion exchange resin, inorganic dopant, cross-linking agent, acid and/or free radical initiating agent into solvent to forming mixture, content of the fluoric ion exchange resin in the mixture is 1-80%, weight ratio; (b) utilizing the mixture prepared in (a) to form membrane on flat plate or prepared single-layer membrane or multilayer membrane through solution casting, solution pouring, screen painting technologies, spin coating, spray finishing or impregnating technology; when forming membrane, it is necessary to perform heat treatment for 10-100 minutes at 30-300 degrees C; and (c) cross-linking during or after membrane forming to form cross-linking structures showed in Formulas (I), (II), (III), (IV) and/or (V) according to the following methods: method for forming the cross-linking structure showed in Formula (I) includes heat, light, electronic radiation, plasma body, X radial or free radical evocating agent, or forming cross-linking structure through heat, light, electronic radiation, plasma, X radial or free radical evocating agent with the existence of one or several cross-linking agents; where structure of the used cross-linking agent is showed in the following Formula (XI): X2Rf7X3. The free radical evocating agent is organic peroxide, azo evocating agent; preferably, the evocating agent is peroxide evocating agent; more preferably, the evocating agent is organic peroxide; method for forming cross-linking structure in (II), (III) is using vikane, sulfonyl chloride, sulfuryl bromide typed resin to react with ammonia, hydrazine, organic diamine or substance releasing ammonia, hydrazine and organic diamine by chemical process; the organic diamine is alkyl of C1-C10 or fluoride alkyl diamine, the substance releasing ammonia, hydrazine and organic diamine by chemical process includes organic or inorganic acid salt of ammonia, hydrazine and organic diamine, carbamide or carbamidine; method for forming cross-linking structure in (IV) is using chlorosulfonic acid to process so as to obtain fluoride sulfoacid resin; method for forming cross-linking structure in (V) is forming fluoride sulfoacid resin at cyano site, fluoride sulfuryl fluoride resin at cyano site, sulfonic acid chloride resin at cyano site or sulfuryl bromide resin at cyano site under effect of heat or acid; the acid is strong proton acid or Lewis acid; where the strong proton acid is selected from sulfuric acid (H2SO4), CF3SO3H or phosphoric acid (H3PO4); the Lewis acid is selected from zinc chloride (ZnCl2), iron chloride (FeCl3), aluminum chloride (AlCl3), organic tin, organic antimony or organic tellurium.X2 and X3=selected from Cl, Br or I; andRf7=selected from perfluoroalkyl or chlorofluoroalkyl.Preferred Solvent: The solvent in (a) is one or more of dimethyl formamide, dimethyl acetamide, methyl formamide, dimethyl sulfoxide, N-methyl pyrolidone, hexamethyl ammonium phosphate, acetone, water, ethanol, methanol, propanol, isopropanol, glycol and/or propanetriol; when forming membrane in (b), it is necessary to perform heat treatment for 20-60 minutes under a temperature of 80-250 degrees C; combining the single-layer or multilayer membranes prepared in (c) to get the inorganic doped cross-linking multilayer fluoric ion membrane of the invention.