TECHNOLOGY FOCUS - POLYMERS - Preferred Process: In step (a), one- or two-component(s) reactive adhesive (preferably an adhesive based on cyanoacrylate, acrylate or epoxide) is used as the further adhesive. In the process, as step (d), the reactive adhesive is applied on the first component, before the step (b), so that it binds the first component with the fringe of the second component, when the first component comes into contact with the second component in the step (c). In the process, as the step (d), the reactive adhesive is applied on the fringe of the second component, before the step (b), so that it binds the first component with the fringe of the second component, where the remaining place of the fringe that is free of the reactive adhesive comes in contact with the hot-melt adhesive compound in the step (c). In the process, as step (d), the reactive adhesive, after step (c), is brought into a gap between the first component and the fringe of the second component. The reactive adhesive is applied or brought in the form of an adhesive bead. The first component after adhering to, or the hot melt adhesive compound, and prior to adhering with the second component is stored and/or transported. The first component overlaps with a handling device that binds itself or the hot melt adhesive compound to the first component and subsequently the first component, without intermediate storing, is brought into contact with the second component by using the same device. The handling device comprises one or more heating equipments with which, in the step (b), the fringe of the second component is heated. The second component is metallic at least in the fringe the heating is carried out by direct electromagnetic induction. Preferred Components: The hot-melt adhesive compound is formed such that it comprises at least two approximately parallel surfaces, where the first parallel surface comes in contact with the first component and the second parallel surface comes in contact with the fringe of the second component. The hot melt adhesive compound comprises one or more components of polyolefin, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, polyamide, polyester, polyurethane or butadiene styrene block polymer. The hot melt adhesive comprises one or more components containing cycloaliphatic hydrocarbon resin, copolymer of styrene with isoprene and/or alpha -methyl styrene, which is optionally hydrogenated, hydrogenated polydecene, or copolymer from maleic acid anhydride with ethylene and/or propylene. The reactive adhesive is a single-component polyurethane adhesive, an epoxy resin adhesive, acrylate adhesive or sealant, silicone adhesive or sealant or two-component reactive adhesive.