TECHNOLOGY FOCUS - ELECTRONICS - Preferred Device: The device further comprises two vertically bonded wafers containing the cubic crystalline material, one of the wafers is doped with n-type materials and the other of the wafers is doped with p-type materials. The device further comprises at least one electrical circuit element.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The cubic crystalline material further comprises a dopant. The dopant is a p-type or n-type dopant. The p-type dopant is Boron. The n-type dopant is selected from phosphorus and arsenic. The cubic crystalline material remains attached to the trigonal or hexagonal substrate. The cubic crystalline material has been separated from the trigonal or hexagonal substrate. The alloy of the cubic crystalline material is SiGe, SiGeC or SiC. The trigonal substrate is c-plane sapphire. The alloy is SiGe having an alloy composition of 0.40 Si and 0.60 Ge, the SiGe alloy is doped with Boron at a doping concentration of 0.028x 10-18, and the substrate is c-plane sapphire. The alloy is SiGe having an alloy composition of 0.20 Si and 0.80 Ge, the SiGe alloy is doped with Boron at a doping concentration of 0.027x 10-18, and the substrate is c-plane sapphire. The alloy is SiGe having an alloy composition of 0.1 Si and 0.9 Ge, the SiGe alloy is doped with Boron at a doping concentration of 0.0016x 10-18, and the substrate is c-plane sapphire. The at least one electrical circuit element make a serial connection between the n- and p-type thermoelectric materials. The at least one electrical circuit element make a parallel connection between the n- and p-type thermoelectric materials. The at least one electrical circuit element comprises a heavily doped p- or n-type semiconductor. The at least one electrical circuit element comprises conducting materials selected from metals, semi-metals, silicides, germanicides, zinc oxide, and indium tin oxide (ITO).    TECHNOLOGY FOCUS - METALLURGY - Preferred Components: The conducting material is a metal selected from aluminum, tungsten and gold. EXAMPLE - No suitable example given.