NOVELTY - A vacuum film formation method for forming at least one inorganic layer on a support (15), involves transporting a support of which the area of the surface to be coated with inorganic layer formed on it, is a (unit: cm2) into a first vacuum tank (1) having a capacity of at most 100 cm3 under atmospheric pressure; degassing the first vacuum tank into a vacuum; transporting the support from the first vacuum tank to a second vacuum tank (2) while the vacuum condition is kept as such; and forming at least one inorganic layer on the support in the second vacuum tank.    USE - As vacuum film formation method for forming inorganic layer on a support such as plastic film; in barrier laminate used as a sealant film in a device such as organic electroluminescent (EL) device and in an optical component (claimed); and for film sealing of devices. The device also includes liquid-crystal display device, thin film transistors, touch panels, electronic papers and solar cells.    ADVANTAGE - The barrier laminate exhibits excellent barrier property. The film formation technique is capable of forming an inorganic layer having a good barrier property necessary for liquid-crystal display devices. The method allows formation of inorganic layer having better barrier property in a more simplified manner than conventional method. The optical component exhibits excellent durability. By controlling the relation between the area of the support on which the inorganic layer is to be formed and the capacity of the load-locking chamber to be used in vacuum film formation, inorganic layer having an excellent barrier property can be formed.    DETAILED DESCRIPTION - A vacuum film formation method for forming at least one inorganic layer on a support (15), involves transporting a support of which the area of the surface to be coated with an inorganic layer formed on it, is a (unit: cm2) into a first vacuum tank (1) having a capacity of at most 100 cm3 under atmospheric pressure; degassing the first vacuum tank into a vacuum; transporting the support from the first vacuum tank to a second vacuum tank (2) while the vacuum condition is kept as such; and forming at least one inorganic layer on the support in the second vacuum tank. The inorganic layer is Si3N4 layer or an Al2O3 layer. The inorganic layer is formed according to a chemical vapor deposition (CVD) method. The support is a plastic film. INDEPENDENT CLAIMS are included for the following:    (1) a barrier laminate having inorganic layer formed by the vacuum film formation method; and    (2) a device comprising the barrier laminate.    DESCRIPTION OF DRAWING(S) - The figure shows outline view showing a constitution example of a vacuum film formation apparatus.    First vacuum tank (1)    Second vacuum tank (2)    Third vacuum tank (3)    Gate valves (4, 5, 6, 7)    Exhaust ports (8, 9, 10)    Starting material gas introduction port (11)    Support (15)