NOVELTY - The method comprises bonding layer bodies consisting of transparent front cover (a), photosensitive semiconductor layer (b), a plasticized foil (c) and a reverse cover (d) in a process chamber at 120-190 degrees C and has pressure of 2Pa to 3.104 to a laminate. The laminate is pressed with a surface loading of 1-104 Pa to 12-105 Pa. The plasticized foil has 40 wt.% of plasticizer content. The plasticized foil has one side or both side roughness of 20-180 mu m. The photosensitive semiconductor layers are subjected on a carrier and imbedded between two plasticized foils.    USE - Method for the production of photovoltaic module useful in solar power station, as facade component, roof areas, winter garden cover, sound protection wall, balcony- or parapet element or as a component of window areas (claimed).    ADVANTAGE - The method ensures production of photovoltaic module with good mechanical, chemical and electrical properties and high corrosion resistance thus enabling protection against external influences.    DETAILED DESCRIPTION - The method comprises bonding layer bodies consisting of transparent front cover (a), photosensitive semiconductor layer (b), a plasticized foil (c) and a reverse cover (d) in a process chamber at 120-190 degrees C and has pressure of 2Pa to 3.104 to a laminate. The laminate is pressed with a surface loading of 1-104 Pa to 12-105 Pa. The plasticized foil has 40 wt.% of plasticizer content. The plasticized foil has one side or both side roughness of 20-180 mu m. The photosensitive semiconductor layers are subjected on a carrier, imbedded between two plasticized foils and then bonded with the transparent front cover and the reverse cover or the photosensitive semiconductor layers are subjected on transparent front cover and the reverse cover and are bonded together through the foil.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic representation of a laminate of photovoltaic module.    Transparent front cover (a)    Photosensitive semiconductor layer (b)    Plasticized foil (c)    Reverse cover (d)    Transport band (e)    Laminated module. (f)