TECHNOLOGY FOCUS - ELECTRONICS - Preferred Component: The electronic assembly comprises an electronic device (112) mounted on a substrate by solder joint or other electrical interconnect, and alkali silicate glass-based coating, which partially covers the solder joint or electrical interconnect. The coating covers portion(s) of the metal within the electronic assembly. The electronic device is integrated circuit, resistor, capacitor, diode, light emitting diode, inductor or photovoltaic cell. The coating reduces interaction between the solder joint or electrical interconnect and environment around the surface, and metal is prevented from oxidizing, whiskering, or corroding.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Component: The finish is tin, cadmium or zinc. The alkali silicate glass material is doped with a primary element to affect radiation passing through the coating. The radiation is ultraviolet ray, x-ray, gamma ray, and/or radio wave radiation. The primary element comprises nanoparticles, chemical additive, ceramic particles, fluorescent particles, magnetic materials, rare earth materials, lanthanide materials and/or actinide materials. The coating is partially transparent, when surface is surface of solar cell. The fluorescing particles block ultraviolet light and retransmit usable light to solar cell. The coating is partially transparent, when surface is surface of light emitting diode. The fluorescing particles absorb light from the light emitting diode and retransmit light at a different wavelength. The fluorescing particles are nanophosphors. The alkali silicate glass material is an anti-reflective material improving light transmission into the solar cell. The refractive index of the alkali silicate glass material is modified by a dopant or by modifying the alkali silicate glass chemistry. The curing of the alkali silicate glass material is performed by blowing air across the alkali silicate glass material or by applying heat to the alkali silicate glass material. The alkali silicate glass material coats a galvanic junction in the liquid cooling pipe. The pipe is installed to cool a magnetic resonance imaging device, a nuclear magnetic resonance device, a circuit or collection of circuits, or a power supply. The coolant is water. The pipe is composed of metal, such as copper.