NOVELTY - Wedge imprint patterning method involves disposing patterned deformable stamp (1110) to contact at least one of wafer (1704) and flowable material; heating stamp and wafer to above flow temperature of material; cooling stamp and wafer assembly so that flowable material becomes unflowable; retracting stamp to reveal patterned material covering regions of wafer, which pattern includes at least one open region of wafer not covered by flowable material; and subjecting patterned wafer to at least one subsequent processing step. Flowable material consists of wax or polymer.    USE - Wedge imprint patterning method for imparting pattern to substrate for making patterned substrate with specified texture for e.g. photovoltaic device.    ADVANTAGE - Prevents formation of defects caused by trapped air by applying vacuum to the region between stamp and coated substrate during the process. Provides wedge imprint process that is less susceptible to residual areas of trapped resist material in regions to be opened since tapering form leads naturally to systematically advancing front as the stamp engages the substrate, rather than simultaneous contact at all regions as results naturally from a flat-tipped structure. Enables de-wetting of the substrate by the resist due to use of truly flowable resist material. Enables use of relatively inexpensive low-resolution techniques to form the master since features e.g. grooves formed in the wax resist layer may be substantially smaller than the parent features e.g. wedges created in the stamp master by anisotropic etching. Improves fidelity of flexographic printing due to use of resist material exhibiting thermal phase change or flowability. Eliminates difficulty by combination of low-viscosity heat flowable resist material and wedge-shaped soft tool, thus leading to spontaneous de-wetting of the substrate by the resist material.    DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of a silicon body used to form a master mold covered with a resist layer.    Stamp (1110)    Pyramidal raised wedge feature (1112)    Points (1113)    Wafer (1704)    Rectangular openings (1722)