NOVELTY - The method involves forming a transparent electrode on a light-transmissive substrate (100), and patterning the transparent electrode by removing a portion of the transparent electrode that is utilized as a top electrode (1400). An insulating protective layer (1200) is formed in an edge region of the patterned transparent electrode through a printing process. The substrate is separated into active and inactive regions. The protective layer is formed in the edge region of the transparent electrode and the inactive region. An insulating coating material is cured by utilizing light.    USE - Method for manufacturing a transparent electrode pattern for an electro-optic device such as an optical sensor, organic light emitting device and a solar cell.    ADVANTAGE - The insulating protective layer is formed in the edge region of the patterned transparent electrode through the printing process, so that the manufacturing process of the insulating protective layer can be simplified, thus reducing the manufacturing cost. The transparent electrode can be formed in the line shape on the light-transmissive substrate by patterning the transparent electrode through the laser scribing process, so that the power can be uniformly supplied to the transparent electrode. The method provides the cleaning process to remove impurities from the substrate after the insulating protective layer is formed, thus protecting the patterned transparent electrode of the edge region by the insulating protective layer. The insulating protective layer is locally formed in the edge region of the pattern of the transparent electrode, thus reducing the amount of material.    DETAILED DESCRIPTION - The insulating coating material includes an organic material i.e. photoresist (PR) or an inorganic material such as piezoelectric ceramic (PZT), alumina, oxide and nitride. An INDEPENDENT CLAIM is also included for a method for manufacturing an electro-optic device.    DESCRIPTION OF DRAWING(S) - The drawing shows sectional views illustrating a method for manufacturing an organic light emitting device.    Light-transmissive substrate (1000)    Bottom transparent electrode (1100)    Insulating protective layer (1200)    Hole injection layer (1310)    Top electrode (1400)