TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The filler material is selected from aluminum nitride, calcium carbonate, calcium silicate, talc, barite, clay, titanium oxide, magnetite, aluminum oxide, silicon dioxide, boron nitride, and/or silicon carbide.    TECHNOLOGY FOCUS - INSTRUMENTATION AND TESTING - Preferred Device: In the solar panel, the backsheet comprises a second polymeric material and a second thermal conducting filler material, the backsheet having a dielectric constant of at least 2 measured at 60 hertz and a higher thermal conductivity than the second polymeric material in neat form; the backsheet comprises a glass sheet with a thermal conductivity of at least 1.4 watt per meter per Kelvin; the first polymeric material comprises ethylene vinyl acetate; and the second polymeric material comprises polyethylene terephthalate; and the ethylene vinyl acetate comprises a copolymer of ethylene and vinyl acetate having vinyl acetate (4-90 wt.%) and a melt flow index of 5-40 g/10 minutes. The solar panel further comprises at least one solar concentrator. Preferred Method: In the method, laminating uses a vacuum to remove from the solar panel one selected from air, moisture, and/or other volatiles; and the first sheet of encapsulant material differs from the second sheet of encapsulant material.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The silane coupling agent comprises a first reactivity type selected from amino groups, epoxy groups, phenyl groups, vinyl groups, alkyl groups; and/or a second reactivity type selected from methoxy reactivity groups, and ethoxy reactivity groups.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The polymeric material (P1) is selected from ethylene vinyl acetate, polyurethane, polysilicone, polypropylene, and/or polyethylene ionomers. The filler material comprises glass fibers. The polymeric material (P2) is selected from polypropylene, polyethylene terephthalate, polyvinyl fluoride, polyvinylidene fluoride, and/or polytetrafluoroethylene. The filler material has an average particle size of 0.001-1000 micrometers. The encapsulant forms pellets for additional processing. The encapsulant forms sheets or films. The filler material has an aspect ratio of at least 5. The polymeric material comprises a chemical crosslinking agent. The encapsulant comprises a thermal diffusivity of at least 1.3x 10-7 meters squared per second. The thermal conductivity is measured at 30 degrees C. The backsheet comprises a multilayer material selected from polyvinyl fluoride-polyester-polyvinyl fluoride, polyvinyl fluoride-aluminum-polyvinyl fluoride, polyvinyl fluoride-aluminum-polyester, polypropylene, polyethylene terephthalate, polyvinyl fluoride, polyvinylidene fluoride, and/or polytetrafluoroethylene. Preferred Composition: In the encapsulant, the polymeric material comprises a copolymer of ethylene and vinyl acetate including vinyl acetate (4-90 wt.%); and filler material has an aspect ratio of greater than or equal to 1. The encapsulant comprises the filler material (0.1-30 wt.%). The encapsulant further comprises at least one silane coupling agent for dispersing the filler material in the polymeric material or promoting adhesion of the encapsulant to other materials of a photovoltaic or a semiconductor. The backsheet further comprises additional laminated layers including polyester, aluminum, polyvinyl fluoride, and/or polyvinylidene fluoride. EXAMPLE - No suitable example given.