TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Condition: The predetermined concentration is a concentration at which the solution has a redox potential and the support has another redox potential. The redox potential of the solution is positive with respect to the redox potential of the support. The predetermined concentration of the noble metal compound(s) is 0.1-100 mM. Preferred Component: The noble metal compound(s) is a noble metal salt comprising a noble metal chloride, a noble metal cyanide, or a noble metal nitrate. Preferred Solution: The solution is an aqueous solution, or a molten salt comprising sodium chloride-potassium chloride melt, a sodium hydroxide cryolite melt, and/or imidazolium melt.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Solution: The solution may also be an organic solution comprising propylene carbonate, acetonitrile, and/or dimethylsulfoxide. EXAMPLE - Thin film samples of lanthanum hexaboride were prepared on glass, sapphire, and aluminum oxide substrates via radio frequency magnetron sputtering. A stoichiometric lanthanum hexaboride target having a 6 inch diameter was used as the source material, and an argon plasma, generated at 5 millitorr pressure and 120 Watts of power, was used to deposit the lanthanum hexaboride thin films. The stoichiometry of each of the films was verified using energy dispersive X-ray analysis. An aqueous solution containing 5 mM of chloroauric acid was prepared. Similarly, an aqueous solution containing 20 mM of chloroplatinic acid solution was prepared. At least one drop of each solution was deposited on the lanthanum hexaboride film. After one minute, the specimen was rinsed with de-ionized water to remove excess solution. A gold film and a platinum film were spontaneously deposited on the lanthanum hexaboride film that had been previously sputtered onto a glass slide. Metal deposition was easily observed soon after the acid solutions came in contact with the hexaboride. The thickness of the platinum film was estimated to be 30 nm using a profilometer. The thickness of the metal deposits can be controlled by the acid solution concentration and the reaction time.