NOVELTY - Combinatorial processing comprises receiving a substrate comprising regions, and combinatorially processing the regions on the substrate in a site-isolated manner through a dry vacuum deposition process to complete the structures in each of the regions for optical or electrical screening of the structures. The structure is defined within each of the regions of the substrate. The structure is a partially completed photonic device, optoelectronic device, or a solar cell.    USE - Combinatorial processing for regions of substrate. Can also be used for manufacture of integrated circuits, semiconductor devices, flat panel displays, optoelectronic devices, data storage devices magnetoelectronic devices, magnetooptic devices, molecular electronic devices, magnetooptic devices, molecular electronic devices, solar cells, photonic devices, and packaged devices.    ADVANTAGE - The method enables formation of functional devices that meets the desired performance metrics such as speeds, power consumption, and reliability. The method is capable to process uniformly an entire monolithic substrate and/or across a series of monolithic substrate, and is cost effective. The method allows monolithic substrate to previously and/or processed in separate processing tool(s) within particularly manufacturing flow without the need to alter or modify the separate processing tool and/or process(es) used in separate tool.    DETAILED DESCRIPTION - The vacuum process is physical vapor deposition, chemical vapor deposition, or atomic layer deposition. The method includes processing the regions on the substrate using a wet processing technique before combinatorially processing the regions on the substrate in the site-isolated manner through a dry vacuum deposition process, screening the site-isolated regions using an optical screening technique on the substrate, screening the site-isolated regions using atomic force microscopy, depositing a thin film through a physical mask by a physical vapor deposition process to create the regions on the substrate before receiving the substrate, applying an etchant to the substrate to create the partially completed device, and processing the regions to prepare an exposed surface of the structures for subsequent processing of the exposed surface. The processing using the wet processing technique is combinatorial processing of the regions. The wet processing technique comprises surface modification of the substrate, and etching the substrate. The wet deposition technique comprises an electroless process. The processing to prepare an exposed surface is etch, removal, cleaning or surface modification processes. The processing does not deposit a film. The optical screening technique comprises reflectometry, diffraction, X-ray reflectivity, or X-ray diffraction. The optical screening occurs after combinatorially processing the regions on the substrate.    DESCRIPTION OF DRAWING(S) - The drawing shows a flowchart of combinatorial process sequence integration.