NOVELTY - Polyimide film (I) prepared from an aromatic tetracarboxylic acid component comprising 3,3',4,4'-biphenyltetracarboxylic dianhydride as a main component and an aromatic diamine component comprising p-phenylenediamine as a main component, where the aromatic diamine component comprises not less than 3 mole% but less than 35 mole% of 2,4-toluenediamine based on the total molar quantity of the aromatic diamine component, is claimed.    USE - (I) is useful in copper-laminated polyimide film (claimed). (I) is useful as an insulating substrate material for flexible printed circuits, tape automated bonding, chip on flex, and a metal-wiring board, a cover base material for a metal wiring and a chip such as an integrated circuit chip, and a base material for a liquid crystal display, an organic electroluminescent display, an electronic paper and a solar cell.    ADVANTAGE - (I) has: excellent productivity and excellent linear expansion coefficient close to that of copper; and sufficiently high tensile properties. (I) has improved: adhesiveness, while maintaining the excellent properties of a conventional polyimide film; and sputtering properties, metal vapor deposition properties, and water-vapor permeability. The copper-laminated polyimide film has excellent adhesiveness and sufficiently high peel strength.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for:    (1) preparing (I) comprising providing a solution of a polyimide precursor prepared from the aromatic tetracarboxylic acid component and the aromatic diamine component comprising not less than 65 mole% but less than 97 mole% of p-phenylenediamine and not less than 3 mole% but less than 35 mole% of 2,4-toluenediamine, flow-casting the solution of the polyimide precursor on a support and heating it, thus preparing a self-supporting film of a polyimide precursor solution, and heating the self-supporting film to effect imidization; and    (2) a copper-laminated polyimide film, where a copper foil is laminated on the surface of (I) via an adhesive layer or a thermocompression-bonding layer.