NOVELTY - The method comprises depositing a contact layer (306A) on the front surface of the metallic substrate, depositing an electrically conductive protection layer (308A) (5-100 nm) on the back surface onto which the low resistivity ohmic contact is made to electrically connect the electrically conductive protection layer of the solar cell to the terminal (324A) of the other solar cell, forming an absorber layer (320A) over the contact layer, and depositing an adhesion layer onto the back surface of the metallic substrate before depositing the electrically conductive protection layer.    USE - The method is useful for forming solar cell using metallic substrate with back and front surfaces (claimed).    ADVANTAGE - The method is capable of economically and easily manufacturing the solar cell with improved conversion efficiency and high resistivity.    DETAILED DESCRIPTION - The method comprises depositing a contact layer (306A) on the front surface of the metallic substrate, depositing an electrically conductive protection layer (308A) (5-100 nm) on the back surface onto the low resistivity ohmic contact to electrically connect the electrically conductive protection layer of the solar cell to the terminal (324A) of the other solar cell, forming a absorber layer (320A) over the contact layer, depositing an adhesion layer onto the back surface of the metallic substrate before depositing the electrically conductive protection layer, and depositing a transparent conductive layer (322B) onto the absorber layer. The formation step of absorber layer comprises forming a precursor layer over the contact layer by electroplating, and heating the precursor layer (400-600 degrees C) in an environment. An INDEPENDENT CLAIM is included for a solar cell.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic view of a solar cell string having two solar cells using the base structure.    Contact layer (306A)    Protection layer (308A)    Absorber layer (320A)    Transparent conductive layer (322B)    Terminal. (324A)