NOVELTY - Encapsulant (I) comprises heat conductive material, desiccant and thermoplastic and/or thermosetting polymer.    USE - (I) is useful: for encapsulating a functional component in a non-hermetic enclosure; in the construction of sealed enclosures, which is electric, electronic, optic, photoelectric or photovoltaic modules or devices; for application onto the PV module or between the module and its back enclosure; for the construction of the device; for preventing or minimizing heat buildup, and/or for preventing or minimizing collection of humidity in the device; for fabricating a photovoltaic cell module; for protecting a functional element from exposure to at least one condition comprising humidity, heat, thermal expansion, heat related damage, and humidity related damage; for reducing the exposure of a functional element to the condition; and for decreasing permeating of humidity into a non-hermetic enclosure and decreasing damage to a functional element associated with exposure of the element to one or more of humidity and heat (all claimed). (I) is useful for: preventing corrosion in elements of such non-hermetic enclosures; preventing or minimizing heat buildup, e.g. due to the high heat capacity of (I), in a photovoltaic module; and preventing or minimizing collection of humidity in a PV module.    ADVANTAGE - (I) provides a low cost packaging for a non-hermetic enclosure and/or functional components disposed in that permits heat dissipation within the enclosure, which limits to a minimum or prevents humidity build-up and optionally minimizes stress build-up in the enclosure. (I) avoids or minimizes heat build-up in a functional element, e.g. the photovoltaic, may be imparted also by the inclusion of at least one phase change material. (I) has a desired adhesion, lowered viscosity, wetting of the HTP, HCP and PCM particles and with increased thermal resistance, creep resistance and mechanical strength. (I) has desired elasticity and adhesion. (I) minimizes bleeding.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for:    (1) a process for fabricating a photovoltaic cell module, comprising bringing into contact at least one encapsulant (I) with a photovoltaic cell or an array of photovoltaic cells and/or at least one substrate under conditions permitting (I) to adhere to the photovoltaic cell(s) and/or to the substrate to form a photovoltaic cell module;    (2) a photovoltaic cell module comprising a photovoltaic cell or an array of photovoltaic cells encapsulated in (I), where (I) is optionally adhered to a supporting substrate;    (3) a process for protecting a functional element from exposure to at least one condition comprising humidity, heat, thermal expansion, heat related damage, and humidity related damage, comprising encapsulating the functional element, partially or completely with (I);    (4) a process for reducing the exposure of a functional element to the condition comprising encapsulating the functional element, partially or completely with the encapsulant;    (5) a process for decreasing permeating of humidity into a non-hermetic enclosure, comprising encapsulating the enclosure, partially or completely with (I); and    (6) a process for decreasing damage to a functional element associated with exposure of the element to one or more of humidity and heat, comprising encapsulating the element, partially or completely with (I).    DESCRIPTION OF DRAWING(S) - The figure shows a schematic representation of a photovoltaic module.    Optical units (10, 11, 12)    Photovoltaic cells (20, 21, 22)    Substrate (30)    Encapsulant material layer. (40)