NOVELTY - The method of recycling thin-film solar cell modules, which include a substrate layer with a layer structure made of a first electrode layer, a semiconductor layer, a second electrode layer and a plastic layer that directly lies on the substrate layer in a circumferential edge region for encapsulating the functional layers and a cover layer, comprises scanning a free surface of the substrate layer with a working laser beam. The first electrode layer is able to absorb the working laser beam. The first electrode layer is partially vaporized by the absorption of the working laser beam.    USE - Method for recycling thin-film solar cell modules.    ADVANTAGE - The method is capable of simply and effectively recycling the thin-film solar cell modules without damaging its substrate layer.    DETAILED DESCRIPTION - The method of recycling thin-film solar cell modules, which include a substrate layer with a layer structure made of a first electrode layer, a semiconductor layer, a second electrode layer and a plastic layer that directly lies on the substrate layer in a circumferential edge region for encapsulating the functional layers and a cover layer, comprises scanning a free surface of the substrate layer with a working laser beam. The first electrode layer is able to absorb the working laser beam. The first electrode layer is partially vaporized by the absorption of the working laser beam. The substrate layer is transparent to the working laser beam. The layer structure of the functional layers is detached from the substrate layer so that the substrate layer is separated from the functional layers that are attached to the plastic layer and the cover layer for further separation processing. The plastic layer over the cover layer is heated up to the softening temperature and the cover layer is removed from the plastic layer, so that the cover layer is separated from the functional layers that are attached to the plastic layer for further separation processing. The substrate layer is completely scanned over the inner region that is enclosed by the circumferential edge region and the edge region is subsequently heated. The inner region is scanned along tracks adjacent to one another, which lead to a closed area, over which the first electrode layer detaches itself from the substrate layer, as a result of which a closed intermediate chamber is formed in which the gas volume is enclosed. The inner region is scanned along tracks that are spaced at a distance from one another, with the distance equaling the width of the tracks, which reduces the thermal load. The plastic layer is cooled by the cover layer during the scanning process. Before the inner region is scanned, an opening is created in the circumferential edge region. The gases are discharged from the inner chamber by the created opening. The carrier gas is fed into the inner chamber through the created opening.