NOVELTY - The method for producing quantum structures and/or continuous nano-metal islands on substrate for bipolar plates, comprises cleaning a substrate surface from impurities and/or oxide layers, structuring and then simultaneously depositing active atomic- and/or molecular clusters. The in-situ cleaning, structuring and depositing of clusters are simultaneously carried out for creating photovoltaic, photoelectro-chemical and/or electro-catalytic active surfaces from a highly-ionized metal plasma by applying a voltage of larger than 200 V on the substrate.    USE - Method for producing quantum structures and/or continuous nano-metal islands on substrates for bipolar plates (claimed) for electrolysis or fuel cells.    ADVANTAGE - The method ensures economical and simple production of the quantum structures and/or continuous nano-metal islands on the substrates with high efficiency, high electrically-conductive corrosion-resistant surface and high yield.    DETAILED DESCRIPTION - The method for producing quantum structures and/or continuous nano-metal islands on substrate for bipolar plates, comprises cleaning a substrate surface from impurities and/or oxide layers, structuring and then simultaneously depositing active atomic- and/or molecular clusters. The in-situ cleaning, structuring and depositing of clusters are simultaneously carried out for creating photovoltaic, photoelectro-chemical and/or electro-catalytic active surfaces from a highly-ionized metal plasma by applying a voltage of larger than 200 V on the substrate. A high metal ion density of more than 70% of loaded ions presents in the plasma of the metal atoms to be deposited. The metal plasma deposition is carried out by evaporating a metal target by cathodic light-arc or high-performance magnetron sputtering. The application of metal ions from highly-ionized metal plasma under applying defined negative potentials at the substrate, and the atomization of the substrate material are simultaneously carried out. The metal deeply penetrates itself in the surface of 1-10 atomic layers. A discontinuous metal film is formed from the equilibrium of the atomization rate of the substrate material and the deposition of the metals to be deposited, and is formed by an inductively coupled plasma for post-ionized, atomized or evaporated metal atoms. The porosity of the substrate surface is adjustable by highly applied negative voltages at the beginning of the process. A roughness and/or a micro-porous surface are adjustably obtained in the substrate surface by removing the oxide layer over the cleaning. The metal ions are subjected in defined penetration depth by applying a negative bias-voltage on the substrate between 200-1200 V into the surface-near atomic layers locally and uniformly without the formation of barrier layers in the high reproducibility in the first 5-20 atom layers of the substrate surface. A texture of the surface is increased by increasing the pulse lengths of several milliseconds during sputtering in desired manner. An INDEPENDENT CLAIM is included for an electrically-conductive corrosion-resistant surface for bipolar plates.