TECHNOLOGY FOCUS - ELECTRONICS - Preferred Components: The first organic coating formed on the surface of the transparent substrate and the second organic coating formed on the surface of the n-type fine silicon particle and the second organic coating formed on the surface of the n-type fine silicon particle and the third organic coating formed on the surface of the p-type fine silicon particle film are different from each other. The covalent bond is an N-C bond formed by a reaction between an epoxy group and an imino group. The first, second and third organic coatings comprise a monomolecular film. Preferred Method: The first, second, and third reactive monomolecular films, which are covalently bound to the surface of the transparent electrode, n-type fine silicon particles and p-type fine silicon particles, are formed by cleaning with an organic solvent after the respective reactions with the alkoxysilane compounds in the process of forming the first reactive organic coating, forming the second reactive organic coating, and forming the third reactive organic coating. Either the first and third reactive organic coatings contains an epoxy group and the second reactive organic coating contains an imino group, or the first and third reactive organic coatings contain an imino group and the second reactive organic coating contains an epoxy group; where either the first and third reactive monomolecular films contains an epoxy group and the second reactive monomolecular film contains an imino group, or the first and third reactive monomolecular films contain an imino group and the second reactive monomolecular film contains an epoxy group. A least two layers of n-type fine silicon particle films and p-type fine silicon particle films are respectively formed into a stacked film via an organic coating. The organic coatings formed on the surfaces of the n-type and p-type fine silicon particles respectively have two types, and the fine silicon particles with the second organic coating formation and the fine silicon particles with the third organic coating formation are alternately stacked. The second organic coating and the third organic coating react with each other to form a covalent bond. The method (M1) involves forming a monostratal n-type fine silicon particle film, followed by process having the film surface of the n-type fine silicon particles, on which the second reactive organic coating is formed, contact the n-type fine silicon particles coated by the fourth reactive organic coating for reaction, and a process of forming the second layer of the n-type fine silicon particle film by cleaning and removing redundant n-type fine silicon particles coated by the fourth reactive organic coating; as well as a process of forming a monostratal p-type fine silicon particle film, followed by a process of having the film surface of the p-type fine silicon particles, on which the third reactive organic coating is formed, contact the p-type fine silicon particles coated by the fifth reactive organic coating for reaction, and forming the second layer of the p-type fine silicon particle film by cleaning and removing redundant p-type fine silicon particles coated by the fifth reactive organic coating. The organic coatings contacting each other between layers are combined with functional groups that mutually react with each other. The silicon file particle film is formed by accumulating an arbitrary number of layers as n-type and p-type fine silicon particle films. After the process of forming the first to fifth reactive organic coatings, the transparent electrode or the surface of the fine silicon particles are cleaned with an organic solvent to form the first to fifth reactive monomolecular films, which are covalently bound with the transparent electrode or the surface of the fine silicon particles, respectively. The combination of the functional groups reacting with each other is that of an epoxy group and imino group. The ketimine compound, organic acid, aldimine compound, enamine compound, oxazolidine compound or an aminoalkylalkoxysilane compound is used instead of the silanol condensation catalyst. The promoter, selected from ketimine compound, organic acid, aldimine compound, enamine compound, oxazolidine compound, or aminoalkylalkoxysilane compound, is mixed with the silanol condensation catalyst for use. EXAMPLE - No suitable example given.