NOVELTY - A polyimide-type material contains polyamic acid and/or polyimide obtained by reacting acyl compound and aromatic imino formation compound (3). The acyl compound is 2,3,5-tricarboxy cyclopentyl acetic acid, 2,3,5-tricarboxy cyclopentyl acetic acid dianhydride and/or their reactive derivative.    USE - Polyimide-type material used for polyimide-type resin composition for forming polyimide film used for optical component and printed wirings for substrates (all claimed). Uses include but are not limited to peripheral material of light emitting diode, solar cell, flat display and electronic circuit, heat-proof transparent film, electroconductive transparent film, liquid crystal display, plasma display, electronic paper, organic electroluminescent element, optoelectronic printed wirings, substrate for tape automated bonding and chip on film.    ADVANTAGE - The polyimide-type material economically provides the film having excellent heat resistance and transparency.    DETAILED DESCRIPTION - A polyimide-type material contains polyamic acid and/or polyimide obtained by reacting acyl compound and aromatic imino formation compound of formula (3). The acyl compound is 2,3,5-tricarboxy cyclopentyl acetic acid, 2,3,5-tricarboxy cyclopentyl acetic acid dianhydride and/or their reactive derivative.    X=-NH2, -N=C=O or -NHSi(R25)(R26)(R27);    Y'=direct bond, -CH2-, -O-, -S- or -C(CH3)2-;    Z=direct bond, -CH2-, -O-, -S-, -C(CH3)2-, -C(=O)- or -SO2-;    R1-R16=H, alkyl, vinyl, aryl or halo;and    R25-R27=1-15C alkyl.    X, Y'and Z are coupled together in para-position. INDEPENDENT CLAIMS are included for the following:    (1) polyimide-type resin composition, which contains polyimide-type material and organic solvent;    (2) manufacture of polyimide-type material, which involves reacting acyl compound and aromatic imino formation compound of formula (3) in organic solvent, and imidating portion(s) of obtained polyamic acid; and    (3) manufacture of polyimide film, which involves coating solution containing polyimide-type material and organic solvent, on the substrate, forming coating film and removing the organic solvent from coating film by evaporating.