NOVELTY - The compound has a fibrous layer e.g. fiber glass fabric, impregnated by non halogenated thermoplastic polymer. The glass transition temperature of the polymer is greater than or equal to 130 degree Celsius. The polymer presents moisture regain coefficient lower than or equal to 0.25 percentages. A fraction of the thermoplastic polymer is fixed superficially at one of surfaces of the layer. The surface density of the layer is in the range between grams/meter square.    USE - Sheet molding compound for use in a stratified complex for forming a flexible support of an electrically conducting jumper lug that is utilized in a precursor system of a printed circuit board of an electronic tracing or identification unit i.e. radio frequency identification tag, and a photovoltaic panel for forming a radio signal transmission/reception antenna or solar sensor (all claimed). Can also be used for an electronic device such as high consumption apparatus e.g. mobile telephone or pocket computing apparatus e.g. multimedia player or game console.    ADVANTAGE - The fibrous layer is impregnated by non halogenated thermoplastic polymer, thus obtaining health and environment friendly molding compound in a simple and economic manner, while improving dimensional thermo stability, robustness and life duration of the compound. The sheet molding compound allows storage and transportation of the support with limited constraints. The compound is recyclable, and utilizes thermo adhesion properties of the polymer for being connected to another compound without using external adhesive, thus reducing number of machine runs for fabricating the support. The compound is thermoformed based on needs. The polymer presents moisture regain coefficient lower than or equal to 0.25 percentage, so that the lug support is less sensible to humidity, thus avoiding modification of electrical insulation characteristics of the support, and hence improving life duration of the support. The compound increases resistance of the support to heat and fire, while increasing chemical stability. The compound provides homogenous physico-chemical properties, renders the support to be adapted to critical geometric environments, and permits fabrication of the board in a simple, reliable and economic manner.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for forming a printed circuit board.