TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preparation: The preparation method of the conductive paste comprises mixing the conductive metallic powder, organic carrier, adhesive, auxiliary agent and additive with the solvent. Preferred Components: The additive is phosphorus pentachloride, iridochloride, iridous chloride, iridium chloride, rhodium chloride, or platinum chloride. The surfactant is zinc stearate, calcium stearate, sodium stearate, fatty acid, resin acid, amino acid, or oleic acid. The coupling agent is silane coupling agent, titanic acid ester, cobalt ester, or aluminate ester. The plasticizer is butyl benzyl phthalate, phosphate diphenyl octyl ester, or dioctyl phthalate. The anti-foaming agent is vinyl-acrylic acid polymer, polyethylene glycol, poly-oxypropylene propylene glycol ester, or polyglycerol fatty acid ester. The conductive metallic powder is copper powder, aluminum powder, zinc powder, or silver powder. The organic carrier is phenol aldehyde resin, novolac epoxy resin, acrylic resin, or cellulose based polymer. The adhesive is glass powder. The solvent is terpineol, turpentine, ricinoleic acid, carbitol, cyclohexanone, ethylene glycol phenyl ether, acetic ether, acetone, butanone, or n-butyl acetate. Preferred Composition: Preferably, the conductive paste comprises (wt.%) conductive metallic powder (50-80, preferably 60-80), organic carrier (1-15, preferably 1-12), adhesive (1-20, preferably 1-10), solvent (10-30, preferably 10-20), auxiliary agent (0.5-10, preferably 0.5-5), and additive (0.1-3, preferably 0.1-2). The auxiliary agent comprises (wt.%) surfactant (1-100, preferably 1-60), coupling agent (0-60, preferably 1-60), plasticizer (0-40, preferably 1-40), and anti-foaming agent (0-40, preferably 1-40). Preferred Process: Mixing the conductive metallic powder, organic carrier, adhesive, auxiliary agent and solvent comprises mixing the organic carrier and auxiliary agent with the solvent to sufficiently dissolve the organic carrier and auxiliary agent in the solvent; and mixing the conductive metallic power, adhesive and additive with the solvent.