TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The thermosetting resin composite contains 25-90 pts.wt. of epoxide resin; 9-70 pts.wt. of thermal treating agent and 0.1-5 pts.wt. of treating accelerator; the thermosetting resin composite has a viscosity of 10-3000 cps at 25 degrees C. The thermosetting resin composite further comprises 0.001-5 pts.wt. of coupling agent or 0.001-0.5 pts.wt. of antioxidant. The epoxide resin is selected from bisphenol A-type epoxide resin, bisphenol F-type epoxide resin, hydrogenation bisphenol epoxide resin, cycloaliphatic epoxy resin, aromatic epoxide resin, phenol formaldehyde varnish epoxide resin, dicyclopentadiene epoxide resin and mixture. The thermal treating agent is more than one substance selected from diethylenetriamine, trien, N-amino ethide piperazidine, diaminodiphenyl-methane, adipic dihydrazide, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, linear metlbond treating agent, trioxane methylene thiol, benzyl dimethylamine, 2,4,6-tri(dimethylamino methyl) phenol, 2-methylimidazole, 2-ethide-4-methylimidazole and 1-phenmethyl-2-methylimidazole. The treating accelerator is more than one substance selected from ammonium bromide;, tetrabutyl ammonium bromide, tetraphenyl phosphonium bromide, tetrabutyl phosphonium bromide, zinc octoate, 1-phenmethyl-2-methylimidazole, 1-phenmethyl-2-phenylimidazole, 2-ethide-4-methylimidazole and benzyl dimethylamine. The coupling agent is more than one substance selected from free silane coupling agent, titanic acid ester coupling agent, aluminate coupling agent, and silicon compound. The antioxidant is more than one substance selected from dibutyl hydroxy toluene, 2,6-di-tert-butyl-4-methylphenol, mercaptopropionic acid ramification, triphenyl phosphate and 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. Moreover, the light-cured resin composite contains 50-90 pts.wt. of epoxide resin, 0.1-5 pts.wt. of light trigger, 1-40 pts.wt. of inorganic filler and 0.1-5 pts.wt. of coupling agent. Preferred Conditions: The thermosetting resin composite is solidified at a temperature of 75-120 degrees C. The electronic element or optical element is organic light emitting display (OLED), LED or dye sensitization solar battery. Preferred Electrical Element: The electrical element with transmission parts further comprises a light-cured resin composite firming body rim that is filled on the rim between the bonding planes of the upper sealing component and the lower sealing component and surrounds the thermosetting resin composite layer. The electrical element is organic light emitting diode formed by splicing the lower sealing component and the upper sealing component, where the lower sealing component comprises lower plate base material, anode laminated on the lower plate base material, luminous layer and cathode.