NOVELTY - Production of an electronic component encapsulated in barrier layers involves (a) applying first barrier layer(s) (3) to a functional layer of a substrate (1) by plasma-less atomic layer deposition (PLALD) and (b) applying second barrier layer(s) (4) to the functional layer by plasma-enhanced chemical vapor deposition (PECVD).    USE - The electronic component is specifically an organic light emitting diode (OLED) or a solar cell (both claimed). Other possible components include photodiodes, thin film transistors, integrated circuits and combinations of the above elements. Although the components are preferably organic, encapsulation of inorganic components is also possible.    ADVANTAGE - The barrier layers permanently protect the components against moisture, to ensure that the components retain their function even on all-day use for a period of years. The first barrier layer (obtained by PLALD) has higher density than layers produced by chemical vapor deposition (CVD) or PECVD; has a markedly reduced tendency for formation of channels and/or pores; and shows superior moisture and/or oxygen barrier properties. A reduced number of barrier layers and/or layers of reduced thickness are thus required in comparison with conventional multilayer systems obtained by CVD; and production costs are therefore reduced. Both large and small surfaces can be encapsulated, and diffusion of moisture and/or oxygen via grain boundaries and/or pores is suppressed or eliminated, even in the edge regions of the capsule. The present system is also less expensive and thinner than covering glass-getter material barrier systems, and may be transparent if required.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an organic opto-electronic component obtained by the process.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic diagram of the second barrier layer deposition stage in the production of an organic electronic component.    Substrate, e.g. bottom emitter (1)    Organic layer sequence, typically forming organic LED (2)    First barrier layer obtained by PLALD, e.g. of aluminum oxide (3)    Second barrier layer obtained by PECVD, e.g. of silicon dioxide (4)