NOVELTY - Preparation of semiconductor-based optical system involves providing device substrate having receiving surface; and assembling printable semiconductor element on the receiving surface of the substrate via contact printing, where the printable semiconductor element comprises a semiconductor structure having length 0.0001-1000 (preferably 0.02-30, especially 0.1-1, particularly 1-10) mm, a width 0.0001-1000 (preferably 0.02-30, especially 0.1-1, particularly 1-10) mm and a thickness 0.00001-3 (preferably 0.0003-0.3, especially 0.002-0.02) mm.    USE - For preparation of a semiconductor-based optical system, where the optical system is array of light emitting diodes, an array of lasers, an array of Vertical-Cavity Surface-Emitting Lasers (VCSEL), a passive matrix light emitting diode (LED) display, an active matrix LED display, an optical sensor and an array of optical sensors; a sheet scanner and an array of solar cells (claimed); also for manufacturing large area integrated electronics including macroelectronic systems, light collecting systems, light sensing systems and photovoltaic systems.    ADVANTAGE - The method is capable of high throughput and low cost implementation. The systems manufactured by the method exhibits good electronic device performance and enhanced mechanical functionality such as flexibility, shapeability, bendability and stretchability. The optical system prepared by the method includes printable semiconductor containing structures assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods.    DETAILED DESCRIPTION - Preparation of a semiconductor-based optical system involves providing a device substrate having a receiving surface; assembling a printable semiconductor element on the receiving surface of the substrate via contact printing, where the printable semiconductor element comprises a semiconductor structure having length 0.0001-1000 (preferably 0.02-30, especially 0.1-1, particularly 1-10) mm, a width 0.0001-1000 (preferably 0.02-30, especially 0.1-1, particularly 1-10) mm and a thickness 0.00001-3 (preferably 0.0003-0.3, especially 0.002-0.02) mm. The method further involves pre-patterning receiving surface of device substrate with at least one device component; providing at least one optical component in optical communication with the printable semiconductor element; and providing an array of optical components selected from diffusing optics, dispersive optics, collecting optics, concentrating optics, and optical fiber. The method involves providing optical component having internal surface; and transferring the component having grid or mesh to the device substrate. The optical component is positioned on top of the semiconductor elements assembled on the receiving surface of the substrate. The printable semiconductor element is an electronic device or component of an electronic device. The electronic device is an light emitting diode (LED), a laser, a solar cell, a sensor, a diode, a transistor, a p-n junction, an integrated circuit or a photodiode. The printable semiconductor element comprises the semiconductor structure integrated with at least one additional structure selected from another semiconductor structure; a dielectric structure; conductive structure, and an optical structure; or integrated with at least one electronic device component selected from an electrode, a dielectric layer, an optical coating, a metal contact pad and a semiconductor channel. The method further involves providing an adhesive layer on the receiving surface; and contacting the printable semiconductor element with the adhesive layer, thereby bonding the printable semiconductor element to the receiving surface of the substrate, where the adhesive layer is at least one polymer layer, prepolymer layer, elastomer layer and/or metal layer; and providing a laminating or encapsulating layer in contact with the printable semiconductor element. An INDEPENDENT CLAIM is included for a semiconductor-based optical system comprising a device made by a method involving providing a device substrate having a receiving surface; and assembling the printable semiconductor element on the receiving surface of the substrate via contact printing; or comprising device substrate having a receiving surface; and a planarized printable semiconductor element supported by the receiving surface, where the device substrate having the printable semiconductor element has the planar top surface that includes the printable semiconductor element; or comprising a device substrate having receiving surface; several printable semiconductor elements supported by receiving surface, where each of the element comprises the semiconductor structure; and a grid or mesh provided in electrical contact with at least a portion of the elements supported by receiving surface.    DESCRIPTION OF DRAWING(S) - The figures show schematic views of optical system comprising printable semiconductor elements; and vertical-cavity surface-emitting laser (VCSEL) array on silicon chip with integrated optical fibers.