TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The free-radical thermal curing agent is one more of 86 compounds, e.g. ethylenediamine, hexamethylene diamine, triethylene tetramine, diethylenetriamine hydroxyethyl, hydroxy isopropyl diethylenetriamine, poly-dicarboxyl adipamide, dipropylamine, 2,3,5,6- tetramethylphenylene diamine, dicyandiamide, diaminodiphenylsulfone, diaminodiphenylmethane, metaphenylene diamine, diethylmethylbenzenediamine, N-(aminopropyl)-toluenediamine, dimethylethanolamine, dimethyl benzenamine, triethyl amine chloride, benzyl-dimethylamine, N-based dimethylamine, 2,4,6-tri-(dimethylamino-methyl)phenol, phenol formaldehyde hexanediamine, N,N-dimethyl amine formaldehyde, 2-ethyl imidazole, 2-phenyl imidazole, 2-methylimidazole, 2-ethyl imidazole, 2-ethyl-4-methylimidazole, 1-(2-aminoethyl)-2-methylimidazole, maleic anhydride, diethyl ether anhydride, phthalic anhydride, benzene anhydride, tribromophenyl anhydride, poly nonyl acetic anhydride, sebacate hydrazide, hydrazide, dimethyl hydrazide, oxalic acid diacyl hydrazine, hydrazide succinate, adipate hydrazide, N-amino-polyacrylamide, sebacic acid hydrazide, isophthalic acid hydrazide, hydroxy benzoic acid hydrazide, acid dimethyl nonane hydrazide, isophthalic acid hydrazide, ferrocene tetrafluoroborate, leukotriene-propyl isocyanate trimer, toluene diisocyanate, diphenylmethane diisocyanate, or diisocyanate. The anaerobic curing binder includes dimethyl acrylic acid ethylene glycol esters, dimethyl acrylic acid glycol methacrylic acid ester, triethylene glycol diacrylate, ethylene glycol dimethyl acrylate esters, 2-hydroxyethyl methacrylate or light propyl, methoxy polyethylene glycol methacrylate, o-reduced 3-diethyl glycol dimethyl ester, methyl p-hydroxyethyl methacrylate, triglycol dimethacrylate, diethylene glycol methacrylic acid ester, phthalic acid di(diethylene glycol acrylate), ethoxylated bisphenol A methacrylate, bisphenol A dimethacrylate resin glycol, ethylene methyl acrylate ester, reduced triethylene dimethacrylate glycol ester, glycol dimethyl acrylate, ethylene glycol dimethyl acrylate, diethanol methacrylate, methacrylate resin, or reduced dimethacrylic acid ester of diethylene glycol. The photoinitiating agent includes benzoin and its derivatives including benzoin methyl ether, benzoin ether, acetophenone derivatives, benzoin isopropyl ether, aromatic sulfur iodonium salt, iodonium salt and alum malysite. The photosensitizing agent includes benzophenone, thiaxanthenone and Michler's ketone. The addition agent includes plasticizer, thixotropic agent and filler. The plasticizer includes o-dioctyl phthalate, o-dibutyphthalate, tributyl oxyethenyl phosphate, polyvinyl butyral, acetyl tributyl citrate, o-diethyl dimethyl (butoxy ethoxy) B ester, isopropyl titanate, butyl titanate, citric acid esters, trimellitic acid (2-ethyl) hexyl phthalate (2-ethyl) hexyl, sebacate (2-ethyl) acetate, phthalandione diethylene glycol diphenyl esters, and phthalic anhydride. The coupling agent includes methyl vinyl dichlorosilane, methyl dichlorosilane hydrogen, dimethyl dichlorosilane, dimethyl chlorosilane, vinyl trichlorosilane, gamma -aminopropyl trimethoxy silane, dimethyl silicone polymer, poly(hydrogen methylsiloxane), polymethyl methoxy silane, gamma -aminopropyl triethylene silane, n-propyl ether trimethoxy silane, aminopropyl silsesquioxane, gamma -trimethoxy silane oxypropenoyl-propyl silane trimethoxy silane, long-chain alkyl trimethoxy silane, vinyl triethoxysilane, vinyl trimethoxysilane, gamma -tripropyl triethoxysilane, di-( gamma -propyl triethoxysilane silicon), triethoxysilane, N-p(aminoethyl) triethoxysilane aminopropyl silane, N-(p-aminoethyl) aminopropyl triethoxysilane, N-p(aminoethyl) aminopropyl triethoxysilane, gamma -(2,3-oxyglycidylpropyltrimethoxy) propyl trimethoxysilane, gamma (methacryloyloxy) propyl-trimethylsilane, mercaptopropyltrimethoxysilane, or gamma -mercaptopropyltriethoxysilane. Preferred Method: The curing process for free-radical UV curing-thermal curing system involves performing UV curing, heating curing and final UV curing, or, performing heating curing, UV curing and final heating curing. The curing process for free-radical UV curing-anaerobic curing system involves performing UV curing, automatic performing anaerobic curing reaction at binder part in absence of light under anoxic condition, and performing UV curing. The curing process for free-radical UV curing-microwave curing system involves performing UV curing, microwave curing and final UV curing, or, performing microwave curing, UV curing and final microwave curing. The curing process for free-radical UV curing-electronic beam curing system involves performing UV curing, electronic beam curing in vacuum and final UV curing. The curing process for cation UV curing-thermal curing system involves performing UV curing, heating curing and final UV curing, or heating curing, UV curing and final heating curing. The curing process for cation UV curing-microwave curing system involves performing UV curing, microwave curing and final UV curing, or, microwave curing, UV curing and final microwave curing. The curing process for cation UV curing-anaerobic curing system involves performing UV curing, automatic performing anaerobic curing reaction at binder agent part in absence of light under anoxic condition, and final performing UV curing. The curing process for cation UV curing-electronic beam curing system involves performing UV curing, electronic beam curing in vacuum and final UV curing. The binding layer is spirally coated on flexible underlayer directly or after thinned by organic solvent. The bonding layer and conductive film are formed by vacuum evaporation, ionized-cluster beam deposition, direct current sputtering coating, radio frequency sputtering coating, ionized beam sputtering coating, ionized beam assistant deposition, plasma enhanced chemical vapor deposition, catalyst chemical vapor deposition, magnetron sputtering, plating, spiral coating, immersed coating, inking and printing, roller coating and Langmuir-Blodgett film. The binding layer is spirally coated on flexible underlayer directly or after thinned by organic solvent. The bonding layer and conductive film are formed by vacuum evaporation, ionized-cluster beam deposition, direct current sputtering coating, radio frequency sputtering coating, ionized beam sputtering coating, ionized beam assistant deposition, plasma enhanced chemical vapor deposition, catalyst chemical vapor deposition, magnetron sputtering, plating, spiral coating, immersed coating, inking and printing, roller coating and Langmuir-Blodgett film. The manufacture of flexible substrate involves:(A) completely cleaning flexible underlayer with detergent, acetone solution, ethanol solution, deionized water and drying flexible substrate with nitrogen;(B) coating binding layer material, mixing for 20 hours after being thinned by ethanol at ratio of 1:10, on surface of flexible underlayer;(C) UV curing surface of substrate for 30 seconds;(D) thermal curing, microwave curing, anaerobic curing or electronic beam curing flexible underlayer; and(E) putting flexible underlayer in vacuum room at room temperature, sputtering transparent conductive film with thickness of 100 nm on surface of substrate at 1000 W by direct current magnetron sputtering; and UV curing further substrate plated with conductive film again for 60 seconds.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The dual-curing system includes UV curing-thermal curing system, UV curing-microwave curing system, UV curing-anaerobic curing system and UV curing-electronic beam curing system. The free-radical UV curing-thermal curing system comprises (wt.%): unsaturated polyester resin, acrylic acid resin or polythiol-polyene (30-40), epoxide resin, isocyanate, amine resin or free-radical thermal curing agent (35-45), styrene and its derivatives or monofunctional group or polyfunctional group acrylic acid (0.2-3), photoinitiating agent (0.1-3), and photosensitizing or addition agent (0.2-6). The free-radical UV curing-microwave curing system comprises (wt.%): unsaturated polyester resin, acrylic acid resin or polythiol-polyene (30-40), epoxide resin, isocyanate or amine resin or free-radical thermal curing agent (35-45), styrene and its derivatives including monofunctional group or polyfunctional group acrylic acid (0.2-3), photoinitiating agent (0.1-3), and photosensitizing or addition agent (0.2-6). The free-radical UV curing-anaerobic curing system comprises (wt.%): unsaturated polyester resin or acrylic acid resin or polythiol-polyene (55-65), dimethyl acrylic acid pentaalcohol ester or bisphenol A epoxy pentaalcohol ester (20-30), styrene and its derivatives including monofunctional group or polyfunctional group acrylic acid (0.2-3), photoinitiating agent (0.1-3), and photosensitizing or addition agent (0.2-6). The free-radical UV curing-electronic beam curing system comprises (wt.%): unsaturated polyester resin, acrylic acid resin or polythiol-polyene (35-40), bisphenol A vinyl ester resin (50-55), styrene and its derivatives including monofunctional group or polyfunctional group acrylic acid (0.2-3), photoinitiating agent (0.1-3), and photosensitizing agent or addition agent (0.2-6). The cation UV curing-thermal curing system comprises (wt.%): epoxy resin or modified epoxy resin (35-40), epoxy resin, isocyanate, amine resin or free-radical thermal curing agent (40-45), thinner (0.4-9), photoinitiating agent (0.1-3), and photosensitizing or addition agent (0.2-3). The cation UV curing-microwave curing system comprises epoxy resin or modified epoxy resin (35-40),epoxy resin, isocyanate, amine resin or free-radical thermal curing agent (40-45), thinner (0.4-9), photoinitiating agent (0.1-3), and photosensitizing or addition agent (0.2-3). The cation UV curing-anaerobic curing system comprises (wt.%): epoxy resin or modified epoxy resin (60-65), dimethyl acrylic acid pentaalcohol ester or bisphenol A epoxy pentaalcohol ester (25-30), thinner (0.4-9), photoinitiating agent (0.1-3), and photosensitizing or addition agent (0.2-3). The cation UV curing-electronic beam curing system comprises epoxy resin or modified epoxy resin (30-35), bisphenol A vinyl ester resin (50-55), thinner (0.4-6), photoinitiating agent (0.1-3), and photosensitizing or addition agent (0.2-3). The electron beam curing adhesive includes triphenol-based epoxy resin diglycidyl ether of methane, 2-cyclopentadienyl-type epoxy resin of bisphenol, bisphenol A type vinyl ester resins, epoxy vinyl ester resin, epoxy acrylate resin, maleimide resin, 4,4,-bismaleimide diphenylmethane, bisphenol A-diphenyl ether bimaleimide, bisphenol A-maleic acid vinyl resin, bromovinyl ester resin, phenolic aldehyde epoxy vinyl ester resin, hydroxymethylated bisphenol A epoxy resin, bisphenol A acrylate ester, polyurethane acrylate, bisphenol A epoxy vinyl ester resin, bisphenol A benzoxazine-epoxy resin, bisphenol fluorene epoxy resin, bisphenol A epoxy acrylate resin, bisphenol A diglycidyl ether of bisphenol F, or bisphenol A epoxy chloropropene acrylate resin.