NOVELTY - A substrate (120) having a surface for receiving an aluminum film is provided. The surface of substrate is heated at printing temperature and a volume of ink is deposited on the surface of substrate. The ink comprises an organometallic aluminum complex. The surface of substrate is heated to printing temperature to decompose the organometallic aluminum complex to the aluminum film and a gaseous byproduct. Thus aluminum film is deposited.    USE - Method for depositing aluminum film for providing contacts in solar cells, and fabrication of electronic devices such as computers and cellular phones. The direct wire method is used in inkjet printing, printed circuits and electronic devices.    ADVANTAGE - The method provides efficiently provides aluminum film. The aluminum metallization is formed using direct-write method without requirement of reaction chamber, photolithography and non-contact processing, and has high material efficiency.    DETAILED DESCRIPTION - A substrate having a surface for receiving an aluminum film is provided. The surface of substrate is heated at printing temperature and a volume of ink is deposited on the surface of substrate. The ink comprises an organometallic aluminum complex. The surface of substrate is heated to printing temperature to decompose the organometallic aluminum complex to the aluminum film and a gaseous byproduct. Thus aluminum film is deposited. The ink further comprises a solution of organometallic aluminum complex and a solvent. The organometallic aluminum complex comprises an amine compound and alane, and an aluminum compound chosen from trimethylaluminum, triethylaluminum, tri-n-propylaluminum, tri-n-butylaluminum, tri-t-butylaluminum, triphenylaluminum, tribenzylaluminum, diethylaluminum hydride, diisobutylaluminum hydride, diphenylaluminum hydride and their monoamine complexes. The substrate comprises a solar cell substrate. An INDEPENDENT CLAIM is included for direct write method for providing aluminum metallization on surface of electronic component.    DESCRIPTION OF DRAWING(S) - The drawing shows schematic view of deposition system.    Printing system (100)    Platform (110)    Heater (112)    Temperature sensor (114)    Substrate (120)