WO2009132207-A2 -- KR2006091160-A   SAMSUNG ELECTRONICS CO LTD (SMSU)   LEE J,  KHANG Y;  US20030015234-A1   ;  US20080026578-A1   ;  US20080096386-A1   ;  EP2279285-A2 -- KR2008035864-A   SHIN W (SHIN-Individual);  LEE J (LEEJ-Individual);  KANG Y (KANG-Individual)   SHIN W,  LEE J,  KANG Y;  US20070054475-A1   ;  WO2008057616-A2   ADVANCED TECHNOLOGY MATERIALS (ATMI)   HUNKS W,  CHEN T,  XU C,  ROEDER J F,  BAUM T H,  PETRUSKA M A,  STENDER M,  CHEN P S H,  STAUF G T,  HENDRIX B C;  CN102076882-B -- US20080096386-A1   ;  EP2279285-B1 -- KR2006091160-A   SAMSUNG ELECTRONICS CO LTD (SMSU)   LEE J,  KHANG Y;  KR2008035864-A   SHIN W (SHIN-Individual);  LEE J (LEEJ-Individual);  KANG Y (KANG-Individual)   SHIN W,  LEE J,  KANG Y;  US20030015234-A1   ;  US20070054475-A1   ;  US20080026578-A1   ;  US20080096386-A1   ;  WO2008057616-A2   ADVANCED TECHNOLOGY MATERIALS (ATMI)   HUNKS W,  CHEN T,  XU C,  ROEDER J F,  BAUM T H,  PETRUSKA M A,  STENDER M,  CHEN P S H,  STAUF G T,  HENDRIX B C;  JP5718808-B2 -- JP92226930-A   ;  JP2002322181-A   ;  JP2007186784-A   SAMSUNG ELECTRONICS CO LTD (SMSU)   SHIN W,  KHANG Y;  JP2009149980-A   AIR PROD&CHEM INC (AIRP)   GAFFNEY T R,  XIAO M,  YANG L;  JP2010514918-A   ADVANCED TECHNOLOGY MATERIALS (ATMI)   HUNKS W,  CHEN T,  XU C,  ROEDER J F,  BAUM T H,  PETRUSKA M A,  STENDER M,  CHEN P S H,  STAUF G T,  HENDRIX B C;  US20070054475-A1   ;  US9175390-B2 -- EP1995236-A1   AIR PROD & CHEM INC (AIRP)   XIAO M,  GAFFNEY T;  JP04226930-A   ;  JP2002322181-A   ;  JP2007186784-A   SAMSUNG ELECTRONICS CO LTD (SMSU)   SHIN W,  KHANG Y;  JP2009149980-A   AIR PROD&CHEM INC (AIRP)   GAFFNEY T R,  XIAO M,  YANG L;  JP2010514918-W   ADVANCED TECHNOLOGY MATERIALS (ATMI)   HUNKS W,  CHEN T,  XU C,  ROEDER J F,  BAUM T H,  PETRUSKA M A,  STENDER M,  CHEN P S H,  STAUF G T,  HENDRIX B C;  KR2006091160-A   SAMSUNG ELECTRONICS CO LTD (SMSU)   LEE J,  KHANG Y;  KR2007066114-A   ;  KR2008035864-A   SHIN W (SHIN-Individual);  LEE J (LEEJ-Individual);  KANG Y (KANG-Individual)   SHIN W,  LEE J,  KANG Y;  US20060180811-A1   ;  US20070048977-A1   ;  US20070054475-A1   ;  US20070249086-A1   ;  US20080017841-A1   ;  US20080026578-A1   ;  US20080093591-A1   ;  US20080096386-A1   ;  US20080108175-A1   ;  US20090074652-A1   ;  US20090112009-A1   ;  US20090124039-A1   ;  US20090137100-A1   ;  US20090191330-A1   ;  US20090280052-A1   ;  US20090305458-A1   ;  US20100317150-A1   ;  US6706115-B2   LESKELA M (LESK-Individual);  RITALA M (RITA-Individual);  ALEN P (ALEN-Individual);  JUPPO M (JUPP-Individual)   LESKELA M,  RITALA M,  ALEN P,  JUPPO M;  US6716713-B2   ASM AMERICA INC (ASMI)   TODD M A;  US7482286-B2   AIR LIQUIDE SA (AIRL)   MISRA A,  FISHER M,  JURCIK B,  DUSSARRAT C,  TSUKADA E,  GIRARD J;  US7817464-B2   SAMSUNG ELECTRONICS CO LTD (SMSU)   KUH B,  HA Y,  PARK D,  PARK J,  KO H;  WO2007133837-A2   ADVANCED TECHNOLOGY MATERIALS (ATMI)   ROEDER J F,  BAUM T H,  HENDRIX B C,  STAUF G T,  XU C,  HUNKS W,  CHEN T,  STENDER M;  WO2009132207-A3   ASM INT NV (ASMI);  ASM AMERICA INC (ASMI)   HATANPAEAE T,  LESKELA M,  PORE V,  RITALA M;  WO2008057616-A8   ADVANCED TECHNOLOGY MATERIALS (ATMI)   HUNKS W,  CHEN T,  XU C,  ROEDER J F,  BAUM T H,  PETRUSKA M A,  STENDER M,  CHEN P S H,  STAUF G T,  HENDRIX B C;  US2016031919-A1 -- US20090137100-A1