TECHNOLOGY FOCUS - IMAGING AND COMMUNICATION - Preferred Composition: The composition comprises an uncharged complex consisting of a salt. The composition comprises a fluoride containing compound selected from ammonium tetrafluoroborate, tetrafluoroboric acid, Selectafluor (1-chloromethyl-4-fluoro-1,4-diazoniabicyclo(2.2.2)octane bis(tetrafluoroborate)) and organic acid fluorides such as benzyl fluoride, arylsulfonyl fluorides, especially para-toluenesulfonyl fluoride. The composition comprises a proton generating compound selected from N-sulfonyloxyimides, oxime sulfonates, ammonium sulfonates, benzoin tosylate and 2-nitrobenzene tosylate. The composition comprises compound releasing a proton under irradiation selected from hydroxyarenes, preferably selected from 1-naphthol, 2-naphthol and diphenyliodonium fluoride. The composition comprises fluoride generating component in an amount of 5-25 wt.%; and polyvalent alcohol in an amount of about 5-15 wt.%.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The salt is selected from alkali metal fluorides, HF salts of amines including ammonia, mono, di- and trialkyl amines, and HF salts of polymeric amines, of polymers of nitrogen heterocycles such as fluorides of polyallylamine and polyvinyl pyridine, and/or fluoroacetone (preferably NH4F, (CH3)3NHF, (CH3CH2)3NHF, or (i-propylene)3NHF).    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The polyvalent alcohol is selected from glycerol, ethylene chlorohydrin, and/or dioxane pinacol, water and optionally polyethylene glycol, polymethylene glycol, ethylene glycol monomethyl ether. EXAMPLE - An ink consisting of ethylene glycol, 40 wt.% of water and 10 wt.% of KF, was inkjet printed onto a silicon nitride coated silicon wafer. Heating of this patterned substrate to a temperature of 300 degrees C for 1 minute activated the comprising KF to etch the nitride surface. After this reaction the wafer was immersed in 0.1% KOH solution under irradiation with sonic waves for 5 minutes in order to remove etching products.