TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Compounds: The amine compound has primary and/or secondary amino group(s) in an aliphatic or alicyclic hydrocarbon group, and the amine adduct has primary and/or secondary amino group. The one-component epoxy-resin composition contains hardening agent (h3) chosen from acid anhydride group hardening agent, phenol type hardening agent, hydrazide type hardening agent, guanidinium type hardening agent, thiol type hardening agent, imidazole type hardening agent, and imidazoline type hardening agent. The weight ratio of hardening agent (h3) and hardening-agent composition is 100:10-10:1000.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: Epoxy resin (e1) contains epoxy resin (EP1) having a rigid skeletal structure chosen from benzene structure, naphthalene structure, biphenyl structure, triphenyl structure, anthracene structure, dicyclopentadiene structure, norbornene structure, acenaphthylene structure, adamantane structure, fluorene structure, benzofuran structure, benzoxazine structure, indene structure, indan structure, hydantoin structure, oxazoline structure, cyclic carbonate structure, aromatic-ring imide structure, alicyclic imide structure, oxadiazole structure, thiadiazole structure, benzoxadiazole structure, benzothiadiazole structure, carbazole structure, azomethine structure, oxazolidone structure, triazine structure, isocyanurate structure, xanthene structure, di-t-butylbenzene structure, thiophene structure, dihydrophenanthrene structure, phenanthrene structure, biphenylene structure, oxazolo-benzoxazole structure, benzimidazole structure, quinoline structure, thiazolo-benzothiazole structure, diphenylfuran structure, diphenyl-dioxane structure, phenylcyclohexenyl-benzene structure, methylenecyclohexane-dione structure, methylenecyclopentane-dione structure, piperazine-dicarbaldehyde structure, and oxazine structure, preferably benzene structure, naphthalene structure, and/or biphenyl structure. The infrared absorption spectrum of the core exhibits a ratio of 1655 cm-1 peak height with respect to peak height of 1050-1150 cm-1 of 1-3. Epoxy resin (e1) contains epoxy resin (EP3) which consists of a reaction material of epoxy resin (EP1) and an epoxy resin (EP2), and an isocyanate compound. The monomer molecular weight of the basic structure type of epoxy resin (EP1) is 90-1000. Epoxy resin (EP3) is an epoxy resin which has oxazolidone structure, triazine structure, and/or isocyanurate structure, preferably oxazolidone structure. Epoxy resin (e1) contains 10-90 %mass of epoxy resin (EP1) and 10-90 %mass of epoxy resin (EP3). The molecular weight in a crosslinking point of epoxy resin (EP1) is 90-500. The epoxy equivalent of epoxy resin (EP3) is more than 300 and 1000 or less. The softening point of epoxy resin (EP3) is 50-100 degrees C. The number average molecular weight of epoxy resin (EP3) is 500-3000. The softening point of the core is 50-90 degrees C. The 120 degrees C-melt viscosity of the core is 30 Pa.second or less. The ratio of concentration bonding group (x: urea group) on the surface with respect to the total concentration of bonding group (x), bonding group (y: biuret group), and bonding group (z: urethane group) in the shell, is 0.5-0.75. The moisture content in the core is 0.05-3 parts mass with respect to 100 parts mass of core components. The content of amine compound contained in the core is 0.001-3 parts mass with respect to 100 parts mass of core components. The total chlorine content of epoxy resin (EP1), epoxy resin (EP2), and epoxy resin (EP3) is 2500 ppm or less. The total chlorine content of the core is 2500 ppm or less. The shell includes any 2 types of isocyanate compound, active hydrogen compound, hardening agent (h2), epoxy resin (e2), and the amine compound, or the reaction product. The total chlorine content of said epoxy resin (e2) is 2500 ppm or less. The infrared absorption spectrum of the shell shows a ratio of 0.3-1.2 with respect to peak height of 1630-1680 cm-1 and height of 1050-1150 cm-1. The total chlorine content of epoxy resin (e3) is 2500 ppm or less. The diol terminal impurity component in epoxy resin (e3) is 0.001-30 wt.% of basic structure component of epoxy resin (e3). The one-component epoxy-resin composition further contains a cyclic boric-acid ester compound (0.001-10 %mass), preferably 2,2'-oxybis(5,5-dimethyl-1,3,2-dioxaborinane). The ratio (multiplied by 100) of epoxy equivalent contained in the anisotropically conductive film with respect to value obtained by dividing overall amine titer value of the core component by mixing weight of the microcapsule-type hardening agent contained in the anisotropically conductive film is (ratio of epoxy equivalent and amine titer) 1.5-4. EXAMPLE - A hardening agent obtained by reacting an epoxy resin and an amine compound, was coarsely crushed and pulverized. A hardening agent was then obtained by mixing (in parts mass) the pulverized material (100), bisphenol A type epoxy resin (200) having epoxy equivalent of 185 g/eq and a chlorine content of 1200 ppm, MR-200 (RTM: polymethylene polyphenyl polyisocyanate) (3), and water (0.5). The hardening agent had excellent storage stability and low-temperature rapid hardening property. The agent provided anisotropically conductive films having excellent connection reliability.