TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Method: The distribution of nanoparticles of the first metal or its alloy is established by means of adsorption of nanoparticles or ions from a solution. An adhesion promoter or promoting treatment is applied between the substrate and the distribution of nanoparticles of the first metal or its alloy. The inhibiting material is applied by a printing method or dipping method. The inhibiting material is applied by a stamp. Application of the inhibiting material is followed by an isotropic etching step. The method further involves removing of the inhibiting material from non-metallized areas of the substrate after the electroless process. The method is performed in a roll-to-roll fabrication method. Preferred Components: The first metal or its alloy comprises at least one cobalt, nickel, iron, tin, copper, rhodium, palladium, platinum, ruthenium, iridium silver and/or gold. The second metal or its alloy comprises at least one copper, nickel, nickel-phosphorus, nickel-boron, tin, silver, gold, cobalt, palladium and/or platinum. The substrate comprises at least one material selected from bakelite, alumina, zirconia, silica, silicon, sapphire, zinc oxide, tin oxide, chalcopyrites and glass.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The inhibiting material comprises at least one heavy metal ion, organic and inorganic sulfur-, selenium- or tellur-containing compounds, oxygen containing compounds and aliphatic and aromatic organic compounds. The inhibiting material is applied to the substrate from a solution comprising at least one solvent selected from ethanol, propanol, isopropanol, butanol, pentanol, hexanol, pentanol, octanol, and decanol.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The substrate comprises a thermoplastic material, a thermosetting material and/or a ceramic material. The substrate comprises at least one material selected from polyethylene terephthalate, polyethylene naphthalate, polyimide, polyetherimide, liquid crystalline polymer, polyamide, acrylonitrilebutadiene-styrene, polymethylmethacrylate, polycarbonate/acrylonitrile-butadiene-styrene, epoxy compounds, melamine and polyester compounds. The substrate has a thickness of 5-500 (preferably 25-250) mu m. EXAMPLE - No suitable example given.