NOVELTY - Manufacturing electronic apparatus involves forming several first conductors coupled to a base; coupling several spherical substrate particles to the several first conductors; subsequent to the coupling to the several first conductors, converting the several spherical substrate particles into several spherical diodes; forming several second conductors coupled to the several spherical diodes; depositing spherical lenses suspended in a first polymer. The step of depositing further involves printing the spherical lenses suspended in the first polymer over diodes and second conductors.    USE - For manufacturing an electronic apparatus (claimed) selected from light emitting diode-based lighting devices and photovoltaic devices.    ADVANTAGE - The process prepares light emitting or photovoltaic devices with less expensive and more robust manner, thus produce light emitting diode-based lighting devices and photovoltaic panels which are available for widespread use and adoption by consumers and businesses; provides apparatus is robust and capable of operating under wide variety of conditions including outdoor and other stressful environmental conditions; provides apparatus is flexible, foldable, and creasable.    DETAILED DESCRIPTION - Manufacturing electronic apparatus involves forming several first conductors coupled to a base; coupling several spherical substrate particles to the several first conductors; subsequent to the coupling to the several first conductors, converting the several spherical substrate particles into several spherical diodes; forming several second conductors coupled to the several spherical diodes; depositing spherical lenses suspended in a first polymer; attaching a prefabricated layer to spherical diodes, the prefabricated layer comprising spherical lenses suspended in a first polymer; partially curing the first conductive medium; depositing third conductors over or within the second conductors; coupling a reflector or a refractor to the base; and attaching an interface for insertion into a standardized lighting socket. The step of depositing further involves printing the spherical lenses suspended in the first polymer over diodes and second conductors. The diodes are semiconductor light emitting diodes, organic light emitting diodes, encapsulated organic light emitting diodes, polymer light emitting diodes, or photovoltaic diodes. The substrate particle comprises gallium nitride, gallium arsenide, or silicon. The first conductive medium comprises a conductive ink or a conductive polymer. The first conductive medium comprises a silver conductive ink, a copper conductive ink, a gold conductive ink, an aluminum conductive ink, a tin conductive ink, a carbon conductive ink, a carbon nanotube polymer, or a conductive polymer. The step of depositing a first conductive medium involves sputtering, coating, vapor depositing or electroplating a metal, a metal alloy, or a combination of metals. The metal, and/or metal alloy comprises aluminum, copper, silver, nickel, or gold. The annealing or alloying is laser or thermal annealing or alloying. The dopant material is a substrate liquid or film. The base comprises paper, coated paper, plastic coated paper, embossed paper, fiber paper, cardboard, poster paper, poster board, wood, plastic, rubber, fabric, glass, and/or ceramic. The interface is compatible with an E12, E14, E26, E27, or GU-10 lighting standard.    DESCRIPTION OF DRAWING(S) - The figure shows cross-sectional view of the fifth exemplary base with first conductors and substrate particles.    First conductor (110)    Crest (115)    Substrate particle (120)    Ohmic contact (265)    Conductive backplane (290)