TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The pigment is black-type pigment having light absorptivity of 3 mu m or less at wavelength of more than 700 nm, porous microparticles having number average particle diameter of 50 nm to 10 mu m, or non-porous microparticles having number average particle diameter of 5-100 nm.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The curable resin composition contains (in parts mass) photoinitiator (0.1-10), thermal-polymerization initiator (0.1-10) and organic compound (b) (10-500) having polymerizable unsaturated group in a molecule and number average molecular weight of less than 1000 with respect to resin (a) (100) having number average molecular weight of 1000-300000, and has viscosity of 10 Pa.second to 10 kPa.second at 20 degrees C. The resin composition further contains pigment (0.01-5 %mass) having number average particle diameter of 5 nm to 10 mu m, or hollow microparticles (0.1-50 %mass) having number average particle diameter of 0.1-300 mu m. The photoinitiator is hydrogen abstraction-type photoinitiator, preferably chosen from benzophenone, Michler's ketone, xanthene, thioxanthone and anthraquinone, and has molar extinction coefficient of 1x 104-1x 106 M-1cm-1 at wavelength of 250 nm. The thermal-polymerization initiator has liquefaction temperature of 20 degrees C and 10-hour half life temperature of 60 degrees C or more, and is chosen from peroxy ester, diperoxy ketal, dialkyl peroxide, diacyl peroxide and t-alkyl hydroperoxide. The resin (a) has carbonate structure. The support includes fiber-reinforced plastics, metal sleeve, metal cylinder or rubber-made cylinder. Preferred Process: The photocuring process is carried out by irradiating light generated from light source chosen from high-pressure mercury-vapor lamp, ultrahigh pressure mercury lamp, ultraviolet-ray fluorescent lamp, germicidal lamp, carbon arc lamp, xenon lamp and metal halide lamp. The thermosetting process is carried out by heating at 80-200 degrees C. The printing original plate layer has thickness of 50 mu m to 50 mm.