TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The alpha-olefins are selected from ethylene, propylene, octene, and/or butene. The alpha-olefins are polymerized using a metallocene-based catalyst. The light stabilizer includes an ultraviolet (UV) absorber in an amount of 0.05-1.2 wt.%; and a hindered amine light stabilizer in an amount of 0.05-0.75 wt.%. The UV absorber is a 2-hydroxyphenyl benzotriazole based UV absorber. The adhesion promoters include at least one trialkoxysilane. The trialkoxysilanes include gamma-methacroyloxypropyl trimethoxysilane and/or bis(triethoxysilyl)ethane. The amount for gamma-methacroyloxypropyl trimethoxysilane is 1.5 (parts per hundred parts (phr)), and for bis(triethoxysilyl)ethane is 0.5 phr.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The base resin has at least one of the following properties: a melt mass flow index (according to ASTM D1238 tested at 190 degrees C/2.16 kg) that is greater than 1 g/10 minutes at 190 degrees C; a percent (%) crystallinity of less than 20%; a melting point of 50-80 degrees C; and a glass transition temperature of less than -30 degrees C. The base resin includes at least one elements from the Dow Chemical Engage (RTM: base resin) product line or Exxon Exact (RTM: base resin) product line, preferably Dow Chemical Engage 8100 (RTM: base resin) or Dow Chemical Engage 8130 (RTM: base resin). Preferred Composition: The composition (C1) further includes at least one non-alpha olefin homopolymers or copolymers. The composition (C1) comprises (wt.%): the base resin (89-98, preferably 94-96); the light stabilizer (0.05-1.95, preferably 1.25-1.35); and the adhesion promoter (0.5-9, preferably 1.5-2.5). The composition further comprises a peroxide curing agent. The peroxide curing agent decomposes at 100-140 degrees C. The peroxide curing agent includes: Lupersol TBEC (RTM: tert-butyl peroxy 2-ethyl-hexyl carbonate); Luperox P (RTM: tert-butyl peroxy benzonate) and/or Lupersol 231 (RTM: 1,1-di-tert-butyl peroxy-2,2,4-trimethyl cyclohexane). The peroxide curing agent is present in an amount of 2.5 (phr). EXAMPLE - An encapsulant composition comprising (g): Dow Chemical Engage 8100 (RTM: polyethylene octane, metallocene catalyzed) (97.90); Tinuvin 234 (RTM: 2-(2H-benzotriazol-2-yl)-4,6-bis(1-ethyl-1-phenylethylphenol) (0.29); Tinuvin 770 (RTM: bis(2,2,6,6-tetramethyl-4-piperadinyl)sebacate) (0.1); Dow Corning Z6030 (RTM: gamma-methacroyloxypropyl trimethoxysilane) (0.24); and OO-tert-butyl-O-2-ethyl-hexyl peroxycarbonate (TBEC) (1.47), was prepared. The composition was tested for Wet High Pot test for photovoltaic module according to standard IEC 61215. The module was immersed in a surfactant containing bath with applied voltage of 500 V. Resistance of greater than 2 G-Ohms were passed. It was observed that the module encapsulated with the test composition showed resistance at 85 degrees C and relative humidity of 85% as follows (G-ohms): at 0 hours: (7.81); after 192 hours: (7.4); and after 2176 hours: (8.76), and passed the wet high pot test; whereas a comparative module encapsulated with conventional ethylene-vinyl acetate (EVA)-based composition, had failed after 504 hours of test.