TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The barrier material is a ceramic material selected from oxides of aluminum, silicon, titanium, tungsten, magnesium, zirconium, or calcium, nitrides of silicon, tungsten, aluminum, zirconium, chromium, titanium, tantalum, molybdenum, gallium, or boron, carbides of silicon, titanium, vanadium, zirconium, iron, or boron, borides of titanium or iron, and suicides of tungsten and titanium.    TECHNOLOGY FOCUS - POLYMERS - Preferred Method: In the method, all steps are repeated an additional one to 10 times, such that from one to 10 additional barrier and bonding layers are formed. The curing is carried out at elevated temperature for a predetermined period of time, where when bonding layers are formed, the curing is either carried out after the formation of each bonding layer or after all bonding layers are formed. The method further involves forming a protective layer between the electronic device and the barrier layer by depositing a protective material on the electronic device. The protective material is selected from parylene-C, parylene-D, and parylene-N, and is deposited by thermal evaporation of parylene dimer, or where the protective material is polyimide and is deposited by thermal evaporation or spin coating. The protective material is at least partially transparent to UV radiation. The protective layer is not present and the barrier material is deposited directly on the electronic device. Preferred Components: The silicon containing material is a siloxane or polysiloxane comprising monomer units of formula -(-(R2)Si(R1)-X-)n- (I). The encapsulation portion further comprises an additional one to 10 pairs of alternating layers of the barrier material and the cross- linked material. The silicon-containing polymer comprises cross-linked units having the structure -(Si(R'2)(X')1.5)-. The protective material is selected from parylene and polyimide. The barrier material of the first pair of layers directly contacts at least one of the component layers in the electronic device. The encapsulation portion further comprises a protective layer that directly contacts at least one of the component layers of the electronic device and is disposed between the electronic device and the first pair of layers. The barrier material of the first pair of layers is attached through covalent linkages to the bonding material of the first pair of layers. The barrier material of each barrier layer is covalently attached to the bonding material of any adjacent barrier layer.R1 and R2=H, OH, 1-30C hydrocarbyl, organometallic, halocarbyl, or organosilyl (all optionally substituted and optionally heteroatom containing);X=-O- or -NR3-;R3=hydrocarbyl;n= greater than or equal to 1;R'2=H, hydroxyl, fluorocarbyl, and hydrocarbyl (preferably alkyl, alkenyl, alkynyl, alkoxy, aryl, aryloxy, aralkyl or alkaryl (optionally contains heteroatom, and optionally substituted with at least one groups selected from halo, hydroxyl, alkyl, or aryl));X'=-O- or -NR'3-(preferably -O-);R'3=alkyl and aryl. EXAMPLE - No suitable example given.