NOVELTY - A metallic circuit (50) is formed on both surfaces of resin film (a) (100), and inner wall face of a conduction via (120). An elongate resin film (II) is laminated with respect to surface or both surfaces of the resin film (a). A metallic circuit is formed on both surfaces of the front and back of resin film (b) (101), and inner wall face of the conduction via. The elongate resin film (II) is laminated with respect to a surface(s) of the resin film (b). The resin film (b) is laminated on the resin film (a) via an adhesive to obtain a multilayer laminated circuit board (1).    USE - Manufacture of multilayer laminated circuit board used for electric product, electronic product, semiconductor product, antenna circuit board, integrated circuit card, solar cell, motor vehicle and robot (all claimed).    ADVANTAGE - The method enables manufacture of multilayer laminated circuit board efficiently, by suppressing disconnection of metallic circuit.    DETAILED DESCRIPTION - A conduction via which penetrates front and back of a resin film (a) with respect to an elongate resin film (I) is formed. A metallic circuit is formed on both surfaces of resin film (a), and inner wall face of the conduction via. An elongate resin film (II) is laminated with respect to surface or both surfaces of the resin film (a). A conduction via which penetrates front and back of a resin film (b). A metallic circuit is formed on both surfaces of the front and back of resin film (b), and inner wall face of the conduction via. The elongate resin film (II) is laminated with respect to surface or both surfaces of the resin film (b). The metallic circuit is obtained by forming a plated layer by electrophotography on a base layer, after forming base layer comprising an antioxidant layer and a base metal layer (130). The resin film (b) is laminated on the resin film (a) via an adhesive to obtain multilayer laminated circuit board, and the laminate has adhesive force of 1000-3000 gf/20 mm2. The antioxidant layer contains metal such as nickel, copper and/or cobalt, alloy containing metallic element of chromium, titanium, nickel, cobalt and/or copper, or oxide or nitride of metallic element. The base metal layer contains aluminum, silver, nickel and/or copper.    DESCRIPTION OF DRAWING(S) - The drawing shows the sectional view of the multilayer laminated circuit board.    Multilayer laminated circuit board (1)    Resin films (100,101)    Conduction via (120)    Base metal layer (130)    Metallic circuit (50)