NOVELTY - Forming photoelectronic element with transparent adhesion structure involves providing first semiconductor stack layer (12) including first and second surfaces, and first active layer; providing supporting substrate (11); forming first transparent adhesion layer (13) on the supporting substrate and second transparent adhesion layer (16) under the first surface of the first semiconductor stack layer; and performing first connecting process to connect the first semiconductor stack layer and the supporting substrate by the first and second transparent adhesion layer.    USE - As photoelectronic elements (claimed) e.g. light-emitting diode (LED), solar cell, photo diode.    ADVANTAGE - The photoelectronic element provides lighting apparatus or the light-absorbing apparatus by connecting the substrate and a base with a bumping material or glue.    DETAILED DESCRIPTION - Forming photoelectronic element with transparent adhesion structure involves providing first semiconductor stack layer (12) including first surface, second surface, and first active layer; providing a supporting substrate (11); forming a first transparent adhesion layer (13) on the supporting substrate and second transparent adhesion layer (16) under the first surface of the first semiconductor stack layer respectively, where at least one surface of the first transparent adhesion layer or of the second transparent adhesion layer containing hydrogen-oxygen bonds or hydrogen bonds; and performing a first connecting process to connect the first semiconductor stack layer and the supporting substrate by the first transparent adhesion layer and the second transparent adhesion layer. An INDEPENDENT CLAIM is included for photoelectronic element with transparent adhesion structure comprising supporting substrate; a transparent adhesion layer on the supporting substrate; and a first semiconductor stack layer including a first active layer on the second transparent adhesion layer, where one surface of the surfaces where the transparent adhesion layer on the supporting substrate adjacent to the supporting substrate having the surface roughness less than 2 nm and one surface of the surfaces, where the transparent adhesion layer on the supporting substrate adjacent to the supporting substrate containing hydrogen-oxygen bonds or hydrogen bonds.    DESCRIPTION OF DRAWING(S) - The figure shows cross-sectional view of manufacture process of photoelectronic element.    Supporting substrate (11)    Stack layer (12)    First transparent adhesion layer (13)    Window layer (14)    Second transparent adhesion layer (16)