TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The organic functional group is an oxygen-containing organic functional group, where the oxygen-containing organic functional group is an acrylic functional group, epoxy functional group, or oxetanyl functional group, and the acrylic functional group is acryloxyalkyl or methacryloxyalkyl group and the epoxy functional group is glycidoxyalkyl or epoxy cyclohexylalkyl group. The polymerizable organic functional group is an oxygen-containing polymerizable organic functional group, and the organic group is an oxygen-containing organic group, where the oxygen-containing polymerizable organic functional group is an acrylic functional group, epoxy functional group, oxetanyl functional group, or alkenyl ether functional group, and the oxygen-containing organic group contains a carbonyl group or ether bond; where the acrylic functional group is an acryloxyalkyl group, methacryloxyalkyl group, acrylamidealkyl group or methacrylamidealkyl group; the epoxy functional group is a glycidoxyalkyl group or epoxycyclohexylalkyl group; the alkenyl ether functional group is a vinyloxyalkyl group; and the oxygen-containing organic group has a carboxylic acid ester bond, carboxylic acid amide bond or ether bond.    TECHNOLOGY FOCUS - POLYMERS - Preferred Method: The organic functional group-containing curable organosilane or its composition is condensation reaction-curable, the organic functional group-containing curable organopolysiloxane is condensation reaction-curable, and the organic functional group-containing curable organopolysiloxane composition is condensation reaction-curable or hydrosilylation reaction-curable. In methods (M1)-(M3), the silicon oxynitride layer is formed by a reactive ion plating procedure. Preferred Components: The resin (OP1) represented by the unit (I) is composed of at least one siloxane unit of formula (X(3-b)(R1)bSiO\2) and at least one siloxane unit of formula (R2SiO3/2), or at least one siloxane unit of formula (X(3-b)(R1)bSiO\2), at least one siloxane unit of formula (R2SiO3/2) and at least one siloxane unit of formula (SiO4/2). The organopolysiloxane resin of formula (X(3-b)(R1)bSiO\2)v(R2SiO3/2)w (II) or by the average siloxane unit of formula (X(3-b)(R1)bSiO\2)x(R2SiO3/2)y(SiO4/2)z (III).X=2-10C monovalent unsaturated aliphatic hydrocarbyl;R1=1-10C monovalent hydrocarbyl other than X;b=0-2;R2=1-10C monovalent hydrocarbyl other than X;w=greater than 0.8 and less than 1;v+w=1;x=greater than 0 and less than 0.4;y=greater then 0.5 and less than 1;z=greater than 0 and less than 0.4;andx+y+z=1. EXAMPLE - Methylphenylvinylpolysiloxane resin (A1) having weight-average molecule weight of 2300 and a number-average molecular weight of 1800; and having average siloxane unit of formula (ViMe2SiO\2)0.15(PhSiO3/2)0.76(SiO4/2)0.09 (where Vi = vinyl group and Me = methyl group. There were 2.2 vinyl groups per molecule), was prepared. Toluene solution of the resin (A1) (75 wt.%) was mixed with 1,4-bis(dimethylsilyl)benzene to provide a molar ratio of the silicon-bonded hydrogen atoms in the latter to the vinyl groups in the former of 1.2 and this was thoroughly stirred. A 1,3-divinyl-1,1,3,3-tetramethyldisiloxane solution of a platinum-1,3-divinyl- 1,1,3,3-tetramethyldisiloxane complex was subsequently added in an amount that provided 2 part per million (ppm) for the weight of the platinum metal with reference to the weight of the solids fraction in the polysiloxane+1,4-bis(dimethylsilyl)benzene mixture; stirring was continued to give a casting solution. This casting solution was cast onto a glass substrate; after standing for 1 hour at room temperature, the toluene was evaporated off by heating for 2 hours at 100 degrees C and curing was then effected by heating for 3 hours at 150 degrees C. This was followed by cooling to room temperature and a free-standing film comprising cured resin (A1) was then obtained by peeling the cured resin (A1) from the glass substrate. This film was transparent and had a thickness of 100 mu m. Measurement of the light transmittance of this film yielded a light transmittance at 400-700 nm of at least 85%. Measurement of the bending strength of the cured resin (A1) film having a width of 1.27 cm, a length of 5.08 cm, and a thickness of 0.25 cm gave a Young's modulus of 1.4 GPa and a bending strength of 50 MPa. A silicon oxynitride layer, that was, silicon oxynitride film was formed on one side of this film having a width of 10 cm, a length of 10 cm, and a thickness of 100 mu m using reactive ion plating. A 100 nm-thick silicon oxynitride layer, that was, silicon oxynitride film was formed using a silicon oxide rod as the film formation starting material and using nitrogen gas as the reactive gas; the discharge current was 120 A, the pressure during film formation was 5 mTorr, that was, 0.67 Pa, and the cycle was carried out two times. The surface roughness of the silicon oxynitride layer, that was, silicon oxynitride film was 1.32-1.77 nm. This silicon oxynitride layer, that was, silicon oxynitride film-bearing cured resin (A1) film had a light transmittance at 400-700 nm of at least 80% and had a water vapor transmission rate of 0.37-0.56 g/m2.day.