NOVELTY - A monolithic module comprises first conducting layer covering a semiconductor layer covering a second conducting layer; first trench (12) penetrating through the first conducting layer (14) to separate a first conducting layer for a first electrical device; second trench (18) penetrating through the semiconductor layer and the second conducting layer to separate a second conducting layer (20); third trench (24) penetrating through the semiconductor layer; and electrically conductive interconnecting material partially filling the third trench.    USE - Monolithic module for interconnecting electrical devices (10) including photovoltaic cells on common flexible substrate.    ADVANTAGE - The module is capable of monolithically interconnecting electrical devices on common substrate while avoiding mechanical scribe steps, providing an advantage over known processing techniques for low cost flexible substrates. Since the interconnect processing can be implemented in one step after all device layers are deposited, the number of cleaning steps may be reduced, increasing the quality of device interfaces. Interconnect area required for scribing can be reduced, thus providing a larger effective cell area to reduce difference between individual device (cell) and module efficiency.    DETAILED DESCRIPTION - Monolithic module comprises first conducting layer covering semiconductor layer covering a second conducting layer covering a substrate (58); first trench (12) penetrating through the first conducting layer to separate a first conducting layer (14) for a first electrical device from a first conducting layer for a second electrical device; second trench (18) penetrating through the semiconductor layer and second conducting layer (20) to separate a second conducting layer for the first electrical device and a second conducting layer for the second electrical device, the second trench partially filled with a resistive material; third trench (24) penetrating through the semiconductor layer; and electrically conductive interconnecting material (28) partially filling the third trench and providing an electrical current pathway from the first electrical device first conducting layer to second electrical device second conducting layer (22), the second or third trench being within the boundaries of the first trench.    DESCRIPTION OF DRAWING(S) - The drawing is a cross-sectional view of a monolithically integrated module.    Electrical device (10)    First trench (12)    First conducting layer (14)    Second trench (18)    Second conducting layer (20)    Second electrical device second conducting layer (22)    Third trench (24)    Interconnecting material (28)    Substrate (58)