NOVELTY - A bonded structure is produced by preparing two base materials each having a terminal, and a transfer base material having a liquid repellency-imparted surface; applying a silicone material- and conductive particle-containing liquid material (35) to the liquid repellency-imparted surface and drying the formed liquid coating to obtain a bonding film; bonding the base materials to each other via the bonding film; and applying pressure to a temporarily bonded structure to electrically connect the terminals via the conductive particles contained in bonding film.    USE - Method of producing a bonded structure (claimed). Uses include but are not limited to LCD device, organic electroluminescent elements, electrophoretic display elements, bonded structures of a mount substrate, memory, piezoelectric elements (e.g. crystal oscillators), photoelectric converting elements (e.g. solar cells), microelectromechanical systems components (e.g. micromirrors), or sensor components (e.g. pressure sensors or acceleration sensors).    ADVANTAGE - The method can bond the terminals of two substrates to each other via the bonding film having excellent bonding strength and that has been patterned with high deposition accuracy. The bonding film is formed to correspond to the first and second terminals of the base materials, and the terminals are electrically connected to each other via the conductive particles contained in the bonding film. Thus, shorting between adjacent terminals can be reliably prevented, and a highly reliable bonded structure can be obtained.    DETAILED DESCRIPTION - Production of a bonded structure comprises:    (A) preparing a first base material having a first terminal, a second base material having a second terminal, and a transfer base material having a liquid repellency-imparted surface that is repellent against a silicone material- and conductive particle-containing liquid material (35);    (B) applying the silicone material- and conductive particle-containing liquid material to the liquid repellency-imparted surface of the transfer base material to form a liquid coating in patterns of a predetermined shape, and drying the liquid coating to obtain a bonding film patterned into the predetermined shape;    (C) imparting energy to the bonding film to provide adhesion near a surface of the bonding film, then bonding the transfer base material and the first base material to each other via the bonding film, and then separating the transfer base material and the first base material from each other to transfer the bonding film from the transfer base material to the first base material;    (D) imparting energy to the bonding film after the transfer to provide adhesion near another surface of the bonding film, and bonding the first base material and the second base material to each other via the bonding film to obtain a temporarily bonded structure of the first base material and the second base material; and    (E) applying pressure to the temporarily bonded structure in a thickness direction of the bonding film to finalize the bonding between the first base material and the second base material via the bonding film and electrically connect the first terminal and the second terminal via the conductive particles contained in the bonding film.    DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view illustrating a droplet discharge apparatus used to apply a liquid material onto the transfer base material.    Liquid material (35)    Droplet discharge apparatus (500)    Tank (501)    Droplet discharger (503)    Tube (510)