NOVELTY - A solar cell array electrode is prepared by (A) coating protective film, (B) notching groove using laser, (C) taking activation radio-activation processing, (D) electrochemical machining, and (E) removing protective film. The step (A) includes coating bed of protective film on surface of silicon semiconductor which is coated with reflecting layer. The step (E) includes putting silicon semiconductor which is completed by electrochemical machining soak into organic solvent to remove protective film covered on surface of polar plate, washing, and stoving to obtain desired electrode (E1).    USE - Method is used for preparation of solar cell array electrode (E1) using electrochemical machining useful in preparing composition board of solar cell (claimed).    ADVANTAGE - The method has good automation level and fast plating rate, and simple operation; is easy to master; has comparatively low cost and high efficiency; and needs few tool devices. The use electro chemical machining apparently improves manufacturing efficiency, thus can realize preparation of array electrode in short time. The prepared electrode (E1) is uniform and light. The electroplating groove is easy to maintain. The combined strength of electrode and matrix is high. The bond of cladding material is high, thus reducing contact resistance between matrix and conductor wires.    DETAILED DESCRIPTION - Solar cell array electrode is prepared by (A) coating protective film, (B) notching groove using laser, (C) taking activation radio-activation processing, (D) electrochemical machining, and (E) removing protective film. The step (A) includes coating bed of protective film on surface of silicon semiconductor which is coated with reflecting layer, where silicon semiconductor has p/n knot. The step (B) includes notching array grooves through laser on surface of silicon semiconductor which is coated with protective film. The step (C) includes taking activation radio-activation to groove in fluorine-containing acid solution or hydroxide solution after washing silicon semiconductor notched with array grooves through surface active agent to obtain silicon semiconductor which is through pre-processing. The step (D) includes using normal electroplating power supply, and using negative pole of power supply to connect with silicon semiconductor which is through pre-processing and positive pole connecting with plating pen saturated with plating solution; and starting power supply, and taking electro chemical machining on surface of silicon semiconductor which is through pre-processing to plating at current density of 1-4 A/dm2, where plating pen is mobile plating pen or pictographic plating pen. The step (E) includes putting silicon semiconductor which is completed by electrochemical machining soak into organic solvent to remove protective film covered on surface of polar plate, washing, and stoving to obtain silicon solar cell array electrode.