NOVELTY - A multilayer laminated circuit board (1) has a laminated structure formed by alternately laminating resin film (100) and circuit layer (200). The circuit layer has metallic circuit (50) having base layer (130) and plating layer (140). The base layer (130) contains an antioxidant layer and a base metal layer. The antioxidant layer comprises metal chosen from nickel, titanium, cobalt and silicon, its alloy or alloy containing chromium, and has thickness of 2-20 nm. The base metal layer comprises metal chosen from copper, gold, silver, tin, nickel, bismuth and zinc or its alloy.    USE - Multilayer laminated circuit board is used for component and product e.g. electric product, electronic product, semiconductor product, antenna circuit board, integrated circuit card, solar cell, motor vehicle and robot (all claimed).    ADVANTAGE - The multilayer laminated circuit board is easily prevented from disconnection of metallic circuit.    DETAILED DESCRIPTION - A multilayer laminated circuit board (1) has a laminated structure formed by alternately laminating resin film (100) and circuit layer (200). The resin film (100) is an elongate material and has one or more multi conduction portions (110). The multi conduction portion (110) occupies the region having diameter of 10-3000 mu m and has two or more conduction via (120). The conduction via (120) has an internal diameter of 5-300 mu m. The ratio of internal diameter of the conduction via and thickness of the resin film is 0.3-2. The circuit layer has metallic circuit (50) formed on the resin film and in the conduction via. The metallic circuit consists of a base layer (130) and a plating layer (140) formed by electroplating on base layer (130). The base layer (130) contains an antioxidant layer and a base metal layer. The antioxidant layer comprises metal chosen from nickel, titanium, cobalt and silicon, its alloy or alloy containing chromium, and has thickness of 2-20 nm. The base metal layer comprises metal chosen from copper, gold, silver, tin, nickel, bismuth and zinc or its alloy.    DESCRIPTION OF DRAWING(S) - The drawing shows the sectional view of multilayer laminated circuit board.    Multilayer laminated circuit board (1)    Metal circuit (50)    Resin film (100)    Conduction via (120)    Base layer (130)    Plating layer (140)    Circuit layer (200)