TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Composition: The phosphorus-comprising dopant further comprises nanoparticles having an average particle size of not greater than 1 mu m. The nanoparticles comprise silica nanoparticles. The nanoparticles comprise the phosphorus-comprising dopant ( not greater than 10 wt.%). Preferred Method: In the method (M1), the step of providing involves the step of providing a phosphorus-comprising dopant formed using a phosphorus-comprising acid and a phosphorus-comprising salt. The step of providing involves the step of providing a phosphorus-comprising dopant having a pH of 0-10; and comprising a liquid medium. The step of providing involves the step of providing a phosphorus-comprising dopant further formed using an alkaline material (preferably an ammonia alkaline material); and using nanoparticles having an average particle size of not greater than 1 mu m. The step of depositing is performed by inkjet printing or aerosol jet printing. The step of causing involves the step of permitting the liquid medium to evaporate at a temperature not greater than 800 degrees C. The step of diffusing involves the step of annealing the semiconductor material using high-temperature thermal annealing, laser annealing, or microwave annealing. The method (M1) further involves, before the step of depositing, the step of subjecting the semiconductor material to a pre-dopant treatment. The step of subjecting involves applying to the semiconductor material acid, a base, an oxidizer, and/or a solvent, and/or heating the semiconductor material to a temperature of not greater than 800 degrees C. The method (M1) further involves, after the step of diffusing, the step of subjecting the semiconductor material to a post-diffusion treatment. In the method (M2), the step of combining involves combining the phosphorus source with a liquid medium or with an ammonia alkaline material. The method (M2), further involves the step of combining the phosphorus source combined with nanoparticles having an average particle size of not greater than 1 mu m. Preferred Components: The phosphorus source comprises an inorganic, non-metal, phosphorus-comprising acid, an inorganic, non-metal, and/or a phosphorus-comprising salt. The phosphorus-comprising acid is selected from phosphoric acid (H3PO4), phosphorous acid (H3PO3), hypophosphorous acid (H3PO2), pyrophosphoric acid (H4P2O7), and acids of formula HR1R2PO2 and H2RPO3. The phosphorus-comprising salt is selected from ammonium phosphate ((NH4)3PO4), ammonium dihydrogen phosphate (NH4H2PO4), diammonium hydrogen phosphate ((NH4)2HPO4), ammonium phosphite ((NH4)3PO3), diammonium hydrogen phosphite ((NH4)2HPO3), ammonium dihydrogen phosphite (NH4H2PO3), ammonium hypophosphite ((NH4)3PO2), diammonium hydrogen hypophosphite ((NH4)2HPO2), ammonium dihydrogen hypophosphite (NH4H2PO2), ammonium pyrophosphate ((NH4)4P2O4), triammonium hydrogen pyrophosphate ((NH4)3HP2O4), diammonium dihydrogen pyrophosphate ((NH4)2H2P2O4), ammonium trihydrogen pyrophosphate (NH4H3P2O4), and phosphate salts of formula (NR3R4R5R6)3PO4, (NR3R4R5H)3PO4, (NR3R4H2)3PO4, or (NR3H3)3PO4. The phosphorus-comprising dopant has a pH of 0-10 (preferably 6-7). The phosphorus element of the phosphorus source comprises the phosphorus-comprising dopant ( not greater than 60 wt.%). The liquid medium is selected from alcohols, N-methylpyrrolidone (NMP), propylene glycol methyl ether acetate (PGMEA), ethyl acetate, dimethylformamide (DMF), glycerol, tetrahydrofuran (THF), and/or water. The liquid medium comprises the phosphorus-comprising dopant ( not greater than 95 vol.%). The alkaline material comprises greater than or equal to zero and not greater than 50 wt.% of the phosphorus-comprising dopant. The alkaline material comprises an ammonia alkaline material.R, R1-R6=alkyl or aryl. EXAMPLE - In a 1 liter glass vessel, 85% phosphoric acid (8.3 parts by volume) was combined with ethylene glycol (33.3 parts by volume) and 25% tetramethylammonium hydroxide (TMAH) aqueous solution (58.3 parts by volume). The solution was stirred at room temperature for thirty minutes using an electromagnetic stirrer. The solution was then filtered using a 0.45 mu m polyvinylidine fluoride (PVDF) filter to obtain a phosphorus-comprising dopant. The pH of the dopant was 7. The phosphorus-comprising dopant was deposited on a bare P-type silicon wafer. The silicon wafer was baked at 200 degrees C for 10 minutes. A 25 mu m dopant line width on the silicon wafer was achieved.