NOVELTY - The module has a frame allowing a substrate (20) to pass through the module. An illumination source assembly is attached to the frame, and comprises two light sources (10) e.g. LEDs, emitting lights (11, 12) of wavelengths in red and blue spectrums, respectively. An image sensor assembly e.g. charge-coupled device camera, is attached to the frame, where the substrate is passed through the illumination source assembly and the image sensor assembly. The illuminating source assembly is positioned to direct light toward the image sensor assembly.    USE - Inspection module for inspecting a substrate e.g. light transparent substrate, glass substrate, polymer substrate and metal substrate, during manufacture of a thin film solar cell device e.g. single junction amorphous or micro-crystalline silicon solar cell device, which is utilized to generate electricity, in a production line. Can also be used for other solar cell device e.g. III-V type solar cell device, thin film chalcogenide solar cell device such as copper indium gallium selenide (CIGS) and cadmium telluride (CdTe) cell devices, amorphous or nanocrystalline silicon solar cell device, photochemical type solar cell device such as dye sensitized device, crystalline silicon solar cell device and organic type solar cell device, and photovolatic device.    ADVANTAGE - The module detects defects in the thin film solar cells during manufacturing process in an efficient manner. The module disqualifies the substrate for processing, so as to reduce production cost. The module improves efficiency of the inspection station by avoiding double inspection and double cameras, and increases light source efficiency. The module improves production line of the solar cell device.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for inspecting a substrate.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic illustration of a method for substrate inspection.    Light source (10)    Lights (11, 12)    Substrate (20)    Intrinsic type silicon layer (24)    Pinholes (27, 28)