TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Component: The metal atom (i) is copper, aluminum and/or silver. When the metal atom (i) is copper, the metal atom (ii) is aluminum, zinc, iron, nickel, lead and/or indium. Preferred Properties: The abundance ratio of sum total of metal atom (i) and metal atom (ii) in joining film (a) and joining film (b), and carbon atom is 3:7-7:3. The base material (b1) and base material (b2) have plate shape. Preferred Composition: The portion which forms at least the joining film (a) of base material (b1) and portion which forms at least the joining film (b) of base material (b2) contain silicon material, metal material or glass material.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Process: The base material (b1) with joining film (a) and base material (b2) with joining film (b) are piled up to obtain a laminated material such that the joining film (a) and joining film (b) are adhered. The energy is provided to the joining film (a) and joining film (b), leaving group in the joining film (a) and joining film (b) are detached, and joining film (a) and joining film (b) are joined. The joining film (a) and joining film (b) are formed into a film by organometallic chemical vapor deposition method using an organometallic material (I) with metal atom (i), and an organometallic material (II) with metal atom (ii) in a low reducing atmosphere. After the leaving group detaches from the surface vicinity of the joining films (a,b), active connection is produced. The joining film (a) and joining film (b) are at solid state, and does not have fluidity respectively. The joining film (a) and joining film (b) are subjected to surface treatment to improve adhesiveness, before forming joining film (a) on surface of base material (b1) and joining film (b) on surface of base material (b2). The surface treatment is plasma processing. An intermediate layer containing oxide-based material as a main component is provided between joining layer (a) and joining layer (b). The energy is provided to the joining layer (a) and joining layer (b) by irradiating energy beam of ultraviolet-ray with wavelength of 126-300 nm to joining layer (a) and joining layer (b), heating the joining layer (a) and joining layer (b) at 25-200 degrees C and/or providing compressive force of 0.2-10 MPa to joining layer (a) and joining layer (b), under atmosphere condition. The joint strength of the joined component is raised by carrying out energy beam irradiation to joined component, heating the joined component and/or providing compressive force to the joined component. Preferred Group: The leaving group is a group which remains in a portion of organic material in the organometallic material (I) and organometallic material (II). The leaving group has carbon atom as an essential component, and hydrogen atom, nitrogen atom, phosphorus atom, sulfur atom and/or halogen atom. The leaving group is alkyl group. The active connection is dangling bond or hydroxyl group. Preferred Component: The organometallic material (I) and organometallic material (II) are ( beta )-diketone-type complexes. Preferred Properties: The joining film (a) and joining film (b) have electroconductivity, and average thickness of 1-1000 nm.