TECHNOLOGY FOCUS - CERAMICS AND GLASS - Preferred Material: The electroconductive material contains ceramic material containing titanium, tantalum, niobium, zinc or tin. The ceramic material contains titanium nitride, titanium carbon nitride, titanium aluminum nitride, titanium aluminum carbon nitride, tantalum nitride, niobium nitride, zinc nitride or tin nitride, preferably titanium nitride.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The metal (a) contains titanium, tantalum, niobium, zinc, tin or their alloys. The metal (b) contains iron, aluminum, copper, nickel, chromium, vanadium, manganese, tungsten, molybdenum or their alloys. The layer (124) further contains metal foil. The primary metal oxide comprises titanium oxide, zinc oxide, tantalum oxide, tin oxide and/or terbium oxide. The primary metal oxide further contains nanoparticles. The photoactive layer is a porous layer. The photoactive layer contains several pores and a hole carrier material. The article further contains a hole blocking layer (130) and hole carrier layer (150). The hole blocking layer comprises secondary metal oxide. The secondary metal oxide contains n-type semiconducting metal oxide. The secondary metal oxide comprises titanium oxide, zinc oxide, niobium oxide, tantalum oxide, tin oxide and/or terbium oxide. The hole blocking layer is a non-porous layer. The hole carrier layer further contains hole carrier material (i) and photoactive layer which comprises several pores and hole carrier material (ii). The secondary electrode is transparent which comprises mesh or grid electrode. The layer (122) further contains an electroconductive material that does not form an electrically insulating metal oxide or p-type semiconducting metal oxide, titanium or titanium nitride. Preferred Properties: The layer (122) has thickness of 100 nm-5 microns, preferably 500 nm-2 microns. The layer (124) has thickness of 5-500 microns. The primary metal oxide has an average particle diameter of 20-100 nm. The hole blocking layer has thickness of 5-50 nm.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The hole carrier layer comprises a material which is 2,2',7,7'-tetrakis(N,N-di-methoxyphenylamine)-9,9'-spirobifluorene, triarylamines, polythiophene, polyaniline, polycarbazole, polyvinyl carbazole, polyphenylene, polyphenylvinylene, polysilanes, poly(thienylene vinylene), polyisothianaphthanenes, their copolymers or mixture, or poly(3-hexylthiophene) or poly(3,4-ethylenedioxythiophene).