NOVELTY - Metal containing composition comprises (a) 20-80 wt.% of at least an electrically conductive metal powder, a powder of a metallic alloy and/or at least a metal organic compound of the conductive metal; (b) at least a first oxidic material from glass, ceramics or metal oxides and/or glass, ceramic and/or metal oxide containing metals derived from metal organic compound and/or its mixtures; and (c) at least a second oxidic material from ceramics and/or metal oxides and/or ceramic and/or metal oxide containing metals derived from metal organic compound or its mixture.    USE - The metal containing composition is useful for the preparation of a contact structure on an electronic component, preferably solar cell (claimed).    ADVANTAGE - The metal containing composition exhibits high electrical conductivity, good electrical contact, adhesion, high mechanical adhesion and good solderability.    DETAILED DESCRIPTION - Metal containing composition comprises (a) 20-80 wt.% of at least an electrically conductive metal powder, a powder of a metallic alloy and/or at least a metal organic compound of the conductive metal; (b) at least a first oxidic material from glass, ceramics or metal oxides with a melting point of less than 1000 degrees C and/or glass, ceramic and/or metal oxide containing metals derived from metal organic compound and/or its mixtures; and (c) at least a second oxidic material from ceramics and/or metal oxides with a melting point of at least 1100 degrees C and/or ceramic and/or metal oxide containing metals derived from metal organic compound or its mixture. An INDEPENDENT CLAIM is included for the preparation of an electronic contact structure on an electronic component comprising applying the composition on the contact structure to be produced on the electronic component, and heating the component containing composition in contact at 400-900 degrees C.    DESCRIPTION OF DRAWING(S) - The figure shows schematic representation of the electronic component produced using the composition.    Semiconductor module (1)    Silver crystallite (2)    Glass layer (3)    Antireflection layer (4)    Silver layer. (5)