TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The carbon nanostructure is chosen from carbon nanotube, nanohorn, nanocone, nanoparticles, nanofiber, graphene and fullerene. The shell comprises a noble metal in form of atomic sub-monolayer, monolayer, bilayer and tri-layer. The shell contains palladium or palladium alloy. The shell has a dual-layer structure comprising an inner transition metal shell and an outer noble metal shell. The inner transition metal shell contains copper, nickel or zinc. The catalytically active noble metal contains platinum or platinum alloy in form of atomic sub-monolayer, monolayer, bilayer and tri-layer. Preferred Method: The carbon nanostructures are formed by chemical vapor deposition, laser ablation or arc discharge process. The surface of the carbon nanostructures is oxidized by immersion in 1 M sulfuric acid solution containing ammonium persulfate (10 g) at room temperature for 12 hours. The adsorbed metal ions are chosen from ions of lead, zinc, copper, bismuth, silver, tin, mercury, antimony, selenium, tellurium and thulium. The adsorbed metal ions are reduced by immersion in sodium perchlorate solution at potential of -1000 mV. The adsorbed metal ions are reduced by immersion in 0.1 M sodium perchlorate solution at potential of -1000 mV for 1 minute. The adsorbed metal ions are replaced by immersing the carbon nanostructures in a solution containing salt of primary transition metal. The adsorbed metal ions are replaced by immersing carbon nanostructures in 1 mM bivalent platinum cation solution for 5 minutes. The secondary transition metal is deposited by underpotential deposition carried out in solution having copper sulfate. Preferred Salt: The salt of primary transition metal is potassium tetrachloro platinate, palladium chloride, iridium chloride, ruthenium chloride, osmium chloride, rhodium chloride, gold chloride and rhenium chloride. The secondary transition metal is copper or lead. The salt of secondary transition metal is potassium tetrachloro platinate.