NOVELTY - The stamp (100) has a deformable layer (70) with multiple relief features (105) on its external surface (80), and a rigid support layer (150) connected to internal surface (75) of deformable layer. The rigid support layer has a bottom surface (175) that is positioned proximate to internal surface of deformable layer. A reinforcement layer (120) is operably connected to the support layer and includes an opening which vertically coincides with one or more portions of relief features on external surface of deformable layer.    USE - Reinforced composite stamp for printing tool device used for dry transfer printing of semiconductors (all claimed) such as micro-scale solar cells used in fabrication of distributed electronic system such as low profile heliostat concentration solar photovoltaic system. Can also be used for dry transfer printing of semiconductors such as transistors, diodes, LED, laser, PN junctions, photodiodes, integrated circuits and sensors.    ADVANTAGE - Excellent control over relative spatial placement accuracy of the semiconductors being transferred can be ensured. Precise and repeatable vertical motion of patterned surface of printing apparatus is possible, while the stamp can be self-leveled to the surface of contacted substrate. Also, uniform distribution of contact forces between printing apparatus patterned surface and top surface of substrate being contacted can be ensured.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) method for making reinforce composite stamp;    (2) device for making reinforced composite stamp;    (3) printing tool device for dry transfer printing of semiconductors; and    (4) method of patterning substrate surface with semiconductors elements.    DESCRIPTION OF DRAWING(S) - The drawing shows the schematic cross sectional view of the reinforced composite stamp.    Deformable layer (70)    Internal surface of deformable layer (75)    External surface of deformable layer (80)    Composite stamp (100)    Relief feature (105)    Reinforcement layer (120)    Rigid support layer (150)    Bottom surface of support layer (175)