NOVELTY - Fabricating contact grid involves providing photovoltaic cell having antireflective coating disposed on sun facing side; soft stamping pattern of ultraviolet (UV) sensitive photoresist and/or polymer onto the coating; exposing the photoresist and/or polymer to ultraviolet radiation to cure; etching pattern to form openings in the coating that define the contact grid; stripping the photoresist and/or polymer; and depositing conductive metal into the openings defined by pattern.    USE - For fabricating a contact grid for a photovoltaic cell (claimed).    ADVANTAGE - The process is improved manufacturing process that is less expensive and less prone to degradation. The process utilizes a relatively low temperature firing and soft stamping process for forming the contact grid and/or bus bars. The process is relatively simple and uses minimal capital equipment. The stamping material has a low cost and stamp alignment is generally not an issue since large dimensions are used. The annealing temperature is below that where any degradation occurs within the photovoltaic cell. The process is established at existing silicon based photovoltaic fabrication facilities without any significant investment and production costs.    DETAILED DESCRIPTION - Fabricating a contact grid for a photovoltaic cell involves providing a photovoltaic cell having an antireflective coating disposed on a sun facing side, where the photovoltaic cell comprising a silicon substrate having a p-n junction; soft stamping a pattern of a UV sensitive photoresist and/or polymer onto the antireflective coating; exposing the UV sensitive photoresist and/or polymer to ultraviolet radiation to cure the UV sensitive photoresist and/or polymer; etching the pattern to form openings in the antireflective coating that define the contact grid; stripping the UV sensitive photoresist and/or polymer; and depositing a conductive metal into the openings defined by the pattern. The etching the pattern comprises a phosphoric acid based wet etching chemistry. The stripping the UV sensitive photoresist and/or polymer comprise exposing the UV sensitive photoresist and/or polymer to hydrofluoric acid. In the method, depositing the conductive metal comprises stamping metal paste into the pattern; and annealing the metal paste.    DESCRIPTION OF DRAWING(S) - The figure shows view of process for fabricating contact grids.    Silicon substrate (12)    N-doped silicon surface (14)    Antireflective coating (16)    Annealed metal (26)