NOVELTY - A photopolymerizable resin laminate has a layer comprising photopolymerizable resin composition laminated on a support film having thickness of 5-100 mu m. The photopolymerizable resin composition contains (in %mass) binder resin (10-90) having acid equivalent of 100-1500 and weight average molecular weight of 2500-50000, compound (5-50) having photopolymerizable reactive group, radical photopolymerization initiator (0.1-20), coloring material (1-20) and radical polymerization inhibitor (0.1-20).    USE - Photopolymerizable resin laminate is used for forming resist pattern on copper substrate used for forming electromagnetic wave shield and transparent conductive substrate (all claimed). Can also be used in manufacture of conductive pattern used in printed wiring board, plasma display and solar cell.    ADVANTAGE - The copper substrate having black resist pattern formed using photopolymerizable resin laminate has high sensitivity. The electromagnetic wave shield and transparent conductive substrate are economically produced.    DETAILED DESCRIPTION - A photopolymerizable resin laminate has a layer comprising photopolymerizable resin composition laminated on a support film having thickness of 5-100 mu m. The photopolymerizable resin composition contains (in %mass) binder resin (10-90) having acid equivalent of 100-1500 and weight average molecular weight of 2500-50000, compound (5-50) having photopolymerizable reactive group, radical photopolymerization initiator (0.1-20), coloring material (1-20) and radical polymerization inhibitor (0.1-20). The content of radical polymerization inhibitor is 1-5 times the content of radical photopolymerization initiator. The layer comprising photopolymerizable resin composition has optical density of 0.5-2. INDEPENDENT CLAIMS are included for the following:    (1) formation of resist pattern;    (2) copper substrate;    (3) formation of electromagnetic wave shield; and    (4) formation of transparent conductive substrate.