TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Properties: The ratio of peak intensity of silicon and hydrogen with respect to peak intensity of silicon and nitrogen of layer (A) is preferably 0.01 or more and 0.03 or less. The ratio of peak intensity of carbon and hydrogen with respect to peak intensity of silicon and nitrogen of layer (A) is preferably more than 0 and 0.02 or less. The ratio of peak intensity of nitrogen and hydrogen with respect to peak intensity of silicon and nitrogen of layer (A) is preferably more than 0.05 and 0.08 or less. The ratio of peak intensity of carbon and fluorine with respect to peak intensity of silicon and nitrogen of layer (A) is preferably more than 0.05 and 0.25 or less. The ratio of peak intensity of silicon and hydrogen with respect to peak intensity of nitrogen and hydrogen of layer (B) is preferably more than 0.1 and 0.5 or less. The ratio of peak intensity of carbon and hydrogen with respect to peak intensity of nitrogen and hydrogen of layer (B) is preferably more than 0 and 0.2 or less. The ratio of peak intensity of silicon and nitrogen with respect to peak intensity of nitrogen and hydrogen of layer (B) is preferably more than 10 and 20 or less. The ratio of peak intensity of silica with respect to peak intensity of nitrogen and hydrogen of layer (B) is preferably more than 2 and 5 or less. The ratio of peak intensity of silicon and hydrogen with respect to peak intensity of silicon and nitrogen of layer (C) is preferably more than 0.01 and 0.03 or less. The ratio of peak intensity of carbon and hydrogen with respect to peak intensity of silicon and nitrogen of layer (C) is preferably more than 0 and 0.02 or less. The ratio of peak intensity of nitrogen and hydrogen with respect to peak intensity of silicon and nitrogen of layer (C) is preferably more than 0.05 and 0.08 or less. Preferred Layers: The gas-barrier film further contains conductive layer on the surface of gas-barrier film. Preferred Process: The gas-barrier layer is formed by catalyst-chemical vapor deposition using organic silane compound, organic amino silicon compound, ammonia, fluorocarbon, oxygen and hydrogen as raw materials.    TECHNOLOGY FOCUS - POLYMERS - Preferred Properties: The plastic film has glass transition temperature of 120 degrees C or more, melting point of 200 degrees C or more and liquid crystal transition temperature of 200 degrees C.