NOVELTY - Electrically conductive, thermally curable composition (A) comprises: electrically conductive particles; and (a) fatty acid modified epoxy acrylate and/or methacrylate monomer(s) or oligomer(s), and/or (b) fatty acid modified polyester acrylate and/or methacrylate monomer(s).    USE - (A) is useful: for forming an electrically conductive layer on a substrate; and in a photovoltaic device and a layered assembly (all claimed) e.g. a solar cell.    ADVANTAGE - (A): is thermally curable at temperatures less than 250 degrees C; and is solvent-free so that it can be used in processing or manufacturing operations without any solvent recovery concern.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for:    (1) a method of forming an electrically conductive layer on a substrate comprising: forming (A); applying (A) on the substrate to a thickness of 1-100 microns, and heating (A) to less than 250 degrees C to form the electrically conductive layer;    (2) a substrate comprising a thin layer of an electrically conductive polymeric material, where the material comprises metallic particles (70-90%) dispersed in a polymeric matrix formed by thermally curing (A);    (3) a photovoltaic device comprising many layers and an electrically conductive member, which is formed from (A);    (4) a layered assembly (10) comprising: a substrate; a layer of a transparent conducting oxide (20) on the substrate; and an electrically conductive member in electrical communication with the layer of the transparent conducting oxide, where the electrically conductive member is formed from (A); and    (5) a layered assembly comprising: a silicon substrate; a layer of aluminum on the silicon substrate; and an electrically conductive member in electrical communication with the layer of aluminum, where the electrically conductive member is formed from (A).    DESCRIPTION OF DRAWING(S) - The figure shows a schematic cross sectional view of a layered assembly having contacts formed from the electrically conductive, thermally curable composition.    Layered assembly (10)    Transparent conducting oxide layer (20)    Upper layer (30)    Semiconductor material (40)    lower layer (50)