TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Component: The electrode is bipolar electrode; and active material layer includes positive electrode active material layer bonded with one side of collector and a negative electrode active material layer bonded with an opposite side of the collector.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The active material layer comprises active material and binder polymer. The resin layer of the collector is bonded to active material layer by thermal fusion bonding. The binder polymer is thermosetting polymer. The resin layer comprises polymer material having softening point lower than melting point of the binder polymer. The conductive collector comprises laminated material of at least three resin layers including two outermost resin layers and at least one inner resin layer interposed between the two outermost resin layers. Each of the at least three resin layer is partially comprised of polymer material having softening point lower than a melting point of the binder polymer; and polymer material of the one of the two outermost resin layers disposed nearer to the active material layer than the other of the two outermost resin layers has softening point lower than that of polymer material of other of the two outermost resin layers. The polymer material is polyolefin, polyester, polyimide, polyamide or polyvinylidene fluoride. The binder polymer is polypropylene, polyester, polyimide, polyamide, polyvinylidene fluoride, epoxy resin or synthetic rubber. The binder polymer is thermoplastic polymer, and satisfying Tb subtracted with 10 is less than T and less than Ta, where T is thermal fusion bonding temperature during thermal fusion bonding, Tb is softening point of polymer material of conductive resin layer, and Ta is a melting point of the binder polymer. The binder polymer is thermosetting polymer, and satisfying Tb' subtracted to 10 is less than T', where is thermal fusion bonding temperature during thermal fusion bonding, and Tb' is softening point of polymer material of conductive resin layer. The collector comprises laminated material of three or more resin layers including outermost resin layers and at least one inner layer interposed between outermost resin layers; and where the thermal fusion bonding temperature is lower than a softening point of the at least one inner resin layer. Preferred Content: The collector has volume resistivity of 102-1-5 omega .cm. Preferred Methods: The formation of active material layer includes forming active material layer at least partially comprised of active material and binder polymer. The bonding of conductive resin layer to active material layer is performed by thermal fusion bonding. The active material layer is formed on resin layer by transferring or by applying high viscosity precursor of active material layer onto resin layer.