NOVELTY - A hopper (0102) has a funnel (0101) for dripping the semiconductor material. The semiconductor material is heated and melted in floating state by the electromagnetic induction process. An induction heating coil (0103) is positioned to enclose the semiconductor charge region of a hopper so as to apply the electromagnetic force. A drop tube (0104) cools the semiconductor material dripped in the molten state from the hopper, into the spherical shape. A receiving unit (0105) receives the cooled ball semiconductor in the solid state, when dropping in the drop tube.    USE - Manufacturing apparatus of ball semiconductor for spherical silicon type solar cell panel.    ADVANTAGE - The ball semiconductor of small particle size can be manufactured efficiently in short period of time by melting the semiconductor material in the floating state and by dropping the molten semiconductor material in the drop tube. The mixing of the impurity can be prevented. The production yield of the ball semiconductor can be improved.    DETAILED DESCRIPTION - A blowing unit blows off the pressurized inert gas inside the hopper so that the semiconductor material is heated and melted within the hopper by the electromagnetic induction process. A control unit controls the electric current sent through the induction heating coil so that the semiconductor material is heated in supercooled state. The length of the semiconductor material in non-supercooled state is less than length of the semiconductor material in solid state. An INDEPENDENT CLAIM is included for manufacturing method of ball semiconductor, which involves fixing an electroconductive material to the surface of the semiconductor material. The temperature of the melted semiconductor material is maintained at supercooling temperature. The dripping of the semiconductor material is performed in supercooling temperature so that the semiconductor material is cooled in preset time.    DESCRIPTION OF DRAWING(S) - The drawing shows a conceptual diagram of the manufacturing apparatus of the ball semiconductor.    Funnel (0101)    Hopper (0102)    Induction heating coil (0103)    Drop tube (0104)    Receiving unit (0105)