NOVELTY - Semiconductor device (I), comprises: interconnect structure (102); semiconductor die (120) (electrically connected to interconnect structure) mounted to interconnect structure; ground pad formed over interconnect structure; shielding cage (electrically connected to ground pad) formed over semiconductor die to isolate semiconductor die with respect to inter-device interference; encapsulant formed over shielding cage, semiconductor die and interconnect structure; and shielding layer formed over encapsulant to isolate semiconductor die with respect to inter-device interference.    USE - The semiconductor devices are useful: in electronic products including military, aviation, automotive, industrial controllers, and office equipment; as microcontrollers, microprocessors, charged coupled devices, solar cells, and digital micro-mirror devices; to perform high-speed calculations, transmitting and receiving electromagnetic signals, controlling electronic devices, transforming sunlight to electricity, and creating visual projections for television displays; and in the fields of entertainment, communications, power generation, networks, computers, and consumer products.    ADVANTAGE - The semiconductor device provides encapsulant which is non-conductive and environmentally protects the semiconductor device from external elements and contaminants.    DETAILED DESCRIPTION - Semiconductor device (I), comprises: an interconnect structure (102); a semiconductor die (120) mounted to the interconnect structure, where the semiconductor die is electrically connected to the interconnect structure; a ground pad formed over the interconnect structure; a shielding cage formed over the semiconductor die to isolate the semiconductor die with respect to inter-device interference, where the shielding cage is electrically connected to the ground pad; an encapsulant formed over the shielding cage, the semiconductor die, and the interconnect structure; and a shielding layer formed over the encapsulant to isolate the semiconductor die with respect to inter-device interference, where the shielding layer conforms to a geometry of the encapsulant and electrically connects to the ground pad. INDEPENDENT CLAIMS are also included for:    (1) semiconductor device (II), comprising: the interconnect structure; the semiconductor die; the shielding cage formed over the semiconductor die to isolate the semiconductor die with respect to inter-device interference, where the shielding cage is electrically connected to a ground point; and the encapsulant; and    (2) a semiconductor device (III), comprising: the interconnect structure; the semiconductor die; an encapsulant formed over the semiconductor die and the interconnect structure; and the shielding layer electrically connected to the ground point.    DESCRIPTION OF DRAWING(S) - The figure illustrates the diagram of conductive pillar implemented as a bar or rod of conductive material electrically connecting the shielding layer to a ground point.    Build-up interconnect layer (102)    Insulating layer (116)    Electrically conductive layer (118)    Semiconductor die (120)    Contact pads (122)