TECHNOLOGY FOCUS - ELECTRONICS - Preferred Apparatus: In the laser processing apparatus, during the measurement or inspection, the laser radiation section, which is performing the laser radiation, and the measurement section or the inspection section are kept in a given positional relationship; and where a point of laser radiation on the substrate and the point of measurement or the point of inspection on the substrate are kept in a given positional relationship. The laser processing apparatus comprises the inspection section, where the inspection section inspects a groove formed by the laser radiation. The laser radiation section forms a set of grooves in the substrate; and where the inspection section inspects a groove that is under the laser radiation. Also, the laser radiation section forms a set of grooves in the substrate; and where the inspection section inspects a groove other than a groove under the laser radiation. The inspection section is an optical inspection section for inspecting the grooves optically; and where the optical inspection section includes a confocal laser scanning microscope or dark-field microscope. The inspection section is an electrical inspection section for inspecting the grooves electrically; and where the electrical inspection section, with two probes contacting both sides of film sandwiching a laser-processed groove, measures electric resistance between the probes. Moreover, a groove judged as defective by the inspection is reprocessed by the laser radiation section. The measurement section is a measurement section which measures the substrate's undulation or the thin film's thickness; and where a focal position or laser light intensity of the laser radiation section is determined according to a result of measurement by the measurement section at a point on the substrate where the measurement section has made a measurement. The thin film is transparent conductive film, silicon film or a laminate of transparent conductive film and silicon film, where the transparent conductive film is zinc oxide (ZnO) film or tin oxide (SnO) film and the silicon film is amorphous silicon film or microcrystal silicon film. Preferred Method: In the laser processing method, laser radiation and measurement or inspection are performed while a point of laser radiation and a point of measurement or inspection on the substrate are kept in a given positional relationship.