NOVELTY - The solar cell comprises a semiconductor substrate having emitter regions and highly doped base regions next to each other in a main surface, and a passivation layer arranged on the main surface. The passivation layer has breakthroughs for locally contacting the emitter regions with a first metal layer and the base regions with a second metal layer. The first metal layer is a thin film applied all-over to the semiconductor substrate. The thin film has openings above the base region. A first insulating layer is deposited above the first metal layer and has openings above the base regions.    USE - Used as a solar cell e.g. an interdigitated back contact solar cell.    ADVANTAGE - The solar cell can be simply and economically produced with high quality, and provides high light intensity.    DETAILED DESCRIPTION - The solar cell comprises a semiconductor substrate having emitter regions and highly doped base regions next to each other in a main surface, and a passivation layer arranged on the main surface. The passivation layer has breakthroughs for locally contacting the emitter regions with a first metal layer and the base regions with a second metal layer. The first metal layer is a thin film applied all-over to the semiconductor substrate. The thin film has openings above the base region. A first insulating layer is deposited above the first metal layer and has openings above the base regions. The second metal layer is deposited on the first insulating layer and is electrically insulated from the first metal layer in such a manner that it extends into the openings of the first metal layer and the insulating layer and contacts the main surface in the base regions. A second insulating layer is completely deposited on the second metal layer and a solder-contact metal layer is locally deposited over the second insulating layer. The solder-contact metal layer contacts the breakthroughs that are aligned to each other, in the second insulating layer, the first metal layer contacts the second metal layer and the first insulating layer, and the second metal layer contacts the breakthroughs of the second insulating layer where the emitter- and/or base solder contact regions are formed. The base region adopts a smaller surface portion of the main surface as the emitter region. In the area of the emitter solder contact, the breakthroughs in the first and second insulating layers have a smaller width than the breakthroughs in the second metal layer but have a larger width than the breakthroughs in the passivation layer. In the area of the base solder contact, the breakthroughs in the first insulating layer have smaller or same width than that of the second insulating layer and the breakthroughs in the first and second insulating layers have a smaller width than the breakthroughs in the second metal layer. The breakthroughs in the first insulating layer over the base regions have a larger width than the breakthroughs in the passivation layer. The first metal layer has elongated spatially distanced openings in the edge regions of the wafer substrate, where the distance is smaller than the length of the openings. The first insulating layer extends up to the edge of the wafer substrate. The second metal layer has elongated openings in the edge regions of the wafer substrate, which lie over the regions of the first metal layer reached up to the edge of the wafer substrate, where the regions of the second metal layer reached up to the edge of the wafer substrate lie over the openings of the first metal layer. The emitter- and base-solder contact regions form first and second quadratic matrix over the main surface, where the first and second quadratic matrix are oppositely displaced around 1/2 pitch in x- and y-direction. An INDEPENDENT CLAIM is included for a method for producing a solar cell.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic representation of a contact structure of a solar cell.    Metal contact crest for a first polarity (1)    Metal contact crest for a second polarity (2)    Solder contact surfaces for a first polarity (3)    Solder contact surfaces for a second polarity (4)    Busbar for a first polarity (5)    Busbar for a second polarity. (6)