TECHNOLOGY FOCUS - ELECTRONICS - Preferred Method: In the method above, the FPCB is fixed to the fixing surface via adhesive or dual sided tape. The die-type chip circuit devices are active circuit devices that are die bonded to the main body of the FPCB so that the terminals of the active circuit devices are on a surface that is positioned away from the interface between the active circuit devices and the main body of the FPCB. The die-type chip circuit devices are die bonded to the FPCB by coating an adhesive substance on the FPCB at the interface between the one or more active circuit devices and the main body. The adhesive substance at the interface between the one or more active circuit devices and the main body comprises a thermal conductive resin or a resin containing thermal conductive particles. The method further comprises forming wire bond pads on the FPCB and electrically interconnecting the terminals of the active devices to the wire bond pads via wire bonding. Additionally, the terminals of the active device on the die-type circuit devices are wire boded to the wire bonding pads so that the wire bonds are less than approximately 0.1 mm above an upper surface of the die-type circuit devices. FPCB comprises copper foil and the wire bond pad is formed by plating gold onto the copper foil. The method also comprises connecting one or more internal terminals to the FPCB that are adapted to be connected to one or more electrodes of a bare cell supplying electrical energy so that the internal terminals extend outward from the main body of the FPCB. Positioning a protective layer over at least a portion of the FPCB comprises positioning the protective layer over the main bodies of the FPCB that include active circuit components. Positioning a protective layer over at least a portion of the FPCB comprises positioning the protective layer over the FPCB so that the height of the protective layer is less than approximately 0.15 mm above the upper surface of the die-type circuit devices. Positioning the protective layer over the main bodies of the FPCP comprises respectively positioning protective layers over at least a portion of each of main bodies of the FPCB. Positioning the protective layer over at least a portion of each of the main bodies of the FPCB comprises positioning a protective layer so that the active circuit components of the main bodies of the FPCB are covered and so that other circuit components of the main body are not covered. The protective layer comprises an electrically insulative resin. Positioning a protective layer over at least a portion of the FPCB comprises depositing a liquid epoxy resin or a liquid silicon compound on the FPCB and hardening the liquid epoxy resin or the liquid silicon compound. The method further comprises removing one or more unnecessary portion of the FPCB prior to separation of the FPCB from the fixing member. In forming PCM of secondary battery, the one or more circuit devices in the form of die-type chips include active circuit devices that are die bonded to the main body of the FPCB so that the terminals of the active circuit devices are on a surface that is positioned away from the interface between the active circuit devices and the main body of the FPCB. The one or more circuit devices are die bonded to the FPCB by coating an adhesive substance on the FPCB at the interface between the one or more active circuit devices and the main body. The method further comprises forming wire bond pads on the FPCB and electrically interconnecting the terminals of the active devices to the wire bond pads via wire bonding.