NOVELTY - The stamper has a light-transmitting rigid substrate (7), a light-transmitting resilient plate (9), a light-transmitting and flexible rigid stamper base (11), a light-transmitting stamper buffer layer (13) and a light-transmitting patterned stamp layer (15), where Young`s modulus of the stamper buffer layer is lower than Young`s modulus of the patterned stamp layer. A vacuum adsorption groove (17) i.e. annular groove, is provided in a lower surface of the resilient plate, where inside diameter of the groove is greater than outside diameter of the patterned stamp layer.    USE - Nanoimprint stamper for a fine-structure transfer apparatus (claimed) for fabricating high-capacity media disks such as magnetic disk and optical disk, semiconductors and ultrahigh-density printed wiring board. Can also be used for manufacturing biosensor, DNA chip, micro-channel device, field emission display (FED) or surface-conduction electron-emitter display (SED), organic electroluminescent device, highly functional optical member, solar cell surfacing member, nano-lens array, optical integrated circuit, optical device, optical interconnection and organic semiconductors.    ADVANTAGE - The stamper base has a light-transmitting, flexible and rigid thin plate that deforms simultaneously with the resilient plate, thus ensuring that the stamper conforms to a warpage of a transfer substrate. The stamper buffer layer, which is softer than the patterned stamp layer, is deformed, thus conforming presence of protrusions or foreign objects on the substrate. The capability of conforming to the warpage of the transfer substrate is isolated from the capability of conforming to presence of protrusions or foreign objects on the substrate surface, so that the mechanical conditions of the transfer substrate can be identified independently, thus ensuring a uniform transfer despite of presence of the warpage and protrusions or foreign objects on the substrate. The stamper buffer layer is thin, so that the occurrence of an in-plane deformation in a bulk buffer layer can be suppressed, thus ensuring that the fine structure of the patterned stamp layer experiences small positional offsets and small rates of dimensional changes in the process of pressing the stamper, and hence improving the precision of transfer and ensuring extended service life of the fine structure of the patterned stamp layer.    DETAILED DESCRIPTION - The light-transmitting rigid substrate is made of a material selected from a group consisting of glass, quartz and plastic. The light-transmitting and flexible rigid stamper base is made of a material selected from a group consisting of glass, quartz, sapphire, acrylic resins and rigid polyvinyl chloride.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a fine-structure transfer apparatus.    Light-transmitting rigid substrate (7)    Light-transmitting resilient plate (9)    Light-transmitting and flexible rigid stamper base (11)    Light-transmitting stamper buffer layer (13)    Light-transmitting patterned stamp layer (15)    Vacuum adsorption groove (17)