NOVELTY - The method comprises applying an adhesive mass (5) based on partially crystalline polyolefin on and/or to the area of an optoelectronic arrangement (1) to be encapsulated, where the polyolefin has a density of 0.86-0.87 g/cm3 and/or a crystalline melting point of 135 degrees C. The adhesive mass is provided in the form of an adhesive tape. The adhesive mass and/or the area of the optoelectronic arrangement to be encapsulated is heated before, during and/or after the application of the adhesive mass. The adhesive mass is crosslinked after the application.    USE - Method for encapsulating an optoelectronic arrangement against permeates, where the optoelectronic arrangement is electrophoretic or electrochromic structures or displays, organic or polymeric light-emitting diodes, display devices, electroluminescent lamps, light emitting electrochemical cells, organic solar cells, polymer solar cells, a thin-layer solar cell based on silicon, germanium, copper, indium and selenium, organic laser diodes, organic or inorganic sensors or organic or inorganic based radio frequency identification transponders.    ADVANTAGE - The method ensures encapsulation of an optoelectronic arrangement against permeates with good durability and improved properties such as high shear strength and peel strength, good chemical resistance and aging resistance, high transparency, and high flexibility and pliability.    DETAILED DESCRIPTION - The method comprises applying an adhesive mass (5) based on partially crystalline polyolefin on and/or to the area of an optoelectronic arrangement (1) to be encapsulated, where the polyolefin has a density of 0.86-0.87 g/cm3 and/or a crystalline melting point of 135 degrees C. The adhesive mass is provided in the form of an adhesive tape. The adhesive mass and/or the area of the optoelectronic arrangement to be encapsulated is heated before, during and/or after the application of the adhesive mass. The adhesive mass is crosslinked after the application. The application of the adhesive mass is carried out without subsequent hardening. The polyolefin is combined with an adhesive resin, where the quantity of the adhesive resin is 200-240 phr. The adhesive mass consists of a hydrogenated resin with a hydrogenation ratio of 95%, additives, and fillers such as nanoscale fillers, transparent fillers and/or getter- and/or scavenger filler. The additive is softener, primary antioxidants, secondary antioxidants, process stabilizer, light stabilizers, processing agents, UV-blocker and/or polymers. The adhesive mass is transparent and has a transmission grade of 90%. The adhesive mass is formed as UV-blocking in a wavelength range of 190-400 nm, where an average transmission grade of the UV blocker is 1%. The adhesive mass has a water vapor transmission rate of 40 g/m2.d and/or an oxygen transmission rate of 5000 g/m2.d.bar. The adhesive mass is formed as carrier-free adhesive tape. An INDEPENDENT CLAIM is included for an electronic arrangement with organic electronic structure.    DESCRIPTION OF DRAWING(S) - The figure shows schematic representation of an optoelectronic arrangement.    Optoelectronic arrangement (1)    Substrate (2)    Electronic structure (3)    Covering (4)    Adhesive mass. (5)