NOVELTY - Encapsulating electronic device involves providing a substrate and an electronic device disposed on it; forming barrier layer by depositing barrier material on electronic device, where barrier material is ceramic material; oxidizing barrier layer to provide exposed functional groups; forming bonding layer by depositing layer of bonding material on barrier layer; optionally oxidizing bonding layer to provide exposed functional groups; and optionally forming at least one pairs of additional barrier and bonding layers.    USE - For encapsulating electronic device such as organic light-emitting diode (OLED), organic thin-film transistor, and organic photovoltaic device (claimed).    ADVANTAGE - The encapsulation method utilizes materials that are readily available or easily prepared; minimizes the number of process steps; and provides highly reproducible results and effective barrier layers without damaging the OED components.    DETAILED DESCRIPTION - Encapsulating an electronic device involves providing a substrate and an electronic device disposed on it; forming a barrier layer by depositing a barrier material directly or indirectly on the electronic device, where the barrier material is a ceramic material; oxidizing the barrier layer to provide exposed functional groups; forming a bonding layer by depositing a layer of a bonding material on the barrier layer, where the bonding material is a silicon-containing material and containing functional groups capable of reacting with the functional groups of the barrier layer; optionally oxidizing the bonding layer to provide exposed functional groups; and optionally forming at least one pairs of additional barrier and bonding layers by repeating all steps. An INDEPENDENT CLAIM is included for an encapsulated electronic device comprising an electronic device containing several of component layers disposed on a substrate; and an encapsulation portion containing a first pair of layers of a barrier material and a cross-linked material, where the barrier material is ceramic material and the cross-linked material is a silicon-containing polymer.