NOVELTY - Making printable diamond patterns involves growing diamond layer (310) on supporting substrate (320); and patterning diamond layer to form diamond microstructures capable of printing to receiving substrate which is part of device (300) or component. The diamond layer comprises synthetic chemical vapor deposition (CVD) diamond, ultrananocrystalline diamond or single crystal diamond.    USE - For making printable diamond patterns on a device or its part particularly flexible heat-sinked electronic component incorporated into high powered RF device for thermal management (Claimed). The device includes e.g. displays, solar cells, smart textiles.    ADVANTAGE - The ability to transfer print diamond patterns provides unique capability to precisely tailor thermal contact to areas corresponding to substantial heat generation and attendant temperature increase, thus provides improved and more efficient heat transfer and also reduces the amount of diamond required to achieve thermal cooling of a heat-sensitive component. The diamond layer provides electrical insulation between electronic component and conductive substrate. The diamond also provides dissipation, hardness, high modulus, index of refraction, bendability, chemical inertness, biocompatibility, and wear resistance performance characteristic to the device or its component. The thermally conductive diamond provides efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperature. The micropattern of diamond is capable of bending or stretching without fracture by making portion of micropattern of diamond that is buckled. The diamond based printing methods are capable of use and are compatible with wide range of applications. The method provides efficiently and reliably printing pattern of diamond over relatively large area of substrate surface.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for method of manufacturing electronic device capable of thermal regulation involving providing substrate capable of supporting device and/or component which generates heat; printing micropattern of diamond comprising diamond features on portion of surface of substrate and/or device, where diamond is in thermal contact with substrate and/or device, so that change in substrate or device temperature from generated heat results in change in diamond temperature, thus providing thermal regulation of the electronic device.    DESCRIPTION OF DRAWING(S) - The figure shows cross-sectional schematic view of semiconductor platform utilizing diamond for thermal management.    Device (300)    Diamond layer (310)    Substrate (320)