NOVELTY - The method involves providing a semiconductor wafer segment (202b) comprising a set of die sites, and placing the semiconductor wafer segment in contact with a substrate and in registration with a reference on the substrate, where the wafer segment comprises an array of solder balls at each die site. The semiconductor wafer segment comprising the set of die sites is secured to the substrate through a solder reflow process. One of the die sites selected from the wafer segment is subsequently physically isolated from the adjacent die site by laser dicing the wafer segment.    USE - Method for forming an electronic assembly i.e. solar cell array (claimed).    ADVANTAGE - The method enables dicing the wafer segments after mounting on the substrate while applying minimal mechanical strain to the wafer segment, thus making a relatively narrow cut so as to allow placing semiconductor die sites closer to one another on the wafer, thus reducing the dimension of the streets between die sites, and hence potentially enabling formation of more die sites on the given semiconductor wafer, so as to improve the maximum yield of the wafer. The method enables performing laser dicing of the wafer fragments both at the time of separating the wafer into segments for simplified handling, and for post-mounting singulation, thus facilitating greater density of manufacturing of the cells on the wafer. The method enables reducing the separate motions required of a die placement device to fully populate all mounting sites of printed circuit board, so that each mounting site is populated with the discrete solar cell die.    DETAILED DESCRIPTION - The assembly includes a laser that is a neodymium-doped yttrium aluminum garnet laser.    DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view representing an apparatus placing a wafer segment on the substrate in which semiconductor dies are mounted.    Semiconductor wafer segment (202b)    Printed circuit board (300)    Arm (602)    Contact head (604)    Registration marks/fiducials (606a, 606b)    Vision system (608)