NOVELTY - A base material (21) having conductive portion (A) and a base material (22) having conductive portion (B) are prepared. A liquid film (31) is formed by supplying a liquid material containing polyester-modified silicone material and electroconductive particles (32) on the surface of conductive portions. The base materials (A) and (B) are piled-up through the liquid film, the obtained temporarily joined component (5) is pressurized along thickness direction, dried and/or hardened, and adhesiveness is provided in the joined film, to obtain joined component (1).    USE - Method for producing joined component (claimed) used for electronic device. Uses include but are not limited to transistor, diode, reflective mirror, micro electro mechanical system, pressure sensor, magnetic recording medium, magneto-optical recording medium, liquid crystal display element, organic electroluminescent element, circuit board and fuel cell.    ADVANTAGE - The joined component having high dimensional accuracy and excellent chemical resistance is manufactured efficiently under low temperature condition.    DETAILED DESCRIPTION - A base material (21) having conductive portion (A) on its surface and a base material (22) having conductive portion (B) on its surface are prepared. A liquid film (31) is formed by supplying a liquid material containing polyester-modified silicone material and electroconductive particles on the surface of conductive portion (A) and/or (B). The polyester-modified silicone material is obtained by dehydration-condensation of silicone material having branched polyorganosiloxane structure and polyester resin obtained by carrying out esterifying reaction of trimethylol propane and terephthalic acid. The silicone material having branched polyorganosiloxane structure has silicon-containing unit structure of formula: R1-Si-X3 (I) in branch portion, silicon-containing unit structure of formulae: R1-Si(-OH)-X2 (II) and/or H3C-Si(-CH3)-X2 (III) in connection portion, and siloxane residue-containing unit structure of formulae: R1-Si(-OH)2-X (IV) and/or H3C-Si(-CH3)(-OH)-X (V) in terminal portion. The base materials (A) and (B) are piled-up through the liquid film, the obtained temporarily joined component is pressurized along thickness direction of liquid film, and dried and/or hardened to form joined film. Adhesiveness is provided in the joined film by providing energy to joined film, such that the base materials (21) and (22) are joined and electrically connected between conductive portions (A) and (B) through electroconductive particles in the joining film, to obtain joined component.    R1=methyl or phenyl;and    X=siloxane residue.    N.B: X2 and X3 are not defined. An INDEPENDENT CLAIM is included for joined component, which is formed by electrically connecting the conductive portions of base materials (21) and (22) which are positioned opposingly.    DESCRIPTION OF DRAWING(S) - The drawing shows a longitudinal cross-sectional view illustrating joining method. (Drawing includes non-English language text)    Joined component (1)    Joining film (3)    Temporarily joined component (5)    Base materials (21,22)    Liquid film (31)    Electroconductive particles (32)