NOVELTY - Forming a dielectric layer in an electronic device comprises: (i) forming a barrier layer by depositing a barrier material directly/indirectly on a substrate; (ii) oxidizing the barrier layer to provide exposed functional groups; (iii) forming a bonding layer by depositing a layer of a bonding material on the barrier layer; (iv) optionally oxidizing the bonding layer to provide exposed functional groups; and (v) optionally forming one or more pairs of additional barrier and bonding layers.    USE - The method is useful for forming the dielectric layer in the electronic device, which is an organic light emitting diodes, an organic thin-film transistor, and an organic photovoltaic device (claimed); in the field of microelectronic devices; and in the field of electronics.    ADVANTAGE - The method provides electronic devices with increased stability, shelf-life, increased durability and longer device life. The method is energetically favorable, inexpensive, rapid and more effective for encapsulating organic electric devices (OEDs), preferably organic light emitting diodes (OLEDs). The dielectric layers allow the preparation of OEDs with improved device performance for any given thickness.    DETAILED DESCRIPTION - Forming a dielectric layer in an electronic device comprises: (i) forming a barrier layer by depositing a barrier material directly or indirectly on a substrate, where the barrier material is a ceramic material; (ii) oxidizing the barrier layer to provide exposed functional groups; (iii) forming a bonding layer by depositing a layer of a bonding material on the barrier layer, where the bonding material is a silicon-containing material and comprises functional groups capable of reacting with the functional groups of the barrier layer; (iv) optionally oxidizing the bonding layer to provide exposed functional groups; and (v) optionally forming one or more pairs of additional barrier and bonding layers by repeating (i), (ii), (iii), and (iv) steps. An INDEPENDENT CLAIM is included for an electronic device comprising many component layers disposed on a substrate, and a dielectric layer comprising at least a first pair of layers of a barrier material and a crosslinked material, where the barrier material is a ceramic material and the crosslinked material is a silicon-containing polymer.