NOVELTY - The method involves applying an emulsion with an immiscible liquid combined with another immiscible liquid to a surface of a substrate, where one of the immiscible liquids is a polar solvent and the other immiscible liquid is a non-polar solvent. A force with a normal component is applied to one particle from solid particles i.e. agglomerates of a surface active material, to bring one of the solid particles within an interaction range of a contaminant on the surface of the substrate. The solid particle and the contaminant are removed from the surface of the substrate.    USE - Method for cleaning a substrate i.e. silicon substrate, during fabrication of a semiconductor device e.g. integrated circuit, flat panel display, solar cell, memory device and memory cell. Can also be used for a space program, or high technology area such as surface science, energy, optics, microelectronics, and micro-electro-mechanical system (MEMS).    ADVANTAGE - The method enables effectively and efficiently removing contaminants from a semiconductor wafer without requiring the need for abrasive contact. The mechanical properties of the solid components avoid damage to a wafer in surface during a cleaning process. The solid components are defined to avoid damaging the substrate and avoid adherence to the substrate.    DETAILED DESCRIPTION - The polar solvent is selected from water, acetic acid, formic acid, methanol, ethanol, n-propanol, n-butanol, isopropanol, acetone, acetonitrile, dimethylformamide, and dimethyl sulfoxide. The non-polar solvent is selected from an aromatic hydrocarbon solvent, an aliphatic hydrocarbon solvent, a cyclic hydrocarbon solvent, a ketone solvent, a carbonate based solvent, a halogenated hydrocarbon solvent, an alcohol solvent, an ester solvent, an ether solvent, and an amine solvent. An INDEPENDENT CLAIM is also included for a system for cleaning a substrate.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view illustrating an aggregate of surfactant molecules that form solid particles.    Solid components (109)    Core (501)    Hydrophilic portions (503)