NOVELTY - The method for texturing a surface of a semiconductor substrate (3), comprises etching the surface with an etching solution (7) containing an etching substance that etches a semiconductor substrate material and a wetting agent that contains water-soluble polymers with a polymerization grade of above 1000. The etching solution is provided with a temperature of more than 85 degrees C during the etching step. The etching solution is continually circulated before the etching step for dissolving the water-soluble polymers and/or during the etching step.    USE - Method for texturing a surface of a semiconductor substrate such as a silicon wafer, which is useful to manufacture solar cells.    ADVANTAGE - The method is capable of rapidly, economically, reliably, homogeneously and simply texturing the surface of the semiconductor substrate with high stability thus increasing the efficiency of the solar cells.    DETAILED DESCRIPTION - The method for texturing a surface of a semiconductor substrate (3), comprises etching the surface with an etching solution (7) containing an etching substance that etches a semiconductor substrate material and a wetting agent that contains water-soluble polymers with a polymerization grade of above 1000. The etching solution is provided with a temperature of more than 85 degrees C during the etching step. The etching solution is continually circulated before the etching step for dissolving the water-soluble polymers and/or during the etching step. The method includes a cleaning step after texturing, where the cleaning step comprises a rinse of the substrate surface in a hot rinsing solution at above 60 degrees C. The substrate surface is etched in an alternative etching solution before etching in the etching solution, which contains the wetting agent, to partially remove a surface damage. An INDEPENDENT CLAIM is included for a device for texturing a surface of a semiconductor substrate.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic representation of a device for texturing a surface of a semiconductor substrate.    Semiconductor substrate (3)    Tank (6)    Etching solution (7)    Heater (9)    Heatable drainage assembly (12)    Circulating assembly. (18)