NOVELTY - A multilayer laminated circuit board (1) has a laminated structure formed by laminating resin film (100) having specific thermal expansion coefficient, and circuit layer (200). Circuit layer has metallic circuit (50) having base layer (130) and plating layer (140). The base layer (130) contains antioxidant layer and base metal layer. Antioxidant layer comprises metal chosen from nickel, titanium, cobalt and silicon, their alloy or alloy containing chromium. Base metal layer comprises metal chosen from copper, gold, silver, tin, nickel, bismuth, zinc or their alloy.    USE - Multilayer laminated circuit board is used for component and product e.g. electric product, electronic product, semiconductor product, antenna circuit board, integrated circuit card, solar cell, motor vehicle and robot (all claimed).    ADVANTAGE - The multilayer laminated circuit board is easily prevented from disconnection of metallic circuit.    DETAILED DESCRIPTION - A multilayer laminated circuit board has a laminated structure formed by alternately laminating resin film and circuit layer. The resin film is an elongate material and has one or more conduction via (120) which penetrates front and back surfaces of resin film. The circuit layer has a metallic circuit formed on the resin film and in the conduction via. The metallic circuit consists of a base layer and a plating layer formed by electroplating on base layer. The base layer contains an antioxidant layer and a base metal layer. The antioxidant layer comprises metal chosen from nickel, titanium, cobalt and silicon, its alloy or alloy containing chromium. The base metal layer comprises metal chosen from copper, gold, silver, tin, nickel, bismuth and zinc or their alloy. The resin film has layers having different thermal expansion coefficient. The ratio of thermal expansion coefficient of resin film having minimum thermal expansion coefficient with respect to thermal expansion coefficient of resin film having maximum thermal expansion coefficient is 0.015-0.4. The ratio of thickness of circuit layer adjacent to resin film with respect to thickness of resin film is 0.015-8.75. The ratio of area of metallic circuit formed on surface of resin film with respect to area of surface of one layer of resin film is 0.2-0.7.    DESCRIPTION OF DRAWING(S) - The drawing shows the sectional view of multilayer laminated circuit board.    Multilayer laminated circuit board (1)    Metal circuit (50)    Resin film (100)    Conduction via (120)    Base layer (130)    Plating layer (140)    Circuit layer (200)