NOVELTY - The process comprises applying a conductive metal paste to holes of a p-type silicon wafer to provide an inside of the holes with a metallization, where the p-type silicon wafer is provided with holes forming vias between a front-side and a back-side of the wafer and an n-type emitter extending over the entire front-side and the inside of the holes, drying the applied conductive metal paste, and firing the dried conductive metal paste. The p-type silicon wafer reaches a peak temperature of 700-900 degrees C, and has an anti-reflective coating layer on its front-side.    USE - The process is useful for production of a metal-wrap-through silicon solar cell.    ADVANTAGE - The process ensures efficient production of the metal-wrap-through silicon solar cell with improved electric efficiency, long service life, good adhesion property and reduced shunting characteristics and without any damage.    DETAILED DESCRIPTION - The process comprises applying a conductive metal paste to holes of a p-type silicon wafer to provide an inside of the holes with a metallization, where the p-type silicon wafer is provided with holes forming vias between a front-side and a back-side of the wafer and an n-type emitter extending over the entire front-side and the inside of the holes, drying the applied conductive metal paste, and firing the dried conductive metal paste. The p-type silicon wafer reaches a peak temperature of 700-900 degrees C, and has an anti-reflective coating layer on its front-side that leaves out the inside of the holes. The conductive metal paste has fire-through capability, comprises an organic vehicle having a content of 10-45 wt.% based on total conductive metal paste composition, and is applied as a conductive metal layer or as a conductive metal plug by printing. The firing step is performed as cofiring together with metal paste consisting of a conductive metal paste that is applied to the front-side to form a front-side metallization in the form of thin conductive metal collector lines arranged in a pattern typical for metal-wrap-through silicon solar cells, a back-side aluminum paste that is applied to the back-side to form an aluminum back anode and a backside silver or silver/aluminum paste that is applied to the back-side to form silver or silver/aluminum back collector contacts. An INDEPENDENT CLAIM is included for a metal-wrap-through silicon solar cell.