TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: (I) is a CIGS, CIS or CGS material. The substrate is a semiconductor, a doped semiconductor, silicon, gallium arsenide, insulators, glass, molybdenum glass, silicon dioxide, titanium dioxide, zinc oxide, silicon nitride, a metal, a metal foil, molybdenum, aluminum, beryllium, cadmium, cerium, chromium, cobalt, copper, gallium, gold, lead, manganese, molybdenum, nickel, palladium, platinum, rhenium, rhodium, silver, stainless steel, steel, iron, strontium, tin, titanium, tungsten, zinc, zirconium, a metal alloy, a metal silicide, a metal carbide, a polymer, a plastic, a conductive polymer, a copolymer, a polymer blend, a polyethylene terephthalate, a polycarbonate, a polyester, a polyester film, Mylar (RTM: Polyester film), a polyvinyl fluoride, polyvinylidene fluoride, a polyethylene, a polyetherimide, a polyethersulfone, a polyetherketone, a polyimide, a polyvinylchloride, an acrylonitrile butadiene styrene polymer, a silicone, an epoxy, paper and/or coated paper. The substrate is a shaped substrate including a tube, a cylinder, a roller, a rod, a pin, a shaft, a plane, a plate, a blade, a vane, a curved surface or a spheroid. (I) is enriched or deficient in a group 11 atom. The substrate is a layer of a solar cell. Preferred Method: The method further comprises an optional step of selenization or sulfurization, either before, during or after steps (c) or (d). The substrate is heated at 100-550 degrees C (preferably 200-400 degrees C). The deposition is done by spraying, spray coating, spray deposition, spray pyrolysis, printing, screen printing, inkjet printing, aerosol jet printing, ink printing, jet printing, stamp/pad printing, transfer printing, pad printing, flexographic printing, gravure printing, contact printing, reverse printing, thermal printing, lithography, electrophotographic printing, electrodepositing, electroplating, electroless plating, bath deposition, coating, wet coating, spin coating, knife coating, roller coating, rod coating, slot die coating, Meyer bar coating, lip direct coating, capillary coating, liquid deposition, solution deposition, layer-by-layer deposition, spin casting and/or solution casting.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The polymeric precursor compound has a metal containing compound of formula (Cux(In1-yGay)v((S1-zSez)R)w) (A).R = alkyl, aryl, heteroaryl, alkenyl, amido, silyl, inorganic or organic ligands;x, v = 0.5-1.5;y, z = 0-1; andw = 2-6. EXAMPLE - An ink containing a polymeric precursor compound of formula ((copper(0.9)indium(0.7)gallium(0.3)(selenium(n)butyl)3(selenium(tert)butyl)(0.9))n) (where t and n were not defined) (25 wt/wt.%) was added in heptane, and knife coated onto a molybdenum-glass substrate. The coating was dried at room temperature for 1-2 minutes, converted at 300 degrees C for 10 minutes and annealed at 550 degrees C for 1 hour to give a corresponding thin film.