NOVELTY - The substrate processing method comprises statically and dynamically generating solutions from chemicals in series and parallel, where a composition of the solutions is varied in a combinatorial fashion, and dispensing the chemicals and the solutions through a fluid delivery system to a conventional processing module and a combinatorial processing module. The combinatorial processing module comprises site isolated reactors defining site isolated regions on the substrate. The fluid delivery system feeding the combinatorial processing module is shared with the delivery system.    USE - The method is useful for mixed-mode processing a substrate such as wafer for manufacturing integrated circuits, flat panel displays, optoelectronic devices, data storage devices, magnetoelectronic devices, magnetooptic devices, molecular electronic devices, solar cells, photonic devices and packaged devices.    ADVANTAGE - The method is capable of rapidly and efficiently mixed-mode processing the substrate with high throughput and improved performance and without occurrence of oxidation of substrate thus economically manufacturing the integrated circuit with reduced size.    DETAILED DESCRIPTION - The substrate processing method comprises statically and dynamically generating solutions from chemicals in series and parallel, where a composition of the solutions is varied in a combinatorial fashion, and dispensing the chemicals and the solutions through a fluid delivery system to a conventional processing module and a combinatorial processing module. The combinatorial processing module comprises site isolated reactors defining site isolated regions on the substrate. The fluid delivery system feeding the combinatorial processing module is shared with the delivery system feeding the conventional processing module such that the solution delivered to a first site isolated region in the combinatorial processing module is varied independently from the solution delivered to a second site isolated region in the combinatorial processing module. The composition is varied according to a recipe for process sequences that include the generating and the dispensing steps. The method further comprises synchronizing process sequences, controlling timing of the dispensing across the site isolated regions according to a global parameter for the process sequence, controlling the dispensing of a chemical onto the entire surface and controlling the dispensing of the solutions using a first set of processes and a second set of processes, controlling the dispensing of the solutions using serial, rapid serial, serial/parallel, or parallel flows, and controlling the dispensing of the solutions to serially flow in parallel the solutions to each region of a first set of regions and a second set of regions. The global parameter includes time, temperature, and pH. The solutions are dispensed by dispensing solutions in series and parallel to each region of a set of the regions. The solution delivered to the conventional processing module is varied independently from the solutions delivered to the site isolated reactors in the combinatorial processing module.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic view of a substrate processing system.    Modules (101, 102, 103)    System interface (104)    Substrate handler (104a)    Substrate load station (104b)    Substrate unload station (104c)    Substrate handling system. (105)