NOVELTY - Printed circuit board (1), comprises: an insulating layer that is made of a porous material; an adhesive layer provided on the insulating layer; and a conductor layer provided on the adhesive layer, where the conductor layer and the adhesive layer have the same patterns or different patterns.    USE - The printed circuit board is useful: in the fuel cell (claimed); and as an electrode of solar battery.    ADVANTAGE - The printed circuit board: provides fuel cell that has an ability to prevent collection of the electrodes, thus improving reliability and longer life of the fuel cell; and is easily manufactured at low cost.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS - are also included for:    (1) a fuel cell comprising the printed circuit board, a cell element, and a housing that accommodates the printed circuit board and the cell element, where the cell element is arranged between the first conductor portion and the second conductor portion while the first region and the second region of the insulating layer of the printed circuit board are bent along the bend portion with the one surface as an inner side;    (2) a method (I) of manufacturing a printed circuit board, comprising: (a) preparing a base material having a laminated structure of a support layer and a conductor layer; (b) forming a conductor pattern having a given pattern on one surface of the support layer by processing the conductor layer; (c) forming an adhesive pattern made of an adhesive layer having the same pattern as or a different pattern from the pattern of the conductor layer on the conductor pattern; (d) joining an insulating layer on the conductor pattern with the adhesive pattern sandwiched between the insulating layer and the conductor pattern; and (e) stripping the support layer from the conductor pattern;    (3) a method (II) of manufacturing a printed circuit board, comprising: step (a) as above per se; forming an adhesive pattern composed of an adhesive layer having a given pattern on the conductor layer; forming the conductor pattern by removing an exposed region of the conductor layer using the adhesive pattern as a mask; steps (d) and (e) as above per se; and    (4) a method of manufacturing a printed circuit board, comprising: step (a) as above per se; forming the conductor pattern on one surface of the support layer by processing the conductor layer; forming a laminated structure of an adhesive layer and an insulating layer; step (e) as above per se; and forming an adhesive pattern having a given pattern by removing an exposed region of the adhesive layer that does not overlap the conductor pattern after stripping the support layer.    DESCRIPTION OF DRAWING(S) - The figure shows a plan view of printed circuit board.    Printed circuit board (1)    Base insulating layer (2)    First insulating portion (2a)    Second insulating portion (2b)    Cover layer (6a)