TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The material is enriched or deficient in a Group 11 atom.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The polymeric precursor compound has the empirical formula (Agu((MB1)1-yMB2y)v((S1-zSez)R)w). The thin film has a thickness of 0.001-100 (preferably 0.1-10) micrometers.MB1, MB2 = different atoms of Group 13;v = 0.5-1.5;w = 2-6; andR = alkyl, (hetero)aryl, alkenyl, amido, silyl, or inorganic and organic ligands.Preferred Process: The substrate is heated at 100-550 degrees C, preferably 200-400 degrees C. The process further comprises an optional step of selenization or sulfurization, either before, during or after steps (c) or (d). The step of depositing is done by spraying, spray coating, spray deposition, spray pyrolysis, printing, screen printing, inkjet printing, aerosol jet printing, ink printing, jet printing, stamp printing, transfer printing, pad printing, flexographic printing, gravure printing, contact printing, reverse printing, thermal printing, lithography, electrophotographic printing, electrodepositing, electroplating, electroless plating, bath deposition, coating, dip coating, wet coating, spin coating, knife coating, roller coating, rod coating, slot die coating, Mayer bar coating, lip direct coating, capillary coating, liquid deposition, solution deposition, layer-by-layer deposition, spin casting, and/or solution casting. Preferred Components: The substrate is a semiconductor, a doped semiconductor, silicon, gallium arsenide, insulators, glass, molybdenum glass, silicon dioxide, titanium dioxide, zinc oxide, silicon nitride, a metal, a metal foil, molybdenum, aluminum, beryllium, cadmium, cerium, chromium, cobalt, copper, gallium, gold, lead, manganese, molybdenum, nickel, palladium, platinum, rhenium, rhodium, silver, stainless steel, steel, iron, strontium, tin, titanium, tungsten, zinc, zirconium, a metal alloy, a metal silicide, a metal carbide, a polymer, a plastic, a conductive polymer, a copolymer, a polymer blend, a polyethylene terephthalate, a polycarbonate, a polyester, a polyester film, Mylar (RTM: Polyester film), a polyvinyl fluoride, polyvinylidene fluoride, a polyethylene, a polyetherimide, a polyethersulfone, a polyetherketone, a polyimide, a polyvinylchloride, an acrylonitrile butadiene styrene polymer, a silicone, an epoxy, paper and/or coated paper. The substrate is a shaped substrate, a tube, a cylinder, a roller, a rod, a pin, a shaft, a plane, a plate, a blade, a vane, a curved surface or a spheroid. Preferred Definitions:    u = 1.05-1.5 or 0.7-1.1;    y = 0-1;    z = 0.5-1;    v = 0.7-1.1; and    w = 2-2.4.    EXAMPLE - Polymeric precursor (Ag(0.9)(Se-sec-butyl)(3.9)In) was heated at 10 degrees C per minute to a final temperature of 500 degrees C and holding the temperature at 500 degrees C for 30 minutes to give a bulk aluminum-indium-selenium material (Ag(0.9)InSe2).