NOVELTY - A pattern transfer method, involves forming a transfer material layer (110) on substrate (100); hardening it in the solid state; patterning by laser irradiating; pressing the patterned transfer material layer in the solid state, against a flexible substrate (200) and transferring the patterned transfer material layer onto the flexible substrate by a viscous force of the flexible substrate occurring in a facing part between patterned layer and substrate by irradiating laser beam from the patterned layer to substrate or vice versa. One side of the substrate is wound around a roll.    USE - As a pattern transfer method for forming an electrode for a flexible display panel; a flexible solar cell and an electronic book; for forming an electromagnetic shielding sheet; for forming drain electrode of thin film transistor; for forming a conductive wire of flexible printed circuit board (Claimed) and for forming electrode wire of a touch panel.    ADVANTAGE - The present method results in patterns having a clear boundary of the transferred pattern, which are uniformly formed on a large area. The pattern is strongly adhered to a flexible substrate without a separate adhesive layer by directly transferring a patterned transfer material layer on the flexible substrate by a viscosity force occurring in the flexible substrate thus simplifying the pattern manufacturing processes. The method rapidly manufactures patterns without using a mask. By transferring a transfer material layer in the solid state on a flexible substrate pattern having strong durability are obtained. The method is applicable to mass production of a pattern at a low manufacturing cost. Using this method, a substrate on which a pattern is transferred is not transformed by heat; patterning is possible in a substrate having low thermal resistance; uniformity of a boundary of a transferred pattern is improved; size and quality of a pattern is not changed according to environment variation; it is capable of easily changing thickness of a pattern; and capable of manufacturing a pattern smaller than the size of a laser focus.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following    (1) a pattern transfer apparatus comprising: a flexible substrate (200) whose one side is wound around a roll and having a polymer material; a substrate (100) disposed to be pressed facing a lower portion of the flexible substrate, and patterned by a laser beam after a transfer material layer (110) formed on an upper surface of the substrate is hardened in the solid state; a moving unit (300) disposed at a lower surface of the substrate and moving the substrate; and a laser irradiating unit (400) irradiating a laser beam from the moving unit to a direction of the flexible substrate, where the flexible substrate and the substrate are pressed facing each other as the substrate moves by the moving unit, and the transfer material layer is transferred to the flexible substrate by a viscous force of the flexible substrate occurred in a facing part between the transfer material layer and flexible substrate by the laser beam from the laser irradiating unit;    (2) a thin film transistor comprising a gate electrode, a source electrode, and a drain electrode formed by a pattern transferred by the pattern transfer method;    (3) a flexible printed circuit board comprising a conductive wiring formed by a pattern transferred by the pattern transfer method.    DESCRIPTION OF DRAWING(S) - The figure shows view of the pattern transferring apparatus used in the pattern transfer method.    Substrate (100)    Transfer material layer (110)    Flexible substrate (200)    Moving unit (300)    Laser irradiating unit (400)