NOVELTY - An electroconductive pressure-sensitive adhesive tape comprises a metal foil and a pressure-sensitive adhesive layer including an electroconductive filler on at least one side of the metal foil. The tape has surface exposure ratio of 2-5% of electroconductive filler on surface of the adhesive layer (determined by Determination Method of Surface Exposure Ratio).    USE - As electroconductive pressure-sensitive adhesive tape (claimed), useful for electrical conduction between two positions separated from each other, in electromagnetic wave shields for electric and electronic equipment and cables. Also used for grounding of a printed circuit board, grounding of an outer shielding case for electronic equipment, grounding for static protection, internal wiring of a power supply device and electronic equipment (e.g. liquid crystal display, organic electroluminescence display, plasma display panel, display apparatus for electronic paper, and solar cell).    ADVANTAGE - The electroconductive pressure-sensitive adhesive tape achieves excellent tackiness and high electrical conductivity even when it is used in a finer shape (particularly a narrow shape) and that has a small change in resistance value over time and achieves stable electrical conductivity even when it is used for a long time or in a harsh environment. Thus, the tape has good workability when it is used for downsized or fine-pitched products (e.g. electronic equipment) and has an advantage in cost. It also can achieve high conduction reliability (conduction reliability over a long time) in products to be used. The tape can be used in a wide variety of shapes from wide to narrow and thus is highly versatile.    DETAILED DESCRIPTION - An electroconductive pressure-sensitive adhesive tape comprises a metal foil and a pressure-sensitive adhesive layer including an electroconductive filler on at least one side of the metal foil. The tape has surface exposure ratio of 2-5% of electroconductive filler on surface of the adhesive layer, determined by Determination Method of Surface Exposure Ratio. The surface of the pressure-sensitive adhesive layer in the tape is vapor stained with a 0.5% aqueous ruthenium acid solution at room temperature for 30 minutes. The surface of the adhesive layer is sputtered with Pt-Pd using E-3200 (RTM: sputtering system) to prepare a sample for observation. A backscattered electron image (observation range: 450x 575 mu m2) of the surface of the adhesive layer in the sample is observed using a S-4800 (RTM: scanning electron microscope) (FE-SEM) at an acceleration voltage of 5 kV and a magnification of 200 times. The obtained backscattered electron image is binarized using Winroof (RTM: image processing software), and an area ratio of an inorganic part attributed to the electroconductive filler is calculated to determine the surface exposure ratio.