NOVELTY - The process comprises coating a substrate by a first material such as conductive materials to form a conductive wet film of the conductive material on a region of a surface of the substrate, treating the conductive film with a second material for displacing the conductive material in the conductive film at the point of contact for leading to displacement of the film material from the point of contact and the exposure of the substrate to provide an array of spaced apart ring-voids in the conductive film, and optionally treating the film to render the first material conductive.    USE - The process is useful for manufacturing a conductive transparent film on a substrate, where conductive transparent film is useful in an electronic device such as a photoconductor, a photodiode, a solar cell, a LED, an organic LED, a laser, a light sensor, a transistor, an organic transistor, an inorganic transistor, a hybrid transistor, a touch screen, a display backplane, a large area display array, a flexible display, and electromagnetic interference shielding layer and an e-paper, and an optoelectronic device such as a photovoltaic solar cell (all claimed).    ADVANTAGE - The method is capable of easily and economically manufacturing the conductive transparent film with high conductivity and transparency thus improving the efficiency and performance of the device.    DETAILED DESCRIPTION - The process comprises coating a substrate by a first material such as conductive materials to form a conductive wet film of the conductive material on a region of a surface of the substrate, treating the conductive film with a second material for displacing the conductive material in the conductive film at the point of contact for leading to displacement of the film material from the point of contact and the exposure of the substrate to provide an array of spaced apart ring-voids in the conductive film, and optionally treating the film to render the first material conductive. The substrate is a two-dimensional or a three-dimensional surface, and comprises a material consisting of glass, paper, semiconductor inorganic or organic material, a polymeric material and a ceramic material. The conductive material: comprises metal, transition metal, semiconductor, alloy and intermetallic material; is selected amongst semiconductor materials consisting of elements of group II-VI, group III-V, group IV-VI, group III-VI and/or group IV semiconductors; is deposited on the substrate to form ring structures that are a different conductive material; is deposited step-wise to form a conductive multilayer that is composed of ring structures and is a different material or material form; is applied onto the substrate by a method consisting of ink jetting, spraying, brushing, dipping, the doctor blade method, spin and roll-to-roll coating; is present in the form of particles; and is dispersed or dissolved in a liquid carrier before application, where the liquid carrier comprises water and an organic solvent. The liquid carrier comprises an additional material for endowing with or enhancing a functionality or property of the film, where the functionality or property comprises wetting, rheology, adhesion, doping, scratch resistance, contact and sheet resistance and preferential diffusion into an adjacent layer. The additional material of liquid carrier comprises glass frits and inorganic salts. The conductive film is treated with a second material for displacing the conductive material in the film upon contact. The second material has a chemical or physical property permitting displacement of material from the film upon contact. The chemical or physical property consists of hydrophilicity, hydrophobicity, wetting behavior, surface tension, surface energy, spreading coefficient, evaporation rate and viscosity. The void has a width of less than 20 microns, a height of less than 10 microns and an average diameter of 10-300 microns. The conductive film having an array of spaced apart material-free ring-voids has a light transparency of 95% and a sheet resistance of 0.004 Ohm/square to 5 kOhm/square. INDEPENDENT CLAIMS are included for:    (1) a substrate coated with a conductive transparent film of a material;    (2) a process for manufacture of a conductive transparent pattern on a substrate; and    (3) a device such as electronic device or an optoelectronic device.    DESCRIPTION OF DRAWING(S) - The diagram shows a photographic view of an array of material-free voids in a conductive transparent film.