TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Component: The inert gas is argon gas or mixture of argon gas and oxygen gas. The gas barrier layer contains silicon, titanium, tin, zinc, aluminum, indium, magnesium, their oxide, their nitride or their mixture, preferably silicon oxide (SiOx).x=1-2.The gas barrier layer is laminated by vacuum evaporation method.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Compound: The curing catalyst is chosen from iron acetylacetonato, zinc acetylacetonato, aluminum acetylacetonato, tin tetrachloride, diisopropoxy bisacetyl acetonato titanium, and dihydroxy bislactate titanium. The silane-type compound is chosen from tetramethoxysilane, tetraethoxysilane, vinyl trimethoxysilane, vinyl triethoxysilane, methyl trimethoxysilane, methyl triethoxysilane, dimethyldiethoxysilane, ( gamma )-glycidoxy propyl trimethoxysilane, ( gamma )-glycidoxy propyl triethoxysilane, ( gamma )-glycidoxy propylmethyl diethoxysilane, ( gamma )-acryloxypropyl trimethoxysilane, ( gamma )-aminopropyl trimethoxysilane, ( gamma )-aminopropyl triethoxysilane, ( gamma )-mercapto propyl trimethoxysilane, ( gamma )-isocyanate propyl triethoxysilane, and their mixture. The compound (B) is chosen from ( gamma )-glycidoxy propyl trimethoxysilane or ( gamma )-glycidoxy triethoxy silane.    TECHNOLOGY FOCUS - POLYMERS - Preferred Method: A secondary polymeric resin is laminated on the surface of gas barrier layer. A tertiary polymeric resin is laminated on the outer surface of obtained gas barrier film. A plastic film is further laminated on outer surface and outermost layer is laminated. The thickness of primary polymeric resin layer is 0.03-3 mu m. The primary polymeric resin is thermosetting resin. The primary polymeric resin is obtained by mixing olefin-type polymer and a silane-type compound (A) and dissolving in aqueous medium, and adding curing catalyst. The amount of silane-type compound (A) with respect to 100 parts weight of olefin-type polymer is 5-100 parts weight. The secondary polymeric resin is thermosetting resin hardened by epoxy ring-opening polymerization and condensation reaction. The secondary polymeric resin is obtained by mixing 50 parts weight or more of pure water with 100 parts weight of silane-type compound (B), producing liquid mixture, adding hydrochloric acid or acetic acid such that pH of liquid mixture is 3-5, producing main ingredient, diluting main ingredient, producing dilution liquid, and adding 1-10 parts weight of curing catalyst and dilution liquid to silane-type compound (B).