TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Process: The substrate is heated at 100-550 degrees C or 200-400 degrees C. Preferred Components: The precursor is a polymeric precursor. The predetermined stoichiometry is the stoichiometry of copper and/or silver. The precursor has a predetermined stoichiometry according to the empirical formula ((Cu1-xAgx)u(In1-y-tGayAlt)v((S1-zSez)R)w). The precursor has a predetermined stoichiometry of a photovoltaic absorber material including copper-indium-selenide, copper-indium-gallium-selenide, aluminum-indium-selenide, aluminum-indium-gallium-selenide, copper-aluminum-indium- selenide, copper-aluminum-indium-gallium-selenide, copper-indium-gallium-aluminum-selenide, aluminum-indium-gallium-aluminum-selenide and copper-aluminum-indium-gallium-aluminum-selenide. The precursor is deposited in an ink composition. The substrate is a semiconductor, a doped semiconductor, silicon, gallium arsenide, insulators, glass, molybdenum glass, silicon dioxide, titanium dioxide, zinc oxide, silicon nitride, a metal, a metal foil, molybdenum, aluminum, beryllium, cadmium, cerium, chromium, cobalt, copper, gallium, gold, lead, manganese, molybdenum, nickel, palladium, platinum, rhenium, rhodium, silver, stainless steel, steel, iron, strontium, tin, titanium, tungsten, zinc, zirconium, a metal alloy, a metal silicide, a metal carbide, a polymer, a plastic, a conductive polymer, a copolymer, a polymer blend, a polyethylene terephthalate, a polycarbonate, a polyester, a polyester film, a polyvinyl fluoride, polyvinylidene fluoride, a polyethylene, a polyetherimide, a polyethersulfone, a polyetherketone, a polyimide, a polyvinylchloride, an acrylonitrile butadiene styrene polymer, a silicone, an epoxy, paper and/or coated paper.x = 0-1, preferably 0-0.2;y = 0-1;t = 0-1;z = 0-1;y+t = 0-1;u = 0.5-1.5, preferably 0.7-1.2;v = 0.5-1.5, preferably 1;w = 2-6, preferably 3.5-4.5; andR = alkyl, aryl, heteroaryl, alkenyl, amido, silyl or inorganic and organic ligands.    TECHNOLOGY FOCUS - INSTRUMENTATION AND TESTING - Preferred Process: The depositing is done by spraying, spray coating, spray deposition, spray pyrolysis, printing, screen printing, inkjet printing, aerosol jet printing, ink printing, jet printing, stamp printing, transfer printing, pad printing, flexographic printing, gravure printing, contact printing, reverse printing, thermal printing, lithography, electrophotographic printing, electrodepositing, electroplating, electroless plating, bath deposition, coating, wet coating, dip coating spin coating, knife coating, roller coating, rod coating, slot die coating, Meyer bar coating, lip direct coating, capillary coating, liquid deposition, solution deposition, layer-by-layer deposition, spin casting and/or solution casting.