NOVELTY - The method for the metallization of silicon wafer (101), comprises dipping a wafer into a coating bath (102) containing an electrolyte (103), light-induced or light-assisted coating the surface of the wafer and transporting the wafers into a rinsing device (110) in which the coated surface is freed by a liquid rinsing medium from metal residues of the electrolyte, where the metal-containing rinsing medium is transferred from the rinsing device into the coating and then partially replaced by the bath and/or evaporated electrolyte.    USE - Method useful for metallization of silicon wafer such as solar cells.    ADVANTAGE - The method ensures simple and economical metallization of silicon wafer with good electrical conductivity.    DETAILED DESCRIPTION - The method for the metallization of silicon wafer (101), comprises dipping the wafer into a coating bath (102) containing an electrolyte (103), light-induced or light-assisted coating the surface of the wafer and transporting the wafers into a rinsing device (110) in which the coated surface is freed by a liquid rinsing medium from metal residues of the electrolyte, where the metal-containing rinsing medium is transferred from the rinsing device into the coating and then partially replaced by the bath and/or evaporated electrolyte. The metal-containing rinsing medium occurring in the rinsing device is completely transferred into the coating bath, is concentrated before introducing into the coating bath and is constricted through the evaporation and/or is added to the metal compounds. Organic additive is added to the rinsing medium before the rinsing medium is fed into the coating bath. The wafer in the rinsing device is subjected to a cascade rinsing. The electrolyte residues are removed mechanically from the surface of the wafer before its transfers into the rinsing device with compressed air. An INDEPENDENT CLAIM is included for a plant for the metallization of silicon wafer.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic representation of a metallization of silicon wafer.    Wafer (101)    Coating bath (102)    Electrolyte (103)    Electrode (104)    Rinsing device. (110)