NOVELTY - Fabricating photovoltaic cell (1) comprising semiconductor substrate (2) having front (3) and back side, involves applying layer of diffusion source material (5) comprising first dopant atoms at front side of semiconductor substrate for formation of emitter, where first dopant atoms dope part of substrate n-type or p-type and do not diffuse into substrate; and applying second dopant atoms, which are opposite to first dopant atoms, at back side of substrate for formation of back surface field portion (10).    USE - For fabricating photovoltaic cell e.g. solar cell.    ADVANTAGE - The method allows simpler tuning of multiple different doping processes with decreased manufacturing costs of photovoltaic cells due to decreased complexity of fabrication process and use of less manufacturing tools. The capping layer is applied to encapsulate the layer of diffusion source material on front and back side of semiconductor substrate to prevent diffusion of first dopant atoms out of the diffusion source material into process ambient and also prevent diffusion of second dopant atoms into diffusion source material or semiconductor substrate underneath diffusion source material. The capping layer and diffusion source material can be removed in same etching process after simultaneous diffusion of first and second dopant atoms into front and back side of semiconductor substrate, thus providing reduction of process complexity and hence reduction of manufacturing cost of photovoltaic cell.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for photovoltaic cell e.g. solar cell, having semiconductor substrate comprising n-type monocrystalline silicon-based material, where p-type emitter is formed using first dopant atoms e.g. boron atoms, at the front side and an n-type back surface field portion is formed using second dopant atoms e.g. phosphorus atoms, at back side; where first dopant atoms and second doping atoms, are driven into front and back side of n-type monocrystalline silicon-based substrate.    DESCRIPTION OF DRAWING(S) - The figure shows schematic diagram of layer of partially doped silicate glass that encapsulates semiconductor substrate of photovoltaic cell.    Photovoltaic cell (1)    Semiconductor substrate (2)    Front side of semiconductor substrate (3)    Layer of diffusion source material (5)    Capping layer (6)    Field portion (10)