NOVELTY - A flexible polyester coated nickel electrode is prepared by cleaning and drying polyester substrate, siliconizing polyester substrate surface by soaking cleaned polyester substrate in silane coupling agent solution, taking out, cleaning and drying, catalyzing and activating surface of polyester substrate by soaking siliconized polyester substrate in mixing solution of silver nitrate-glucose, taking out, cleaning and drying, and chemical nickel plating by soaking catalyzed and activated polyester substrate in nickel chemical plating solution, plating at room temperature, taking out and drying.    USE - Preparation of flexible polyester coated nickel electrode for electronic material and device e.g. solar battery, film ion secondary battery and flexible organic electronic device.    ADVANTAGE - The method obtains flexible polyester coated nickel electrode with strong anchoring strength with substrate, peeling strength of not less than 40 N/cm, good evenness, root-mean-square roughness (Rrms) of not greater than 15 nm, high conductive performance and electrical resistivity of 5.3 mu Omega .cm.    DETAILED DESCRIPTION - A flexible polyester coated nickel electrode is prepared by cleaning substrate and drying polyester substrate; siliconizing polyester substrate surface by soaking cleaned polyester substrate in silane coupling agent solution for 30-60 minutes, taking out, cleaning and drying; catalyzing and activating surface of polyester substrate by soaking siliconized polyester substrate in mixing solution of silver nitrate-glucose for 1-10 s, taking out, cleaning and drying; and chemical nickel plating by soaking catalyzed and activated polyester substrate in nickel chemical plating solution, plating for 20-50 minutes at room temperature, taking out and drying to prepare flexible polyester coated nickel electrode. The polyester substrate is polyethylene glycol terephthalate, polytrimethylene terephthalate, polybutylene terephthalate or polyethylene naphthalate. The silane coupling agent contains acetone as solvent and 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropanoic triethoxysilane, gamma -(methacryloyl monoisopropyl) trimethoxysilane as solute with concentration of 1-3 g/L. The mixing solution of silver nitrate-glucose contains deionized water as solvent and silver nitrate with concentration of 3-5 g/L, glucose with concentration of 6-8 g/L or 28 wt.% of ammonia water with concentration of 4-6 mL/L as solute. The nickel chemical plating solution contains deionized water as solvent and nickel sulfate with concentration of 20-50 g/L, sodium pyrophosphate with concentration of 18-24 g/L, sodium hydroxide with concentration of 2-4 g/L or N,N-dimethylamine borane with concentration of 2-4 g/L as solute.