NOVELTY - Formation of multichip module (200) comprises attaching first connection structure (206a-1) to integrated circuit (IC) chip (215) and to first power transistor; attaching second connection structure (206a-1) to IC chip and to second power transistor; attaching third connection structure (220) to IC chip and to third lead (210b-3); attaching fourth connection structure (222) to IC chip and to fourth lead (210b-4); and molding a material (202) around part of IC chip, power transistors, and two connection structures.    USE - Method for forming a multichip module used in a battery protection circuit. Uses include but are not limited to wireless phone systems, laptop computers, server computers, and power supplies.    ADVANTAGE - A number of different features can lead to a compact, multi-chip module. First, the die mounting pad of leadframe structure for power MOSFET can extend completely from one edge of the multi-chip module to the other. This allows the size of a power chip on the die mounting pad to be maximized, thus maximizing the current rating of power MOSFET. Second, there are no "down bonds" from either the power chip or IC chip to the leadframe structure. Third, connections between IC and power MOSFET are made by chip-to-chip interconnects (i.e. connection structures). Fourth, the number of external leads and signal routing elements adjacent to the MOSFET die mounting pad is minimized. By minimizing the external leads and eliminating "down bonds", the area inside the package is maximized allowing for a larger power MOSFET. The increased size of power MOSFET reduces on-resistance which minimizes power loss and reduces heating. This ultimately increases the useful energy of the battery. The multi-chip module makes it easier to form the battery protection circuit, since many of the components of the circuit are present in a single, small form factor module. One lead of the multi-chip module, which is not used for normal operation, connects to a pad on the IC that enables the IC to scale the switching time by a factor of 10, thus allowing the validation test time to be reduced to 120 msecond. The reduced test time increases the throughput of the validation test operation and reduces the manufacturing cost of the product. The multichip module may have an aspect ratio of greater than 1. This particular form factor minimizes space when it is used in an electrical assembly that is used with a rechargeable battery.    DETAILED DESCRIPTION - Formation of multichip module (200) comprises:    (A) obtaining a leadframe structure (210) comprising a first lead (210b-1), a second lead (210b-2), a third lead (210b-3), a fourth lead (210b-4) and at least two independent die mounting pads (210a-1, 210a-2) electrically isolated from one another;    (B) mounting an IC chip (215) to the leadframe structure;    (C) mounting at least one semiconductor chip (204) comprising first power transistor having first MOSFET transistor and second power transistor having second MOSFET transistor on the leadframe structure;    (D) attaching a first connection structure (206a-1) to the integrated circuit chip and to the first power transistor;    (E) attaching a second connection structure (206a-1) to the integrated circuit chip and to the second power transistor;    (F) attaching a third connection structure (220) to the integrated circuit chip and to the third lead;    (G) attaching a fourth connection structure (222) to the integrated circuit chip and to the fourth lead, the fourth lead being separate from the third lead; and    (H) molding a material (202) around part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.    The first lead provides an electrical connection to the first power transistor and the second lead provides an electrical connection to the second power transistor. The first and second leads are at a first end of the multi-chip module, and the third and fourth leads are at a second end of the multi-chip module.    DESCRIPTION OF DRAWING(S) - The drawing is a perspective view of a multi-chip module.    Multichip module (200)    Molding material (202)    Semiconductor chip (204)    First connection structure (206a-1)    Second connection structure (206a-1)    Leadframe structure (210)    Die mounting pads (210a-1, 210a-2)    First lead (210b-1)    Second lead (210b-2)    Third lead (210b-3)    Fourth lead (210b-4)    Integrated circuit chip (215)    Third connection structure (220)    Fourth connection structure (222)