TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The substrate is a semiconductor, a doped semiconductor, silicon, gallium arsenide, insulators, glass, molybdenum glass, silicon dioxide, titanium dioxide, zinc oxide, silicon nitride, a metal, a metal foil, molybdenum, aluminum, beryllium, cadmium, cerium, chromium, cobalt, copper, gallium, gold, lead, manganese, molybdenum, nickel, palladium, platinum, rhenium, rhodium, silver, stainless steel, steel, iron, strontium, tin, titanium, tungsten, zinc, zirconium, a metal alloy, a metal silicide, a metal carbide, a polymer, a plastic, a conductive polymer, a copolymer, a polymer blend, a polyethylene terephthalate, a polycarbonate, a polyester, a polyester film, Mylar (RTM: Polyester film), a polyvinyl fluoride, polyvinylidene fluoride, a polyethylene, a polyetherimide, a polyethersulfone, a polyetherketone, a polyimide, a polyvinylchloride, an acrylonitrile butadiene styrene polymer, a silicone, an epoxy, paper and/or coated paper. The substrate is a shaped substrate including a tube, a cylinder, a roller, a rod, a pin, a shaft, a plane, a plate, a blade, a vane, a curved surface or a spheroid.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Method: The deposition is done by spraying, spray coating, spray deposition, spray pyrolysis, printing, screen printing, inkjet printing, aerosol jet printing, ink printing, jet printing, stamp/pad printing, transfer printing, pad printing, flexographic printing, gravure printing, contact printing, reverse printing, thermal printing, lithography, electrophotographic printing, electrodepositing, electroplating, electroless plating, bath deposition, coating, wet coating, spin coating, knife coating, roller coating, rod coating, slot die coating, Meyer bar coating, lip direct coating, capillary coating, liquid deposition, solution deposition, layer-by-layer deposition, spin casting and/or solution casting. The step (c) is repeated. The method further comprises: either heating the substrate at 100-400 degrees C to convert the compounds or inks to a material, followed by repeating the step (c), depositing the compounds or inks onto the substrate, repeating steps (d) and (e) and annealing the material by heating the substrate at 300-650 degrees C; or heating the substrate, annealing the material and repeating the steps (c), (d) and (e). The method further comprises an optional step of selenization or sulfurization, before, during or after any step of heating or annealing.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The polymeric precursor compound is of formula (Agu(In1-yGay)v((S1-zSez)R)w) (A).R = alkyl, aryl, heteroaryl, alkenyl, amido, silyl, inorganic or organic ligands;u = 0.5-1.5;y, z = 0-1;v = 0.5-1.5; andw = 2-6.