NOVELTY - The method involves providing a carrier. A heat spreader (134) is mounted over the carrier. A semiconductor die (122) is mounted over the spreader, where a back surface (135) of the die is oriented toward the spreader. An insulating layer (142) is formed over the die and the spreader. A via (144) is formed in the insulating layer. A conductive layer (146) is formed over the insulating layer and connected to the spreader through the via, and contact pads on the semiconductor die, where the spreader extends from the surface of the die to the via. The carrier is removed.    USE - Method for making a flip chip semiconductor device (claimed) e.g. microcontroller, microprocessor, charged-coupled device (CCD), solar cell and digital micro-mirror device (DMD), that is utilized in an electronic device i.e. stand-alone system device such as graphics card and network interface card, in an entertainment field, communications field, power conversion field, network, computer and consumer product. Can also be used for military application, aviation, automotive, industrial controllers and office equipment.    ADVANTAGE - The method enables the semiconductor device to provide a short electrical conduction path from active devices on the semiconductor die to conduction tracks on a printed circuit board (PCB) to reduce signal propagation distance, lower capacitance and improve overall circuit performance. The conductive layer provides a short signal path from the contact pads to bumps for higher operating speed and better electrical performance of the semiconductor die. The method enables combining semiconductor packages over a single substrate, where the semiconductor packages include sophisticated functionality, so that electronic devices can be manufactured using cheaper components and streamlined manufacturing process, thus providing the electronic devices with reduced failure in an inexpensive manner.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a semiconductor device comprising a heat spreader.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a semiconductor die mounted to a heat spreader with polymer layers and conductive layers formed over and around the die.    Semiconductor die (122)    Heat spreader (134)    Back surface (135)    Insulating layer (142)    Via (144)    Conductive layer (146)