NOVELTY - The circuit board (10) comprises a first conductive post for electrically connecting to a first electrode of a semiconductor device (50), a first metal plate connecting to the first conductive post, a second conductive post for electrically connecting to a second electrode of the semiconductor device, a second metal plate connecting to the second conductive post, a third conductive post for electrically connecting to a third electrode of the semiconductor device, a third metal plate connecting to the third conductive post, and an anchoring resin (21) between the first and second posts.    USE - The circuit board is useful for mounting a semiconductor device having a first electrode, a second electrode and a third electrode in a semiconductor module (claimed) that is mounted in hybrid vehicle such as fuel cell hybrid electric vehicle, useful for boosting the voltage from the battery and useful as a switching device for motor control, where the semiconductor device includes square plate insulated gate bipolar transistor device and gate turn-off thyristor device.    ADVANTAGE - The circuit board exhibits high heat radiation effect and long-term reliability.    DETAILED DESCRIPTION - The circuit board (10) comprises a first conductive post for electrically connecting to a first electrode of a semiconductor device (50), a first metal plate connecting to the first conductive post, a second conductive post for electrically connecting to a second electrode of the semiconductor device, a second metal plate connecting to the second conductive post, a third conductive post for electrically connecting to a third electrode of the semiconductor device, a third metal plate connecting to the third conductive post, an anchoring resin (21) between the first and second conductive posts, between the second and third conductive posts and between the third and first conductive posts, and a reinforcing resin covering the anchoring resin and the first, second and third metal plates. The anchoring resin mechanically connects and electrically insulates the first, second and third metal plates. The first, second and third metal plates (11, 12, 13) and the first, second and third conductive posts are composed of similar materials as each other, and connected with the conductive post inserted into a through hole provided in the metal plate. The connection between the first conductive post and the first metal plate, the connection between the second conductive post and the second metal plate, and the connection between the third conductive post and the third metal plate are connected by solder. An uneven surface is formed on a surface of flange, head and foot of the first, second and third conductive posts. A notch is formed in the head or foot of the first, second and third conductive posts. The thicknesses of the first, second and third conductive posts differ.    DESCRIPTION OF DRAWING(S) - The diagram shows an exploded view of a circuit board.    Circuit board (10)    Metal plates (11, 12, 13)    Anchoring resin (21)    Semiconductor device (50)    Heat sink. (100)