NOVELTY - Manufacturing a barrier laminate comprises: forming first organic layer by laminating and hardening composition containing an acidic compound which is polymerizable acidic compound, oligomer or polymer, polymerizable compound and silane coupling agent on first inorganic layer; forming second organic layer by laminating and hardening composition containing polymerizable compound and silane coupling agent on the first organic layer or on at least one organic layer disposed on first organic layer; and forming second inorganic layer on second organic layer by plasma deposition method.    USE - The method is useful for manufacturing a barrier laminate, which is useful in a gas barrier film for sealing a devices and as a substrate in the devices including organic electroluminescence device, solar battery (all claimed), liquid-crystal display device, thin-film transistor, touch panel or electronic paper.    ADVANTAGE - The method: utilizes silane coupling agent in first and second organic layers, thus the adhesion between the first inorganic layer and the first organic layer, and the second inorganic layer and the second organic layer are improved; and has improved barrier resistance property and water vapor permeability.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for:    (1) a barrier laminate is manufactured by the above method in which a first inorganic layer, a first organic layer containing a polymer, a second organic layer containing a polymer and a second inorganic layer are laminated sequentially, where at least one organic layer may be laminated between the first organic layer and the second organic layer, acidic groups and siloxane bonds contained in the first organic layer, an M-O-Si bond is formed between an atom M constituting the first inorganic layer and an silicon atom constituting the first organic layer, siloxane bonds are contained in the second organic layer, the acidic value of the first organic layer is greater than the acidic value of the second organic layer, and an M1a-O-Si bond is formed between an atom M1a constituting the second inorganic layer and an silicon atom constituting the second organic layer, and where M and M1a is metal atom; and    (2) a gas barrier film in which the barrier laminate is formed on a base film.