NOVELTY - The method involves forming an aluminum thin layer (5) on bottom surface (3) of a silicon substrate (1). A hole pattern (9) is formed in bottom surface and thin layer. A dielectric, glass-forming paste (11) is applied on thin layer by screen printing so that diameter of hole pattern is reduced. A through-hole (10) is formed on the hole pattern using laser (13). The paste is heated and sintered at 577 degrees C and phosphorus silica glass layer is removed, to expose an aluminum doping layer on bottom surface. A metal film is formed on the substrate by applying silver containing paste.    USE - Method for manufacturing solar cell (claimed) using metal wrap through technology.    ADVANTAGE - The stable electrical interconnection between upper and bottom surface of substrate is achieved and the damage to the solar cell is prevented so that operation efficiency and service life of solar cell can be improved. The thickness and manufacturing cost of solar cell can be reduced by using simple technique.    DETAILED DESCRIPTION - The hole pattern is formed in bottom surface of the silicon substrate and aluminum thin layer. The dielectric, glass-forming paste is applied on thin layer by screen printing so that diameter of hole pattern is reduced. The through-hole is formed on the hole pattern using laser (13). The paste is heated and sintered so that phosphorus silica glass layer is removed, to expose an aluminum doping layer on bottom surface. The walls of the through holes are anisotropically etched using potassium hydroxide and isopropanol. A metal film is formed on the substrate by applying silver containing paste. A passivation film and a antireflection layer containing silicon nitride (SiN) or SiN/ silicon oxide (SiO2) can be formed on the upper surface of the silicon substrate during solar cell manufacture. An INDEPENDENT CLAIM is included for solar cell using metal wrap through technology.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view explaining the manufacturing process of solar cell using metal wrap through technology.    Silicon substrate (1)    Bottom surface of silicon substrate (3)    Aluminum thin layer (5)    Hole pattern (9)    Through-hole (10)    Dielectric, glass-forming paste (11)    Laser (13)