NOVELTY - The method comprises coating nano/micro-particles on a surface of a photoresist layer by a dip coating method, a spin coating method, a spray coating method/a natural drying method to form a particle layer, exposing and developing the photoresist layer to obtain a patterned photoresist layer, removing the particle layer, etching a substrate (10) with the photoresist layer using the patterned photoresist layer as an etching template, removing the patterned photoresist layer to obtain a patterned substrate with cavities (101), and filling each of the cavities with the nano/micro-particle.    USE - The method is useful for preparing a patterned substrate using nano- or micro-particles, where the patterned substrate is useful for manufacturing a LED or a solar cell.    ADVANTAGE - The method is capable of easily and rapidly preparing a patterned substrate with high industrial application efficiency thus economically manufacturing the LED with reduced energy consumption, good illuminance efficiency, long lifespan, compact volume and improved light extraction efficiency, reducing the manufacturing cost of the solar cell and increasing the photoelectric conversion efficiency and light transmittance of the solar cell.    DETAILED DESCRIPTION - The method comprises coating nano/micro-particles on a surface of a photoresist layer by a dip coating method, a spin coating method, a spray coating method/a natural drying method to form a particle layer, exposing and developing the photoresist layer to obtain a patterned photoresist layer, removing the particle layer, etching a substrate (10) with the photoresist layer using the patterned photoresist layer as an etching template, removing the patterned photoresist layer to obtain a patterned substrate with cavities (101), filling each of the cavities with the nano/micro-particle, forming a metal layer on the patterned photoresist layer, removing the patterned photoresist layer, etching the substrate using the metal layer as an etching template, and removing the metal layer to obtain a patterned substrate having rods (102). The substrate is etched by a dry etching method or a wet etching method. The photoresist layer is a positive photoresist and a negative photoresist, and has holes and rods. The nano- or micro-particles have particle diameters of 90-5 mm.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic view of a method for manufacturing a patterned substrate.    Substrate (10)    Cavities (101)    Rods. (102)