TECHNOLOGY FOCUS - INSTRUMENTATION AND TESTING - Preferred Method: The bonding method includes a first bonding sequence and a second bonding sequence after the first bonding sequence where the dispensing step (a) includes (a1) dispensing the adhesive into the first clamshell and (a2) dispensing the adhesive into the second clamshell, and the first portion adhesive applying step (b) includes (b1) applying the curing modality selectively to a first portion of the dispensed adhesive in a seal zone in the first clamshell and (b2) applying the curing modality selectively to a first portion of the dispensed adhesive in a seal zone in the second clamshell with the first bonding sequence including steps (a1) and (b1) and the second sequence including steps (a2) and (b2). The bonding method further comprises: (d) applying a modality-transparent fixture to a second portion of the elements different from the first portion, where the modality-transparent fixture coupled to the second portion of the elements during a wetting of the elements by the dispensed adhesive, or dispensing the adhesive into the second module fixture after the steps (a)-(c); (e) curing the module fixture and the modality transparent fixture in a curing enclosure that applies the curing modality to all exposed dispensed adhesive, or applying the curing modality selectively to a third portion of the dispensed adhesive in a second seal zone, where the second seal zone including at least one regions surrounding the apertures of the second module fixture, where the dispensed adhesive in the second seal zone is sufficiently cured to inhibit significant quantities of the adhesive from emerging from the apertures while the adhesive continues to be dispensed into the module fixture during step (d) and the curing modality is not applied to a fourth portion of the adhesive outside of the second seal zone but may include application of the curing modality to portions of the adhesive in the seal zone of the first module fixture; and (f) applying the curing modality to the fourth portion of the dispensed adhesive. Preferred Components: The adhesive includes at least one wettability parameters including a viscosity of 0-2000 (preferably 50-500) centipoises and/or a surface tension with a substrate of the bonding wells producing a contact angle with the adhesive less than 30 degrees , preferably less than 5 degrees in air. The bonding wells accepting the portions of the at least one elements has a nominal depth, where the adhesive fills the many bonding wells up to the nominal depth without substantial overfilling of the bonding wells. The module fixture includes a first battery fixture clamshell and a second battery fixture clamshell, where the many elements include many battery cells, the bonding wells are formed from counterbores in the clamshells with the portions of the batteries accepted within the counterbores including an end of the battery cell and each counterbore populated with an end of one of the battery cells has a portion of a wall of the clamshell defining a contact port aperture communicated to the counterbore allowing electrical communication to the end of the battery cell from outside the clamshell. The seal zones in step (b1) include the bonding wells in the first fixture and exclude bonding wells in the second fixture and the seal zones in step (b2) include the bonding wells in the second fixture and may include seal zones of the first fixture. The dispensed adhesive includes many wettability characteristics during dispensing with the first portion of the adhesive having a different wettability than the second portion of the adhesive. The wettability of the second portion is greater than or less than the wettability of the first portion. The selectively curable adhesive is curable upon exposure to UV radiation and the curing modality includes selective application of UV radiation to the identified portions of the dispensed radiation. The selectively curable adhesive is curable upon exposure to at least one modalities comprising UV, electron beam, peroxide, cationic, amine, hydroxy and/or thermal, and the curing modality includes application of selected at least one modalities to the identified portions of the dispensed radiation. The module fixture includes adhesive guiding structures directing the dispensing adhesive to many bonding surfaces in the bonding wells between the portions of the elements and the fixture. The adhesive guiding structures include at least one structures including ramps, channels, counterbores and/or sloped walls. The portion of an external surface of each of the elements includes a curing modality redirecting component for redirecting the curing modality into a body of the module fixture that promotes an inter-element bonding. The bonding method further comprises a second module fixture populated with many elements, where the second module fixture provides many bonding wells with each bonding well accepting a second portion of the elements with the second module fixture including at least one aperture communicated with the bonding wells in the second module fixture. The adhesive includes an indicator disposed in the seal zone with the indicator representing a state of cure of the adhesive. The module fixture is transparent to the curing modality with the seal zone defined by a mask opaque to the curing modality. EXAMPLE - No suitable example given.