NOVELTY - The device (100) has a signal reading unit formed in a surface portion of a semiconductor substrate, for reading out, as shot image signals, signals corresponding to signal charge amounts detected by a photoelectric conversion film to incident light quantities. A transparent glass substrate (102) is bonded to a layer that is placed on a light incidence side of the photoelectric conversion film with a transparent resin adhesive. A bonding wire (104) connects connection pads formed on a peripheral portion of the semiconductor substrate to a connection terminal of a circuit board (103).    USE - Photoelectric conversion film-stacked solid-state imaging device e.g. charged-coupled devices (CCD) image sensors and complementary metal oxide semiconductor (CMOS) image sensors, for an imaging apparatus (claimed) i.e. digital camera such as digital still camera, digital video camera, camera-incorporated cell phone, camera-incorporated electronic apparatus, monitoring camera, endoscope and vehicular camera.    ADVANTAGE - The device enables the use of a transparent adhesive whose refractive index is not subjected to restrictions. The device is manufactured by the material of the adhesive with which to bond the transparent glass substrate to the device chip, is selected from many options, thus enabling reduction in manufacturing cost and increase in reliability in an effective manner. The transparent glass substrate prevents a failure that is caused by a foreign substance stuck to the surface of the imaging device chip, if a foreign substance is stuck to the surface of the transparent glass substrate, and it is wiped away easily.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following:    (1) a manufacturing method for a photoelectric conversion film-stacked solid-state imaging device    (2) an imaging apparatus comprising a photoelectric conversion film-stacked solid-state imaging device.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic vertical sectional view of a solid-state imaging device.    Photoelectric conversion film-stacked solid-state imaging device (100)    Imaging device chip (101)    Transparent glass substrate (102)    Circuit board (103)    Bonding wire (104)    Optically black resin (105)