TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The material is enriched or deficient in a Group 11 atom. The polymeric precursor compound has a metal containing compound of formula ((Ma11-x1Ma2x1)(Mb11-y1-t1Mb2y1Mb3t1)v1((S1-z1Sez1)R)w1). The thin film has a thickness of 0.001-100 micrometers, preferably 0.1-10 micrometers. The substrate is semiconductor, a doped semiconductor, silicon, gallium arsenide, insulators, glass, molybdenum glass, silicon dioxide, titanium dioxide, zinc oxide, silicon nitride, a metal, a metal foil, molybdenum, aluminum, beryllium, cadmium, cerium, chromium, cobalt, copper, gallium, gold, lead, manganese, molybdenum, nickel, palladium, platinum, rhenium, rhodium, silver, stainless steel, steel, iron, strontium, tin, titanium, tungsten, zinc, zirconium, a metal alloy, a metal silicide, a metal carbide, a polymer, a plastic, a conductive polymer, a copolymer, a polymer blend, a polyethylene terephthalate, a polycarbonate, a polyester, a polyester film, a Mylar (RTM: Polyester film), a polyvinyl fluoride, polyvinylidene fluoride, a polyethylene, a polyetherimide, a polyethersulfone, a polyetherketone, a polyimide, a polyvinylchloride, an acrylonitrile butadiene styrene polymer, a silicone, an epoxy, paper, and/or coated paper. The substrate is a shaped substrate, a tube, a cylinder, a roller, a rod, a pin, a shaft, a plane, a plate, a blade, a vane, a curved surface or a spheroid.x1, y1 = 0-1;t = 0-1, where the sum of y1 and t1 is 0-1;z1 = 0-1; u1, v1 = 0.5-1.5;w1 = 2-6; andR = alkyl, aryl, heteroaryl, alkenyl, amido, silyl, and inorganic and organic ligands.Preferred Process: The substrate is heated at a temperature of 100-550 degrees C, preferably 200-400 degrees C. In the thin film material, the depositing is done by spraying, spray coating, spray deposition, spray pyrolysis, printing, screen printing, inkjet printing, aerosol jet printing, ink printing, jet printing, stamp printing, transfer printing, pad printing, flexographic printing, gravure printing, contact printing, reverse printing, thermal printing, lithography, electrophotographic printing, electrodepositing, electroplating, electroless plating, bath deposition, coating, dip coating, wet coating, spin coating, knife coating, roller coating, rod coating, slot die coating, Meyer bar coating, lip direct coating, capillary coating, liquid deposition, solution deposition, layer-by-layer deposition, spin casting, and/or solution casting. The process further comprises an optional step of selenization or sulfurization, either before, during or after steps (c) or (d). EXAMPLE - No suitable example given.