NOVELTY - A surface mount circuit protection device (10) comprises: laminar positive temperature coefficient resistive element having two major surfaces; first electrode layer formed at first major surface, and having first metal material to be soldered to printed circuit substrate; second electrode layer formed at second major surface; and weld plate (18) unit of the material formed separately of and extending from second electrode layer and having thermal mass capable of withstanding resistance micro spot welding of strap interconnect unit without significant resultant damage to device.    USE - As surface mount circuit protection device such as a battery protection circuit assembly (claimed).    ADVANTAGE - The device have an integrally formed, or discretely formed and attached, weld plate to which an interconnect strap may be resistance-welded in a manner overcoming limitations and drawbacks of the prior art; interconnects strap is subsequently welded by a user in a manner providing a reliable electrical and mechanical connection which does not shift during solder reflow attachment of the PPTC device to a printed circuit board assembly, thereby enables production and supply of the polymeric positive temperature coefficient (PPTC) device as a separate component for assembly into electronic circuits including printed circuit boards and cells/batteries; interconnects strap is mechanically attached, and electrically connected, particularly by resistance welding, without changing, damaging or destroying the polymeric material forming the PPTC device.    DETAILED DESCRIPTION - A surface mount circuit protection device (10) comprises: (a) a laminar positive temperature coefficient (PTC) resistive element having first and second major surfaces and a thickness between them, the resistive element comprising a conductive polymer composition; (b) a first electrode layer formed at the first major surface and being coextensive with them, and comprising a first metal material of a type adapted to be soldered to a printed circuit substrate for effecting surface mounting of the device; (c) a second electrode layer formed at the second major surface and being coextensive with them; and (d) weld plate (18) unit of metal material formed separately of and extending from the second electrode layer and having a thermal mass capable of withstanding resistance micro spot welding of a strap interconnect unit without significant resultant damage to the device. The device further comprises a printed circuit board (22) assembly (20) to which the device is surface mounted and electrically connected. An INDEPENDENT CLAIM is included for a battery protection circuit assembly including a printed circuit substrate, several electrical components attached to the printed circuit substrate including the surface mounted circuit protection device.    DESCRIPTION OF DRAWING(S) - The figure shows an enlarged view in side elevation of a battery protection circuit assembly.    Surface mount circuit protection device (10)    Weld plate (18)    Circuit board assembly (20)    Printed circuit board (22)    Surface mount components (24, 26)    Metal weld plate (32)