NOVELTY - A method of texturing a surface of selected material, involves: applying base etching component as a layer extending over the surface of selected material; and depositing a fluid etching component in a pattern of discrete deposition points over predetermined area of the surface to be textured. The base etching component and deposited fluid etching component combine to form etching composition to etch surface of selected material in areas where the deposited fluid etching component is deposited and spreads, resulting in etched pattern of texture on surface of selected material.    USE - For texturing a surface of a selected material (particularly silicon or glass) (claimed). Also useful for fabrication of thin film solar cells.    ADVANTAGE - The present method is improved and can treat surfaces including glass. The texturing process can process glass substrates continuously by simply maintaining a minimum fluid level in the liquid reservoir used to form the aerosol. Because the concentration of fluoride in the waste from the rinse station can be controlled to be very low (less than 5 parts per million) in most jurisdictions there is no need to treat the effluent from the process. Thus, the rinse unit can operate continuously with a waste effluent being continually drained to accommodate the new waste water. The method textures materials such as silicon dioxide and silicon for enhanced light capture in thin film solar cell devices.    DETAILED DESCRIPTION - A method of texturing a surface of a selected material, involves: applying a base etching component as a layer extending over the surface of the selected material; and depositing a fluid etching component in a pattern of discrete deposition points over a predetermined area of the surface to be textured, such that the deposited fluid etching component spreads laterally after being deposited. The base etching component and the deposited fluid etching component combine to form an etching composition to etch the surface of the selected material in the areas where the deposited fluid etching component is deposited and spreads, resulting in an etched pattern of texture on the surface of the selected material, which is a two dimensional spatial modulation of the pattern of discrete deposition points.