NOVELTY - The process comprises: forming structures on a substrate using a technique consisting of photolithography, e-beam writing and focused ion-beam writing; bonding a polymer film to an array of structures disposed on the substrate; nanoimprinting the structures on the substrate before the bonding step; undertaking the bonding step under conditions to cause polymer chains in the polymer film to partially diffuse into the structured substrate; selecting a thermoplastic polymer as the polymer film; and selecting poly(methyl methacrylate) as the thermoplastic polymer.    USE - The process is useful for forming a laminated structure, which is useful for electrical, optical, photonic and biological applications and to planarize a variety of different nano-structured surfaces for manufacturing thin film device, displays, solar panels and integrated circuits.    ADVANTAGE - The process is capable of effectively and economically forming a laminated structure without additional equipments such as a pinch roller, and enables precise control of the extent of infiltration of the laminate film on the structure and the transfer of a laminate film onto a structure at high transfer yields.    DETAILED DESCRIPTION - The process comprises: forming structures on a substrate using a technique consisting of photolithography, e-beam writing and focused ion-beam writing; bonding a polymer film to an array of structures disposed on the substrate, nanoimprinting the structures on the substrate before the bonding step; undertaking the bonding step under conditions to cause polymer chains in the polymer film to partially diffuse into the structured substrate; selecting a thermoplastic polymer as the polymer film; selecting poly(methyl methacrylate) as the thermoplastic polymer; selecting the condition from a temperature of 20 degrees C below a glass transition temperature of 10 degrees C and above the glass transition temperature of the thermoplastic polymer; selecting the temperature of 20 degrees C below the glass transition temperature to the glass transition temperature; selecting the condition from a pressure of 40-60 bars and a time duration of 150-300 seconds; providing an ordered array of structures on a planar substrate; selecting the thickness of the polymer laminate film (12) of 10 nm to 10 mm; selecting the array of structures having a dimension on the nano-scale size range; selecting a thermosetting polymeric substrate as the substrate; and selecting a cross-linked polymer substrate. Cavities are formed between the polymer film and the array of structures during the bonding and defined by enclosed walls for containing a material, and have openings for permitting material to flow and an ordered pattern throughout laminated structures. The bonding causes the polymer laminate film to infiltrate the array of structures by a distance of 0-200 microns. The infiltration distance is 10-20 nm. INDEPENDENT CLAIMS are included for:    (1) a laminated structure; and    (2) a photonic crystal.    DESCRIPTION OF DRAWING(S) - The figure shows a flow diagram of the nanoimprinting and lamination process.    Glass substrate (2)    Adhesion promoter (4)    Thermosetting polymer (6)    Imprint mold (8)    Imprint forming surface (10)    Polymer laminate film. (12)