TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The thickness of the inorganic film is 5 nm or more and 200 nm or less. The inorganic film contains a material consisting of metal, metal oxide, metal nitride, metal carbide, metal fluoride, and composites of the metal, metal oxide, metal nitride, metal carbide or metal fluoride.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The organic film contains one of radiation-curing monomer and oligomer. The functional film comprises: a substrate; a functional layer including at least one organic film and at least one inorganic film that are alternately arranged on one side of the substrate; a first laminate film arranged on the other side of the substrate; and a second laminate film arranged on a top layer of the functional layer, where adhesion between the second laminate film and the top layer is less than adhesion between the first laminate film and the substrate. The Young's modulus of the second laminate film is less than Young's modulus of the first laminate film. The adhesion between the second laminate film and the top layer is 0.02-1 (N/25 mm), and the adhesion between the first laminate film and the substrate is 0.03-1.5 (N/25 mm). The center line average roughness (Ra) of the second laminate film is 5-50 nm, and center line average roughness (Ra) of the first laminate film is 5-80 nm.    TECHNOLOGY FOCUS - POLYMERS - Preferred Method: In the method: a total thickness of the first laminate film and the substrate is 75 mu m or more; adhesion of the first laminate film is 0.01 N/25 mm or more; adhesion of the second laminate film is 0.06 N/25 mm or less; and a pass roller supports edges of at least one of the back side of the substrate and the front side of the substrate to transfer the substrate in the first and second steps. The method further comprises: a step of improving adhesion between the substrate and the first laminate film before deposition of the inorganic film on the substrate.