TECHNOLOGY FOCUS - ELECTRONICS - Preferred Components: The array of solar tiles includes solar tiles that are portions of different types of solar cells which include at least one of solar cells made of III-V materials, silicon, chalcogenides, fluorescent concentrator cells or organic semiconductors. The photovoltaic module further comprises bypass diodes integrated into the circuitry. The solar tiles are one of back contact, or front contact tiles, which are arranged on either one side of the substrate or both sides of the substrate. The functional tiles include at least one of a battery, a display tile, a power regulator, or a sensor. The display tile comprises one of electrophoretic display, electrochromic display, LCD, micro-electro-mechanical system interference display, electrowetting display, powder display, electrochemical display, organic or inorganic light emitting display, or plasma display. The sensor further comprises one of a photodiode, an accelerometer, a pressure sensor, a motion sensor, a moisture sensor, a gas sensor, a radiation sensor, a biological sensor, or a chemical sensor. The tiles are electrically connected via conductors, which are routed between the tiles in the form of slack loops which are arranged to allow for mechanical flexibility. The flexible substrate comprises one of metal foil or metalized polymer foil. Preferred Method: In the method, manufacturing at least one functional material comprises manufacturing at least one solar cell, and dicing the solar cell to form solar tiles. The manufacturing at least one solar cell comprises: manufacturing at least one solar cell each out of at least two of III-V materials, silicon, or organic semiconductors; and mounting the solar tiles onto the flexible substrate which comprises mounting a mixture of the solar tiles from solar cells of different materials. In the method, forming circuitry comprises: patterning conductors in a configuration to provide connections to and from the functional tiles, where patterning conductors comprises printing a conductive material onto the flexible substrate to provide connections, where printing comprises one of screen printing, inkjet printing, laser patterning, offset printing, gravure printing, or flexography; patterning a seed layer of conductors for plating, plating the seed layer with a conductive material, coating the conductive material with solder, and melting the solder to form connections in the circuitry; and wiring the solar tiles so that the wires contact the fronts of the solar tiles and are routed between the solar tiles with slack loops, where forming the circuitry occurs one of either before or after the mounting of the solar tiles. EXAMPLE - No suitable example given.