NOVELTY - The apparatus comprises deposition modules, draw gas injection chambers, a substrate positioner, gas manifolds, abatement spaces present in fluidic communication with the draw gas injection chambers, vacuum pumps present in fluidic communication with the abatement spaces, substrate heaters operative to heat a substrate (103) while the materials are deposited, heating zones operative to heat the substrate to a different temperature, and process chambers operative to perform substrate cleaning, substrate outgassing, substrate annealing, substrate drying, and/or substrate surface activation.    USE - The apparatus is useful for depositing two different materials on two opposing sides of a rigid and flexible substrate by atomic layer deposition for manufacturing product (claimed) including microelectronic packaging, medical devices, microelectromechanical systems, carbon nanotube assemblies, high-end consumer and aerospace parts, printed circuit boards, hard coatings over machining tools and plastic molding tooling, solar panels, organic light emitting diode based lighting and display panels, smart window coatings, food packaging, and a myriad of other applications.    ADVANTAGE - The apparatus is capable of efficiently and uniformly depositing the material on the substrates with high quality, improved atomic layer control, excellent display conformality and enhanced hermetic sealing properties thus effectively protecting the products from corrosion and harsh ambient condition.    DETAILED DESCRIPTION - The apparatus comprises deposition modules, draw gas injection chambers, a substrate positioner, gas manifolds, abatement spaces present in fluidic communication with the draw gas injection chambers, vacuum pumps present in fluidic communication with the abatement spaces, substrate heaters operative to heat a substrate (103) while the materials are deposited, heating zones operative to heat the substrate to a different temperature, and process chambers operative to perform substrate cleaning, substrate outgassing, substrate annealing, substrate drying, and/or substrate surface activation. The substrate positioner is operative to place a portion of the substrate proximate to the deposition modules such that the substrate and the deposition modules define a respective one of process spaces (102), and comprises conveyer belts driven by rollers, and comprises tensioning reels, and tensioning reels. Each of the process spaces is present in fluidic communication with the draw gas injection chambers. The gas manifolds are adapted to separately inject a first precursor gas and a second precursor gas into the process spaces while injecting a draw gas into the draw gas injection chambers and to inject a sweep gas into the process spaces while injecting no draw gas into the draw gas injection chambers. The deposition modules comprise a respective one of elongate plates (101), and are disposed on opposing sides of the substrate. The elongate plates define respective injection passages that penetrate through the elongate plate proximate to a center (300) of the elongate plate, a respective channel that is centered on a lateral axis of the elongate plate and runs parallel to a longitudinal axis of the elongate plate, and a rectangle that is characterized by a common lateral length and a common longitudinal length, and comprise a respective side defining a concave depression, and a respective draw gas passage that is present in fluidic communication with the concave depression. A portion of the gas manifolds is operative to inject the first precursor gas, the second precursor gas and the sweep gas through the injection passages in the elongate plates, and is operative to inject the draw gas through the draw gas passages in the elongate plates. The common longitudinal length is 5 times greater than the common lateral length. The common lateral length is less than 50 times the average distance between the substrate and the deposition modules. The draw gas injection chambers are physically defined by the deposition modules and a respective gap between two deposition modules. The abatement spaces comprise a respective abatement surface on which the first and second precursor gases are operative to form a film in the presence of an abatement gas. The substrate emanates from a source reel, and is collected by a collection reel. The source reel and the collection reel are separated from the process spaces by a series of partitions defining gaps that are differentially pumped. The substrate heaters are operative to heat the substrate primarily by convection. A portion of the apparatus is covered by a removable tape. INDEPENDENT CLAIMS are included for:    (1) a method for depositing materials on a substrate; and    (2) a product of manufacture formed in part by a method.    DESCRIPTION OF DRAWING(S) - The diagram shows a perspective view of an atomic layer deposition module within the atomic layer deposition apparatus.    Elongate plates (101)    Process space (102)    Substrate (103)    Distribution channel (115)    Center of the elongate plate (300)    Gas flow vectors. (301, 302, 303, 304)