NOVELTY - A silicon regeneration utilization system (10) consists of a silicon ingot processing unit (17), a solid-liquid separator (18) for separating silicon solid content from silicon slurry or silicon sludge containing diamond particles, a heat burning process unit (19) which carries out heat burning process of silicon solid content, a heat melting unit (20) to fuse the silicon baked products, and a unidirectional solidification unit (21) for carrying out unidirectional solidification of fused silicon and forming silicon ingot (11).    USE - Silicon regeneration utilization system is used for recycling silicon fine particles as raw material for wafers used in solar cells and semiconductor devices.    ADVANTAGE - The silicon regeneration utilization system enables safe, economical and efficient reuse of discarded silicon by a simple treatment process. Increase in silicon raw material cost is suppressed.    DETAILED DESCRIPTION - A silicon regeneration utilization system consists of a silicon ingot processing unit, a solid-liquid separator for separating silicon solid content from silicon slurry or silicon sludge containing diamond particles obtained by the silicon ingot processing unit, a heat burning process unit which carries out heat burning process of silicon solid content containing the residual organic substance and diamond particles obtained from the solid-liquid separator, a heat-melting unit to fuse the silicon baked products obtained from the heat-processing unit at a temperature beyond the melting point of silicon, and a unidirectional solidification unit for carrying out unidirectional solidification of fused silicon and forming silicon ingot. The silicon ingot processing unit consists of a silicon ingot fixing device (14) which fixes a silicon ingot through a beam material comprising a silicon system substance, a cutting and grinding apparatus (15) which cuts and grinds the fixed silicon ingot by a cutting and grinding component consisting of a diamond wire saw, and a coolant feeder (16) which supplies the coolant comprising water, or organic type substance containing water to cutting/grinding process portion of the cutting and grinding process unit. The heat burning process unit is provided with a vacuum production unit which makes into a vacuum state the gas supply control unit for supplying an inert gas, hydrogen gas, or oxygen gas to the region which bakes silicon solid content containing residual organic substance and diamond particles, or the baking region (30), and temperature controller (24) for controlling the temperature of the region which bakes the silicon solid content to temperature region range (I) of room temperature to 300 degrees C, temperature region range (II) of 300-850 degrees C, temperature region range (III) of 850-1200 degrees C. The heat-melting unit is provided with temperature controller (25) for controlling the temperature in the heat-melting region, within the heat-melting unit, according to the specific temperature profile in which a maximum temperature is shown at 1500 degrees C or more, to fuse silicon solid content after the heat-burning. During manufacture of silicon wafer for solar cells or semiconductor devices, silicon is extracted from silicon waste material in the production of a silicon ingot at the time of cutting and grinding processes, and recycled to manufacture of silicon wafer. An INDEPENDENT CLAIM is included for silicon regeneration utilization method, which involves baking silicon solid content containing diamond particles in the presence of inert gas, hydrogen gas, or oxygen gas or vacuum state, heat-melting the baked silicon solid content, and carrying out unidirectional solidification.    DESCRIPTION OF DRAWING(S) - The drawing shows a block diagram of the silicon regeneration utilization system and a schematic view of the heat-burning apparatus.    Silicon regeneration utilization system (10)    Silicon ingot (11)    Silicon ingot fixing device (14)    Cutting-grinding apparatus (15)    Coolant feeder (16)    Silicon ingot processing unit (17)    Solid-liquid separator (18)    Heat burning process unit (19)    Heat-melting unit (20)    Unidirectional solidification unit (21)    Temperature controllers (24,25)    Washing apparatus (28)    Baking region (30)    Molding unit (50)