NOVELTY - A gas barrier film is manufactured by plasma processing the outermost surface of base film laminated with peelable plastic films at 0.1-10 Pa in inert gas, laminating polymeric resin to the plasma processed base material surface, plasma processing the polymeric resin layer, and laminating gas barrier layer on the plasma processed polymeric resin layer.    USE - Manufacturing method of gas barrier film for solar cell back sheet (claimed), and electronic material packaging.    ADVANTAGE - Water vapor and oxygen gas barrier properties are excellent, is hot water resistant, and adhesion power reduction and delamination are prevented.    DETAILED DESCRIPTION - A gas barrier film is manufactured by plasma processing the outermost surface of base film laminated with peelable plastic films at 0.1-10 Pa in inert gas, laminating polymeric resin to the plasma processed base material surface, plasma processing the polymeric resin layer, and laminating gas barrier layer on the plasma processed polymeric resin layer. The thickness of polymeric resin layer is 0.03-3 mu m. Polymeric resin is a thermosetting resin which contains olefin polymer dissolved in aqueous medium, silane compound, and curing catalyst consists of iron acetylacetonate, zinc acetylacetonate, aluminum acetylacetonate, tin tetrachloride, titanium diisopropoxy bis(acetylacetonate) or dihydroxy titanium bislactate. Silane compound is 5-100 weight parts with respect to 100 weight parts olefin polymer. Silane compound contains tetramethoxysilane, tetraethoxysilane, vinyl trimethoxysilane, vinyl triethoxysilane, methyl trimethoxysilane, methyl triethoxysilane, dimethyldiethoxysilane, gamma -glycidoxy propyl trimethoxysilane, gamma -glycidoxy propyl triethoxysilane, gamma -glycidoxy propylmethyl diethoxysilane, gamma -acryloxypropyl trimethoxysilane, gamma -aminopropyl trimethoxysilane, gamma -aminopropyl triethoxysilane, gamma -mercapto propyl trimethoxysilane, and/or gamma -isocyanate propyl triethoxysilane.