NOVELTY - Deposition inhibitor composition comprises: first and second compatible solvents, where the first solvent has a vapor pressure of at least 10 mm mercury at room temperature and the second solvent has a vapor pressure of less than that of the first solvent; and a hydrophilic deposition inhibitor material dissolved in the composition, where the inhibitor material is soluble in an aqueous solution comprising water (at least 50 wt.%), and having a free acid content of less than 2.5 milliequivalents/g.    USE - The deposition inhibitor composition is useful: in a deposition method for forming a patterned thin film, which is useful to obtain an electronic device including integrated circuit, active-matrix display, solar cell, active-matrix imager, sensor, or an radio-frequency label; and in treating a substrate (all claimed).    ADVANTAGE - The deposition inhibitor composition utilizes: hydrophilic deposition inhibitor material, which can be provided on substrates in a uniform manner with relatively low coverage; and solvents which can be removed easily, thus providing highly uniform thin film deposition only in the selected areas of a substrate with improved throughput speeds.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for:    (1) a deposition method for forming a patterned thin film (220) comprising: (a) applying the composition comprising the deposition inhibitor material to a substrate (200); (b) patterning the deposition inhibitor material, simultaneously or subsequently to step (a), to provide selected areas on the substrate where the deposition inhibitor material is absent; and (c) depositing an inorganic thin film on the substrate by chemical vapor deposition only in those areas where the deposition inhibitor material is absent;    (2) an electronic device obtained from the above method; and    (3) treating a substrate comprising: providing the deposition inhibitor composition to an application device; and applying the deposition inhibitor composition to a substrate after at least 70% of the first solvent has evaporated.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of the layers on the substrate at different points in the process.    Substrate (200)    Patterned thin film layer material (220)