TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The white inorganic filler powder is anatase-type or rutile-type titania, alumina, barium sulfate, magnesia, aluminum nitride, boron nitride, barium titanate, kaolin, talc, calcium carbonate, zinc oxide, silica, mica powder, granulated glass, powder nickel and/or powder aluminum. White inorganic filler powder is dispersed in the silicone resin, by performing silane-coupling process. The titanium oxide is surface-treated and coated with aluminum, alumina, zinc oxide, zirconium oxide and/or silica. The content of white inorganic filler powder in the silicone resin, is 2-80 %mass. Preferred Property: The white inorganic filler powder has average particle diameter of 0.05-50 mu m. Preferred Process: The portion of white inorganic filler powder is exposed from the surface by mold casting by grinding the surface of at least one portion of silicone resin. Preferred Film: A metal film is attached on the surface of reflective base material. The metal film is formed using copper, silver, gold, nickel, and/or palladium. The metal film is metal-plated film, metal vapor deposition film, metal spraying film, or metal foil film.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The silicone resin essentially contains non-cyclic dimethyl siloxy repeating unit. The content of low molecular-weight polysiloxane having 4-10 siloxy group-containing repeating unit is 300 ppm or less, in the silicone resin. The raw-material composition further comprises a reaction inhibitor which deactivates or volatilizes by heating, and organic solvent and/or reactive diluent for viscosity adjustment. The reflection layer further comprises a fluorescent substance. The surface of metal mold is coated by fluororesin. Preferred Properties: The reflection layer has thickness of 1-2000 mu m. The silicone resin has refractive index of 1.35-1.65. Preferred Layer: The surface of reflection layer is non-mirror surface, and has prism shape and/or satin-finished surface shape. Preferred Process: The polymerization reaction is performed by heating and/or pressurizing within metal mold, or press molding with a metal mold. The reflection layer which covers the support having conductive pattern, is polished, and the conductive pattern is exposed.