NOVELTY - Moisture barrier potting compound comprises: (a) at least one olefinic polymer included in an amount from about 40% to about 95% by weight of the total compound; (b) at least one silane included in an amount from about 0.1% to about 15% by weight of the total compound; (c) at least one wax included in an amount from about 2% to about 30% by weight of total compound; (d) at least one antioxidant included in an amount from about 0.1% to about 4% by weight of the total compound; and (e) at least one filler included in an amount from about 0.1% to about 20% by weight of the total compound.    USE - The moisture barrier potting compound is useful for preparing solar module and solid state device (all claimed). Generally, it can be used in solar applications, solid state meters, and other applications with water sensitive components.    ADVANTAGE - The invention improves the characteristics of the potting compound, in terms of moisture barrier protection, while still providing a compound having a viscosity that allows the compound to adequately flow to cover or seal the solid state device without undue heating of the compound.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are:    (1) a solar module comprising a first substrate; a second substrate; at least one photovoltaic cell disposed between the first and the second substrates, current generated by the at least one photovoltaic cell being communicated to lead lines that exit through an opening in the solar module; and a potting compound disposed within the opening of the solar module to seal the lead lines and the opening, where the potting compound includes at least one olefinic polymer; at least one silane; at least one wax; at least one antioxidant; and at least one filler; and    (2) a solid state device comprising a housing that defines an inner cavity; a circuit board located within the housing; and a potting compound that encapsulates the circuit board to form a moisture barrier to protect the circuit board from moisture penetration, where the potting compound includes at least one olefinic polymer; at least one silane; at least one wax; at least one antioxidant; and at least one filler.