NOVELTY - Bonding method comprises: (a) dispensing high-wettability adhesive into first module fixture populated with many elements, where first module fixture provides many bonding wells with each bonding well accepting first portion of elements with module fixture including apertures communicated with bonding wells, and adhesive is selectively curable upon application of curing modality; (b) applying curing modality selectively to first portion of dispensed adhesive in seal zone; and (c) applying curing modality to second portion of dispensed adhesive.    USE - The bonding methods are useful in for battery module assembly construction used in electric vehicles.    ADVANTAGE - The bonding methods: decrease costs (by decreasing expense, mass and/or cure time) associated with use of adhesives when assembling modularized components; and enable use of high-wettability adhesives (as low viscosity and/or low surface tension adhesives) for assembling modularized components.    DETAILED DESCRIPTION - Bonding method (I) comprises: (a) dispensing a high-wettability adhesive into a first module fixture populated with many elements, where the first module fixture provides many bonding wells with each bonding well accepting a first portion of at least one of the elements with the module fixture including at least one apertures communicated with at least one of the bonding wells, and the adhesive is selectively curable upon application of a curing modality; (b) applying the curing modality selectively to a first portion of the dispensed adhesive in a seal zone, where the seal zone includes at least one regions surrounding the apertures, and the dispensed adhesive in the seal zone is sufficiently cured to inhibit significant quantities of the adhesive from emerging from the apertures while the adhesive continues to be dispensed into the module fixture where the curing modality is not applied to a second portion of the adhesive outside of the seal zone; and (c) applying the curing modality to the second portion of the dispensed adhesive. INDEPENDENT CLAIMS are also included for:    (1) bonding method (300) (II) comprising: populating a module fixture with many elements (305), where the module fixture is transparent to a curing modality; masking selected areas of first portion of the module fixture using a mask opaque to the curing modality producing an unmasked first portion of the module fixture and a masked first portion of the module fixture; dispensing high-wettability adhesive into the populated module fixture, where the adhesive is selectively curable upon application of the curing modality and the first module fixture provides many bonding wells with each bonding well accepting a first portion of the elements with the module fixture including at least one apertures communicated with the bonding wells, and the adhesive is selectively curable upon application of a curing modality; curing, during the dispensing step, first portion of the dispensed adhesive in the unmasked first portion upon application of the curing modality to the first portion of the dispensed adhesive in the first portion without application of the curing modality to a second portion of the dispensed adhesive in the masked first portion; removing the mask; and curing uncured dispensed adhesive in the module fixture, including the second portion of the dispensed adhesive, upon application of the curing modality to the module fixture; and    (2) a system comprising: a module fixture supporting many elements, where the module fixture defines many bonding wells with each bonding well accepting a first portion of at least one elements with the module fixture including at least one apertures communicated with the bonding wells with the bonding wells having a nominal depth; and a dispensing system, coupled to the module fixture, for dispensing a high-wettability adhesive into each bonding well and surrounding each element substantially filling the bonding well up to nominal depth without significant overfill, where the adhesive is selectively curable upon application of a curing modality; and a curing structure for selectively exposing the adhesive to the curing modality as the adhesive emerges from the apertures during dispensation of the adhesive.    DESCRIPTION OF DRAWING(S) - The figure shows flowchart of the bonding process.    Bonding process (300)    Populating the battery cells into a first module fixture (305)    Applying adhesive (315)    Installing UV-clear fixture (320)    Exposing adhesive cures (335)