NOVELTY - The module has optical element (2a, 2b) which is provided on circuit board (1) and which is optically coupled with optical waveguide (11) transmitting optical signal. A wiring pad is provided on insulating film provided on circuit board and optical element. An electrical wiring (3) electrically connecting wiring pad with optical element. A semiconductor element (4) provided on wiring pad, is electrically connected. The side of optical element is provided with resin fillet, and insulating film is formed with insulation film provided on resin on board and fillet.    USE - Photoelectric composite wiring module for transmission apparatus (claimed).    ADVANTAGE - The side of the optical element is provided with resin fillet, and insulating film is formed with insulation film provided on resin present on circuit board and fillet. Hence a highly productive photoelectric fusion wiring module which carries out the batch processing of the high capacitance optical signal transmitted and received in a transmission apparatus, is obtained. The distance between the large scale integration (LSI) and an optical element is shortened, and a gap formed between the optical element side and a resin layer at the time of insulation layer forming, is reduced. The influence of the optical elements on the mounting reliability that falls by the retention of the moisture content to a gap, can be prevented. As an optical element is firmly fixed by the board top, the mounting reliability can be improved. The manufacturing is simple. As only the top clad portion of an optical waveguide is optically coupled through the distance for the resin layer formed in surface layer, a number, several dozen micrometers, optical element and the optical waveguide has high optical coupling efficiency. As the optical efficiency becomes high, the drive current of an optical element is reduced, and the effect of a power-saving and warming prevention is realized. The transmission speed per channel is increased.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacturing method of the photoelectric composite wiring module.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the photoelectric composite wiring module.    Circuit board (1)    Optical elements (2a, 2b)    Electrical wiring (3)    Semiconductor element (4)    Optical waveguide (11)