NOVELTY - A transparent electrically conductive substrate (20) manufacturing method involves forming a metal layer (24a) on a surface of a transparent substrate layer (22), where the metal layer has thickness of 40-2000 nm. A self-organizing film (26) containing diphenyl methanone compound (I) is formed on a surface of the metal layer. Part(s) of the surface of the self-organizing film is coated with a resin layer (28). A metal wiring (24) is formed by removing part of the metal layer that is not coated with the resin layer by etching.    USE - Method for manufacturing a transparent electrically conductive substrate (claimed) that is utilized as a current collection electrode for flat panel displays such as LCD, solar cell and various touch panels, antistatic film, and electromagnetic shielding material.    ADVANTAGE - The method enables manufacturing the transparent electrically conductive substrate in an easy and economical manner with better electroconductivity and durability and formation of uniform shape and fine pattern of metal wiring.    DETAILED DESCRIPTION - A transparent electrically conductive substrate manufacturing method involves forming a metal layer on a surface of a transparent substrate layer, where the metal layer has a thickness of 40-2000 nm. A self-organizing film containing diphenyl methanone compound of formula (I) is formed on a surface of the metal layer. Part(s) of the surface of the self-organizing film is coated with a resin layer. A metal wiring is formed by removing part of the metal layer that is not coated with the resin layer by etching.    R1-R6 = -X-(CH2)m-SH or 1-6C hydrocarbon group connected by H, O or N;    X = O, OCO, COO, NH or NHCO; and    m = 1-20.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic illustration of a method for manufacturing a transparent electrically conductive substrate.    Transparent electrically conductive substrate (20)    Substrate layer (22)    Metal wiring (24)    Metal layer (24a)    Self-organizing film (26)    Resin layer (28)