TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: (I) is enriched or deficient in Group 11 atoms. The substrate is a semiconductor, a doped semiconductor, silicon, gallium arsenide, insulators, glass, molybdenum glass, silicon dioxide, titanium dioxide, zinc oxide, silicon nitride, a metal, a metal foil, molybdenum, aluminum, beryllium, cadmium, cerium, chromium, cobalt, copper, gallium, gold, lead, manganese, molybdenum, nickel, palladium, platinum, rhenium, rhodium, silver, stainless steel, steel, iron, strontium, tin, titanium, tungsten, zinc, zirconium, a metal alloy, a metal silicide, a metal carbide, a polymer, a plastic, a conductive polymer, a copolymer, a polymer blend, a polyethylene terephthalate, a polycarbonate, a polyester, a polyester film, Mylar (RTM: Polyester film), a polyvinyl fluoride, polyvinylidene fluoride, a polyethylene, a polyetherimide, a polyethersulfone, a polyetherketone, a polyimide, a polyvinylchloride, an acrylonitrile butadiene styrene polymer, a silicone, an epoxy, paper and/or coated paper. The substrate is a shaped substrate including a tube, a cylinder, a roller, a rod, a pin, a shaft, a plane, a plate, a blade, a vane, a curved surface or a spheroid. The substrate is a layer of a solar cell. Preferred Method: The method further comprises an optional step of selenization or sulfurization, either before, during or after steps (c) or (d). The substrate is heated at 100-550 degrees C (preferably 200-400 degrees C). The deposition is done by spraying, spray coating, spray deposition, spray pyrolysis, printing, screen printing, inkjet printing, aerosol jet printing, ink printing, jet printing, stamp/pad printing, transfer printing, pad printing, flexographic printing, gravure printing, contact printing, reverse printing, thermal printing, lithography, electrophotographic printing, electrodepositing, electroplating, electroless plating, bath deposition, coating, wet coating, spin coating, knife coating, roller coating, rod coating, slot die coating, Meyer bar coating, lip direct coating, capillary coating, liquid deposition, solution deposition, layer-by-layer deposition, spin casting and/or solution casting.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The polymeric precursor compound has a structure of formula ((Ma11-xMa2)u(Mb11-ytMb2yMb3t)v((S1-zSez)R)w).R = alkyl, aryl, heteroaryl, alkenyl, amido, silyl, inorganic or organic ligands;Mb1, Mb2 = different atoms of Group 13;x, y, z, t = 0-1, where the sum of y+t is 0-1;u, v = 0.5-1.5; andw = 2-6. EXAMPLE - No suitable example given.