NOVELTY - A distributor assembly (300) comprises: a first chamber including an interior into which solid material and carrier gas are introduced; a heating element positioned within interior of first chamber; a first flow path proximate to first chamber and providing a material flow indirect to mix vapor and carrier gas; a second flow path proximate to first flow path and providing material flow indirect to maintain the composition; and an outlet proximate to second flow path and positioned to direct the composition toward surface of proximate substrate (400).    USE - As distributor assembly for depositing a film on a substrate (claimed).    ADVANTAGE - The system provides a semiconductor film with improved film thickness uniformity and grain structure uniformity; and provides improved definition of the film deposition area, resulting in higher material utilization. This results in higher efficiency in the production of solar panels.    DETAILED DESCRIPTION - A distributor assembly (300) comprises: a first chamber including an interior into which solid material and carrier gas are introduced; a heating element positioned within interior of first chamber; a first flow path proximate to first chamber and providing a material flow sufficiently indirect to mix vapor and carrier gas into uniform vapor/carrier gas composition; a second flow path proximate to first flow path and providing material flow indirect to maintain the composition; and an outlet proximate to second flow path and positioned in a manner that directs the composition toward a surface of proximate substrate (400). An INDEPENDENT CLAIM is included for a system for depositing a film on a substrate comprising: a material source connected to a distributor assembly such that a solid material and carrier gas supplied by the material source are introduced into the distributor assembly, where the distributor assembly includes: a first chamber including an interior, such that the solid material and carrier gas introduced into the distributor assembly are directed into the interior of the first chamber; a heating element positioned within the interior of the first chamber and providing a temperature high enough that at least a portion of the solid material vaporizes into a vapor; a first flow path proximate to the first chamber and providing a material flow sufficiently indirect to mix the vapor and the carrier gas into a uniform vapor/carrier gas composition; a second flow path proximate to the first flow path and providing a material flow sufficiently indirect to maintain the composition; and an outlet proximate to the second flow path and positioned in a manner that the composition toward a surface of a proximate substrate; and a conveyor for transporting the substrate sufficiently proximate to the distributor assembly such that the vapor may be deposited on the substrate as a film.    DESCRIPTION OF DRAWING(S) - The figure shows a drawing depicting a material supply for introducing a semiconductor powder and a carrier gas into a distributor assembly.    Housing (240)    Distributor assembly (300)    Substrate (400)    Powder (500)    Carrier gas (600)    Hopper (700)    Carrier gas source (800)    Feed tube (900)