NOVELTY - A polyimide-type material is obtained by reacting component (A) comprising at least one type of acyl compound (A-1) chosen from tetracarboxylic dianhydride (I) and tetracarboxylic dianhydride (II) or their reactive derivatives, and at least one type of acyl compound (A-2) chosen from aliphatic and/or alicyclic tetracarboxylic dianhydride or its reactive derivatives, and aromatic imino formation compound (B).    USE - Polyimide-type material is used for manufacturing film used for optical component, printed wiring substrate (all claimed), light emitting diode material, solar cell material, flat display peripheral material, electronic circuit peripheral material, electroconductive transparent film, sealing agent, lens, substrate for rigid printed wiring, substrate for optoelectronic printed wiring, substrate for chip on film, and substrate for tape automated bonding.    ADVANTAGE - The polyimide-type material has excellent flame retardance, heat resistance and transparency.    DETAILED DESCRIPTION - A polyimide-type material is obtained by reacting component (A) comprising at least one type of acyl compound (A-1) chosen from tetracarboxylic dianhydride of formula (I) and tetracarboxylic dianhydride of formula (II) or their reactive derivatives, and at least one type of acyl compound (A-2) chosen from aliphatic and/or alicyclic tetracarboxylic dianhydride or its reactive derivatives, and aromatic imino formation compound (B).    R1,R2=halo, 1-12C hydrocarbyl, 1-12C halogenated hydrocarbyl or group of formula (i);    R3=H or R1 excluding halo;    h,j,l,m,p,q=0-4;    k,n=0 or 1;    h=1-4;    R4,R5=R1 excluding group of formula (i);    R6=R3;and    R7-R8=R1 excluding group of formula (i).    (i) When k is 0, R1 is group of formula (i) and h is 1-4; (ii) When k is 1, R3 is group of formula (i); (iii) When n is 0, l is 1-4 and R4 is group of formula (i); and (iv) When n is 1, R6 is group of formula (i). INDEPENDENT CLAIMS are included for the following:    (1) polyimide-type resin composition containing the polyimide-type resin and a solvent; and    (2) manufacture of film, which involves applying solution containing polyimide-type resin and an organic solvent on a substrate, forming a coating film, and evaporating solvent.