NOVELTY - A method (M1) of repairing a substrate involves: obtaining a substrate and a continuous or discontinuous layer of a low-melt polymer in contact with the substrate, or applying a continuous or discontinuous layer of a low-melt polymer to a substrate; and heating the layer of a low-melt polymer to a first temperature effective to melt the low-melt polymer to spread it into cracks or deformations that may exist or have formed in the substrate, where the low-melt polymer comprises a polyimide comprising polyether or polysiloxane blocks.    USE - For repairing substrate, for making wire insulation repair wrap, forming polyimide film, poly(amic acid) (PAA) film and molded article, and forming a polymer coating on metal (claimed); and in repair of electrical wire insulation, flat or ribbon wire harnesses, and flat surfaces, for inflatables or solar panels applications.    ADVANTAGE - The low-melt polymer is viscous liquid at room temperature, and has the ability to flow and fill any new breaks or cracks that might develop over the lifetime of the repaired area.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) a wire insulation repair wrap comprising a poly(amic acid) (PAA) or a polyimide having reactive end groups, or a polyimide comprising polyether blocks or polysiloxane blocks, where the wrap is adapted to patch or surround an electrical wire having a layer of polyimide insulation, to repair damage to the insulation layer;    (2) an article of manufacture comprising a metal layer coated with a coating comprising a polyimide; where the coating is formed by a process involving: coating the metal with a low-melt polymer comprising reactive end caps, where the low-melt polymer is a polyimide or poly(amic acid) (PAA); and heating the low-melt polymer on the metal to initiate cross-linking on the metal to form a high-melt polyimide coating;    (3) forming a polymer coating on a metal involving: coating the metal with a low-melt polymer comprising olefinic organic acid end caps, where the low-melt polymer is a polyimide or poly(amic acid) (PAA); and heating the low-melt polymer on the metal to initiate cross-linking on the metal to form a high-melt polyimide coating;    (4) forming a polyimide film or poly(amic acid) (PAA) film involving: obtaining a solution of a polyimide or a PAA in an organic solvent; casting the solution on a non-stick surface selected from a polysiloxane and a perfluorinated alkane; and evaporating at least a portion of the organic solvent from the solution on the surface to form a polyimide film or a PAA film;    (5) a low-melt polymer comprising olefinic organic acid end caps, having an average molecular weight of less than 20000, and having a melting temperature less than 300 degrees C, where the low-melt polymer is a polyimide or poly(amic acid) (PAA);    (6) forming a molded article involving: obtaining a polymide having a melting temperature of less than 300 degrees C; melting the polyimide; forming the melted polyimide into a desired shape by injection molding, extrusion molding, rotomolding, blow molding, or vacuum forming; curing the polyimide in the desired shape into a higher melting temperature polyimide by heating the polyimide further past the curing temperature and allowing the polyimide to cure for an effective time at a temperature above the curing temperature; and cooling the cured polyimide in the desired shape;    (7) a method (M2) of forming a polyimide involving: reacting a dianhydride and a diamine in a polymerization reaction mixture to form a poly(amic acid) (PAA); and heating the PAA to form a polyimide, where the dianhydride is a dianhydride of formula (I), and the diamine is a diamine of formula H2N-(2-6C)alkyl-(O-(2-6C)alkyl-)nO-(2-6C)alkyl-NH2 (II) or H2N-(2-6C)alkyl-O-Si(CH3)2-(O-Si(CH3)2-)nO-Si(CH3)2-O-(2-6C)alkyl-NH2 (III), where at least 50 wt.% of reactants in the polymerization reaction mixture are the compound (I), (II) and (III);    (8) a polyimide formed by the method (M2); and    (9) forming a poly(amic acid) (PAA) involving: reacting a dianhydride and a diamine in a polymerization reaction mixture to form a PAA, where at least 50 wt.% of reactants in the polymerization reaction mixture are the dianhydride and/or diamine.    R1=H or (1-4C)alkyl;    R2=H, 1-4C alkyl or CF3.