NOVELTY - A molded article and a transfer component (62) having transfer shape are mutually contacted, and article is deformed along transferred shape. The deformed portion of article is hardened, and molded article and transfer component are mutually spaced apart. The transfer of shape is repeated for several times, and shaping method is enabled. The molded article contains a curable composition comprising silica particles (a) surface-treated with silane compound, (meth)acrylate compounds and polymerization initiator (d).    USE - Shaping method is used for producing lens for lens array (both claimed). Uses include but are not limited to camera, sensor, optical disk substrate, substrate for color filter, solar cell substrate, touch panel, optical waveguide, plastic substrate for liquid crystal display and light emitting diode sealing material.    ADVANTAGE - The shaping method enables formation of shaped article having excellent transparency, heat resistance, environmental resistance and small Abbe's number.    DETAILED DESCRIPTION - A molded article and a transfer component having transfer shape are mutually contacted, and article is deformed along transferred shape. The deformed portion of article is hardened, and molded article and transfer component are mutually spaced apart. The transfer of shape is repeated for several times, and shaping method is enabled. The molded article contains a curable composition comprising silica particles (a), (meth)acrylate compound (b) having 2 or more ethylenically unsaturated groups and does not having ring structure, (meth)acrylate compound (c) having 2 or more ethylenically unsaturated groups and having aromatic ring structure, and polymerization initiator (d). The silica particles are surface-treated with a silane compound (e) of formula (I), and a silane compound (f) of formula (II).    R1=H or methyl;    R2,R4=1-3C alkyl or phenyl;    R3,R5=H or 1-10C hydrocarbyl;    a=1-6;    b,d=0-2;and    c=0-6.    DESCRIPTION OF DRAWING(S) - The drawing shows the cross-sectional view of transfer component and wafer.    Light irradiation apparatus (60)    Transfer component (62)    Convex portion (90)    Wafer (w)    Substrate (w1)