TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The composition further comprises: an adhesion promoting agent (0.05-2 wt.%), which is an unsaturated alkoxy silane including bis-trialkoxy silanes, amino-alkoxy silanes, phenyl alkoxy silanes, methoxy alkyl silanes and/or ethoxy alkyl silanes; and a coupling coagent (up to 30 wt.%) that comprises a diacrylate. Preferred Components: The curing agent is present at 0.1-3 wt.% of the total composition, where the curing agent is a radical producing curing agent which is peroxide or azide. The inorganic compound is present at 1-25 wt.% of the total composition.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The hindered-amine light stabilizer is: Tinuvin 770 (RTM: Bis(2,2,6,6-tetramethyl-4-piperidinyl)sebacate); Chimassorb 944 (RTM: Poly((6-((1,1,3,3-tetramethylbutyl)amino)-s-triazine-2,4-diyl)-((2,2,6,6-tetramethyl-4-piperidyl)imino)-hexamethylene-((2,2,6,6-tetramethyl-4-piperidyl)imino); Tinuvin 123 (RTM: Decanedioic acid, bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl)ester); and/or Chimassorb 119 (RTM: 1,3,5-Triazine-2,4,6-triamine,N,N'''-(1,2-ethanediylbis(((4,6-bis(butyl(1,2,2,6,6-pentamethyl-4-piperidinyl)amino)-1,3,5-triazine-2-yl)imino)-3,1-propanediyl))-bis(N',N''-dibutyl-N',N''-bis(1,2,2,6,6-pentamethyl-4-piperidinyl)-).    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The ethylene-propylene high molecular weight polymeric material is present at 60-80 (preferably 65) wt.% of the total composition, which is a randomly polymerized mixture of individual units of ethylene and propylene, preferably terpolymerized with at least one diene molecule to form an ethylene-propylene-diene molecule. The diene molecule comprises ethylidene norbornene, dicyclopentadiene, butadiene and/or 1,4-hexadiene. EXAMPLE - Typical composition comprised (in%) of: EP 33 (RTM: High temperature resistant adhesive/sealant) (63.4); Hisile (RTM: Silica) (8.65); Aztech Tmch 40 (RTM: 1,1-Bis(tert-butyl peroxy)-3,3,5-trimethyl cyclohexane) (0.58); Tinuvin 770 (RTM: Bis(2,2,6,6-tetramethyl-4-piperidinyl)sebacate) (0.58); Chimassorb 944(RTM: Poly((6-((1,1,3,3-tetramethylbutyl)amino)-s-triazine-2,4-diyl)-((2,2,6,6-tetramethyl-4-piperidyl)imino)-hexamethylene-((2,2,6,6-tetramethyl-4-piperidyl)imino) (0.58); Silane 172 (RTM: Vinyl tri(2-methoxy-ethoxy)silane) (0.29); titanium dioxide (2.88); zinc diacrylate (17.29); and Indopol H100 (RTM: Low molecular weight butene) (5.76).