TECHNOLOGY FOCUS - CERAMICS AND GLASS - Preferred Components: The substrate is selected from glass and molybdenum glass.    TECHNOLOGY FOCUS - ELECTRONICS - Preferred Components: The substrate is selected from a semiconductor, a doped semiconductor and insulators.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The substrate is selected from silicon, gallium arsenide, silicon dioxide, titanium dioxide, zinc oxide, silicon nitride, molybdenum, aluminum, beryllium, cadmium, cerium, chromium, cobalt, copper, gallium, gold, lead, manganese, molybdenum, nickel, palladium, platinum, rhenium, rhodium, silver, stainless steel, steel, iron, strontium, tin, titanium, tungsten, zinc, zirconium, metal silicide, a metal carbide and silicone.    TECHNOLOGY FOCUS - METALLURGY - Preferred Components: The substrate is selected from metal alloy, metal or metal foil.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The molecular precursor compound has the formula M1a-(E1R1)(E1R2)(E1R3)M1bR4. The substrate is an epoxy.M1a=monovalent metal atom;M1b=atom of Group 13;E1=sulfur, selenium or tellurium;andR1-R4=alkyl, (hetero)aryl, alkenyl, amido, silyl, or inorganic or organic ligands.Preferred Method: In the method (M1), the depositing is done by spraying, spray coating, spray deposition, spray pyrolysis, printing, screen printing, inkjet printing, aerosol jet printing, ink printing, jet printing, stamp printing, transfer printing, pad printing, flexographic printing, gravure printing, contact printing, reverse printing, thermal printing, lithography, electrophotographic printing, electrodepositing, electroplating, electroless plating, bath deposition, coating, dip coating, wet coating, spin coating, knife coating, roller coating, rod coating, slot die coating, meyerbar coating, lip direct coating, capillary coating, liquid deposition, solution deposition, layer-by-layer deposition, spin casting, solution casting, chemical vapor deposition, aerosol chemical vapor deposition, metal-organic chemical vapor deposition, organometallic chemical vapor deposition and/or plasma enhanced chemical vapor deposition. In the method (M1), the step (iii) is repeated. The method further involves A1) iv) heating the substrate at 100-400 degrees C to convert the compound or its inks to a material, v) depositing the compound or inks onto the substrate, vi) repeating steps (iv) and (v), and vii) annealing the material by heating the substrate at 300-650 degrees C; or A2) carrying out steps (iv) and (vii), followed by repeating steps (iii), (iv) and (vii). The method further involves an optional step of selenization or sulfurization, either before, during or after any step of heating or annealing.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The substrate is selected from polymer, plastic, conductive polymer, copolymer, polymer blend, polyethylene terephthalate, polycarbonate, polyester, polyester film, mylar, polyvinyl fluoride, polyvinylidene fluoride, polyethylene, polyetherimide, polyethersulfone, polyetherketone, polyimide, polyvinylchloride and acrylonitrile butadiene styrene polymer. The substrate is a shaped substrate including a tube, a cylinder, a roller, a rod, a pin, a shaft, a plane, a plate, a blade, a vane, a curved surface or a spheroid.    TECHNOLOGY FOCUS - TEXTILES AND PAPER - Preferred Components: The substrate is selected from paper and coated paper.