NOVELTY - Deposition method involves (a) applying a composition comprising a deposition inhibitor material to a substrate, (b) simultaneously or subsequently to step (a), patterning the deposition inhibitor material to provide selected areas on the substrate where the deposition inhibitor material is absent, and (c) depositing an inorganic thin film on the substrate by chemical vapor deposition only in those areas.    USE - For forming patterned thin film in an electronic device selected from an integrated circuit, active-matrix display, solar cell, active-matrix imager, sensor, or an rf label (claimed).    ADVANTAGE - The method is adaptable for deposition on a web or other moving substrate, including deposition onto a large area substrate; allows operation under atmospheric pressure conditions, for e.g. in low temperature processes at atmospheric pressures in an unsealed environment or open to ambient atmosphere; provides for the deposition of a deposition inhibitor material that can be applied in an aqueous medium instead of a strictly organic solvent medium, thus, this aqueous medium or solution comprises at least 50 wt.% water; enables production of relatively inexpensive circuits containing thin film transistors with significantly improved performance; and allows one to make thin films employing a system for delivery of gaseous materials to a substrate surface that can be adaptable to deposition on larger and web-based substrates and capable of achieving a highly uniform thin film deposition at improved throughput speeds.    DETAILED DESCRIPTION - Deposition method involves (a) applying a composition comprising a deposition inhibitor material to a substrate, (b) simultaneously or subsequently to step (a), patterning the deposition inhibitor material to provide selected areas on the substrate where the deposition inhibitor material is absent, and (c) depositing an inorganic thin film on the substrate by chemical vapor deposition only in those areas where the deposition inhibitor material is absent, where the deposition inhibitor material is a hydrophilic polymer that is a neutralized acid having a pKa of less than or equal to 5, where at least 90% of the acid groups are neutralized. An INDEPENDENT CLAIM is included for an electronic device having a substrate and having on it a deposited pattern of a composition comprising a deposition inhibitor material, and a deposited inorganic thin film disposed only in selected areas of the substrate where the composition comprising a deposition inhibitor material is absent, where the deposition inhibitor material is a hydrophilic polymer that is a neutralized acid having a pKa of less than or equal to 5, where at least 90% of the acid groups are neutralized.