NOVELTY - The system comprises a component configured to apply etchant to a sacrificial layer between an epitaxial lift off component and a growth substrate (102), a separation assistance component configured to manipulate the epitaxial lift off component (110) to assist separation of the epitaxial lift off component from a substrate, a tape (119) application component configured to couple the epitaxial lift off component to the tape, a wafer receiving stage, and an etching stage, where the lift off component is manipulated to assist etchant exposure to an etch face of the sacrificial etch layer.    USE - The epitaxial lift off system is useful for manufacturing devices such as photovoltaic devices, solar conversion devices, solar cell devices, opto-electric devices, optical devices, photonic devices, mechanical devices, semiconductor devices, electronic thin film devices and other thin film devices.    ADVANTAGE - The epitaxial lift off system is capable of easily and economically manufacturing the devices with increased productivity and without potential detrimental impacts such as cracking and breaking, and removes the sacrificial layer from the substrates without damaging the epitaxial lift off film or devices thus reducing the cost, etchant consumption and volume during epitaxial lift off process.    DETAILED DESCRIPTION - The system comprises a component configured to apply etchant to a sacrificial layer between an epitaxial lift off component and a growth substrate (102), a separation assistance component configured to manipulate the epitaxial lift off component (110) to assist separation of the epitaxial lift off component from a substrate, a tape (119) application component configured to couple the epitaxial lift off component to the tape, a wafer receiving stage, an etching stage, where the lift off component is manipulated to assist etchant exposure to an etch face of the sacrificial etch layer and aid separation of the epitaxial lift off component from the substrate, a clean and rinse stage, where the epitaxial lift off component and the tape are cleaned and rinsed, a tape receiving stage configured to receive the tape and to prepare for participating in further portions of the epitaxial lift off system. The manipulation of the epitaxial lift off component is controlled to facilitate exposure of an etchant to an etch face of the sacrificial etch layer, and includes applying a force to increase a gap distance between portions of the epitaxial lift off component and the growth substrate before final separation, and applying a force to assist mitigation of adverse impacts associated with final separation of the epitaxial lift off component from the growth substrate. The tape assists the manipulation and transportation of the epitaxial lift off component while etchant is applied to the sacrificial layer, and pulls on the epitaxial lift off component. The force is applied to the tape. The wafer includes a substrate, a sacrificial etch layer and an epitaxial lift off component. The separation assistance component comprises a drive link ramp comprising an elongated slot and having a height that increases from a first end to a second end through the etching section, a chain drive comprising a drive pins, a point loads that contact the center of the tape as the tape is driven along and up the increasing height of the drive link ramps, a guide rail including a slot that receiving one side of the tape and a index pin receiving holes, a pin rail including a index pins, a weight bar that providing force on a center of the tape and the growth substrate, a roller drive shafts, a driven miter gears, and a gear driveshaft including a driving miter gears. The drive pins extends through the slots in the tape and into the elongated slots. The chain drive drives the tape along the drive link ramp causing the sides of the tape to be driven along and up the increasing height of the drive link ramps. The pin rails are operable to be lowered with respect to the guide rails such that the index pin extends into the index pin receiving holes and through the slots along the sides of the tape. The pin rails and the guide rails are operable to raise the sides of the tape. The etchant application component includes a substrate pocket configured to support the substrate and hold the etchant, and an etchant supply component configured to deliver etchant to the substrate and the substrate pocket. Each roller drive shaft supports a roller of the series of rollers. Each miter gear is mounted on the end of one of the roller drive shafts. Each driving miter gear engages one of the driven miter gears such that the series of rollers rotate to support the tape and a substrate assembly as it proceeds through an etching section when the gear driveshaft is driven. An etchant supply comprises etching spray nozzles that direct an etchant spray toward the tape and substrate assembly in the etching section continuously or periodically. An INDEPENDENT CLAIM is included for an epitaxial lift off method.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic block diagram of a lift off separation system.    Growth substrate (102)    Device structure (106)    Epitaxial lift off component (110)    Support structure (115)    Tape. (119)