NOVELTY - Multilayer film comprises a first layer comprising an aqueous or solvent castable fluoropolymer and a particulate filler material; a second layer having top and bottom sides, selected from polyimide, polycarbonate, or aluminum; and a third layer comprising an aqueous or solvent castable fluoropolymer and a particulate filler material, where first layer is disposed on the top side and the third layer is disposed on the bottom side of the second layer.    USE - The multilayer film is used as backsheet to optoelectronic component in an optoelectronic device (claimed). It is used as fluoropolymer/particulate filled protective sheet or packaging materials for electronic devices. The multilayer film is used to protect the components from heat, humidity, weather, chemical, radiation, physical damage, and general wear and tear; to electrically insulate the active components/circuits of the electronic devices; and for providing protective cushioning to electronic devices. Uses include but are not limited to organic LEDs, LEDs, LCD, printed circuit boards, flexible displays, printed wiring boards, copper indium gallium selenide photovoltaic modules, dye solar cell, crystalline-silicon based photovoltaic modules, and organic photovoltaics modules.    ADVANTAGE - The multilayer film has dielectric break down strength of greater than 3 kV measured by ASTM D3755 method; solar reflectance of greater than 70% measured by ASTM E424 method; and water vapor transmission rate of less than 20 g/m2/day measured by ASTM F1249 method. It provides anti-soiling properties, chemical resistance, UV resistance, reflectivity, increased flame retardancy, aesthetics, and/or opacity.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for:    (1) optoelectronic device; and    (2) preparation of multilayer film comprising coating a casting composition onto a polyimide, polycarbonate, or aluminum support, where casting composition comprises a carrier, an aqueous or solvent castable fluoropolymer, and a particulate filler material.