TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: (I) is a CAIGS, CAIS or CAGS material. (I) has a thickness of 0.001-100 (preferably 0.1-10) mu m. (I) is enriched or deficient in a group 11 atom. The substrate is a semiconductor, a doped semiconductor, silicon, gallium arsenide, insulators, glass, molybdenum glass, silicon dioxide, titanium dioxide, zinc oxide, silicon nitride, a metal, a metal foil, molybdenum, aluminum, beryllium, cadmium, cerium, chromium, cobalt, copper, gallium, gold, lead, manganese, molybdenum, nickel, palladium, platinum, rhenium, rhodium, silver, stainless steel, steel, iron, strontium, tin, titanium, tungsten, zinc, zirconium, a metal alloy, a metal silicide, a metal carbide, a polymer, a plastic, a conductive polymer, a copolymer, a polymer blend, a polyethylene terephthalate, a polycarbonate, a polyester, a polyester film, Mylar (RTM: Polyester film), a polyvinyl fluoride, polyvinylidene fluoride, a polyethylene, a polyetherimide, a polyethersulfone, a polyetherketone, a polyimide, a polyvinylchloride, an acrylonitrile butadiene styrene polymer, a silicone, an epoxy, paper and/or coated paper. The substrate is a shaped substrate including a tube, a cylinder, a roller, a rod, a pin, a shaft, a plane, a plate, a blade, a vane, a curved surface or a spheroid. The substrate is a layer of a solar cell.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Method: The method further comprises an optional step of selenization or sulfurization, either before, during or after steps (c) or (d). The substrate is heated at 100-550 degrees C (preferably 200-400 degrees C). The deposition is done by spraying, spray coating, spray deposition, spray pyrolysis, printing, screen printing, inkjet printing, aerosol jet printing, ink printing, jet printing, stamp/pad printing, transfer printing, pad printing, flexographic printing, gravure printing, contact printing, reverse printing, thermal printing, lithography, electrophotographic printing, electrodepositing, electroplating, electroless plating, bath deposition, coating, wet coating, spin coating, knife coating, roller coating, rod coating, slot die coating, Meyer bar coating, lip direct coating, capillary coating, liquid deposition, solution deposition, layer-by-layer deposition, spin casting and/or solution casting.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The polymeric precursor compound has an empirical formula (((Cu1-xAgx)u(M11-yM2y)v)((S1-zSez)R)w).R = alkyl, aryl, heteroaryl, alkenyl, amido, silyl, inorganic or organic ligands;M1, M2 = different atoms of group 13;x, y, z = 0-1;u, v = 0.5-1.5; andw = 2-6. EXAMPLE - An ink composition was prepared in a glovebox in an inert atmosphere by dissolving a polymeric precursor compound of formula (copper(0.5)silver(0.5)(selenium(sec)butyl)(4)gallium(0.5)indium(0.5)) (12 wt./wt.%) in tetrahydrofuran, and adding sodium (0.1 wt/wt.%). The ink was slot die coated onto a molybdenum-coated glass substrate in an inert atmosphere. The substrate was removed and heated at 300 degrees C in an inert atmosphere to produce corresponding thin film material with a film thickness is 1.5 micron.