TECHNOLOGY FOCUS - ELECTRONICS - Preferred Device: The semiconductor device comprises an electrode, where the electrode, prior to firing, comprises the silver thick film paste composition. The semiconductor device comprises a semiconductor substrate, an insulating film, and a front side electrode, where the front side electrode comprises at least one component selected from zinc silicates and bismuth silicates.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The composition comprises (wt.%) silver powder (60-90, preferably 78-83), glass frit (0.1-8, preferably 2-5) and organic medium (5-30, preferably 6-17 or 13-20). The silver thick film paste composition further comprises: a metal oxide, a metal or metal compound that forms the metal oxide upon firing, or their mixtures, where the metal is selected from zinc (Zn), lead (Pb), bismuth (Bi), gadolinium (Gd), cerium (Ce), zirconium (Zr), titanium (Ti), manganese (Mn), tin (Sn), ruthenium (Ru), cobalt (Co), iron (Fe), copper (Cu) and/or, chromium (Cr) dispersed in the organic medium. The composition comprises zinc oxide (ZnO) (2-10, preferably 3-7 wt.%). Preferred Components: The metal oxide upon firing is ZnO. EXAMPLE - A silver powder comprised of silver particles, each particle comprising silver components of 100-2000 nm long, 20-100 nm wide and 20-100 nm thick assembled to form a spherically-shaped, open-structured particle was prepared. The particle sizes d10, d50, and d90 were 2.9 mu m, 5.5 mu m and 9.6 mu m, respectively. A glass frit composition comprising (wt.%) silica (SiO2) (22.0779), alumina (Al2O3) (0.3840), lead oxide (PbO) (46.6796), boron oxide (B2O3) (7.4874), bismuth oxide (Bi2O3) (6.7922), titanium oxide (TiO2) (5.8569) and lead fluoride (PbF2) (10.7220) was prepared. An organic medium comprising mixture of medium 1 (1 part by weight) and medium 2 (2.6 parts by weight) was prepared. Medium 1 was EC T200 grade resin ethyl cellulose (11 wt.%) dissolved in Texanol (RTM: ester alcohol (89 wt.%), 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate. Medium 2 was EC N22 grade resin ethyl cellulose (8 wt.%) dissolved in Texanol (92 wt.%) and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate. Silver powder (81 g), glass frit (2 g) and ZnO (51 wt.%) was dispersed in the organic medium (9.8 g) in a mixing can. This resulted in a silver thick film paste composition with silver powder (83 wt.%), glass frit (2 wt.%), ZnO (5 wt.%) and organic medium (10 wt.%). The mixing continued for 15 minutes. Since the silver powder was the major part of the solids, it was added incrementally to ensure better wetting. When well mixed, the paste was passed 4 times through a 3-roll mill at progressively increasing pressures from 0-300 psi. The gap of the rolls was set to 1 mil. The degree of dispersion was measured by fineness of grind (FOG) following the method of ASTM D1316-06. The FOG value was less than 7 mu m for the fourth longest, continuous scratch and less than 3 um for the point at which 50% of the paste was scratched. The resulting composition was a silver thick film paste composition.