NOVELTY - Solar panel module comprises a transparent carrier, silicon semiconductor substrate portions, having a front surface and a rear surface, where the front surface is arranged in use for capturing radiation energy.    USE - Used as a solar panel module.    ADVANTAGE - The layout of the solar panel module provides significant cost advantage by minimizing the amount of metals used for interconnection, and performance advantage by minimizing the ohmic and shadow losses that go together with metallization. It produces solar panels without the use of silver for metallization and without screenprinting. It also produces crystalline silicon solar panel modules with high throughput on large areas (panel area versus wafer area). It also allows the use of thin crystalline silicon wafers because of limited handling and thermal budget limited high temperature processing, minimizing stress. The use of back-contact heterojunctions for high efficiencies and excellent surface passivation is a further enabler of using thin wafers and low temperature manufacturing processes.    DETAILED DESCRIPTION - Solar panel module comprises a transparent carrier, silicon semiconductor substrate portions, having a front surface and a rear surface, where the front surface is arranged in use for capturing radiation energy. The semiconductor substrate portions are arranged adjacent to each other on the transparent carrier and separated from each other by a groove, each semiconductor substrate portion is attached with the front surface to the transparent carrier, each groove comprising a side wall of each of the semiconductor substrate portions adjacent to each other. The semiconductor substrate portions are of a bulk conductivity type; the front surface of each semiconductor substrate portion is provided with a doped layer of a first conductivity type; each semiconductor substrate portion comprising a first electric contact for minority charge carriers in the semiconductor substrate portion and a second electric contact for majority charge carriers in the semiconductor substrate portion; the first electric contact being arranged on at least the rear surface of the semiconductor substrate portion, where the first electric contact is a heterostructure of a first type, the heterojunction of the first type comprising an intrinsic semiconductor layer on the semiconductor substrate portion and a semiconductor layer of a second conductivity type on top of the intrinsic semiconductor layer, the second conductivity type being opposite to the first conductivity type. An INDEPENDENT CLAIM is included for a method for manufacturing a solar panel module.    DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the solar panel module.    Transparent carrier (1)    Encapsulant layer (2)    Semiconductor substrate portions (3a,3b,3c)    Front surface layer (4)    Intrinsic semiconductor material layer (5)    Second electric contact (6)    Doped semiconductor material layer (7)    Conductive layer (8)    Interrupting element (9)