NOVELTY - Lead frame used for internal wiring of a package of a device and for connecting the device to external wiring includes electronic component regions adjoining each other within an outer frame (2). Each of the electronic component regions includes a bent part (11) that is provided between first and second connection terminals, and connects the first and second connection terminals, where bent part is bending-processed in a direction perpendicular to a face of a die pad (3).    USE - The lead frame is used for internal wiring of a package of a device and for connecting the device to external wiring. It is used for an electronic component (claimed) e.g. 2-pin or 3-pin batteries, diodes, functional or passive components, microelectromechanical system having 4-200 pins, and semiconductor devices. Package includes land grid array, ball grid array, small outline non-leaded package, quad flat non-leaded package, and transistor outline package. Uses include but are not limited to cellular phones, cellular terminals, DVD apparatuses, and digital TVs.    ADVANTAGE - It is possible to readily adjust the height of the second outer terminal that serves as an external terminal by including and bending-processing the bent part, allowing realization of the lead frame including upper and lower external terminals using a single piece of lead frame, without using a wiring board. With such flexibility in designing the position and the area size of the external terminal, it is possible to ensure the diversity of designs. Since no separation frame is provided at the boundary of the electronic component regions, it is possible to reduce the stress onto the dicing blade resulting from the cutting of the lead frame with respect to each electronic component region, making the life of the dicing blade longer. Since no separation frame is provided at the boundary of the electronic component regions, it is possible to reduce the number of cut surfaces in the metal cut off by the dicing blade as compared to the conventional lead frame including a separation frame, preventing contact failure caused by metal burrs in the cut surfaces of such adjoining electronic component regions, thus, making it possible to realize a lead frame that allow easy manufacturing and cost reduction while preventing decreases in reliability. The lower surfaces of the first connection terminal and the outer frame are held and secured onto securing tape (13), ensuring not only stable transportation but also stable assembly of the electronic component. Mounting area on mounting board, onto which electronic components are mounted, is reduced. With passive and positive chips being separately exposed on the upper and lower surfaces for electric connections, it is possible to facilitate the complicated wiring within the electronic component, producing an effect of stabilizing the yield of the equipment.    DETAILED DESCRIPTION - Lead frame used for internal wiring of a package of a device and for connecting the device to external wiring comprises an outer frame (2); and electronic component regions adjoining each other within the outer frame. Each of the electronic component regions includes a die pad (3) on which the device is mounted; a first connection terminal, a lower surface of which serves as an external terminal (53), where first connection terminal is provided around the die pad and electrically independent of the die pad; a second connection terminal, an upper surface of which serves as an external terminal, where second connection terminal is provided around the die pad and electrically independent of the die pad; and a bent part (11) that is provided between the first and second connection terminals, and connects the first and second connection terminals, where bent part is bending-processed in a direction perpendicular to a face of the die pad. The electronic component regions adjoining each other are connected through the first or second connection terminal. A separation frame is not formed in the lead frame. It surrounds and secures the electronic component regions by connecting. INDEPENDENT CLAIMS are included for:    (A) electronic component comprising lead frame; and a device mounted on the die pad in the lead frame and including an electrode, which is electrically connected to an upper surface of the first connection terminal by metal wiring, where lead frame and device are sealed with resin to be encapsulated, and the lower surface of the first connection terminal is exposed on the resin; and    (B) manufacture of lead frame.    DESCRIPTION OF DRAWING(S) - The drawing is a schematic diagram showing an unfinished lead frame.    Outer frame (2)    Die pad (3)    Bent part (11)    Securing tape (13)    External terminal (53)