TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The silane compound is tetra alkoxy silane type compound (i) chosen from tetra methoxy silane, tetra ethoxy silane, tetra-n-propoxy silane, tetra-i-propoxy silane or tetra-n-butoxy silane, trialkoxy silane type compound (ii) chosen from methyl trimethoxy silane, methyl triethoxy silane, ethyl trimethoxy silane, ethyl triethoxy silane, N-propyl trimethoxy silane, N-propyl triethoxy silane, i-propyl trimethoxy silane, i-propyl triethoxy silane, N-butyl trimethoxy silane, N-butyl triethoxy silane, N-pentyl trimethoxy silane, N-hexyl trimethoxy silane, N-heptyl trimethoxy silane, N-octyl trimethoxy silane, vinyl trimethoxy silane, vinyl ethoxy silane, cyclohexyl trimethoxy silane, cyclohexyl triethoxy silane, phenyl trimethoxy silane, phenyl triethoxy silane, 3-chloropropyl trimethoxy silane, 3-chloropropyl ethoxy silane, 3,3,3-trifluoro propyl trimethoxy silane, 3,3,3-trifluoro propyl triethoxy silane, 3-amino propyl trimethoxy silane, 3-amino propyl triethoxy silane, 2-hydroxy ethyl trimethoxy silane, 2-hydroxy ethyl triethoxy silane, 2-hydroxy propyl trimethoxy silane, 2-hydroxy propyl triethoxy silane, 3-hydroxy propyl trimethoxy silane, 3-hydroxy propyl triethoxy silane, 3-mercapto propyl trimethoxy silane, 3-mercapto propyl triethoxy silane, 3-isocyanate propyl trimethoxy silane, 3-isocyanate propyl triethoxy silane, 3,3-glycidoxy propyl trimethoxysilane, 3-glycidoxy propyl triethoxy silane, 2-(3,4-epoxy cyclohexyl)ethyl trimethoxy silane, 2-(3,4-epoxy cyclohexyl)ethyl triethoxy silane, 3-(meth)acryloxy propyl trimethoxy silane, 3- acryloxy propyl triethoxy silane, 3-ureido propyl trimethoxy silane and/or 3-ureido propyl triethoxy silane, or dialkoxysilane type compound (iii) chosen from dimethyl dimethoxy silane, dimethyl diethoxy silane, diethyl dimethoxy silane, diethyl diethoxy silane, di-n-propyl dimethoxy silane, di-n-propyl diethoxy silane, di-i-propyl dimethoxy silane, di-i-propyl diethoxy silane, di-n-butyl dimethoxy silane, di-n-butyl diethoxy silane, di-n-pentyl dimethoxy silane, di-n-pentyl diethoxy silane, di-n-hexyl dimethoxy silane, di-n-hexyl-diethoxy silane, di-n-heptyl dimethoxy silane, di-n-heptyl diethoxy silane, di-n-octyl dimethoxysilane, di-n-octyl diethoxy silane, di-n-cyclohexyl dimethoxy silane, di-n-cyclohexyl diethoxy silane, diphenyl dimethoxy silane and/or diphenyl diethoxy silane.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The dispersion solvent is chosen from N,N-dimethyl formamide, acetone, methyl ethyl ketone, methyl alcohol, ethyl alcohol, isopropyl alcohol, butyl alcohol, ethylene glycol, polyethylene glycol, tetrahydrofuran, dimethyl formamide, dimethyl acetamide, N-methyl pyrrolidone, hexane, cyclohexanone, toluene, chloroform, distilled water, o-dichlorobenzene, dimethyl benzene, trimethyl benzene, pyridine, methyl naphthalene, nitromethane, acrylonitrile, octadecyl amine, aniline, dimethyl sulfoxide, methylene chloride, diethylene glycol methyl ethyl ether, ethyl acetate, co-solvent, N-methyl pyrrolidone, ammonium hydroxide, hydrochloric acid aqueous solution and alpha -terpinol. The co-solvent comprises chloroform, methyl ethyl ketone, formic acid, nitroethane, 2-ethoxy ethanol, 2-methoxy ethanol, 2-butoxy ethanol, 2-methoxy propanol, ethylene glycol, acetone, methyl alcohol, ethyl alcohol, isopropyl alcohol, butyl alcohol, ethylene glycol, polyethylene glycol, tetrahydrofuran, dimethyl formamide, dimethyl acetamide, N-methyl pyrrolidone, hexane, cyclohexanone, toluene, chloroform, distilled water, o-dichlorobenzene, dimethyl benzene, trimethyl benzene, pyridine, methyl naphthalene, nitromethane, acrylonitrile, octadecyl amine, aniline, dimethyl sulfoxide or methylene chloride.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The polymer binder is thermosetting resin, photo-cross-linking resin, silane compound, thermoplastic resin or conductive polymer. The thermosetting resin is urethane, epoxy, melamine, polyimide and/or polyvinyl alcohol. The photo-cross-linking resin (A) is epoxy, polyethylene oxide resin and/or urethane resin, and has epoxy acrylate, polyester acrylate, urethane acrylate, polyether acrylate, thiolate, organosilicon polymer and/or organosilicon copolymer as reactive oligomer. Resin (A) has 2-ethyl hexyl acrylate, isodecyl acrylate, 2-phenoxy ethyl acrylate, phenyl ethoxy monoacrylate, ethoxy ethyl acrylate, hydroxy ethyl acrylate, hydroxyl ethyl methacrylate, hydroxyl propyl acrylate, hydroxyl propyl methacrylate, hydroxyl butyl acrylate and/or hydroxyl butyl methacrylate as monofunctional monomer, 1,3-butanediol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, diethylene glycol diacrylate, triethylene glycol dimethacrylate, neopentyl glycol diacrylate, ethylene glycol dimethacrylate, tetraethylene glycol methacrylate, polyethylene glycol dimethacrylate, tripropylene glycol diacrylate and/or 1,6-hexanediol diacrylate as difunctional monomer, and trimethylol propane triacrylate, trimethylol propane trimethacrylate, pentaerythritol triacrylate, glycidyl pentatriacrylate and/or glycidyl pentatriacrylate as trifunctional monomer. Photoinitator(s) chosen from benzophenone type photoinitiator, benzyl dimethyl ketal, acetophenone, anthraquinone type photoinitiator and thioxoxanthone is added to resin (A). The thermoplastic resin is polystyrene, polystyrene derivative, polystyrene-co-butadiene copolymer, polycarbonate, polyvinyl chloride, polysulfone, polyether sulfone, polyether imide, polyacrylate, polyester, polyimide, polyamic acid, cellulose acetate, polyamide, polyolefin, polymethyl methacrylate, polyether ketone and/or polyoxyethylene. The conductive polymer is polythiophene-based homopolymer, polythiophene-based copolymer, polyacetylene, polyaniline, polypyrrole, poly(3,4-ethylene dioxythiophene) and/or pentacene type compound. The surfactant is Triton X-100 (RTM: nonionic surfactant having hydrophilic polyethylene oxide group), polyethylene oxide, polyethylene oxide-polypropylene oxide copolymer, polyvinyl pyrrole, polyvinyl alcohol, Ganex (RTM: alkylated polyvinyl pyrrolidone), starch, monosaccharide, polysaccharide, sodium dodecyl benzene sulfonate, dodecyl sulfonic acid (SDS), 4-cetyl trimethyl ammonium vinyl benzoate, pyrene derivative, gum arabic (GA) and/or Nafion (RTM: sulfonated tetrafluoroethylene based fluoropolymer copolymer), preferably lithium dodecyl sulfate (LDS), cetyl trimethyl ammonium chloride (CTAC), dodecyl trimethyl ammonium bromide (DTAB), pentaoxo-ethylene ether, cyclodextrin, polyethylene oxide, ethylene cellulose, gum arabic, BYK110 (RTM: 60 wt.% block copolymer of 1-methoxy-2-propyl acetate dissolved in solvent) and/or BYK410 (RTM: leveling agent).