NOVELTY - The method involves transferring a portion of flux material from contact pads (142) on a flipchip type semiconductor die (140) to contact pads (152) on a substrate (146) i.e. printed circuit board (PCB). A solder tape is placed between the contact pads of the semiconductor die and the substrate. The solder tape is brought to a liquidus state to separate a portion of the solder tape outside a footprint of the contact pads of the semiconductor die and the substrate under surface tension and coalesce the solder material as an electrical interconnect within the footprint of the contact pads.    USE - Method for making a semiconductor device (claimed) i.e. integrated semiconductor device, that is utilized in an electronic device e.g. stand-alone system, graphics card, network interface card and signal processing card that is inserted into a computer. Uses include but are not limited to microcontrollers, microprocessors, charged-coupled devices (CCDs), solar cells and digital micro-mirror devices (DMDs).    ADVANTAGE - The method enables providing efficient and low cost electrical interconnect between the contact pads of the semiconductor die and the contact pads of the substrate. The method enables manufacturing the electronic device using cheaper components and a streamlined manufacturing process, so that the resulting devices are less likely to fail and less expensive to manufacture, and hence providing lower cost for consumers. The method enables preventing moisture and particles from entering package and contaminating die wire bonds. The method enables utilizing a flip chip semiconductor device to provide a short electrical conduction path from the active devices on the semiconductor die to conduction tracks on the substrate, thus reducing signal propagation distance and lower capacitance, and hence improving circuit performance. The method enables providing solder tape bump formation, thus shortening manufacturing time and reducing cost of the semiconductor device. The method enables providing fine pinch electrical interconnects.    DETAILED DESCRIPTION - The flux material is selected form a group consists of ammonium chloride and rosin. An INDEPENDENT CLAIM is also included for a semiconductor device comprising a semiconductor die.    DESCRIPTION OF DRAWING(S) - The drawing shows a cross sectional view of a semiconductor die and a substrate.    Flipchip type semiconductor die (140)    Contact pads (142, 152)    Substrate (146)    Insulating layer (150)    Bumps (168)