NOVELTY - Texturing semiconductor substrates comprises: (a) providing a semiconductor substrate; and (b) applying an aqueous solution comprising one or more compounds selected from alkoxylated glycols, their mono-methyl ether and mono-methyl ether acetate derivatives comprising a molecular weight of 170 g/mole or greater and a flash point of 75 degrees C or greater, and one or more alkaline compounds to the semiconductor substrate to texture the semiconductor substrate.    USE - The method is useful for texturing semiconductor substrates (claimed) for photovoltaic devices in general, including semiconductors in the manufacture of solar cells. The method can also be used for texturing semiconductors for manufacturing optical and electrochemical detectors/sensors, biodetectors/biosensors, catalysts, electrodes, gate electrodes, ohmic contacts, interconnection lines, Schottky barrier diode contacts, optoelectronic components and other articles where reducing the reflectance of incident light improves the efficiency of the device.    ADVANTAGE - The method provides uniform texturing as well as reproducibility of pyramid structure formation on semiconductors. This results in reduced incident light reflectance and improved conversion efficiency of incident light into electric energy. In addition, the aqueous solutions used to texture the semiconductor substrates have components with high flash points in contrast to components used in conventional texturing solutions, thus preventing substantial evaporation of solution components. Accordingly, the texturing solutions may be used over longer periods of time than many conventional texturing solutions. This reduces downtime for manufacturing processes and reduces the frequency of solution replacement, thus improving the overall efficiency of the texturing method. This improved efficiency of the method reduces costs to both consumers and manufactures alike.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are:    (1) a method comprising: (a) providing a semiconductor substrate; (b) texturing a surface of the semiconductor substrate with an aqueous solution comprising one or more compounds selected from alkoxylated glycols, their mono-methyl ethers and mono-methyl ether acetate derivatives comprising a molecular weight of 170 g/mole or greater and a flash point of 75 degrees C or greater, and one or more bases; (c) doping the semiconductor substrate to provide a p/n junction; (d) depositing an anti-reflective layer on the textured surface; (e) selectively etching the anti-reflective layer to expose portions of the textured surface to form a pattern; and (f) depositing one or more metal layers on the exposed portions of the textured surface; and    (2) an aqueous texturing solution consisting essentially of one or more compounds selected from alkoxylated glycols, their mono-methyl ether and mono-methyl ether acetate derivatives having a weight average molecular weight of 170 g/mole or greater and a flash point of 75 degrees C or greater, one or more alkaline compounds and water.