NOVELTY - Substrate processing apparatus for performing plasma process on a substrate accommodated in a processing chamber and surrounded by a focus ring (124), includes positioning pins (200) made of a material expandable in a diametric direction by heating. Each positioning pin is inserted into a first positioning hole (210) formed in focus ring mounting surface (116) of susceptor (114) and into a second positioning hole (220) formed in the focus ring; and expanded in the diametric direction by heating and fitted into the positioning holes, thus allowing a position of the focus ring to be aligned.    USE - The substrate processing apparatus (e.g. plasma processing apparatus of a single parallel plate type) is used for performing plasma process on substrate accommodated in processing chamber and surrounded by focus ring. The substrate is e.g. semiconductor wafer, flat panel display substrate, or solar cell substrate.    ADVANTAGE - Positioning accuracy of a second component (e.g. focus ring or electrode plate) in a substrate processing apparatus can be improved higher than a conventional case without increasing the insertion accuracy of positioning pins into positioning holes. Even if there is a gap between the positioning pin before heating and the positioning holes in the diametric direction, the positioning pin is expanded in the diametric direction by heating, and, thus, the gap is filled up. Centers of the positioning holes can be accurately aligned on same line just by heating the positioning pin without increasing the insertion accuracy of the positioning pin into the positioning holes. Thus, the focus ring or electrode plate can be accurately positioned at a preset position with respect to the susceptor or electrode support, respectively.    DETAILED DESCRIPTION - Substrate processing apparatus for performing plasma process on a substrate accommodated in a processing chamber and surrounded by a focus ring (124), comprises a mounting table (110) including a susceptor (114) having a substrate mounting surface (115) on which the substrate is mounted and a focus ring mounting surface on which the focus ring is mounted; and positioning pins (200) made of a material expandable in a diametric direction by heating. Each positioning pin is inserted into a first positioning hole (210) formed in the focus ring mounting surface of the susceptor and into a second positioning hole (220) formed in the focus ring; and expanded in the diametric direction by heating and fitted into the positioning holes, thus allowing a position of the focus ring to be aligned. INDEPENDENT CLAIMS are included for:    (1) positioning a focus ring in a substrate processing apparatus;    (2) positioning electrode plate of plasma processing apparatus; and    (3) installation of focus ring to surround a substrate accommodated in processing chamber of substrate processing apparatus that performs plasma process on the substrate.    DESCRIPTION OF DRAWING(S) - The drawing is a schematic sectional view illustrating a positioning hole of the focus ring.    Mounting table (110)    Susceptor (114)    Substrate mounting surface (115)    Focus ring mounting surface (116)    Focus ring (124)    Positioning pins (200)    First positioning hole (210)    Second positioning hole (220)