TECHNOLOGY FOCUS - ELECTRICAL POWER AND ENERGY - Preferred Device: Specifically, the thin film solar cell comprises a non-elongated, non-silicon thin- film solar cell using an electrically conductive foil substrate where the foil substrate carries current when the cell is forward biased, the substrate having a ratio of width to length greater than about 0.5 along an axis of current flow, and when exposed to light at AM 1.5G, the solar cell has a maximum power point current (Impp) greater than about 4 amperes; an avalanche breakdown protection assembly to prevent the avalanche breakdown at the one or more locations by directing current through the protection unit. It is in solar cell diode (50). The device further comprises packaging with top and bottom heat sink connectors, where the heat sinks are different layers of the same cell; or packaging with top and bottom heat sink connectors, where the heat sinks are different layers of different cells. It also comprises a first area that is provided with a first material and a second area that is provided with a second material, where the first and second materials are different from one another, and where the first and second materials are selected from: (a) materials that are electrically conductive; (b) materials that do not bond well to each other; and (c) an interface material in composition at least partially filling a cavity on the tab. The device comprises a device for implantation in a solar cell comprising a diode, a first heat sink attachment having a triggerable adhesive property that allows the implantable device to adhere when exposed to a stimulus; and a tab having a bulk sub-region beneath the surface is activated to be become a solderable joint forming area and another area that is not substantially coated and not solderable when activated. Preferred Parameters: The device comprises a total vertical height is about 180 to 500 microns or less. It comprises stack height is about 300 to 400 microns or less.