NOVELTY - Integrated sensor device (1) comprises metal oxide semiconductor (MOS) circuits in semiconductor substrate; sensor (11) containing sensor porous material for ingress of gas or humidity to be sensed and sensor electrodes; and an interconnect stack comprising three interconnect levels, each having interconnect conductor and insulating dielectric, where interconnect levels being over substrate and interconnecting MOS circuits, and where sensor electrodes are embedded in interconnect dielectric and integrally formed with interconnect conductors.    USE - As an integrated sensor device (claimed) for battery applications.    ADVANTAGE - The device simplifies testing significantly and reduces cost. Since the entire humidity sensor is fabricated in a standard complementary metal oxide semiconductor (CMOS) process, it can be tested- and calibrated-at the normal wafer-level test before wafers are shipped. Thus wafer probe and factory test areas are operated at a precise humidity level, for example 40% relative humidity.    DETAILED DESCRIPTION - An integrated sensor device (1) comprises metal oxide semiconductor (MOS) circuits in semiconductor substrate; sensor (11) containing sensor porous material for ingress of gas or humidity to be sensed and sensor electrodes; and an interconnect stack comprising at least three interconnect levels, each interconnect level having interconnect conductors and insulating dielectric, where the interconnect levels being over the substrate and interconnecting MOS circuits; where sensor electrodes being embedded in interconnect dielectric and being integrally formed with interconnect conductors; where the sensor is a capacitive sensor; where sensor electrodes are capacitive electrodes; and where MOS circuits include a circuit for processing signals from sensor electrodes. An INDEPENDENT CLAIM is included for producing a sensor device involving providing MOS circuits in the substrate, providing interconnect levels in successive fabrication cycles to interconnect the MOS circuits; and providing the sensor.    DESCRIPTION OF DRAWING(S) - The figure shows a block diagram of single-chip wireless sensor device.    Integrated sensor device (1)    Microcontroller (2)    Transmit/receive interface (3)    Wireless antenna (4)    Humidity sensor (11)    Temperature sensor (13)