TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Method: The steps of distributing the organometallic solution on a solid substrate, removing the complexing solvent, and producing a metal oxide layer on the solid substrate are performed at less than or equal to 225 degrees C and a processing pressure of greater than 9.4 (preferably greater than 800) mb or at a processing pressure of ambient atmospheric pressure. The method (I) further comprises: producing a first organic polymer layer on the first metal oxide layer by a liquid coating process; and distributing the organometallic solution on the first organic polymer layer and producing a second metal oxide layer on the first organic polymer layer. In the method (I), the liquid coating process comprises: providing an organic polymer solution, where the organic polymer solution includes an organic polymer dissolved in a solvent; distributing the organic polymer solution on the metal oxide layer at a process pressure of ambient atmospheric pressure; and removing the solvent. In method (IV), the first liquid coating process comprises: providing a blend, the blend including a liquid combined with a reactive organosilicon compound; distributing the blend on the solid substrate; and removing the liquid. In method (IV): the inorganic oxide layer comprises siloxane compounds of formula (SiOx), where x is not defined; distributing the blend on the solid substrate is performed at a process pressure of ambient atmospheric pressure; creating an inorganic oxide layer on the solid substrate is performed at a process pressure of ambient atmospheric pressure; and producing an organic polymer layer on the inorganic oxide layer is performed at a process pressure of ambient atmospheric pressure. Preferred Components: The organometallic solution includes a water content of less than 500 ppm.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The solid substrate comprises an organic polymer. The solid substrate is flexible at 20 degrees C, and is capable of bending 90 degrees around a curve having a radius of less than or equal to 0.5 inch without apparent fracturing. The multilayer heterostructure (A) further has properties including a WVTR of less than or equal to 1.1x 102-g/m2.day at 45 degrees C and 85% RH. EXAMPLE - Diethylaluminum ethoxide (25 wt.%) in toluene was added to anhydrous tetrahydrofuran (THF) (20 ml), and the solution was thoroughly mixed under inert gas. The resulting Et2A10Et/THF solution, in which THF acts as a complexing solvent, is used within two days. Approximately 1 mL of the diethylaluminum ethoxide/THF solution was deposited on a clean 0.0030 inch or 0.0050 inch thick polyethylene naphthalate (PEN) substrate and coated in a controlled humidity chamber. The resulting film was cured in an oven for 10 minutes at 150 degrees C to produce an aluminum oxide layer. Polymethylmethacrylate (PMMA) was dissolved in dichloromethane ( approximately 1-5 wt.%). PMMA/dichloromethane solution (1 ml) was deposited on the aluminum oxide layer and coated to produce an organic polymer layer to give the multilayer heterostructure, which was is treated in an oven at 150 degrees C for 10 minutes.