NOVELTY - The method involves providing a semiconductor die including a low pass filter (134) and two baluns (130, 140). Another semiconductor die including a band- pass filter (138) formed on a gallium arsenide substrate is provided. The latter semiconductor die is mounted to the former semiconductor die. A third semiconductor die including a radio frequency (RF) switch is provided. The third semiconductor die is mounted to the former semiconductor die. A fourth semiconductor die including a RF transceiver is provided. The three semiconductor dies are mounted to the fourth semiconductor die.    USE - Method for making a semiconductor device e.g. integrated semiconductor device and flipchip semiconductor device, for signal processing, high-speed calculations, transmitting and receiving electromagnetic signals, controlling electronic devices, transforming sunlight to electricity and creating visual projections for TV displays in applications. Uses include but are not limited to a microcontroller, microprocessor, charged-coupled device (CCD), solar cell and a digital micro-mirror device (DMD), for controlling stand-alone systems, cellular phones, personal digital assistants (PDAs) and digital video cameras (DVCs), in entertainment applications, communication applications, power conversion applications, network applications, computer applications, consumer product applications, military applications, aviation applications, automotive applications, industrial controller applications and office equipment applications.    ADVANTAGE - The method enables utilizing an RF front end module without a bulky surface acoustic wave filter. The method enables depositing a molding compound or encapsulant over the semiconductor dies and a carrier to provide physical support and electrical isolation for a semiconductor device. The method enables utilizing the flipchip semiconductor device that provides a short electrical conduction path from active devices on the semiconductor dies to conduction tracks on a printed circuit board so as to reduce signal propagation distance, lower capacitance and improve circuit performance. The method enables utilizing the semiconductor dies that are mechanically and electrically connected directly to the printed circuit board using flipchip style level packaging without intermediate carrier. The method enables depositing the encapsulant over the package for environmental protection by preventing moisture and particles from entering the package and contaminating the semiconductor dies or bond wires. The method enables forming contact pads over a surface of the board using an electrolytic plating or electroless plating to prevent oxidation. The method enables utilizing the RF front end module that separates and filters a transmit RF signal and a receive RF signal to avoid conflict or cross-over between RF signals.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a semiconductor device.    DESCRIPTION OF DRAWING(S) - The drawing shows a block diagram of an RF front end module in an RF system.    RF front end module (122)    Antenna (124)    Baluns (130, 140, 144)    Low pass filter (134)    Band-pass filters (138, 142)