NOVELTY - Method for processing substrate involves: hydrophobizing step of supplying a hydrophobizing agent to a substrate to hydrophobize a surface of the substrate; drying step of drying the substrate after performing the hydrophobizing step; and maintaining the substrate in a state of not contacting water from the end of the hydrophobizing step to the end of the drying step.    USE - For processing substrate (claimed) selected from semiconductor wafers, substrates for liquid crystal displays, substrates for plasma displays, substrates for FEDs (field emission displays), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.    ADVANTAGE - The method provides substrate processing method, where pattern collapse on substrate can be suppressed or prevented. Pattern collapse can be prevented if surface of substrate is sufficiently hydrophobized; but cannot be prevented if surface of substrate is not sufficiently hydrophobized. Thus, in case where surface of substrate is only partially hydrophobized or in case where contact angle of processing liquid with respect to substrate is not sufficiently large, pattern collapse cannot be prevented even if substrate is dried after being hydrophobized. By the substrate such as substrate including metal film, processing methods, hydrophobizing agent is supplied to substrate and surface of substrate is hydrophobized. Then substrate is dried, and is maintained in state of not contacting water until it is dried after being hydrophobized. A significant decrease in hydrophobicity of substrate due to contact with water after hydrophobizing agent is supplied to substrate can thus be prevented, and pattern collapse can be suppressed or prevented. Further in substrate processing method, solvent capable of dissolving hydrophobizing agent is supplied to substrate after liquid of hydrophobizing agent has been supplied to substrate. The hydrophobizing agent adhering to substrate is thus replaced by solvent. The solvent is then removed from substrate and substrate is dried. The solvent supplied to substrate in pre-drying rinsing step is lower in surface tension than water. Pattern collapse can thus be suppressed or prevented more than in a case where liquid that contains water is supplied to substrate in pre-drying rinsing step.    DETAILED DESCRIPTION - Method for processing substrate involves:    (1) method (A): hydrophobizing step of supplying a hydrophobizing agent to a substrate to hydrophobize a surface of the substrate; drying step of drying the substrate after performing the hydrophobizing step; and maintaining the substrate in a state of not contacting water from the end of the hydrophobizing step to the end of the drying step;    (2) method (B): rinsing liquid supply step of supplying a rinsing liquid that contains water to a substrate having a metal film formed on it; first solvent supply step of supplying a first solvent that does not contain a hydroxyl group to the substrate to replace a liquid held by the substrate by the first solvent after performing the rinsing liquid supply step; and hydrophobizing agent supply step of supplying a hydrophobizing agent, which contains a second solvent that does not contain a hydroxyl group and which hydrophobizes a metal, to the substrate to replace a liquid held by the substrate by the hydrophobizing agent after performing the first solvent supply step; or    (3) method (C): first hydrophobizing step of supplying a first hydrophobizing agent to a substrate to hydrophobize a surface of the substrate; a second hydrophobizing step of supplying a second hydrophobizing agent that differs from the first hydrophobizing agent to the substrate to hydrophobize the surface of the substrate after performing the first hydrophobizing step; and a drying step of drying the substrate after performing the second hydrophobizing step.    INDEPENDENT CLAIMS are included for the following:    (1) a substrate processing apparatus (A1) comprising: a substrate holding unit that holds a substrate; a hydrophobizing agent supply unit that supplies a hydrophobizing agent to the substrate held by the substrate holding unit; a drying unit that dries the substrate; and a controller that performs hydrophobizing step of controlling the hydrophobizing agent supply unit to supply the hydrophobizing agent to the substrate held by the substrate holding unit to hydrophobize a surface of the substrate, drying step of controlling the drying unit to dry the substrate after performing the hydrophobizing step, and step of maintaining the substrate in a state of not contacting water from the end of the hydrophobizing step to the end of the drying step;    (2) a substrate processing apparatus (A2) comprising: a substrate holding unit that holds a substrate; a rinsing liquid supply unit that supplies a rinsing liquid that contains water to the substrate held by the substrate holding unit; a first solvent supply unit that supplies a first solvent that does not contain a hydroxyl group to the substrate held by the substrate holding unit; a hydrophobizing agent supply unit that supplies a hydrophobizing agent, and contains a second solvent that does not contain a hydroxyl group and which hydrophobizes a metal, to the substrate held by the substrate holding unit; and a controller that performs rinsing liquid supply step of controlling the rinsing liquid supply unit to supply the rinsing liquid to the substrate held by the substrate holding unit, first solvent supply step of controlling the first solvent supply unit to supply the first solvent to the substrate held by the substrate holding unit to replace a liquid held by the substrate by the first solvent after performing the rinsing liquid supply step, and hydrophobizing agent supply step of controlling the hydrophobizing agent supply unit to supply the hydrophobizing agent to the substrate held by the substrate holding unit to replace a liquid held by the substrate by the hydrophobizing agent after performing the first solvent supply step; and    (3) a substrate processing apparatus (A3) comprising: a substrate holding unit that holds a substrate; a first hydrophobizing agent supply unit that supplies a first hydrophobizing agent to the substrate; a second hydrophobizing agent supply unit that supplies a second hydrophobizing agent differing from the first hydrophobizing agent to the substrate held by the substrate holding unit; a drying unit that dries the substrate; and a controller that controls the first hydrophobizing agent supply unit, the second hydrophobizing agent supply unit, and the drying unit to supply the first hydrophobizing agent to the substrate to hydrophobize the surface of the substrate, then supply the second hydrophobizing agent to the substrate to hydrophobize the surface of the substrate, and then dry the substrate.