NOVELTY - The apparatus has drive section that is provided with transport elements. The injector head (1) is moved along plane of substrate (9) to form conveying plane. The lead in zone is provided with slanted wall portion which is arranged with respect to conveying plane to reduce working height. A slitted outlet is arranged between slanted wall portion and drive section. The slitted outlet is extended over lead in zone along conveying direction. The gas flow is arranged outside of slitted outlet along substrate to flow high impact particle removal gas towards conveying direction.    USE - Apparatus for depositing atomic layer such as aluminum oxide layer on surface of substrate such as sheeted substrate for used during manufacturing of semiconductor product such as chip and solar cell.    ADVANTAGE - The combination of relative motion between deposition space and the substrate in the plane of substrate surface for confining the injected precursor gas to the deposition space so as to distributed precursor gas efficiently over the substrate surface, so that probability of attaching precursor gas molecule to substrate surface is enhanced. The flow of active materials between deposition spaces through flow barriers is prevented, so that contamination of substrate is avoided. The heat capacity of the system is reduced so as to provide faster heating response of substrates, so that production throughput of apparatus is increased. The working zone is placed adjacent to lead in zone and is aligned relative to conveying plane, so that the substrate can be easily conveyed between zones. The processing coat of apparatus is reduced. The processing speed of apparatus is improved. The reception gap is provided in intermediate position of wall portion, so that mechanical contact between the wafer and the wall portion of reception element is prevented.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for method for depositing atomic layer on surface of substrate.    DESCRIPTION OF DRAWING(S) - The drawing shows the cross sectional view of injector head of apparatus for depositing atomic layer on surface of substrate.    Injector head (1)    Substrate (9)    Support portion (10)    Cavity (29)    Projecting portion (110)