NOVELTY - The system has a vacuum chamber installed on housing. A sputtering gas feeder supplies sputtering gas to the vacuum chamber. A first circle barrel target and a second circle barrel target are arranged on an inner side of the chamber. Two target rotation apparatuses rotate the first and the second circle barrel target, respectively. Two magnetic units are equipped on an inner side of the targets, respectively. Two magnetic unit angle controlling devices control an angle of the magnetic units, respectively. A plated material holder comprises deposition particle sputtered in the barrel targets.    USE - Rotating cylindrical facing target sputtering system for depositing plated material. Uses include but are not limited to metal film, transparent conductive film, semiconductor film, non-conductor film and dielectric film utilized for manufacturing process of low molecular weight substrate, flexible solar cell, flexible transistor, flexible memory, flexible sensor lamp, active-matrix organic LED, organic thin-film transistor, organic memory device and organic compound sensor lamp.    ADVANTAGE - The system efficiently detains plasma between two rotating cylinder type facing targets so as to minimize damage of the plated material by plasma, improve usage efficiency of targets, enhance deposition rate of particles and reduce fabrication cost. The system reduces damage of plated material during thin film fabrication so as to reduce failure rate of product and improve quality of product. The system controls an arrangement angle of the magnetic units for forming magnetic field so as to provide various deposition effects during deposition process. The system can increase deposition area about the plated material by shuttling plated material among deposition process so as to facilitate deposition toward the plated material of large area and increase number of plated material to be deposited in single deposition process.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a rotating cylindrical facing target sputtering system.