TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The composition comprises (vol.%): metallic powder (1-50); solder powder (1-50); and the curable resin (50-95). The composition comprises the reducing agent in a weight ratio of 0.5-20 parts per hundred to the curable resin, and the curing agent is comprised in an equivalent ratio of 0.4-1.2 to the curable resin. The conductive composition further comprises at least one material selected from silica and a ceramic powder. The composition comprises an intermetallic compound formed by the metallic powder and the solder powder, and a porous matrix formed by the intermetallic compound and the metallic powder; where the cured resin is filled in pores of the matrix. Preferred Components: The anti-reflection film layer comprises silicon nitride.    TECHNOLOGY FOCUS - METALLURGY - Preferred Components: The metallic powder is a material having a melting point of greater than or equal to 500 degrees C and is capable of forming an intermetallic compound with the solder powder. The metallic powder is at least one material selected from copper, nickel, silver, and gold (preferably copper). The solder powder is at least one material selected from tin (Sn), indium (In), bismuth (Bi), lead (Pb), zinc (Zn), gallium (Ga), tellurium (Te), mercury (Hg), antimony (Sb) or selenium (Se); or at least one material selected from Sn, In, Pb, SnBi, tin-silver-copper (SnAgCu), SnAg, Sn, In, AuSIn, and InSn. The conductive powder comprises a metallic powder and a solder powder. The metallic powder of the first conductive composition is silver. The metallic powder of the second conductive composition is aluminum or silver.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The reducing agent is an acid containing a carboxyl group (COOH-). The curing agent is at least one selected from amine-based curing agents and anhydride-based curing agents.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The curable resin is an epoxy resin. EXAMPLE - No suitable example given.