NOVELTY - The light and heat resistant circuit board apparatus (LHRPCB) comprises a thermally conductive material (TCM) layer (20), electrically conducting layer (ECL) layer (35), an electrically isolating material (EIM) layer (30), a heat and UV radiation resistant bonding layer (HUVRBL) (25), and an electronic component. The TCM layer is adapted to serve as a mechanical and thermal substrate for the LHRPCB, includes a material including metal, ceramic, metal matrix composite, and polymeric composite, and has heat transfer paths to the environment and a thickness of 100-5,000 microns.    USE - The light and heat resistant circuit board apparatus is useful in electronic, solar energy, and electric applications.    ADVANTAGE - The light and heat resistant circuit board apparatus can be economically manufactured with long lifespan and high resistance to UV and heat and without delamination, cracking and blistering.    DETAILED DESCRIPTION - The light and heat resistant circuit board apparatus (LHRPCB) comprises a thermally conductive material (TCM) layer (20), electrically conducting layer (ECL) layer (35), an electrically isolating material (EIM) layer (30), a heat and UV radiation resistant bonding layer (HUVRBL) (25), and an electronic component. The TCM layer is adapted to serve as a mechanical and thermal substrate for the LHRPCB, includes a material including metal, ceramic, metal matrix composite, and polymeric composite, and has heat transfer paths to the environment and a thickness of 100-5000 microns. The EIM layer is configured on respective TCM layers, is resistant to UV radiation, and has a thickness of 0.5-120 microns. The ECL layer: is configured above the TCM layer and configured to selectively conduct electrical current; is adapted to be patterned; includes a material including metal, metal filled polymer, metal filled ceramic, and/or carbon filled polymer or ceramic; and has a thickness of 15-100 microns and an electrically conducting surface finish coating that has a thickness of 0.2-10 microns. The HUVRB layer is applied between respective ECL, TCM and EIM layers, and has a thickness of 20-300 microns. The electronic component is mounted upon the ECL layer, and comprises a photovoltaic (PV) cell, an LED, a die, a die package, a surface mount technology component and/or a semiconductor package. The LHRPCB is adapted to be exposed to light and heat for an extended period. A PV module is fabricated on the ECL layer, and comprises PV cells, a module frame enclosing the PV cells on all sides and a front sheet configured above the PV cells. The front sheet allows sunlight to pass onto the enclosed PV cells. The extended period is a range of time from individual months to 25 years. An INDEPENDENT CLAIM is included for a method of fabricating a light and heat resistant circuit board apparatus.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic cross-sectional side view of successive layers of a light and heat resistant circuit board apparatus.    Light and heat resistant circuit board apparatus (10)    Thermally conductive material layer (20)    Heat and UV radiation resistant bonding layer (25)    Electrically isolating material layer (30)    ECL layer. (35)