NOVELTY - The method comprises exposing dies to a molecule having a protective group attached to a chemical functional group, where the dies comprises an electrode to generate a deprotecting reagent, a working electrode, and a confinement electrode, applying a potential to confinement electrodes of dies to confine a reductive molecule or an oxidative molecule, electrochemically generating the deprotecting reagent, removing the protective group from the molecule, bonding the chemical functional group of the molecule to the dies, and connecting a wafer pad to a sealed probe card.    USE - The method is useful for carrying out a chemical reaction such as an electrochemical redox reaction on dies located on a wafer in parallel, where the chemical reaction forms a polymer, a nano-material and an oligonucleotide (all claimed) and the dies are array chips that are useful for: therapeutic materials development such as a drug development; for biomaterial studies; for biomedical research, analytical chemistry, high throughput compound screening and bioprocess monitoring; for sequencing genomic DNA by the technique of sequencing by hybridization; and for developing new materials such as nano-materials for corrosion resistance, battery energy storage, electroplating, low voltage phosphorescence, bone graft compatibility, resisting fouling by marine organisms, superconductivity, epitaxial lattice matching or chemical catalysis.    DETAILED DESCRIPTION - The method comprises exposing dies to a molecule having a protective group attached to a chemical functional group, where the dies comprises an electrode to generate a deprotecting reagent, a working electrode, and a confinement electrode, applying a potential to confinement electrodes of dies to confine a reductive molecule or an oxidative molecule, electrochemically generating the deprotecting reagent, removing the protective group from the molecule, bonding the chemical functional group of the molecule to the dies, connecting a wafer pad to a sealed probe card, and addressing a die pad located on a front side of the die through a via interconnect located between the front side of the die and a backside of the die. The bonding step comprises attaching a functionalized nano-material to the dies by hybridization and/or electrochemical attachment. An INDEPENDENT CLAIM is included for a method of manufacturing dies.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic view of a portion of a wafer.    Complementary metal oxides semiconductor. (CMOS)