NOVELTY - A flexible printed circuit board (200) formed on a motherboard (100), is separated from the motherboard. A laser ablation layer is formed in an upper carrier substrate using a bonding layer, without contacting with the motherboard. The electric component is formed on a separation section of the flexible printed circuit board contacted with the motherboard. The flexible printed circuit board is disassembled after separating from the upper carrier substrate. The flexible printed circuit board is made of metal or metal alloy such as stainless steel.    USE - Manufacturing method of flexible electric component such as organic LED (OLED), LCD, electrophoretic display device (EPD), plasma-display panel (PDP), thin film transistor (TFT), microprocessor, RAM, solar cell (all claimed), using laser.    ADVANTAGE - The manufacturing cost of the flexible electric component is reduced reliably and effectively. The electric component is formed on the separation section having surface roughness same as that of flexible motherboard. Hence the surface roughness problem of metallic flexible printed circuit board can be solved. The surface roughness of circuit is maintained as low, so that the processing temperature of planarization layer is reduced. The expensive polishing process required for the manufacture of circuit board is avoided. Hence reservoir water rate problem due to high defect density can be resolved, while improving the economical efficiency. The generation of crack by the difference of thermal expansion coefficients of materials of the circuit board can be reduced. The complete exfoliation of laser ablation layer is performed without requirement of additional exfoliation process. Hence the flexible electric component can be separated from the carrier substrate without the damage of the flexible electric component.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view explaining the manufacturing process of flexible electric component. (Drawing includes non-English language text)    Motherboard (100)    Flexible printed circuit board (200)