NOVELTY - The method comprises: providing a sheet material comprising a bonding or hot-melt adhesive mass (5) that is thermally activated; applying the sheet material about the region of an electronic arrangement (1) to be encapsulated and to a substrate (2) supporting or enclosing the electronic arrangement; providing a cover (4) for the electronic arrangement and the adhesive mass enclosing the electronic arrangement, where the adhesive mass is brought into contact with the cover; and thermally activating the adhesive mass in a sub-region of the substrate.    USE - The method is useful for encapsulating an electronic arrangement against permeation, where the electronic arrangement includes electrophoretic or electrochromic assemblies or displays, organic or polymeric LEDs, display devices such as electroluminescent lamps, light-emitting electrochemical cells, organic solar cells such as dye and polymer solar cells, inorganic solar cells such as thin-film solar cells, organic field effect transistors, organic switching elements, organic optical amplifiers, organic laser diodes, organic or inorganic sensors or organic or inorganic-based radio frequency identification transponders.    ADVANTAGE - The method is capable of economically, rapidly, efficiently and simply encapsulating the electronic arrangement against permeation with high flexibility, stability, transparency, shear strength and peel strength, increased chemical resistance, long service life and good barrier property.    DETAILED DESCRIPTION - The method comprises: providing a sheet material comprising a bonding or hot-melt adhesive mass (5) that is thermally activated; applying the sheet material about the region of an electronic arrangement (1) to be encapsulated and to a substrate (2) supporting or enclosing the electronic arrangement; providing a cover (4) for the electronic arrangement and the adhesive mass enclosing the electronic arrangement, where the adhesive mass is brought into contact with the cover; and thermally activating the adhesive mass in a sub-region of the substrate so that a bond is formed to the substrate and the cover, where the heat required for activation is substantially generated in the sheet material comprising the adhesive mass itself. The heat is generated in the adhesive mass contained sheet by ultrasound and/or magnetic induction. The inductor is integrated in a compression tool. The induction heating is carried out using a magnetic field having a frequency of 100-200 kHz and/or for 0.1-10 seconds. The activatable adhesive is an activatable pressure sensitive adhesive. The substrate material and/or the cover are provided with a permeation barrier for oxygen and water vapor. The permeation barrier has a value for water vapor transmission rate (WVTR) of less than 102 g/(m2d) and/or for oxygen transmission rate (OTR) of less than 102 cm3/(m2d bar). The substrate material and/or the cover have an average transmission in the visible range of light of greater than 85%. The activatable adhesive mass has a mechanical loss factor tan delta of more than 1 and/or the difference tan delta (adhesive mass) and tan delta (substrate or cover) of 1. The activatable adhesive mass has an electrical conductivity of more than 20 MS/m at 23 degrees C and a WVTR of less than 10 g/m2d and/or an OTR of less than 100 cm3/m2d bar. The activatable adhesive is equipped with a scavenger material for permeation. The sheet material comprises electrically conductive layer, and a heat-activated bonded adhesive layer and a further adhesive layer for the induction heating.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of an optoelectronic arrangement.    Optoelectronic arrangement (1)    Substrate (2)    Electronic structure (3)    Cover (4)    Hot-melt adhesive mass. (5)