TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The flake type powder has an average particle diameter (D50) of preferably 1.6-2.7 mu m. The flake type powder has a tap density of 2.5-5 g/cm3. The spherical powder has an average particle diameter (D50) of preferably 0.5-1 mu m. The flake type powder and the spherical powder are present in a weight ratio of preferably 1:1-1:1.5. The average particle diameter (D50) of the flake type powder is greater than the average particle diameter (D50) of the spherical powder. In the conductive paste composition, where a ratio of the average particle diameter (D50) of the flake type powder to the average particle diameter (D50) of the spherical powder is 1.4:1-2.4:1. The conductive powder is a mixture of the flake type powder and the spherical powder having different average particle diameters.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The conductive powder and the binder resin are present in a weight ratio of 1:0.05-1:0.07, preferably 1:0.06-1:0.07. The conductive paste composition includes the binder resin (1-10 wt.%) and the conductive powder (80-95 wt.%), where the solvent is included in a balance amount. The binder resin is an epoxy resin (cresol novolac, bisphenol F and/or bisphenol A epoxy resins), an acrylic resin, a (meth)acrylic resin, a cellulosic resin, an ester resin, an alkyd resin, a butyral resin and/or a polyvinyl alcohol resin. Preferred Composition: The conductive paste composition further comprises at least one of a diluent and a curing agent. EXAMPLE - Typical conductive paste composition comprised of (in weight ratio): flake silver powder (tap density of 2.5 g/cm3, average particle diameter D50 of 1.6 mu m and specific surface area of 4.6 m2/g) (22.2); flake silver powder (tap density of 5 g/cm3, average particle diameter D50 of 1.4 mu m and specific surface area of 1.2 m2/g) (22.2); spherical silver powder (tap density 4.3 g/cm3, average particle diameter D50 of 0.8 mu m and specific surface area of 1.1 m2/g) (44.6); cresol novolac resin (1.4); bisphenol F resin (4.8); epoxy acrylate resin (1.5); 2-undecylimidazole; and Butyl carbitol acetate (RTM: 2-(2-Butoxyethoxy)ethyl acetate) (3).