NOVELTY - Manufacturing reflective conductive film comprises providing a reflective polymeric substrate comprising a polymeric base layer and a polymeric binding layer, disposing the nanowires on the exposed surface of the binding layer, and heating the composite film to a temperature (T1), where T1 is greater than or equal to a softening temperature (TS-HS), and T1 is at least 5 degrees C below.    USE - The process is useful for manufacturing reflective conductive film, which is useful in an electronic device. The reflective polymeric substrate is useful in the manufacture of a reflective conductive film including nanowires (all claimed). The reflective conductive films is useful as elements in solar cells, liquid crystal displays, electronic display devices (including electronic-paper and electrochromic displays), light irradiation devices (including light-emitting diode devices and semiconductor laser devices), and decorative illumination devices.    ADVANTAGE - The reflective conductive film exhibits low sheet resistance, high reflectance (preferably high diffuse reflectance), excellent adhesion of the nanowires to the substrate, and good abrasion resistance of the nanowires. The reflective conductive film can be produced in an economical manner.    DETAILED DESCRIPTION - Manufacturing a reflective conductive film comprising (i) a reflective polymeric substrate comprising a polymeric base layer and a polymeric binding layer, where the polymeric material of the base layer has a softening temperature (TS-B) and the polymeric material of the binding layer has a softening temperature (TS-HS), and (ii) a conductive layer comprising nanowires, where the nanowires are bound by the polymeric matrix of the binding layer such that the nanowires are dispersed at least partially in the polymeric matrix of the binding layer, comprises providing a reflective polymeric substrate comprising a polymeric base layer and a polymeric binding layer, disposing the nanowires on the exposed surface of the binding layer, and heating the composite film to a temperature (T1), where T1 is greater than or equal to TS-HS, and T1 is at least 5 degrees C below.