TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Process: In chemical texturing the surface of the multicrystalline silicon wafer, the surface of the wafer is contacted with the composition at a temperature of 2-55 degrees C for a period of up to about 5 minutes. Also, the surface of the wafer is contacted with the composition at room temperature for a period of about 1 minute. The nonionic surfactant is a surfactant having a molecular weight of 400-4000 g/mol. The surfactant component is pre-mixed with acetic acid before being combined with the other components of the composition. The nonionic surfactant has been mixed with the acetic acid in a weight ratio of acetic acid/surfactant of 1:3-1:69. The v/v% ratio of HF to HNO3 in the composition is 20:1-40:1 or 26:1-33:1. The amount of surfactant is 0.5-10 wt.% based on the total weight of the composition. The non-ionic surfactant is selected from an alcohol alkoxylate polymer of molecular weight (MW) about 2750, a polyalkylene glycol of MW about 2000, a polyalkylene glycol of MW about 2500, a polyalkylene glycol of MW about 2700, a 8-10C alcohols alkoxylated of MW about 570, a modified polyethoxylated alcohol of MW about 570, a modified fatty alcohol polyglycol ether, and mixtures. The v/v% ratio of HF to HNO3 in the composition is from about 26:1 to about 33:1; the amount of surfactant is 1-5% based on the total weight of the composition, the non-ionic surfactant is selected from an alcohol alkoxylate polymer of MW about 2750, a polyalkylene glycol of MW about 2000, a polyalkylene glycol of MW about 2500, a polyalkylene glycol of MW about 2700, a 8-10C alcohols alkoxylated of MW about 570, a modified polyethoxylated alcohol of MW about 570, a modified fatty alcohol polyglycol ether, and mixtures; the nonionic surfactant has been premixed with the acetic acid in a weight ratio of acetic acid/surfactant of 1:3-1:10 before being mixed with the other components of the composition, and the amount of water is 1-4% based on the total weight of the composition. The texturization of the wafer results in a decreased reflectivity of the wafer such that when employed in a solar cell the short circuit current increases compared to an untexturized wafer. EXAMPLE - No suitable example given.