NOVELTY - Method (M1) for reducing bow and improving electrical performance of aluminum back contacted silicon solar cell involves providing silicon wafer substrate; providing paste comprising aluminum, glass frit and organometallic compound; applying paste to silicon wafer substrate to form coated substrate; and firing coated substrate for time and at temperature sufficient to sinter aluminum together with organometallic compound and fuse glass frit.    USE - For reducing bow and/or improving electrical performance of aluminum back contacted silicon solar cell.    ADVANTAGE - The use of organometallic and hydrocarbon resin additions to back contact aluminum pastes can reduce wafer bowing as well as improves electrical performance of contact made from fired paste; where additives and organic resin additions increase firing temperature as well as uniformity of firing temperature in order to form highly efficient solar cell. The additives also provide heat to aluminum paste through exothermic reactions which increase wafer temperature in order to form more reliable and high efficiency front and back contacts. The higher and more uniform back contact temperature increases thickness of the back surface field (BSF) layer; increases the 'doping' level of aluminum in BSF layer; makes the wafer temperature more uniform and improves temperature distribution in wafer, the heat generated by localized exothermic reaction is very effectively distributed by high thermal conductivity molten aluminum metal or aluminum alloys; improves aluminum paste adhesion to silicon; and improves front contact formation.    DETAILED DESCRIPTION - Method (M1) for reducing bow and improving electrical performance of aluminum back contacted silicon solar cell involves providing silicon wafer substrate; providing paste comprising aluminum, glass frit and organometallic compound, where organometallic compound is organic compound of metal selected from silver, aluminum, barium, bismuth, calcium, cobalt, chromium, copper, iron, potassium, lithium, magnesium, manganese, molybdenum, sodium, neodymium, nickel, antimony, silicon, tin, strontium, tantalum, vanadium, zinc and/or zirconium; where organometallic compound forms paste having exothermic reaction peak at 300-660 degrees C, with sample size of 5-200 mg when run on Mettler-Toledo thermal gravimetric analysis (TGA)/single differential thermal analysis (SDTA) 851e, when measured with differential thermal analysis at heating rate of 20 degrees C per minute in air; applying paste to silicon wafer substrate to form coated substrate; and firing coated substrate for time and at temperature sufficient to sinter aluminum together with organometallic compound and fuse glass frit. INDEPENDENT CLAIMS are included for the following:    (1) method for reducing the reaction temperature of conductive paste sintering reaction by using method (M1);    (2) solar cell comprising fired blend comprises prior to firing; silicon wafer substrate; and paste applied to substrate, where paste comprising aluminum, organic resin, organic vehicle and optionally organometallic compound; the organic resin is selected from rosin resins, terpene resins, hydrocarbon resins and/or polymerized resins; where combination of aluminum, glass frit and organometallic compound is such that sintering temperature of paste is at least 5 degrees C lower than it would otherwise be if organometallic compound or organic resin was not present; and    (3) forming silicon solar cell involving applying aluminum paste on back side of silicon wafer having p-type region, n-region on top and p-n junction; and firing surface provided with aluminum paste, where wafer reaches peak temperature of 700-900 degrees C.