NOVELTY - Structure of transparent conductive circuits (11), comprises a base material (10), a transparent ink layer (20) provided with absorbing conductive polymer liquid characteristics, where the ink layer is attached to a predetermined area on a surface of the base material not requiring electrical conductivity, and either heat energy or radiation is applied in accelerating solidification of the ink, and a conductive layer (30) covers the ink layer and the predetermined area requiring electrical conductivity on the surface of the base material.    USE - The structure is useful in pattern forming method of transparent conductive circuits (claimed) comprising transparent conductive film, liquid-crystal display, heat isolation glass, touch panel, thin film resistor, thin film transistor, light-emitting device, solar cell or printed electronics.    ADVANTAGE - The structure provides high uniformity and high quality of transparent conductive circuits with increased production efficiency at lower cost in a quick manner.    DETAILED DESCRIPTION - Structure of transparent conductive circuits (11), comprises either: (a) a base material (10), (b) a transparent ink layer (20) provided with absorbing conductive polymer liquid characteristics, where the ink layer is attached to a predetermined area on a surface of the base material not requiring electrical conductivity, and either heat energy or radiation is applied in accelerating solidification of the ink, and (c) a conductive layer (30) covers the ink layer and the predetermined area requiring electrical conductivity on the surface of the base material, where the conductive polymer coating contains an intrinsic conductive polymer, the ink layer attached to the surface of the base material thus increasing electrical resistivity of the conductive layer in contact therewith to be at least more than 100 times higher than the original resistivity of the conductive layer, to the extent of being non-conductive, and the area relative to the conductive layer on the surface of the base material where has not been in contact with the ink layer is provided with electrical conductivity thus forming the required conductive circuit on the base material; or (a1) a base material, (b1) a conductive layer attached to a surface of the base material, and (c1) a transparent ink layer soluble in a polar liquid, where the transparent ink layer is attached to area on the surface of the conductive layer predetermined not to require electrical conductivity, and either heat energy or radiation is applied to accelerate drying and solidification of the ink layer, as well as increasing electrical resistivity of the conductive layer. INDEPENDENT CLAIMS are also included for a pattern forming method of transparent conductive circuits, comprising either: (a) attaching an ink layer to a predetermined area on a surface of a base material not requiring electrical conductivity, where the ink layer can be removed by using a removal fluid having polar characteristics, (b) irradiating the ink layer with either heat energy or radiation to accelerate solidification of the ink layer, (c) covering the surface of the ink layer and the area on the base material predetermined to require electrical conductivity with a conductive layer, and implement drying and solidification of it, and (d) removing the ink layer and the conductive layer in contact with the ink layer physically by using a removal fluid provided with the polar characteristics, leaving behind the conductive layer on the surface of the base material not in contact with the ink layer, thus forming the conductive circuits provided with electrical conductivity; or (a1) covering a surface of a base material with the conductive polymer coating, and implement drying and solidification of it, (b1) attaching an ink layer to the predetermined area of the surface of a conductive layer not requiring electrical conductivity, where the ink layer can be removed by using a removal fluid having polar characteristics, accordingly the areas of the conductive layer in contact with the ink layer are transformed into non-conductive areas (301) provided with no electrical conductivity and positioned on the base material, (c1) using either heat energy or radiation to accelerate solidification of the ink layer and increase electrical resistivity of the area of the conductive layer, and (d1) using the removal fluid provided with polar characteristics to remove the ink layer, where the non-conductive area is formed on the area of the conductive layer in contact with the ink layer and the conductive circuit provided with electrical conductivity is formed on the area of the conductive layer not in contact with the ink layer.    DESCRIPTION OF DRAWING(S) - The figure shows a cross-sectional view of the structure of transparent conductive circuits.    Base material (10)    Conductive circuits (11)    Ink layer (20)    Conductive layer (30)    Non-conductive areas (301)