NOVELTY - The method involves providing integrated circuit elements i.e. transfer-printed elements, on a receiving substrate, where each circuit element comprises a chiplet substrate including a connection pad and a conductor element on a surface of the circuit element. A conductive layer is formed on the receiving substrate including the circuit elements such that the connection pad of each of circuit element is electrically connected to the conductive layer that is notwithstanding that the circuit element is misaligned on the receiving substrate.    USE - Method for assembling an integrated circuit element i.e. transfer-printed element (claimed), on a substrate e.g. wafer substrate, and glass substrate, to fabricate an advanced display backplane of an electronic system e.g. imaging device such as flat-panel LCD device and optical LED (OLED) display device, digital radiographic plate, and flat-panel solar cell. Can also be used for polymer substrate, metal substrate, and silicon semiconductor substrate, gallium arsenide semiconductor substrate.    ADVANTAGE - The method enables utilizing small features which can provide additional space within the chiplets for active elements or wiring so as to increase functionality, circuit density, and electrical performance of the chiplets while reducing alignment and tolerance requirements. The method enables employing lower-cost tools to manufacture backplanes so as to increase manufacturing yield and reduce cost and masking processes of the backplanes.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following:    (1) an electronic component array comprising a backplane substrate    (2) a structure for printing transferable integrated circuit chiplets, comprising a substrate    (3) a method for fabricating transferable integrated circuit chiplets.    DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of a backplane having chiplets and wires.    Backplane (10)    Chiplets (20)    Backplane wires (40)