NOVELTY - A polyamic acid resin composition contains a polyamic acid (I) or (II), and a solvent.    USE - Polyamic acid resin composition. Uses include but are not limited to flexible substrates of flat panel display, electronic paper, solar cell, surface-protection film of a semiconductor element, interlayer insulation film, insulating layer, spacer layer of organic electroluminescent element, planarizing film of thin film transistor substrate, insulating layer of organic transistor, flexible printed circuit board, binder for electrodes of lithium ion secondary battery, etc.    ADVANTAGE - The polyamic acid resin composition has excellent heat resistance, storage stability and film forming ability after heat processing.    DETAILED DESCRIPTION - A polyamic-acid resin composition contains a polyamic acid of formula: A-B'-A' (I) or C"-D'-C' (II), and a solvent.    A,A'=terminal-capped polyamic acid block of formula (III);    B'=polyamic acid block of formula (IV);    C',C"=terminal-capped polyamic acid block of formula (V);    D'=polyamic acid block of formula (VI);    W'=2C or more divalent organic group containing organic group of formula (VII);    X=2C or more tetravalent organic group containing organic group of formula (VIII) or (IX);    Y'=2C or more divalent organic group;    Z=2C or more tetravalent organic group;    A1,B1=1-20C monovalent organic group;    h,k=0 or 1;    i,j,m,n=positive integer;    R1-R5=1-10C monovalent organic group;    o,p=0-4;    q=0-2;and    r,s=0-3.    Polyamic acid block containing both tetravalent organic group (VIII) or (IX) as Z, and divalent organic group (VII) as Y, is excluded. An INDEPENDENT CLAIM is included for manufacture of polyamic acid resin composition. 1-2 Molar equivalent of diamine compound of formula: H2N-W'-NH2 (XIV) with respect to 1 molar equivalent of acid dianhydride of formula (XIII), diamine compound of formula: H2N-Y'-NH2 (XV) and 0.01-0.5 molar equivalent of terminal blocker are mixed and reacted. 1.01-2 Molar equivalent of acid dianhydride of formula (XVI) is added to the reaction mixture with respect to 1 molar equivalent of diamine compound (XV) and reacted to obtain polyamic acid resin composition.