TECHNOLOGY FOCUS - CHEMICAL ENGINEERING - Preferred Composition: The reaction is carried out by ball-milling, ultrasound, overload, microwave irradiation or UV irradiation.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Process: During reacting lead, lead salt or lead-acid-storage-battery diachylon and organic or inorganic compound, and further reacting with alkali or caustic alkali, surfactant, reducing agent and complexing agent of impurity metal ion are added into the reaction system. The lead hydroxide precipitate is pyrolyzed at 800 degrees C or less. The disintegrated gas produced by reactant in the heating or gas which produced in reaction is used as reducing agent or precipitator. Before pyrolysis, the precipitate is subjected to fractionation or extraction. Preferred Composition: The lead salt comprises lead sulfate, lead nitrate, lead chloride, lead phosphate, lead chromate, lead molybdate, lead ferrous acid, lead carbonate, lead oxalate, lead stearate, lead acetate and lead citrate. The alkali or caustic alkali comprises ammonium hydroxide, sodium hydroxide, potassium hydroxide gallium hydroxide and/or their solutions. The molar concentration ratio of addition amount of organic or inorganic compound and lead atom or ion is 1:0.1-1:1000, and is reacted at 1000 degrees C or less. The molar concentration ratio of alkali or caustic alkali and lead atom or ion is 1:0.1-1:1000. The molar concentration ratio of lead atom or ion and inorganic or organic compound is more than 1:1. The surfactant comprises anionic surfactant, cationic surfactant, amphionic surfactant and/or nonionic surfactant. The molar concentration ratio of addition amount of surfactant and lead atom or ion is 1:0.0001-1:10. The reducing agent comprises carbon monoxide, hydrogen peroxide, ferrous sulfate, oxygen and air. The molar concentration ratio of reducing agent or oxidant and lead atom or ion is 1-0.1-1:100.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Composition: The organic acid comprises oxalic acid, citric acid, polyacrylic acid, formic acid, acetic acid, propionic acid, oxalic acid, malonic acid, lactic acid, cis-butenedioic acid, ethylene diamine tetraacetic acid, polyacrylic acid olefinic ester, polymaleic acid, formic acid, tartaric acid, fumaric acid, phthalic acid, maleic acid and/or malic acid. The surfactant comprises stearic acid, oleic acid or lauric acid, lauryl dimethyl benzyl ammonium chloride, cocamidopropyl betaine, dodecylamino propionate, polyoxyethylene sorbitan fatty acid ester, dodecyl dimethyl benzyl ammonium chloride, polyoxyethylene polyoxypropylene ether and/or octadecyl trimethyl ammonium chioride. The complexing agent of impurity metal ion comprises ethylenediaminetetraacetic acid, 1,2-diaminopropane-N,N,N',N'-tetraacetic acid, amino acid, glycolic acid, organic acid, alkali and/or their salts. The molar concentration of addition amount of complexing agent of impurity metal ion and lead atom or ion is 1:0.0001-1:10. The amino acid comprises aminoacetic acid, alanine, tryptophan, glutamic acid, valine, leucine, isoleucine, proline, phenylalanine, methionine, serine, threonine, cysteine, tyrosine, asparagines, glutamine, lysine, arginine, histidine and/or aspartate. The alkali comprises ammonia, Quadrol (RTM: N,N,N',N'-tetrakis(2-hydroxypropyl)ethylenediamine) and tetramethylammonium hydroxide.