TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Properties: The average particle diameter of titanium dioxide is 0.1-0.5 mu m. The thickness of material is 50-500 mu m.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The monomer containing acid functional group is chosen from carboxylic group, phosphate group, phosphonic acid group, sulfonic acid group, acrylic acid group, methacrylic acid group, crotonate group, maleic acid and itaconic acid group. The monomer containing basic functional group is chosen from hydroxyl group, amine group, imine group, amide group, azide group, nitrate and ammonium group. The solvent used during manufacture of fluorine-based resin composition is chosen from acetone, methyl ethyl ketone, dimethylformamide and dimethylacetamide. The material of multi layer film is metallic film or macromolecular film. The macromolecular film is polyester film, acrylic film, polyolefin film, polyamide film, polyurethane film, polyethylene terephthalate film, polyethylene naphthalate film and polybutylene terephthalate film.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The fluorine-containing polymer is chosen from vinylidene fluoride, vinyl fluoride, tetrafluoroethylene, hexafluoropropylene, chlorotrifluoroethylene, trifluoroethylene, hexafluoroisobutylene, perfluorobutylethylene, perfluoromethylvinylether, perfluoroethyl vinyl ether, perfluoropropylvinylether, perfluoromethylvinylether, perfluoro-2,2-dimethyl-1,3-dioxole and perfluoro-2-methylene-4-methyl-1,3-dioxolan. The content of comonomer in the fluorine-containing polymer is 0.5-50 weight%. The electric charge is acidic polymer or basic polymer fluorine-based resin composition. The content of electric charge is 0.01-50 parts weight with respect to 100 parts weight of fluorine-containing polymer. The content of titanium dioxide is 5-200 parts weight with respect to 100 parts weight of fluorine-containing polymer. Preferred Properties: The fluorine-containing polymer has weight-average molecular weight of 5-100 and melting point of 80-175 degrees C. The solvent used during manufacture of fluorine-based resin composition has boiling point of 200 degrees C or less. The thickness of resin layer is 3-50 mu m.