NOVELTY - A thermoplastic alkoxysilane-containing polyolefin copolymer comprises alkoxysilane (0.1 wt.% or more) with respect to total weight of polyolefin, and has melt strength of 2-30 cN at 150 degrees C.    USE - Thermoplastic alkoxysilane-containing polyolefin copolymer is used for thermoplastic alkoxysilane-containing polyolefin copolymer film for manufacturing photovoltaic module (all claimed).    ADVANTAGE - The thermoplastic alkoxysilane-containing polyolefin copolymer has reduced melt strength, and provides copolymer film with reduced detrimental film shrinkage.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) grafting process for manufacturing thermoplastic alkoxysilane-containing polyolefin copolymer, which involves grafting 0.1-2.5 wt.% of alkoxysilane compound to thermoplastic polyolefin copolymer using a free radical generating graft initiator material. The free radical generating graft initiator material is used in an amount such than the molar ratio of alkoxysilane compound to free radical of is 20:1 or more;    (2) thermoplastic alkoxysilane-containing polyolefin copolymer film, which has at least one facial surface layer of a thermoplastic alkoxysilane-containing polyolefin copolymer having thickness of 200-1000 mu m (from 8-40 mils) and machine direction shrinkage value of 20% or less;    (3) photovoltaic module (10), which comprises at least one photovoltaic cell and a layer of a film of a thermoplastic polyolefin copolymer disposed on a light-reactive surface of the photovoltaic cell; and    (4) manufacture of photovoltaic module, which involves contacting a primary facial surface of a primary film with the light-reactive facial surface of the photovoltaic cell (11) having at least one light-reactive surface and encapsulating the cell surface, contacting primary facial surface of secondary film optionally with the other facial surface of the photovoltaic cell and encapsulating the cell, contacting a top sheet layer with the secondary facial surface of the encapsulating film(s) applied to the light-reactive surface of cell, contacting a back sheet layer with the secondary facial surface of the film and laminating by compressing the layers with heating to a lamination temperature of 130-170 degrees C. The module has at least one photovoltaic cell having at least one light-reactive surface, at least one layer of glass, and at least one thermoplastic polyolefin copolymer encapsulating film.    DESCRIPTION OF DRAWING(S) - The drawing shows the schematic view of electronic device module.    Photovoltaic module (10)    Photovoltaic cell (11)    Encapsulant (12a,12b)    Glass (13)    Backsheet (14)