NOVELTY - Patterning (A) flexible substrate, comprises: (a1) providing carrier substrate (200) and forming release layer on carrier substrate; (a2) forming a flexible substrate film (204) on release layer; (a3) forming many UV blocking mask patterns (206a) covering various portions of the substrate film and release layer; (a4) performing UV lighting process to expose the substrate film and release layer; and (a5) performing debonding step so that various portions of the substrate film directly above various portions of release layer, not exposed to UV light, are separated from carrier substrate.    USE - The method is useful for patterning flexible substrate, which is used in flexible electronic display, flexible electronic touch panel, flexible solar cell, flexible electronic sensor, flexible bioprobe and other flexible devices.    ADVANTAGE - The method: utilizes many UV blocking mask patterns on a release layer and the subsequent UV lighting process to locally change the adhesion force between the release layer and the flexible substrate connected to each other; transforms release layer with large area into many release layer patterns with smaller area; precisely controls the positions of the release layer patterns; separates the flexible substrate formed on the release layer patterns and the UV treated release layer patterns into a many flexible substrates with smaller area; effectively prevents the conventional release layer patterns, which are formed by the evaporation, from diffusion and connecting with each other; provides patterned flexible substrates, which can maintain independency to each other; utilizing UV blocking mask patterns, which has UV resistant or UV absorption, electrical conduction or gas or hydraulic resistance, and which is used as an element of a subsequent formed flexible device e.g. gas or hydraulic layer or an electrode; and provides patterned flexible substrates and subsequent flexible devices with improved fabrication yield, high throughput and easy production.    DETAILED DESCRIPTION - Patterning (A1) flexible substrate, comprises: (a1) providing carrier substrate and forming a release layer on the carrier substrate; (a2) forming a flexible substrate film on the release layer; (a3) forming many UV blocking mask patterns covering various portions of the flexible substrate film and the release layer; (a4) performing UV lighting process to expose the flexible substrate film and the release layer which is not covered by the UV blocking mask patterns, to a UV light; and (a5) performing a debonding step so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to UV light, are separated from the carrier substrate. INDEPENDENT CLAIMS are also included for:    (1) patterning (B1) a flexible substrate, comprising (a1) as above per se, (b2) forming many UV blocking mask patterns covering various portions of the release layer, (b3) forming a flexible substrate film covering the UV blocking mask patterns and the release layer, (a4) and (a5) as above per se; and    (2) patterning (C1) a flexible substrate, comprising (a1) and (b2) as above per se, (c3) performing a UV lighting process to expose portions of the release layer which is not covered by the UV blocking mask patterns, to UV light, (c4) removing the UV blocking mask patterns, (c5) forming a flexible substrate film covering the release layer, and (a5) as above per se.    DESCRIPTION OF DRAWING(S) - The figure shows cross sectional view of method for patterning flexible substrate.    Carrier substrate (200)    Release layer patterns (202a)    Flexible substrate film (204)    UV blocking mask patterns (206a)    Separating step (214)