NOVELTY - An electroconductive copper paste comprises copper salt of aliphatic monocarboxylic acid, copper-powder, fine copper-powder, (dialkylamino) alkylamine and a first organic solvent, which has alcoholic hydroxyl group.    USE - Electroconductive copper paste for producing a sintered compact film (claimed) and forming a wiring layer and an electrode layer on the surface of an inorganic material substrate.    ADVANTAGE - The copper paste does not utilize a thermosetting resin component or glass frit, shows favorable electrically conductive characteristics, and can be conveniently used for forming wiring and electrode layer in a solar cell.    DETAILED DESCRIPTION - An electroconductive copper paste comprises copper salt of aliphatic monocarboxylic acid having a boiling point of 230-400 degrees C and obtained from aliphatic monocarboxylic acid (R1-COOH) (where R1 is not defined), copper-powder having an average particle diameter of 2-10 mu m, fine copper-powder having an average particle diameter of 0.2-1 mu m, (dialkylamino) alkylamine, which is liquid at room temperature and has a boiling point of 230-300 degrees C, and a first organic solvent, which is liquid at room temperature, has a boiling point of 200-400 degrees C, is not inherent in any reactive functional groups other than hydroxyl group and has alcoholic hydroxyl group. The copper paste is formed by dissolving a mixture of the copper salt of aliphatic monocarboxylic acid and first organic solvent in the (dialkylamino) alkylamine to form a liquid mixture, and dispersing the copper powder and fine copper-powder in the liquid mixture, heating the mixture at 300-400 degrees C and baking. Where the content ratio of the copper powder and a fine copper powder is 80: 20-60: 40 mass parts, the ratio of the sum total (W(copper carboxylate)) of the weight of the copper atom contained in the copper salt of an aliphatic monocarboxylic acid to total (W(copper-powder)+W(copper-fine-powder)) of the weight of the copper powder and a fine copper powder, (W(copper-powder)+W(copper-fine-powder)):(W(copper carboxylate)) is 100: 0.15-100: 0.7 mass parts, the ratio of the weight (W(dispersion medium)) of total (W(copper-powder)+W(copper-finepowder)) of the weight of the copper powder and a fine copper powder, and a first organic solvent, (W(copper-powder)+W(copper-fine-powder)):W(dispersion medium) is 100:2-100:10 mass parts, and the content ratio of the copper salt of the aliphatic monocarboxylic acid and the (dialkylamino) alkylamine is 2.2- 8 molecules (Per 1 molecule of copper salts of an aliphatic monocarboxylic acid). An INDEPENDENT CLAIM is also included for an use of the electroconductive copper paste for the production of a sintered compact film.