NOVELTY - The method involves heating portion of porous foam (10) that is intended to be in contact with substrate (12) that is made of aluminum. The heated portion of porous foam and substrate are contact together so that portion of substrate is heated sufficiently to melt or soften to infuse into pores of foam. The heated portion of foam is allowed to cool below melting point temperature, so that the heated portion of substrate material solidifies to create mechanical bond between substrate and foam while holding the heated portion of porous foam and substrate together.    USE - Method for bonding porous foam such as graphite foam, metal foam, and ceramic foam to substrate such as metal substrate, thermoset conductive plastic substrate, and composite substrate used in thermal application, nonthermal application, power electronics cooling system, transpiration/evaporative cooling system, heat exchanger, space radiator, cold plate, electromagnetic interference (EMI) and radio frequency (RF) shielding system, thermal and acoustic signature management system, ocean thermal energy conversion system, power generation system, alternative energy system, refrigeration system, cryogenics system, liquid natural gas regasification system, desalination system, and water production system (all claimed).    ADVANTAGE - The thermal and electrical resistance of the bond material can be increased by allowing heated portion of foam to cool below melting point temperature. The cost of bond material can be reduced and applied evenly. The labor intensity of the material can be reduced. The strength of the bond material can be improved. The weight of the bond material can be reduced.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for product for bonding porous foam to substrate.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the graphite foam direct bonded to the substrate.    Porous foam (10)    Substrate (12)    Single phase fluid flow (19)    Product (20)    Joint region (22)