TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: (I) further comprises copper particles, or its precursor, having a size of 10-500 nm. Preferred Components: The solvent has a boiling point of at least 5 degrees C higher than melting point of the gallium or indium metal or gallium or indium alloy. The metal is iridium. The alloy of indium and gallium comprises 70 wt.% of indium and 30 wt.% of gallium. The copper precursor metal is copper chloride, copper nitrate, a copper carboxylate compound of formula (Cu (OOCR)2), preferably copper acetate, copper beta -diketonate of formula (Cu(R1COCH2COR2)2), preferably copper acetylacetonate, copper alkoxide of formula (Cu(OR3)2), copper alkoxyamine compound of formula (Cu(OR4)2NR5) or an alcohol compound of formula (HOCH2CH2NR6R7). The metal precursor is copper alkoxides of formula (Cu(OCH2CH2)2NH), (Cu(OCH2CH2)2N-n-butyl) and/or (Cu(OCH2CH2)2N-ethyl).R, R1, R2 = linear 1-3C alkyl;R3 = linear 1-4C alkyl;R4 = linear 1-2C alkyl;R5 = H, linear 2C alcohol or linear 1-4C alkyl; andR7 = H, methyl, ethyl, propyl or butyl.Preferred Process: The process comprises: introducing particles of formed alloy of indium and gallium or mixing (I) with indium and gallium to form the desired alloy of indium and gallium, where the steps (b), (c) and (d) are carried out at 180 degrees C. The process further comprises, after step (c), adding particles of copper or the copper precursor particles. The depositing step is carried out by screen printing, coating or spraying of the emulsion. The metal is indium and the heating temperature in steps (b), (c) and (d) is 180 degrees C. The metal is gallium and the heating temperature in steps (b), (c) and (d) is 70 degrees C. The heat treatment step is carried out at greater than 120 degrees C to less than 300 degrees C for a period of 10-60 minutes. The process of depositing the film comprises depositing (I) on at least one surface of a substrate and heat treatment of the surface in the presence of vapor.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The surfactant is surfactants having at least one thiol function, cetyltrimethylammonium bromide, surfactant of the family of sorbitan monostearates, preferably Span (RTM: Sorbitan monostearate), surfactant of the family of polysorbates, preferably Tween (RTM: Surfactant of the family of polysorbate), Triton X100 (RTM: Octylphenol ethoxylate surfactant) (preferred) and/or a surfactant comprising pyrolidol group. In (I), 90% of liquid metal droplets have an average diameter of less than 1 mu m. The solvent is dodecanethiol. The volume ratio of surfactant/solvent is 10-4-10-2. EXAMPLE - Typical composition comprised of: gallium(0.3) (0.32 g); indium(0.7) (0.78 g); dodecanethiol (40 ml); and Triton X100 (RTM: Octylphenol ethoxylate surfactant) (250 mu l);