TECHNOLOGY FOCUS - INSTRUMENTATION AND TESTING - Preferred Components: In the device (D1) at least one stage is further disposed between the first stage and the final stage. The first stage and each stage between the first stage and the final stage, comprises a gas moving hole, where a number of the gas moving holes of the first stage and a number of gas moving holes of each stage between the first stage and the final stage increases from the first stage to the final stage and the number of the gas jetting holes is more than the number of the gas moving holes on a stage adjacent to the final stage. In the device (D1) a target substrate (100) is disposed opposite the gas jetting holes of a first gas jetting plate of the gas jetting plates, and the target substrate is disposed on a second gas jetting plate of the gas jetting plates. The device (D2) further comprises a cover disposed on the body and which covers the gas jetting unit. The gas jetting unit comprises: many gas jetting pipes, which jet the gas supplied from the body, and the gas jetting pipes are disposed on the body in a matrix, where each gas jetting pipe of the gas jetting pipes includes many gas jetting holes on a surface of it and the diameter of the gas jetting hole proximal to the body is less than a diameter of the gas jetting hole distal to the body in a vertical direction; or many gas jetting plates, which jet the gas supplied from the body, and each gas jetting plate comprises a first stage, which receives the gas supplied from the body, and a final stage, which comprises many gas jetting holes, which jet the gas. The target substrate is disposed: opposite the gas jetting holes of a first gas jetting pipe of the gas jetting pipes; in a vertical direction with respect to a surface of the body; or on a second gas jetting pipe of the gas jetting pipes. The stages are further disposed between the first stage and the final stage. The gas jetting device further comprises a body comprising the gas jetting plate, a cover disposed on the body, which covers the gas jetting plate, and the gas jetting plate is disposed in a vertical direction with respect to a surface of the body. The first electrode comprises a reflective conductive metal. The second electrode comprises a transparent conductive metal. The gas jetting unit includes many gas jetting pipes or many gas jetting plates, where each of the gas jetting pipe includes many gas jetting holes on a surface of it. In the method diameter of a gas jetting hole proximal to the body is less than a diameter of a gas jetting hole distal to the body in a vertical direction. The gas jetting device further comprises a cover disposed on the body and which covers the gas jetting unit. Preferred Method: The heat treatment is performed at 500-600 degrees C. In the method many stages are further disposed between the first stage and a final stage.