TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The precursor compound is a polymeric precursor compound. The polymeric precursor compounds is a (copper-indium-gallium-(di)selenide) (CIGS) precursor compound. The polymeric precursor compound is a CIGS, CIS or CGS precursor compound. The polymeric precursor compounds contain aluminum or silver atoms. The solution contains a sodium-indium compound comprising sodium-indium(selenium-n-butyl)4, sodium-indium(selenium-secondary-butyl)4, sodium-indium(selenium-iso-butyl)4, sodium-indium(selenium-n-propyl)4, sodium-indium(selenium-n-hexyl)4, sodium-gallium-selenium-n-butyl)4, sodium-gallium(selenium-iso-butyl)4, sodium-gallium(selenium-sec-butyl)4, sodium-gallium(selenium-n-propyl)4, sodium-gallium(selenium-n-hexyl)4, sodium(selenium-n-butyl), sodium(selenium-sec-butyl), sodium(selenium-iso-butyl), sodium(selenium-n-praseodymium, sodium(selenium-n-hexyl), sodium(selenium-n-butyl), sodium(selenium-sec-butyl), sodium(selenium-iso-butyl), sodium(selenium-n-propyl) or sodium(selenium-n-hexyl). The depositing is done by spraying, spray coating, spray deposition, spray pyrolysis, printing, screen printing, inkjet printing, aerosol jet printing, ink printing, jet printing, stamp printing, transfer printing, pad printing, flexographic printing, gravure printing, contact printing, reverse printing, thermal printing, lithography, electrophotographic printing, electrodepositing, electroplating, electroless plating, bath deposition, coating, wet coating, dip coating spin coating, knife coating, roller coating, rod coating, slot die coating, Meyer bar coating, lip direct coating, capillary coating, liquid deposition, solution deposition, layer-by-layer deposition, spin casting and/or solution casting. The substrate is a semiconductor, doped semiconductor, silicon, gallium arsenide, insulators, glass, molybdenum glass, silicon dioxide, titanium dioxide, zinc oxide, silicon nitride, metal, metal foil, molybdenum, aluminum, beryllium, cadmium, cerium, chromium, cobalt, copper, gallium, gold, lead, manganese, molybdenum, nickel, palladium, platinum, rhenium, rhodium, silver, stainless steel, steel, iron, strontium, tin, titanium, tungsten, zinc, zirconium, metal alloy, metal silicide, metal carbide, polymer, plastic, conductive polymer, copolymer, polymer blend, polyethylene terephthalate, polycarbonate, polyester, polyester film, mylar, polyvinyl fluoride, polyvinylidene fluoride, polyethylene, polyetherimide, polyethersulfone, polyetherketone, polyimide, polyvinylchloride, acrylonitrile butadiene styrene polymer, silicone, epoxy, paper and/or coated paper.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The solution is free from: hydrazine, hydrazine adducts and hydrazine derivatives; particulates or particles; compounds containing nitrogen or phosphorus atoms; and amine groups or compounds containing amines. The polymeric or monomer precursor compounds are dissolved in a hydrocarbon solvent. The ink is a solution of the compounds in an organic carrier comprising aliphatic hydrocarbons, aromatic hydrocarbons, pentane, hexane, heptane, octane, isooctane, decane, cyclohexane, p-xylene, m-xylene, o-xylene, benzene, toluene, xylene, ethers, diethyl ether, tetrahydrofuran, 2-methyltetrahydrofuran, siloxanes, cyclosiloxanes, silicone fluids, acetonitrile, esters, acetates, ethyl acetate, butyl acetate, acrylates, isobornyl acrylate, ketones, acetone, methyl ethyl ketone, cyclohexanone, cyclopentanone, lactams, N-methylpyrrolidone, N-(2-hydroxyethyl)-pyrrolidone, cyclic acetals, cyclic ketals, aldehydes, alcohol, methanol, ethanol, isopropyl alcohol, thiols, butanol, butanediol, glycerols, alkoxyalcohols, glycols, 1-methoxy-2-propanol, acetone, ethylene glycol, propylene glycol, propylene glycol laurate, ethylene glycol ethers, diethylene glycol, triethylene glycol monobutylether, propylene glycol monomethylether and/or 1,2-hexanediol. The solution contains M(alk)MB(ER3)4 or M(alk)(ER3).M(alk) = Li, Na or K; andR3 = alkyl or aryl.    TECHNOLOGY FOCUS - POLYMERS - Preferred Process: The process further comprises: heating the substrate at 100-450 degrees C to convert the precursor compounds to a material; annealing the substrate at 450-650 degrees C; depositing an ink containing indium(selenium-sec-butyl)3 after annealing, or treating the substrate in a chemical bath to deposit indium sulfide after annealing; annealing the substrate at 450-650 degrees C in the presence of selenium vapor; and depositing a polymeric precursor compound onto the substrate. Preferred Components: The ink further comprises one or more components comprising a surfactant, dispersant, emulsifier, antifoaming agent, dryer, filler, resin binder, thickener, viscosity modifier, antioxidant, flow agent, plasticizer, conductivity agent, crystallization promoter, extender, film conditioner and adhesion promoter. Preferred Definitions:    R1 = n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, pentyl or hexyl.