TECHNOLOGY FOCUS - POLYMERS - Preferred Assembly: Alternatively, the assembly comprises: a barrier film interposed between: a first polymeric film substrate having a coefficient of thermal expansion of up to 50 ppm/Kelvin, and a first major surface of a pressure sensitive adhesive layer, where the pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate, where the assembly is transmissive to visible and infrared light, and where the second polymeric film substrate is resistant to degradation by ultraviolet light. The ratio of the thickness of the first polymeric film to the second polymeric film is at least 5:2. The pressure sensitive adhesive layer has a tensile modulus of up to 3.4x108 Pascals. The assembly comprises a curl of up to 7/m. The pressure sensitive adhesive is at least one of an acrylate, a silicone, a polyisobutylene, or a urea pressure sensitive adhesive. The pressure sensitive adhesive further comprises at least one of a UV stabilizer, a hindered amine light stabilizer, and antioxidant, or a thermal stabilizer. The second polymeric film substrate comprises at least one of an ethylene-tetrafluoroethylene copolymer, a tetrafluoroethylene-hexafluoropropylene copolymer, a tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer, or polyvinylidene fluoride. The barrier film comprises at least first and second polymer layers separated by an inorganic barrier layer. The inorganic barrier layer is an oxide layer that shares a siloxane bond with at least one of the first or second polymer layers. Also, at least one of the first or second polymer layers comprises co-deposited silane and acrylate monomers. The barrier film has at least one of an oxygen transmission rate less than 0.005 g/m2/day at 23 degrees C and 90% relative humidity or a water vapor transmission rate less than 0.005 g/m2/day at 50 degrees C and 100% relative humidity. The assembly is disposed on, above, or around a photovoltaic cell. The first polymeric film substrate comprises at least one of polyethylene terephthalate, polyethylene naphthalate, polyetheretherketone, polyaryletherketone, polyarylate, polyetherimide, polyarylsulfone, polyethersulfone, polyamideimide, or polyimide, any of which may optionally be heat-stabilized. The ratio of a tensile modulus of the first polymeric film substrate to a tensile modulus of the second polymeric film substrate is at least 2 to 1. EXAMPLE - No suitable example given.