NOVELTY - Making a surface-mountable electrical circuit protection device (10) involves forming planar polymeric positive temperature coefficient resistive (PPTC) layer having predetermined electrical characteristics and physical dimensions including first and second major surfaces, forming a first electrode layer at the first major surface in intimate electrical contact therewith, and forming second electrode layer at second major surface in intimate electrical contact with it; forming first, second and third terminal electrodes (22, 23, 26) along at least one major edge wall of the device.    USE - For making a surface-mountable electrical circuit protection device (claimed), useful in circuit protection applications, include motors, batteries, battery chargers, loudspeakers, wiring harnesses in automobiles, telecommunications equipment and circuits, and other electrical and electronic components, circuits and devices.    ADVANTAGE - The direct metallic connection between the zener diode chip and polymeric positive temperature coefficient resistive resistor provides improved thermal transfer characteristics between the diode die and the polymeric positive temperature coefficient resistive material.    DETAILED DESCRIPTION - Making a surface-mountable electrical circuit protection device (10) involves forming a planar polymeric positive temperature coefficient resistive (PPTC) layer having predetermined electrical characteristics and physical dimensions including first and second major surfaces, forming a first electrode layer at the first major surface in intimate electrical contact therewith, and forming a second electrode layer at the second major surface in intimate electrical contact with it; forming first, second and third terminal electrodes (22, 23, 26) along at least one major edge wall of the device, where the first terminal electrode being in electrical connection with the first electrode layer, the second terminal electrode being in electrical connection with the second electrode layer, and the third terminal electrode being electrically isolated from the first and second terminal electrodes; bonding a first metallized face of at least one heat-generating electrical element to a part of the first electrode layer arranged to receive the heat-generating electrical element; and connecting a second metallized face of the heat-generating electrical element to the third terminal electrode with an interconnect structure.    DESCRIPTION OF DRAWING(S) - The figure shows an enlarged isometric view of surface-mountable electrical circuit protection device.    Surface-mountable electrical circuit protection device (10)    Planar parallel-connected polymeric positive temperature coefficient resistive resistor elements (16, 18)    Zener diode element (20)    Terminal electrodes (22, 24, 26)    Semi-cylindrical vias (23, 25, 27)    Top dielectric layer (28)