NOVELTY - Manufacturing electronic apparatus, comprises depositing first conductive medium on base to form at least one first conductor (110), depositing many semiconductor substrate particles suspended in carrier medium, forming ohmic contact (265) between substrate particles and first conductor, forming p-n junction in particle by depositing dopant and annealing to form many semiconductor diodes (155), depositing second conductive medium to form at least one second conductor coupled to semiconductor diodes, and depositing many substantially spherical lenses suspended in first polymer over diodes.    USE - The methods are useful for manufacturing an electronic apparatus including lighting device having LEDs or a power generating device having photovoltaic diodes.    ADVANTAGE - The methods provide electronic apparatus which are robust and can be manufactured in less expensive manner.    DETAILED DESCRIPTION - Manufacturing an electronic apparatus, comprises either: depositing a first conductive medium on a base to form at least one first conductor (110), depositing many semiconductor substrate particles suspended in a carrier medium, forming an ohmic contact (265) between the semiconductor substrate particles and the first conductor, forming a p-n junction in each semiconductor substrate particle by depositing a dopant onto the semiconductor substrate particles and annealing the semiconductor substrate particles to form many semiconductor diodes (155), depositing a second conductive medium to form at least one second conductor coupled to the semiconductor diodes, and depositing many substantially spherical lenses suspended in a first polymer over the diodes, where the spherical lenses have at least a first index of refraction and the first polymer have at least a second, different index of refraction; or printing a first conductive medium within many cavities of a base to form many first conductors, printing within the cavities many substantially spherical substrate particles suspended in a carrier medium, printing a dopant on first, upper portion of the substantially spherical semiconductor substrate particles, annealing the doped substantially spherical semiconductor substrate particles to form many spherical diodes having at least a partially hemispherical shell p-n junction, printing an electrically insulating medium over a first portion of the substantially spherical diodes, printing a second conductive medium over a second portion of the substantially spherical diodes to form many second conductors, and printing many substantially spherical lenses suspended in a first polymer over the substantially spherical diodes, where the substantially spherical lenses have at least a first index of refraction and the first polymer have at least a second, different index of refraction.    DESCRIPTION OF DRAWING(S) - The figure shows a cross-sectional view of the base with many first conductors and diodes for an apparatus.    First conductors (110)    Insulators (135)    Semiconductor diodes (155)    Ohmic contact (265)    Conductive vias (280)