NOVELTY - The ultrasonic bonding system comprises a bond head assembly carrying an ultrasonic bonding tool (108), a conductive material supply, a conductive material feeding system for guiding a length of the conductive material supply to a position proximate to the ultrasonic bonding tool, and a vapor generation system for supplying a vapor proximate to the ultrasonic bonding tool. The vapor includes a carrier gas and a lubricating vapor. The vapor generation system includes a bubbler feeding the vapor to an outlet proximate to the ultrasonic bonding tool.    USE - The ultrasonic bonding system such as wire bonding and ribbon bonding is useful for providing electrical interconnection between two or more locations in processing and packaging of devices including semiconductors, power packages and solar devices.    ADVANTAGE - The ultrasonic bonding system exhibits high bond reliability.    DETAILED DESCRIPTION - The ultrasonic bonding system comprises a bond head assembly carrying an ultrasonic bonding tool (108), a conductive material supply, a conductive material feeding system for guiding a length of the conductive material supply to a position proximate to the ultrasonic bonding tool, and a vapor generation system for supplying a vapor proximate to the ultrasonic bonding tool. The vapor includes a carrier gas and a lubricating vapor. The vapor generation system includes a bubbler feeding the vapor to an outlet proximate to the ultrasonic bonding tool, and supplies the vapor within a vapor containment structure. The outlet is carried by the bond head assembly. The vapor containment structure encloses the bond head assembly. The conductive material supply includes a conductive ribbon supply and/or a wire supply. INDEPENDENT CLAIMS are included for:    (1) a system for processing a conductive material; and    (2) a method of processing a conductive material in connection with an ultrasonic bonding system.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic side view of an ultrasonic bonding system.    Bonding surface (102)    Workpiece (104)    Bonding tool (108)    Ribbon spool (112)    Bond site area. (116)