TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Method: The method further involves filtrating, washing and drying after the reaction is accomplished. Preferred Components: The copper source solution is a copper salt solution or a cuprous salt solution. The chelating agent is a bidentate chelating agent, a tridentate chelating agent, a tetradentate chelating agent or a hexadentate chelating agent (preferably bidentate chelating agent). The bidentate chelating agent is HOOC-(CR1R2)n-COOH or R3R4N-(CR1R2)n-NR'3R'4 (preferably ethylmalonic acid, N,N-dimethylethylenediamine, trimethylenediamine or ethylenediamine). The tridentate chelating agent is NR3R4-(CR1R2)n-NR5R6-(CR'1R'2)m-NR'3R'4, R3N((CR1R2)nCOOH)2 or R3N((CR1R2)OH)2 (preferably diethanolamine, diethylenetriamine or aminodiacetic acid). The tetradentate chelating agent is N((CR1R2)nCOOH)3 or N((CR1R2)nOH)3 (preferably triethanolamine or ammoniatriacetic acid). The hexadentate chelating agent is (HOOC-(CR3R4)n)2N-(CR1R2)m-N((CR'3R'4)rCOOH)2 (preferably ethylenediamine tetraacetic acid or ethylenediaminetetrapropionic acid).R1 to R4, and R'1-R'4=H or 1-6C alkyl;m, n and r=1-6.The first sulfur-based reducing agent is sodium hydrogen sulfite or sodium sulfide, and the second sulfur-based reducing agent is sodium sulfide or sodium thiosulfate. The concentration of the copper source solution is 0.05-1.00M. The mixture solution comprises chelating agent in a concentration of 0.05-1.00M; the first sulfur-based reducing agent in a concentration of 0.05-1.00M; and the second sulfur-based reducing agent in a concentration of 0.05-1.00M. EXAMPLE - 0.05 M of copper sulfide solution (CuSO4.5H2O) was prepared and heated until the temperature reached to 65 degrees C. Then, at the same temperature, ethylenediamine (0.05 M) was added into the copper sulfide solution and stirred to form a mixture solution. Subsequently, sodium hydrogen sulfite and sodium sulfide at a concentration of 0.05 M respectively, were added in the mixture solution in sequence to perform reaction for 5 seconds at 65 degrees C. After the completion of reaction, a powder-like product was obtained by filtration, deionized water washing and drying. The microstructure of the resultant products was observed under a scanning electron microscope (SEM). The obtained porous copper sulfide nano/micrometer hollow spheres had a diameter of 300-700 nm and through holes. The through holes had polygon-like cross sections, and the average distance between adjacent through holes of 80-130 nm.