TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The semiconductor substrate particles comprise gallium nitride, gallium arsenide or silicon.    TECHNOLOGY FOCUS - INSTRUMENTATION AND TESTING - Preferred Method: The method further comprises: partially curing the first conductive medium, where the step of forming the ohmic contact further comprises fully curing the first conductive medium; depositing many third conductors over or within the second conductors; depositing many inorganic dielectric particles suspended with a photoinitiator compound in a second polymer or resin to form many insulators (135) correspondingly coupled to each of the diodes; and attaching an interface for insertion into a standardized lighting socket. The step of depositing the substantially spherical lenses suspended in the first polymer further comprises attaching a prefabricated layer to the semiconductor diodes, where the prefabricated layer comprises the substantially spherical lenses suspended in the first polymer. The step of depositing the first conductive medium comprises sputtering, coating, vapor depositing or electroplating a metal, metal alloy or combination of metals. The carrier medium is: a reactive carrier medium, where the step of forming the ohmic contact further comprises removing the reactive carrier medium and curing or re-curing the first conductive medium; or anisotropic carrier medium, where the step of forming the ohmic contact further comprises compressing the semiconductor substrate particles suspended in the anisotropic conductive medium. The step of forming the ohmic contact further comprises annealing or alloying the semiconductor substrate particles with the at least one first conductor. The step of annealing or alloying is laser or thermal annealing or alloying. The dopant is deposited on a first, upper portion of the semiconductor substrate particles, where 15-55% of a surface of each semiconductor diode of substantially all the semiconductor diodes has a layer or region having a first majority carrier or dopant and the remaining diode substrate has a second majority carrier or dopant. The step of depositing the second conductive medium further comprises: depositing an optically transmissive conductor or conductive compound suspended in a polymer, resin or other media, where the optically transmissive conductor or conductive compound suspended in a polymer, resin or other media further comprises at least one of carbon nanotubes, antimony tin oxide, indium tin oxide or polyethylenedioxythiophene. The step of depositing further comprises at least one type of deposition including printing, coating, rolling, spraying, layering, sputtering, lamination, screen printing, inkjet printing, electro-optical printing, electroink printing, photoresist printing, thermal printing, laser jet printing, magnetic printing, pad printing, flexographic printing, hybrid offset lithography or Gravure printing. Preferred Components: The semiconductor diodes are substantially spherical, substantially toroidal, substantially cylindrical, substantially faceted, substantially rectangular, substantially flat or substantially elliptical. The semiconductor diodes are substantially spherical, where a ratio of a mean diameter of the substantially spherical lenses to a mean diameter of the semiconductor diodes is substantially 5:1 or 10:1-2:1. The semiconductor diodes are substantially spherical, where the comparative size or spacing of the substantially spherical lenses provides a mode coupling to the semiconductor diodes. In the method a mean diameter or length of the semiconductor diodes is 20-40 microns. The first conductive medium comprises a conductive ink or a conductive polymer. The dopant material is a substrate liquid or film or a dopant element or compound suspended in a carrier. The resulting semiconductor diodes are LEDs or photovoltaic diodes. The base further comprises: a Bragg reflector or a reflective plastic or polyester coating; many conductive vias (280) extending between a first side and a second side of the base and correspondingly coupled at the first side to the first conductors; and a conductive backplane coupled to the conductive vias and coupled to or integrated with the second side of the base. The interface is compatible with: an E12, E14, E26, E27 or GU-10 lighting standard; a standard Edison-type lighting socket; and a standard fluorescent-type lighting socket.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The base comprises at least one of paper, coated paper, plastic coated paper, embossed paper, fiber paper, cardboard, poster paper, poster board, wood, plastic, rubber, fabric, glass and/or ceramic. The substantially spherical lenses comprise borosilicate glass or polystyrene latex. EXAMPLE - No suitable example given.