TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Component: The inorganic thin-film packaging material is metal oxide, metal sulfide, or metal nitride. The metal oxide comprises calcium oxide, tantalum pentoxide, titanium dioxide, zirconium dioxide, copper oxide, zinc oxide, aluminum sesquioxide, dichromium trioxide, tin dioxide, nickel oxide, or antimony pentoxide. The metal sulfide comprises titanium disulfide, iron sulfide, dichromium trisulfide, copper sulfide, zinc sulfide, tin bisulfide, nickel sulfide, dicobalt trisulfide, diantimony trisulfide, lead sulfide, dilanthanum trisulfide, cerium sulfide, or disulfide zirconium. The metal nitride comprises silicon nitride or aluminum nitride.    TECHNOLOGY FOCUS - POLYMERS - Preferred Component: The reacting thinner is active epoxy resin thinner, cyclic ether, cyclic lactone, or vinyl ether monomer. The vinyl ether monomer comprises 1,2,3-propanetriol glycidyl ether, triethylene glycol divinyl ether, 1,4-butanediol ether, cyclohexyl vinyl ether, perfluoro n-propyl ethylene ether, isobutyl vinyl ether, hydroxybutyl vinyl ether, vinyl ethyl ether, ethyl vinyl ether, ethyl vinyl ether propylene, ethylene glycol single allyl ether, hydroxybutyl vinyl ether, butyl vinyl ether, chlorotrifluoro ethylene, triethylene glycol divinyl ether, vinyl methyl ether, vinyl n-butyl ether, dodecyl vinyl ether, cyclohexyl vinyl ether, benzyl phenol polyoxyethylene ether, tetrafluoroethylene-full-fluorine propyl vinyl ether, tetrafluoroethylene-full-fluorine propyl vinyl ether, or butyl vinyl ether. The active epoxy resin diluent comprises 3,4-epoxy cyclohexyl formic acid-3',4'-epoxy cyclohexyl methyl ester, bisphenol A type epoxy resin, epoxy acrylate, epoxy vinyl ester, acrylic epoxy ester, glycidyl methacrylate, or acid water soluble itaconic epoxy resin. Preferred Method: The method comprises preparing optoelectronic device; preparing inorganic packaging material layer on optoelectronic device; preparing UV photo-curing resin layer on inorganic packaging material layer; performing UV photo-curing on rigid substrate surface for 30 seconds; repeating step from preparing packaging material layer until UV photo-curing on device for several times; and testing service life of packaged device and other parameters. The packaging layers of inorganic packaging material and UV photo-curing resin are formed by vacuum deposition, ion cluster beam deposition, ion plating, direct current sputtering coating, radio frequency sputtering coating, ion beam sputtering coating, ion beam assisted deposition, plasma enhanced chemical vapor deposition, high-density inductance-coupling plasma source chemical vapor deposition, catalytic chemical vapor deposition, magnetron sputtering, spray ink printing, electroplating, spraying, spin coating, dip coating, roller coating, or Langmuir-Blodgett film processing.