TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Compounds: The moisture absorbent is phosphorus pentoxide, lithia, sodium oxide, barium oxide, calcium oxide, magnesium oxide, lithium sulfate, sodium sulfate, calcium sulfate, magnesium sulfate, cobalt sulfate, gallium sulfate, titanium sulfate, nickel sulfate, calcium chloride, magnesium chloride, strontium chloride, yttrium chloride, copper chloride, cesium fluoride, tantalum fluoride, niobium fluoride, lithium bromide, calcium bromide, cerium bromide, selenium bromide, vanadium bromide, magnesium bromide, barium iodide, magnesium iodide, barium perchlorate, magnesium perchlorate, aluminum 2-ethylhexanoate, and/or barium 2-ethylhexanoate.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Compounds: The adhesive composition further comprises a photoinitiator (0.1-20 parts weight) chosen from acetophenone type, benzoin type, benzophenone type, iodonium type, and sulfonium type, and a thermosetting hardener (1-100 parts weight) chosen from amine compound, imidazole compound, phenolic compound, phosphorus compound, and acid anhydride compound.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The curable resin is an acrylic resin and/or an epoxy resin. The acrylic resin comprises mono (meth)acrylate chosen from alkyl (meth)acrylate, alkylene acrylate, and acrylamide, and/or polyfunctional acrylate chosen from alkyl di(meth)acrylate, alkyl tri(meth)acrylate, alkyl tetra(meth)acrylate, polyether (meth)acrylate, silicone diacrylate, and urethane diacrylate. The epoxy resin is cresol novolak epoxy resin, bisphenol A type epoxy resin, bisphenol A type novolak epoxy resin, phenol novolak epoxy resin, tetrafunctional epoxy resin, biphenyl type epoxy resin, triphenylmethane type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, dicyclopentadiene-modified phenol type resin, and/or urethane-modified epoxy resin. The content of resin is 100 parts weight and the content of moisture absorbent is 5-50 parts weight. The adhesive composition further comprises a binder resin.