NOVELTY - Device for generating a targeted flow- and flow density pattern during chemical and/or electrolytic surface treatment of a substrate (4) in a fluidic process solution, comprises a flow distributor body (1) with a front side facing the substrate during the surface treatment and a back side, where the flow distributor body comprises at least one inlet opening (5) for the process solution, at least one fluid passage exhibiting at least one outlet opening (8) for generating an inflow on the substrate, and at least one connecting passage for receiving a back flow of the substrate.    USE - The device is useful for generating a targeted flow- and flow density pattern during chemical and/or electrolytic surface treatment of a substrate in a fluidic process solution, for processing structured semiconductor substrates, printed circuit boards and film substrates, and the entire surface processing of metallic and metallized planar workpieces, and also for producing larger flat photoelectric plates for solar energy production or large-sized display plates.    ADVANTAGE - The device allows homogeneous liquid flow on all reactive surface elements of the substrate surface, and simultaneously targeted distribution of an electric field between the substrate and the counter electrode.    DETAILED DESCRIPTION - Device for generating a targeted flow- and flow density pattern during chemical and/or electrolytic surface treatment of a substrate (4) in a fluidic process solution, comprises a flow distributor body (1) with a front side facing the substrate during the surface treatment and a back side opposite the front side, where the flow distributor body comprises at least one inlet opening (5) for the process solution and at least one fluid passage, which exhibits at least one outlet opening (8) at the front side for generating an inflow on the substrate. The flow distributor body exhibits at least one connecting passage for receiving a back flow of the substrate that runs from the front side to the back side. An INDEPENDENT CLAIM is also included for generating the targeted flow- and flow density pattern during chemical and/or electrolytic surface treatment of the substrate in the fluidic process solution, comprising: (a) introducing the flow distributor body with the liquid passage into the fluidic process solution; (b) aligning the flow distributor body in such a manner that its front side is coplanar to the substrate to be processed; and (c) pumping the process solution by the inlet opening in such a manner that the process solution is applied as the inflow on the substrate by the outlet opening, and discharged as the back flow by the connecting passage.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic side view of the device.    Flow distributor body (1)    Substrate (4)    Inlet opening (5)    Outlet opening (8)    First electrode (11)