NOVELTY - A heat conductive pressure-sensitive-adhesive composition comprises (meth)acrylic resin composition (A) containing (meth)acrylate polymer (A1) and (meth)acrylate monomer mixture (A2) essentially containing polyfunctional monomer and (meth)acrylate monomer capable of forming homopolymer, flame-retardant inorganic compound (B) capable of performing titanate process, metal weak-acid-salt (D) of groups I, II, XII or XIII, and polymerization initiator (C). The polymerization and crosslinking reaction of (meth)acrylate monomer mixture (A2) in mixing composition are performed.    USE - Heat conductive pressure-sensitive-adhesive composition is used for sheet-like molded product for electronic component (all claimed) e.g. plasma display panel and integrated circuit chip. Uses include but are not limited to carpet, sealing agent of photovoltaic cell, back sheet of solar cell, automatic vending machine, electrophotographic copier, electrophotographic printer, reflective sheet of cold cathode fluorescent lamps, game machine notebook personal computer, optical semiconductor device, mobile telephone and motor vehicle.    ADVANTAGE - The sheet-like molded product formed using heat conductive pressure-sensitive-adhesive composition has excellent flexibility, thermal resistance and heat conductivity.    DETAILED DESCRIPTION - A heat conductive pressure-sensitive-adhesive composition comprises (in parts mass) (meth)acrylic resin composition (A) (100) containing (meth)acrylate polymer (A1) (5-40 %mass) and (meth)acrylate monomer mixture (A2) (60-95 %mass) essentially containing polyfunctional monomer and (meth)acrylate monomer capable of forming homopolymer and having glass transition temperature of -20 degrees C or less, flame-retardant inorganic compound (B) (100-550) capable of performing titanate process, metal weak-acid-salt (D) (30-550) of groups I, II, XII or XIII, and polymerization initiator (C) (0.01-10). The polymerization and crosslinking reaction of (meth)acrylate monomer mixture (A2) in the mixing composition are performed. INDEPENDENT CLAIMS are included for the following:    (1) heat conductive pressure-sensitive-adhesive sheet-like molded product, which is obtained by molding the mixing composition containing components (A)-(D) in sheet form while performing polymerization and crosslinking reaction of (meth)acrylate monomer mixture (A2);    (2) manufacture of heat conductive pressure-sensitive-adhesive composition, which involves mixing components (A)-(D), and performing polymerization and crosslinking reaction of (meth)acrylate monomer mixture (A2); and    (3) electronic component, which is formed by laminating heat conductive pressure-sensitive-adhesive composition on a thermal radiation component, or laminating heat conductive pressure-sensitive-adhesive sheet-like molded product on thermal radiation component.