TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The adhesive comprises the electrically conductive particles at 70-90 wt.%. Preferred Components: The electrically conductive particles are metal particles, metal plated particles and/or metal alloy particles. The electrically conductive particles comprise copper, silver, platinum, palladium, gold, tin, indium, aluminum and/or bismuth. The electrically conductive particles have an average particle size of 2-20 mu m. The metal precursor is obtained by reacting at least one metal or metal compound with at least one heteroatom-containing ligand. The metal compound is metal oxides, metal halogenides, metal cyanides, metal cyanates, metal carbonates, metal nitrates, metal nitrites, metal sulfates, metal sulfites, metal sulfides, metal phosphates, metal thiocyanates, metal chlorates, metal perchlorates, metal borates, metal fluoroborates, metal amides, metal alkoxides, metal acetylacetonates and/or metal carboxylates (preferably silver carboxylates).    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The thermosetting resin is epoxy resins (preferred), benzoxazine resins, acrylate resins, bismaleimide resins, cyanate ester resins and/or polyisobutylene resins. The heteroatom-containing ligand is N-donor ligands, O-donor ligands and/or S-donor ligands. The heteroatom-containing ligand is a N-donor ligand comprising amine-functionalized polyethers, primary amines of formula (Ra-(NH2)u), secondary amines of formula (Rb-NH-Bb1), and tertiary amine compound of formula (Rc-N(-Rc1a)-Rc1). The inwardly facing surface has a surface area less than 5000 mu m2.u = 1-4;Ra = optionally saturated 4-22C hydrocarbon residue;Rb, Rb1 = optionally saturated 3-22C hydrocarbon residues; andRc, Rc1, Rc1a = optionally saturated 3-22C hydrocarbon residues. EXAMPLE - Typical composition comprised (wt.%): thermosetting epoxy silicone resin (1.60); micron sized electrically conductive particles (12.80); metal precursor obtained by n-octylamine (2.58 g) were added to a solution of silver acetate (1.7 g) in butyl glycol acetate/oleic acid (0.47 ml). The reaction mixture was stirred for 1 minutes at 22 degrees C to form metal precursor (0.94); dodecyl succinic anhydride (0.40); viscosity (340.8); and contact resistance (479).