NOVELTY - The method comprises depositing an organic semiconductor layer having an orientation to a first electrode on a substrate (11) or on another organic semiconductor layer, where the organic semiconductor layer comprises complexes disposed on a boundary between a first layer (35a, 36a) and a second layer. The first layer comprises a salt providing the central cations for the complexes. The second layer comprises molecules that are the ligands of the complexes, where complex formation takes place when the second layer is deposited on the first layer.    USE - The method is useful for manufacturing an organic semiconductor component such as a LED, photo detectors, solar cells and organic field effect transistor.    ADVANTAGE - The method is capable of efficiently manufacturing the organic semiconductor component with enhanced conductivity.    DETAILED DESCRIPTION - The method comprises depositing an organic semiconductor layer having an orientation to a first electrode on a substrate (11) or on another organic semiconductor layer, where the organic semiconductor layer comprises complexes disposed on a boundary between a first layer (35a, 36a) and a second layer. The first layer comprises a salt providing the central cations for the complexes. The second layer comprises molecules that are the ligands of the complexes, where complex formation takes place when the second layer is deposited on the first layer. The step of depositing the organic semiconductor layer to the first electrode comprises depositing the first layer or the first layers to a thickness of 2 nm so that a change in surface potential in the underlying electrode surface or surface of the further organic semiconductor layer is established. The second layer or second layers is/are deposited up to a maximum thickness of 20 nm. The ligands are deposited along with the further organic semiconductor material. An INDEPENDENT CLAIM is included for an organic semiconductor component.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of stacked layers of an organic semiconductor component.    Organic semiconductor component (10)    Substrate (11)    Electrode layer (12, 13)    Encapsulation (14)    First layer. (35a, 36a)