NOVELTY - A particle composition is formed by pulverizing aggregated-form composition comprising (meth)acrylic resin composition (A1) containing (meth)acrylic acid ester polymers (AE1), and (meth)acrylic acid ester monomer mixture (( alpha )1) containing polyfunctional monomer essentially containing (meth)acrylic acid ester monomer capable of forming homopolymer, expanded graphite powder (B), and polymerization initiator (C1). The polymerization and crosslinking reaction of (meth)acrylic acid ester monomer mixture (( alpha )1) in the mixed composition are carried out.    USE - Particle composition is used for manufacturing heat conductive pressure-sensitive-adhesive composition for manufacturing sheet-like molded product (all claimed). Uses include but are not limited to fuel cell, semiconductor device, game machine, capacitor, organic electroluminescent display, notebook personal computer, sealing agent for photovoltaic cell, carpet, electrophotographic printer, and automatic vending machine.    ADVANTAGE - The sheet-like molded product formed using the particle composition has excellent productivity, and reduced thermal resistance in thickness direction, and can be manufactured by simple method.    DETAILED DESCRIPTION - A particle composition is formed by pulverizing an aggregated-form composition comprising (in parts mass) (meth)acrylic resin composition (A1) (100) containing (meth)acrylic acid ester polymers (AE1) (5-70 %mass), and (meth)acrylic acid ester monomer mixture (( alpha )1) (30-95 %mass) containing polyfunctional monomer essentially containing (meth)acrylic acid ester monomer capable of forming homopolymer and having glass transition temperature of -20 degrees C or less, expanded graphite powder (B) (100-650) having average particle diameter of 2-60 mu m, and polymerization initiator (C1) (0.01-10). The polymerization and crosslinking reaction of (meth)acrylic acid ester monomer mixture (( alpha )1) in the mixed composition are carried out. INDEPENDENT CLAIMS are included for the following:    (1) heat conductive pressure-sensitive-adhesive composition, which comprises (in parts mass) (meth)acrylic resin composition (A2) (100) containing (meth)acrylic acid ester polymers (AE2) (5-30 %mass), and (meth)acrylic acid ester monomer mixture (( alpha )2) (70-95 %mass) containing polyfunctional monomer essentially containing (meth)acrylic acid ester monomer capable of forming homopolymer and having glass transition temperature of -20 degrees C or less, particle composition (20-200), and polymerization initiator (C2) (0.01-10), The polymerization and crosslinking reaction of (meth)acrylic acid ester monomer mixture (( alpha )2) are carried out in the mixed composition;    (2) heat conductive pressure-sensitive-adhesive sheet-like molded product, which is obtained by molding the heat conductive pressure-sensitive-adhesive composition in a sheet form;    (3) manufacture of particle composition, which involves mixing components (A1), (B) and (C1), polymerization and crosslinking (meth)acrylic acid ester monomer mixture (( alpha )1) in component (A1), obtaining aggregated-form composition, and pulverizing to particle form;    (4) manufacture of heat conductive pressure-sensitive-adhesive composition, which involves mixing components (A2), (D) and (C2), and polymerization and crosslinking the (meth)acrylic acid ester monomer mixture (( alpha )2) in component (A2);    (5) manufacture of heat conductive pressure-sensitive-adhesive sheet-like molded product; and    (6) electronic component, which is formed by laminating heat conductive pressure-sensitive-adhesive composition on thermal radiation component, or laminating heat conductive pressure-sensitive-adhesive sheet-like molded product on thermal radiation component.