NOVELTY - The method comprises exposing a first side of a photovoltaic (PV) module substrate (12) to a light source (32) such that light shines through the substrate and voids (26) in semiconductor material layers (27) on an opposite side of the PV module substrate, where the voids include scribe lines and/or pinhole defects, detecting the light transmitted through the voids using a light detector (40), and controlling a printer in dependence upon the detected light and then filling the voids with a printable dielectric material (38) dispensed by the printer.    USE - The method is useful for depositing a dielectric material into voids in semiconductor material layers of a substrate such as glass sheet for manufacturing a thin film photovoltaic module such as solar panels or solar module, where the dielectric material is an insulating ink, resin, epoxy, adhesive or any other type of material.    ADVANTAGE - The method is capable of uniformly and efficiently depositing the dielectric material into voids in semiconductor material layers of the substrate thus reducing the manufacturing cost and number of manufacturing steps of the module.    DETAILED DESCRIPTION - The method comprises exposing a first side of a photovoltaic (PV) module substrate (12) to a light source (32) such that light shines through the substrate and voids (26) in semiconductor material layers (27) on an opposite side of the PV module substrate, where the voids include scribe lines and/or pinhole defects, detecting the light transmitted through the voids using a light detector (40), and controlling a printer in dependence upon the detected light and then filling the voids with a printable dielectric material (38) dispensed by the printer. The substrate is conveyed in a linear direction, and is held stationary as the printer to traverse the length and width of the substrate to fill the voids. The printer is moved in a back-and-forth direction relative to the linear direction to fill the voids across the width of the substrate. A corresponding print image or file is transmitted to a downstream printer that prints the image or file with the dielectric material to fill the voids. The method further comprises conducting a subsequent light transmission test through the substrate to determine if the voids are satisfactorily filled. The printer provides feedback corrective signal from the subsequent transmission test, and is controlled to dispense a fixed thickness of the dielectric material regardless of the size of the scribe lines or pinholes and to dispense a variable amount of the dielectric material as a function of the size of the scribe lines or pinholes. An INDEPENDENT CLAIM is included for a system for depositing a dielectric material into voids in semiconductor material layers of a photovoltaic module substrate.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic view of a method for filling voids in a photovoltaic module substrate with a dielectric material.    Substrate (12)    Voids (26)    Semiconductor material layer (27)    Light source (32)    Dielectric material (38)    Light detector. (40)