NOVELTY - Reactive conductive adhesive tape comprises: a reactive adhesive layer comprising a curable pressure sensitive adhesive, and a conductive filler; and an electrically conductive substrate, where the adhesive layer is laminated on and in contact with the electrically conductive substrate, and a cure profile of the adhesive layer is pre-selected to correspond to that of a photovoltaic cell fabrication process.    USE - The tape is useful for constructing a photovoltaic cell, preferably a crystalline silicon, polycrystalline silicon, inorganic thin film or organic photovoltaic cell.    ADVANTAGE - The tape exhibits high reliability and high conductivity (i.e. low joint resistance) under harsh conditions and high temperatures. The tape is more elastic and less viscous. The tape has a cure profile that corresponds to that of a photovoltaic cell fabrication process so that the curing step does require exposure to curing conditions that would cause damage to the photovoltaic cell or its components. The tape can be cured simultaneously with other curing steps in the cell fabrication process, hence reduces the total time and number of manufacturing steps needed to construct the cell, and additional discrete cure and/or heat tacking steps are not required. The tape provides benefits such as immediate room temperature, low pressure assembly and fixturing. The tape exhibits good peel strength, little risk of moving or becoming unstuck during other cell fabrication steps prior to curing.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for:    (1) constructing a photovoltaic cell comprising applying the reactive conductive adhesive tape as an electrical interconnect to a photovoltaic cell, and curing the adhesive layer of the reactive conductive adhesive tape during fabrication of the photovoltaic cell; and    (2) a reactive conductive pressure sensitive adhesive composition comprising a curable pressure sensitive adhesive and a conductive filler, where the adhesive composition has a peel strength of at least about 2.7 N/cm in an uncured state and a glass transition temperature of -50 degrees C to -10 degrees C in an uncured state.