TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The paste composition contains (wt.%): conductive powder (50-90), organic vehicle (10-50), additive (0.1-20), and glass frit (0-20). The paste composition is a glass frit-free paste composition or a lead-free paste composition. Preferred Components: The additive includes at least one of silicon, silicon oil, silicon resin, silicon acetate, silicon nitride, silicon oxide and silicon carbide. The additive has a mean grain size of 1-10 mu m. The conductive powder includes aluminum powder.    TECHNOLOGY FOCUS - METALLURGY - Preferred Components: The additive includes at least one of Cu, Mg, Ni and an alloy including one of Cu, Mg and Ni, where the alloy includes at least one of metal oxide and metal additive salt.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The silicon oil includes at least one of dimethyl silicon oil, methyl phenyl silicon oil, cyclic polydimethylsiloxane, and modified silicon oil.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The silicon resin has a siloxane bonding. EXAMPLE - An organic vehicle was prepared by dissolving the binder in the solvent. The solvent was prepared by mixing diethylene glycol monobutyl ether acetate with a terpineol and an ethyl cellulous binder was used as the binder. Then, the aluminum powder (conductive powder) and the silicon oil (additive) were added to and mixed with the organic vehicle. After aging the mixture for 12 hours, the aged mixture was secondarily mixed and dispersed by using the 3-roll mill. Then, the mixture was filtered and defoamed, thus preparing the aluminum paste composition. At this time, the paste composition was comprised of the organic vehicle (26 wt.%), aluminum powder (73 wt.%) and silicon oil (1 wt.%). The paste composition was coated on the silicon substrate having the thickness of 200 degrees C through the screen printing scheme and then dried for 2 minutes under the temperature of 200 degrees C. After that, the paste composition was subject to the rapid thermal process for 30 seconds under the temperature of 900 degrees C, thus forming the rear electrode.