NOVELTY - The process comprises preparing a substrate (100, 110) during which a textured surface of a substrate is made electrically conductive, coating a layer of printable material (120) on the textured surface during which the layer is disposed on the electrically conductive textured surface, pressing a mold (130) including trough or projections so as to transfer the trough or projections in the layer of printable material to form electrically conductive or semiconductive patterns, removing the mold from the layer of printable material, and exposing the textured surface at a bottom of the patterns.    USE - The process is useful for producing electrically conductive or semiconductive patterns on a textured surface, which includes reliefs, of a substrate in the manufacture of a semiconductor device or a photovoltaic cell (all claimed), which is a heterojunction photovoltaic cell.    ADVANTAGE - The process is capable of efficiently producing the electrically conductive or semiconductive patterns on the textured surface of the substrate with high uniformity and good quality thus enhancing the performance and reducing the manufacturing cost of the photovoltaic cell or semiconductor device.    DETAILED DESCRIPTION - The process comprises preparing a substrate (100, 110) during which a textured surface of a substrate is made electrically conductive, coating a layer of printable material (120) on the textured surface during which the layer is disposed on the electrically conductive textured surface, pressing a mold (130) including trough or projections to transfer the trough or projections in the layer of printable material to form electrically conductive or semiconductive patterns, removing the mold from the layer of printable material, exposing the textured surface at a bottom of the patterns, electroplating an electrically conductive or semiconductive material in the patterns for forming conductive or semiconductive patterns, annealing the material, and removing the printable material. The reliefs of the textured surface have: an amplitude, which is ten times greater than a minimal width of the patterns; an inverted pyramid shape or a non-inverted pyramid shape; an inverted cylindrical shape or a cylindrical shape; and/or an inverted polygonal shape or polygonal shape. The patterns have a width of 10 nm to 100 mu m. The reliefs are present in a corrugated shape and/or a groove shape. The step of preparing the substrate comprises obtaining a base substrate of which the surface is textured, forming an amorphous silicon layer (160) that partially covers the textured surface, doping the base substrate with charge carriers to produce electrically conductive or semiconductive patterns, and partially covering the textured surface by an electrically conductive layer, which is an indium tin oxide layer. The electrically conductive or semiconductive patterns form projections beyond the printable material, and the electrically conductive or semiconductive material forms projections beyond the reliefs of the textured surface and is a transparent material. The printable material is preserved after the electroplating step, and is a thermosetting material and a photosensitive resin. The mold comprises a mask coating stopping the exposure of resin that covers or partially covers the patterns. The resin is a positive resin and the mask coating covers the mold apart from an end of the patterns, and the resin is a negative resin and the mask coating covers the mold on the end of the patterns. An INDEPENDENT CLAIM is included for a semiconductor device.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic view of a process for manufacturing a heterojunction photovoltaic cell.    Substrate (100, 110)    Layer of printable material (120)    Mold (130)    Insolated layer (136)    Amorphous silicon layer. (160)