NOVELTY - A particle composition comprises (in parts mass) (meth)acrylic resin composition (A1) (100) containing (meth)acrylic acid ester polymer (AE1) (5-70 %mass), and (meth)acrylic acid ester monomer mixtures (AB1) (30-95 %mass) containing a polyfunctional monomer having (meth)acrylic acid ester monomer which forms the homopolymer having glass transition temperature of -20 degrees C or less, as main component, expanded graphite powder (B) (150-650) having average particle diameter of 60-500 mu m, and polymerization initiator (C1) (0.01-10).    USE - Particle composition is used for manufacturing heat conductive pressure-sensitive-adhesive composition for heat conductive pressure-sensitive-adhesive sheet-like molded product for electronic component (all claimed). Uses include but are not limited to notebook personal computer, mobile telephone, organic electroluminescent display, fuel cell, washing machine, rice cooker, game machine, motor vehicle, plasma display panel, integrated circuit chip, etc.    ADVANTAGE - The particle composition is efficiently manufactured with excellent productivity and thermal resistance.    DETAILED DESCRIPTION - A particle composition comprises (in parts mass) (meth)acrylic resin composition (A1) (100) containing (meth)acrylic acid ester polymer (AE1) (5-70 %mass), and (meth)acrylic acid ester monomer mixtures (AB1) (30-95 %mass) containing a polyfunctional monomer having (meth)acrylic acid ester monomer which forms the homopolymer having glass transition temperature of -20 degrees C or less, as main component, expanded graphite powder (B) (150-650) having average particle diameter of 60-500 mu m, and polymerization initiator (C1) (0.01-10). The polymerization and crosslinking reaction of (meth)acrylic acid ester monomer mixture (AB1) is performed in the mixing composition. INDEPENDENT CLAIMS are included for the following:    (1) heat conductive pressure-sensitive-adhesive composition (E), which contains (in parts mass) (meth)acrylic resin composition (A2) (100) containing (meth)acrylic acid ester polymer (AE2) (5-30 %mass), and (meth)acrylic acid ester monomer mixture (AB2) (70-95 %mass) containing polyfunctional monomer having (meth)acrylic acid ester monomer which forms the homopolymer having glass transition temperature of -20 degrees C or less, particle composition (D) (2-90), and polymerization initiator (C2) (0.01-10);    (2) heat conductive pressure-sensitive-adhesive sheet-like molded product (F), which is obtained by molding the mixing composition in a sheet form;    (3) manufacture of particle composition, which involves mixing the raw material composition, and performing polymerization and crosslinking reaction;    (4) manufacture of heat conductive pressure-sensitive-adhesive composition;    (5) manufacture of heat conductive pressure-sensitive-adhesive sheet-like molded product; and    (6) electronic component, which contains heat conductive pressure-sensitive-adhesive composition (E) and heat conductive pressure-sensitive-adhesive sheet-like molded product (F) laminated by the thermal radiation component.