NOVELTY - The method involves providing a substrate i.e. semiconductor wafer (142), with conductive traces. Conductive vias (146) are formed through a first set of semiconductor dies (124). The semiconductor dies are mounted on an active surface oriented toward the substrate. Bumps (138) are formed over the conductive traces between the semiconductor dies. A second set of semiconductor dies is mounted to the first set of semiconductor dies. A heat spreader (184) or an electromagnetic interference (EMI) and radio frequency interference (RFI) shielding layer is mounted over the dies and the substrate.    USE - Method for manufacturing a semiconductor device i.e. three-dimensional semiconductor package such as flipchip semiconductor device and discrete semiconductor device, of an electronic device e.g. cell phone, personal digital assistant (PDA), digital video camera (DVC), graphics card, and network interface card. Can also be used for an integrated semiconductor device such as microcontroller, microprocessor, charged-coupled device (CCD), solar cell and digital micro-mirror device (DMD).    ADVANTAGE - The method enables utilizing the semiconductor device to provide a short electrical conduction path from the active devices on the semiconductor dies to conduction tracks on the PCB so as to reduce signal propagation distance and improve overall circuit performance. The method enables generating significant thermal energy by the semiconductor dies by stacking semiconductor dies over the substrate, so that the semiconductor package achieves high degree of integration while providing effective heat dissipation through heat spreader and thermal epoxy, thermal epoxy resin or thermal conductive paste for a graphics processing unit in the semiconductor dies and reducing effects of EMI and RFI with the shielding layer, thus enhancing the performance of the semiconductor device, and increasing reliability and the useful lifetime of the semiconductor device.    DETAILED DESCRIPTION - The dies are flipchip type dies. An INDEPENDENT CLAIM is also included for a semiconductor device.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view illustrating a process of manufacturing semiconductor device.    Semiconductor dies (124)    Bumps (138)    Semiconductor wafer (142)    Conductive vias (146)    Heat spreader (184)