TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The conductive filler is silver, gold, nickel, copper, carbon black, carbon fiber, metalized carbon fiber, metal coated glass beads, metal coated glass flakes/fibers and/or metal coated nickel particles. The electrically conductive substrate is tin-coated copper foil, aluminum foil, copper foil, metalized plastic, or conductive scrim.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The curable pressure sensitive adhesive comprises a reactive polymer. The reactive polymer comprises an acrylic copolymer that incorporates one or more functional groups comprising epoxy, carboxylic acid, amine, mercaptan, amide, isocyanate, cyanate ester, allyl, maleimide, acrylate, oxetane, silicone hydride and/or alkoxysilane, where the functional groups are pendant to or within the polymer backbone. The curable pressure sensitive adhesive comprises a non-reactive base polymer and a crosslinking component. The non-reactive polymer comprises an acrylic polymer. The curable pressure sensitive adhesive comprises a phenolic resin, aliphatic polyester, aromatic polyester, polyether polyol, polyester polyol, amine-functional acrylonitrile butadiene copolymer, carboxylic acid-functional acrylonitrile butadiene copolymer, polyurethane, polyamide, rubberized epoxy prepolymer, or hydroxyl-functional acrylonitrile butadiene polymer. The crosslinking component is present at 0.1-70 (preferably 0.5-20) wt.% of the organic solids content of the adhesive. The crosslinking component has an epoxy, acrylate, oxetane, maleimide, alcohol, mercaptan, isocyanate, cyanate ester, alkoxysilane, silicon-hydride, allyl, or benzoxazine functionality. The crosslinking component comprises a urethane acrylate, epoxy resin or blocked isocyanate. The tape has a peel strength of at least 2.7 (preferably at least 4.3) N/cm when the adhesive is in an uncured state. The conductive filler is present at 0.1-90 wt.% solids of the reactive adhesive layer. The curable pressure sensitive adhesive of the reactive conductive adhesive tape comprises an epoxy and carboxylic acid functionalized acrylic polymer, a hydrophobic aliphatic urethane acrylate oligomer, and a urethane acrylate oligomer. The curable pressure sensitive adhesive of the tape comprises a hydroxyl-functional acrylic polymer and a blocked isocyanate. Preferred Method: The step of curing the adhesive layer occurs contemporaneously with a photovoltaic cell curing. The step of curing occurs for a time period of 10-15 minutes at a temperature of 150-170 degrees C. Preferred Composition: The composition has a glass transition temperature of less than 0 degrees C in a cured state. The adhesive composition is formulated to be curable by a radical cure mechanism, a hydroxyl blocked isocyanate cure mechanism, an epoxy-latent amine cure mechanism or an insoluble epoxy-amine cure mechanism.