TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The conductive particles comprise at least metallic particles comprising nickel, palladium, copper, silver, aluminum, titanium, and/or chromium and conductive particles are prepared by coating non-conductive particles with the above metal particles. The conductor is a copper conductor, which is surface-treated at least with a metal comprising copper, corrosion free copper or tin, solder, silver, or nickel. The electrical connecting material in the solar cell module comprises a copper conductor, which on one of its surface comprises at least one metal comprising copper, corrosion free copper or tin, solder, silver or nickel.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The radical polymerizable compound is at least one monomer comprising urethane (meth)acrylates, epoxy (meth)acrylates, polyester (meth)acrylates, fluoro(meth)acrylates, fluorene (meth)acrylates, silicone (meth)acrylates, phosphorus (meth)acrylates, maleimide-modified (meth)acrylates, acrylate (methacrylate) and (meth)acrylate monomers. The organic peroxide comprises ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, diacyl peroxides, peroxy esters and peroxycarbonate.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The bonding material after curing exhibits a tensile elongation of 200-300%. The bonding material has a polymer binding resin (70-85 wt.%), a radical polymerizable compound (13-20 wt.%), organic peroxide (1-5wt.%), and a conductive particle (1-5wt.%). The polymer binding resin is a urethane-modified acrylate resin, and at least one copolymer comprising an acrylonitrile-butadiene copolymer, an ethylene vinyl acetate copolymer and an acrylic copolymer. The polymer bonding resin comprises the urethane-modified acrylate resin (60-90 wt.%) and copolymer (10-40 wt.%). The acrylic copolymer exhibits: a glass transition temperature of 50-120 degrees C; an acid value of 1-100 mg of potassium hydroxide/g. EXAMPLE - Typical electrical connecting material comprised of (in wt.%): polyurethane acrylate resin with average molecular weight of 25000 g/mole (prepared by reacting polyol, 1,4-butanediol and toluene diisocyanate, further reacting the obtained isocyanate-terminated prepolymer with hydroxyethyl methacrylate at 90 degrees C and at 1 atmospheric pressure for 5 hours in presence of dibutyltin dilaurate) (40); polyurethane acrylate resin with an average molecular weight of 28000 g/mole (prepared by reacting polyol, 1,4-butanediol and toluene diisocyanate, reacting the obtained isocyanate-terminated prepolymer with hydroxyethyl methacrylate at 90 degrees c and at 1 atmosphere pressure for 5 hours in presence of dibutyltin dilaurate) (30); thermoplastic resin (prepared by dissolving acrylonitrile butadiene copolymer in toluene/methyl ethyl ketone in a volume fraction of 25%) (10); epoxy acrylate polymer (15); benzoyl peroxide (2); and nickel coated copper particles with a size of 5 mu m (3).