NOVELTY - The method involves forming clearance gap between two groups of warp yarn (21a,21b), and supplying weft (22) to clearance gap according to shuttle mechanism (54). The weft supplied is reed-weaved according to reed mechanism (55). An electrically conductive bonding material is coated to multiple portions corresponding to mesh-shaped network. Several ball semiconductor elements are integrated corresponding to multiple portions to which conductive bonding material is coated, and several one electrodes or another electrodes are connected to weft, respectively.    USE - Manufacturing method of woven rope base material with semiconductor element used for solar cell panel or light emission panel, integrated in window glass or building. Can also be used in electroluminescent (EL) display.    ADVANTAGE - Since the built-in of the ball semiconductor element and the coating of the electrically conductive bonding material can be automated, the woven rope base material with the semiconductor element can be manufactured with stable quality efficiently with reduced process steps. Hence the production cost of the woven rope base material with the semiconductor element can be reduced. Since the woven rope base material with the semiconductor element is provided with the intermediate material products, the woven rope is manufacture with flexibility, light weight, thin shape and improved lighting property. Since the ball semiconductor element can be arranged more densely, without providing an unnecessary space between the row direction element groups, the light reception performance and the light emission performance can be improved, and the tensile strength and the bending strength of the woven base are improved.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) manufacturing apparatus for woven rope base material with semiconductor element; and    (2) woven rope base material with semiconductor element.    DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of the manufacturing apparatus for the woven rope base material with the semiconductor element.    Warp yarns (21a,21b)    Weft (22)    Shuttle mechanism (54)    Reed mechanism (55)    Pulling out mechanism (63)