NOVELTY - The method comprises: providing an insulative substrate (100) having a metallized surface with a first conductive region (112) separated from a second conductive region (114); positioning a solder repelling material within receptacles (130); placing a first component on the first conductive region and on a first one of the attachment regions; and soldering the first component to the metallized surface with solder that remains in the attachment regions; and placing a solar cell on the first conductive region and on the first one of the attachment regions.    USE - The method is useful for manufacturing a solar cell receiver such as a solar cell, bypass diode and electrical connectors, where the solar cell is useful for converting solar energy into electricity.    ADVANTAGE - The method is capable of economically manufacturing the solar cell receiver in an efficient manner.    DETAILED DESCRIPTION - The method comprises: providing an insulative substrate (100) having a metallized surface with a first conductive region (112) separated from a second conductive region (114); positioning a solder repelling material within receptacles (130); placing a first component on the first conductive region and on a first one of the attachment regions; and soldering the first component to the metallized surface with solder that remains in the attachment region; placing a solar cell on the first conductive region and on the first one of the attachment regions; placing a second component on a second one of the attachment regions; placing a third component on a third one of the attachment regions; attaching the solar cell, the second component, and the third component to the metallized surface; and aligning the solar cell and the second and third components relative to the metallized surface using alignment marks (150) that are spaced away from the receptacles; aligning a solar cell receiver component on the metallized surface based on the alignment marks and positioning the receiver component in the second attachment region. The first conductive region forms a first terminal of the solar cell receiver, and the second conductive region forms a second terminal of the solar cell receiver. The metallized surface has the receptacles positioned around attachment regions with each attachment region corresponding to a different portion of the metallized surface. The step of positioning the solder repelling material within the receptacles comprises positioning a solder repellant material within the receptacles that repels solder and maintains the solder within the attachment regions when the solar cell, second component, and third component are attached to the metallized surface. The first component is repelled by the solder repelling material positioned in the receptacles. A cure temperature of the solder repellant material is higher than a reflow temperature of the solder. The method further comprises removing the solder repelling material from the receptacles after the solar cell, the second component, and the third component are attached to the metallized surface. The step of positioning the material within the receptacles includes: positioning the material to extend outward from the receptacles above the metallized surface; and positioning a peg within each receptacle that extends outward from the receptacle above the metallized surface. The insulative substrate has an additional metallized surface on a backside of the substrate with the receptacles demarcating a component attachment region on the backside of the substrate. The step of removing the solder repelling material from the receptacles after the solar cell, the second component, and the third component are attached to the metallized surface includes ultrasonic cleaning of the solder removing material from the receptacles. The step of placing the second component on the second one of the attachment regions includes placing a bypass diode on the first and second conductive regions and within the second attachment region. The step of placing the third component on the third one of the attachment regions includes placing a connector on the first conductive region and within the third attachment region. The first component is a multijunction III-V compound semiconductor solar cell.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic top view of a metallized substrate.    Substrate (100)    First conductive region (112)    Second conductive region (114)    Receptacles (130)    Alignment marks. (150)