NOVELTY - A semiconductor powder is filled in the recesses (5) of a template (1), and a substrate (30) for heating is arranged on the template. The front and back maintenance state is reversed such that the template is arranged on the substrate. Pellets (32) of the powder are formed by pulling up the template and transferring the powder on the substrate. The substrate having pellets is melted, and the powder in the pellets is aggregated to form a spherical melt substance. The melt substance is cooled and solidified, to obtain semiconductor particles.    USE - Manufacture of semiconductor particles useful as ball semiconductor element used for spherical photoelectric conversion elements e.g. solar cells used in buildings e.g. residence, diodes, and elements used for hydrogen production by hydrolysis.    ADVANTAGE - The method enables easy manufacture of semiconductor particles having low mass/dimension/shape variation and excellent quality, with high productivity. The substrate has excellent thermal shock resistance and economical efficiency.    DETAILED DESCRIPTION - A semiconductor powder is filled in the preset-shaped recesses of a template having mutually spaced recesses. A substrate for heating having a planar portion is prepared and arranged on the template to overlap with the near surface of the template with the recess. The front and back maintenance state is reversed such that the template is arranged on the substrate. Pellets consisting of the semiconductor powder of preset amount are formed by pulling up the template arranged on the substrate upwards, and transferring the semiconductor powder filled in the recess on the substrate. The substrate having pellets is supplied to a heating furnace and melted, and the semiconductor powder in the pellets is aggregated to form a spherical melt substance. The melt substance is cooled and solidified, to obtain semiconductor particles.    DESCRIPTION OF DRAWING(S) - The drawing shows a longitudinal cross-sectional view explaining the pellet-formation process.    Template (1)    Recess (5)    Substrate (30)    Base (31)    Pellets (32)