NOVELTY - A heat-conductive pressure-sensitive adhesive composition contains (in parts mass) (meth)acrylate resin composition (A) (100) comprising (meth)acrylic ester polymer (A1) and (meth)acrylic ester monomer (A2), heat-conductive filler (B1) (90-1200) having BET specific surface area of 1-10 m2/g, phosphate ester (C) (45-190), a polyfunctional monomer (D) (0.2-15) having 2 or more polymerizable unsaturated bonds, and a polyfunctional epoxy compound (E) (0.05-15) having 2-10000 functional groups.    USE - Heat-conductive pressure-sensitive adhesive composition is used for manufacturing pressure-sensitive molded product used for electronic components (all claimed) including integrated circuit chip and plasma display panel. Uses include but are not limited to light emitting diode, mobile telephone, solar cell, battery, electron emitter display, plasma display panel, personal computer, vehicle lamp, industrial illumination, copier and printer.    ADVANTAGE - The adhesive composition has excellent strength and flame retardance.    DETAILED DESCRIPTION - A heat-conductive pressure-sensitive adhesive composition contains (in parts mass) (meth)acrylate resin composition (A) (100) comprising (meth)acrylic ester polymer (A1) and (meth)acrylic ester monomer (A2), heat-conductive filler (B1) (90-1200) having BET specific surface area of 1-10 m2/g, phosphate ester (C) (45-190), a polyfunctional monomer (D) (0.2-15) having 2 or more polymerizable unsaturated bonds, and a polyfunctional epoxy compound (E) (0.05-15) having 2-10000 functional groups. Polymerization reaction of (meth)acrylic ester monomer (A2) and polyfunctional monomer (D) is carried out, and cross-linking reaction of the polymer containing structural unit derived from (meth)acrylic ester monomer and/or (meth)acrylic ester polymer is performed. INDEPENDENT CLAIMS are included for the following:    (1) heat-conductive pressure-sensitive adhesive sheet-like molded product formed by molding the adhesive composition;    (2) manufacture of pressure-sensitive adhesive composition;    (3) manufacture of heat-conductive pressure-sensitive adhesive sheet-like molded product; and    (4) electronic component having the heat-conductive pressure-sensitive adhesive composition or heat-conductive pressure-sensitive adhesive sheet bonded by thermal radiation component.