NOVELTY - A glass substrate is placed horizontally in sand blasting device, negative pressure is supplied to inner cavity and lower nozzle, and substrate surface is subjected to sand blasting process, to obtain glass substrate. The glass substrate is soaked in hydrofluoric acid corrosion groove, etched and one side of glass substrate is subjected to plasma-enhanced chemical vapor deposition, immersion plating or magnetron sputtering, to form antireflection film. Then, transparent conductive film is formed on surface of antireflective film, to obtain transparent conductive substrate.    USE - Preparation of transparent conductive substrate used for thin-film solar battery.    ADVANTAGE - The method efficiently and economically provides transparent conductive substrate having high impact strength and bending strength.    DETAILED DESCRIPTION - A glass substrate is placed horizontally in a sand blasting device, negative pressure is supplied to inner cavity and lower nozzle simultaneously and then substrate surface us subjected to sand blasting process, to obtain glass substrate having uniform roughness of 1-50 mu m. The glass substrate is soaked into hydrofluoric acid corrosion groove with hydrofluoric acid concentration of 1-10%, and then etched. One side of the glass substrate is subjected to plasma-enhanced chemical vapor deposition, immersion plating or magnetron sputtering, to form antireflection film having refractive index calculated by formula: nd= lambda /4, where n is the refractive index and d is the thickness of glass substrate and lambda is the concentration of hydrofluoric acid. The formed anti-reflection film is toughened at 600-800 degrees C for tempering time based on thickness of glass substrate, cured and then forming transparent conductive film on surface of anti-reflective film having thickness of 500-1000 nm by using magnetron sputtering, metal-organic chemical vapor deposition or low-pressure chemical vapor deposition. The surface of transparent conductive film is etched using acetic acid or hydrochloric acid solution such that the transparent conductive film surface has average roughness of 50-200 nm, to obtain transparent conductive substrate.