TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The capping material coated on the surface of the first metal particle includes -N- and -O- elements in a molecule. The conductive metal is at least one selected from copper, silver, gold, nickel, platinum, palladium, and their salts.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The solvent is at least one organic solvent selected from toluene, methyl ethyl ketone, and methyl isobutyl ketone; at least one nonpolar solvent selected from palanil oil, tetradecane, tetralin, and mineral oil; and at least one polar solvent selected from propyl alcohol, isopropyl alcohol, terpineol, butyl carbitol, and neodecanate.    TECHNOLOGY FOCUS - POLYMERS - Preferred Method: The first metal particles involves forming a metal precursor containing a first metal; reducing the metal precursor in a high temperature atmosphere; and coating a surface of the metal precursor with the capping material. Preferred Composition: The first metal particles and the second metal particles are included at a weight ratio of 1:1-1:30. The conductive metal paste composition includes the conductive metal particles (50-95 wt.%) including the first metal particles and the second metal particles, the binder (0.01-10 wt.%), and the balance of the solvent. The capping material is included in the entire paste composition by 0.01-25 wt.%. Preferred Components: The binder is at least one selected from cellulose resin, acrylic resin, epoxy resin, vinyl resin, imide resin, amide resin, and butyral resin. EXAMPLE - A paste composition was manufactured by preparing 30 g of first copper particles with a size of 5 nm, which were capped with oleic acid (25 wt.%), and mixing the first copper particles in a second copper particle conductive dispersion solution in which 100 g of second copper particles with an average particle size of 0.3 mu m were dispersed in a wet solvent (terpineol). The conductive copper particles were included in the entire paste composition by 85 wt.%. Further, a final conductive copper metal paste was obtained by adding ethyl cellulose or an adhesive reinforcing additive to the entire paste composition by 10 wt.%.