NOVELTY - The solar cell has a predetermined number of elongate semiconductor fingers which are formed on a light receiving surface of front semiconductor region. The semiconductor fingers are exposed through dielectric layer (43), e.g., silicon nitride, more heavily doped than the remainder of front semiconductor region and has same dopant polarity. The elongate plated metal contacts (62,63) are formed to self align with, and partially cover the semiconductor fingers. The metal collection fingers extend over the dielectric layer, in state that is generally transverse to the plated metal contacts.    USE - Solar cell, e.g., silicon solar cell, plated solar cell or screen-plated solar cell.    ADVANTAGE - Prevents contact between the screen-printed metal and the lightly doped silicon by using the screen-printed paste that does not penetrate through the dielectric layer during firing. Prevents fired metal paste from penetrating the dielectric by refraining from using the additives. Improves conductivity in localized areas to act as the semiconductor fingers since the semiconductor fingers can be formed by patterning the dielectric layer and then heavily doping the exposed silicon. Reduces the shading loss of the metal fingers since the width can be increased to accommodate increased current and allowing both tapering and increased height. Enhance plating capability and characteristics since the silicon surface is treated with the laser or thermal diffusion process after patterning the dielectric layer. Prevents oxidation of the exposed silicon since the screen-printed silver paste can be printed onto the surface.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for forming solar cell.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic sectional view of the hybrid screen-printed and plated solar cell, highlighting the three levels of metallization.    Non-light receiving surface (16)    Dielectric layer (43)    Silicon layer (44)    Metal contacts (62,63)    Laser-doped region (65)