TECHNOLOGY FOCUS - ELECTRONICS - Preferred Method: The method (I) further includes forming metal contacts, a first subset in electrical communication with a positive-side of the p-n junction and a second subset in electrical communication with an n-side of the p-n junction. The substrate is formed from silicon and growing further includes exposing the substrate to plasma deposition chemistries to form a layer of materials upon the substrate, where the materials consists essentially of aluminum oxide or silicon nitride. The step (c) further includes: raising the substrate to a temperature proximate to form the layer by exposing the substrate to plasma deposition chemistries; and maintaining the substrate proximate to the temperature, while moving the substrate between adjacent processing stations of a semiconductor processing system. The method (II) further includes applying the metal contacts, the first subset and the second subset by exposing the substrate to an additional set of plasma chemistries.    TECHNOLOGY FOCUS - INSTRUMENTATION AND TESTING - Preferred Components: The fourth set of instructions are adapted to control the plasma processing chamber, gas delivery system, heating system, vacuum system, and microwave source to form the layer of materials upon the substrate. The thermal processing apparatus is a load lock mechanism that has a carrier and support, and heats opposing sides of the substrate in excess of 200 degrees C. The system further includes a thermal dissipation station. The thermal dissipation station further includes a thermal transfer fluid in thermal communication with the substrate. The thermal dissipation station with the thermal processing apparatus, and plasma deposition chamber is configured in a linear and in-line configuration or diamond configuration, and the substrate transport device is configured to move the substrate along a linear path between the thermal processing apparatus, plasma deposition chamber and thermal dissipation station or along two linear paths, each of which forms an oblique angle with respect to the remaining linear path of the two linear paths. The thermal transfer fluid comprises a set of liquids consisting essentially of a gas or a liquid. EXAMPLE - No suitable example given.