NOVELTY - A printing formulation comprises: at least one metal precursor selected from metal precursor (p1) in the form of metal salt nanoparticles dispersed in a medium, and metal precursor (p2) in the form of a metal complex dissolved in a medium, where the complex having at least one hydroxy amine or aminoacid complexing moiety; or a medium and a combination of the metal precursor (p1); and the metal precursor (p2).    USE - As an ink formulation in liquid form and solid form, for coating surface of substrate including flexible substrate and rigid substrate such as plastic substrate, glass substrate, metallic substrate, silicon substrate, germanium substrate, Indium Tin Oxide (ITO) substrate, Fluorine-doped tin oxide (FTO) substrate, and TiO2 substrate; for forming conductive pattern on surface region of substrate; and in the production of electromagnetic (EMI) shielding materials, conductive adhesives, low-resistance metal wirings, Printed Circuit Boards (PCBs), Fabry Perot Cavites (FPCs), antennas for Radio Frequency Identification (RFID) tags, solar cells, secondary cells or fuel cells, electrodes or wiring materials for thin film transistor liquid crystal display (TFT-LCD), organic light-emitting diode devices (OLEDs), flexible displays, Organic thin-film transistor (OTFT) , and sensors (claimed).    ADVANTAGE - The printing formulation provides printed electronics, precisely write electronic components and circuits, at low cost.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) a method of forming a printing formulation, involving: obtaining a metal precursor selected from the metal precursor (p1) and the metal precursor (p2); where: when the metal precursor is nanoparticles of a metal salt, dispersing the nanoparticles in a liquid medium, or when the metal precursor is a metal complex, dissolving the metal complex in a liquid medium;    (2) a process (P1) of forming a conductive pattern on a surface region of a substrate, involving: obtaining a substrate; on at least a surface region of a substrate forming a pattern of the printing formulation; and decomposing the metal precursor in the pattern to obtain a metallic pattern;    (3) a conductive pattern obtainable by the process (P1); and    (4) an element comprising a conductive pattern, where the conductive pattern comprises a metallic material being free of metal oxide at the time of manufacture, or have high oxidation resistance at ambient atmosphere.