TECHNOLOGY FOCUS - IMAGING AND COMMUNICATION - Preferred Method: The method further comprises: burning the metal oxide through the anti-reflection coating and producing an electrical contact with the p-n junction, where the electrical contact includes the first metal and is an ohmic contact; and reacting the second metal complex with the reducing agent at a processing temperature of above 150 degrees C, where the second metal complex and the reducing agent are un-reactive toward each other in the metal ink at room temperature, and the second metal complex comprises a metal ion, and reacting the second metal complex with the reducing agent reduces the metal ion. The burning of the metal oxide through the anti-reflection coating is performed at a process temperature of greater than or equal to 500 degrees C, preferably at or below 750 degrees C. The metal ink is deposited on the anti-reflection coating by a deposition technique comprising spray printing, inkjet printing (both preferred), dipping, spinning or direct-write deposition. The method is performed in the absence of a paste comprising glass frits or a metal. The method is performed without using a glass frit paste. Preferred Components: The metal ink further comprises a second metal and the electrical contact further comprises the second metal. The second metal resides in the metal ink in a form comprising of (i) a second metal complex, where the metal ink further comprises a reducing agent and the second metal complex, both the second metal complex and the reducing agent is dissolved in the solution, or (ii) a particulate metal.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The anti-reflection coating comprises silicon nitride and the p-n junction comprises silicon. The first metal is lead, tin or zinc. The second metal is nickel, copper, gold, silver, lead, palladium, platinum, cobalt, iron or tin. The metal oxide resides on or in the anti-reflection coating. EXAMPLE - No suitable example given.