NOVELTY - A heat conductive adhesive composition is obtained by polymerizing (meth)acrylic acid ester monomer (a1) and crosslinking polymer having structural unit derived from (meth)acrylic acid ester polymer (A1) and/or (meth)acrylic acid ester monomer (a1) in mixed composition containing 100 parts mass (meth)acrylic resin composition (A) including (meth)acrylic acid ester polymer (A1), 300-100 parts mass heat conductive filler (B1), 60-900 parts mass conductive filler (B2), and 0.05-4 parts mass polyfunctional epoxy compound (C).    USE - Heat conductive pressure-sensitive adhesive composition is used for producing sheet-like molded product for electronic device (all claimed). Uses include but are not limited to plasma display panel, integrated circuit chip, fuel cell, solar cell, battery, mobile telephone, portable information terminal, notebook personal computer, motor vehicle, semiconductor element etc.    ADVANTAGE - The sheet-like molded product formed using the heat conductive pressure-sensitive adhesive composition has excellent tear resistance, and heat conductivity.    DETAILED DESCRIPTION - A heat conductive adhesive composition is obtained by polymerizing (meth)acrylic acid ester monomer (a1) and crosslinking polymer having structural unit derived from (meth)acrylic acid ester polymer (A1) and/or (meth)acrylic acid ester monomer (a1) in a mixed composition containing 100 parts mass (meth)acrylic resin composition (A) including (meth)acrylic acid ester polymer (A1) and (meth)acrylic acid ester monomer (a1), 300-100 parts mass heat conductive filler (B1) having average particle diameter of 20 mu m or less, and BET specific surface area of less than 1 m2/g, 60-900 parts mass conductive filler (B2) having average particle diameter of 20 mu m or less and a BET specific surface area of 1 m2/g or more, and 0.05-4 parts mass polyfunctional epoxy compound (C) having 2-10000 functional groups. INDEPENDENT CLAIMS are included for the following:    (1) heat conductive adhesive sheet-like molded product, which is obtained by molding mixed composition in sheet form;    (2) manufacture of heat conductive adhesive composition;    (3) manufacture of heat conductive adhesive sheet-like molded product; and    (4) electronic device.