NOVELTY - Printing transferable components involves pressing stamp (10) including transferable semiconductor component on target substrate (30) such that the component and a surface of the substrate contact opposite surfaces of conductive eutectic layer (31); during pressing of the stamp on the substrate, exposing the component to electromagnetic radiation that is directed through the transparent portion of the stamp to reflow the eutectic layer; and then separating the stamp from the substrate to delaminate the component from the stamp and print the component onto the surface of the substrate.    USE - For printing transferable components such as solar cell, light emitting diode, laser diode, or transistor (claimed).    ADVANTAGE - The method improves transfer printing cycle throughput, which can be useful for applications requiring relatively large area target substrates. For e.g. multi-laser beams or fast scanning optics can be used to quickly transfer-weld a large array of dies in a time period which may be shorter than prior art transfer printing processes typically requiring slower (i.e. less than 1 mm/s) stamp delamination rates in order to achieve high transfer printing yield onto adhesive coated target substrates. No adhesive is used on the target substrate, a continuous array of dies can be picked up from a source substrate and then selectively transfer welded onto the surface of a target substrate in successive print operations. In contrast with some conventional transfer printing processes, the transfer stamp does not necessarily need be repopulated with a new array of semiconductor dies after each selective print operation.    DETAILED DESCRIPTION - Printing transferable components involves pressing a stamp (10) including at least one transferable semiconductor component on a target substrate (30) such that the transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer (31), where the stamp includes a transparent portion at least partially aligned with the transferable component in plan view; during pressing of the stamp on the target substrate, exposing the transferable component to electromagnetic radiation that is directed through the transparent portion of the stamp to reflow the eutectic layer; and then separating the stamp from the target substrate to delaminate the transferable component from the stamp and print the transferable component onto the surface of the target substrate. An INDEPENDENT CLAIM is included for system for fabricating an array of printable components comprising a stamp including at least one printable semiconductor component on its transfer surface and a transparent portion at least partially aligned with the printable component in plan view; a transfer printing tool head including the stamp mounted on it; a controller configured to operate the transfer printing tool head to press the stamp on a target substrate such that the printable component contacts the surface of the target substrate, where the printable component and/or the surface of the target substrate include a conductive eutectic layer on it; and an electromagnetic radiation source configured to expose the printable component to electromagnetic radiation directed through the transparent portion of the stamp to reflow the eutectic layer when the stamp is pressed on the target substrate, where the controller is configured to operate the transfer printing tool head to separate the stamp from the target substrate after the reflow of the eutectic layer to delaminate the printable component from the stamp and transfer the printable component onto the surface of the target substrate.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of a transfer welding process.    Stamp (10)    Post (11)    Semiconductor die (20)    Target substrate (30)    Conductive eutectic layer (31)