NOVELTY - Polyimide film (6) having surface side opposite to the support is subjected to surface treatment, and surface(s) in which support and polyimide film oppose is patterned using coupling agent, to obtain favorable adhesion portion, and easy separation portion having different adhesion peeling strength. Then, support and polyimide film are piled up, subjected to pressure heating process and organic alkali treatment, resulted product is coated using polyamic acid solution (A) which does not contain lubricating agent component, dried and imidated, to obtain polyimide laminate.    USE - Manufacture of polyimide laminate for device (claimed) e.g. semiconductor element and circuit wiring. Uses include but are not limited to coil, capacitor, electronic circuit system, solar cell, thin-film transistor, micro-electro-mechanical system element, photosensor, logic circuit, photodiode, microphone, etc.    ADVANTAGE - The polyimide laminate has excellent heat resistance, rigidity, dimensional stability and peeling strength. The device is formed using polyimide laminate by smooth and highly efficient method.    DETAILED DESCRIPTION - Polyimide film having surface side opposite to the support is subjected to surface treatment, and surface(s) in which support and polyimide film oppose is patterned using coupling agent, to obtain favorable adhesion portion and easy separation portion having different adhesion peeling strength. Then, support and polyimide film are piled, subjected to pressure heating process and organic alkali treatment, resulted product is coated using polyamic acid solution (A) which does not contain lubricating agent component, dried and imidated, to obtain polyimide laminate. The polyimide laminate has 3 layered structure having at least 3 layers, and has layers(s) comprising lubricating agent, and in which surface(s) does not comprises lubricating agent. INDEPENDENT CLAIMS are included for the following:    (1) polyimide laminate; and    (2) manufacture of polyimide laminate with device, which involves creating device in polyimide laminate surface of easy separation portion of initial period laminate, putting notch into polyimide laminate of easy separation portion, and peeling polyimide laminate from support.    DESCRIPTION OF DRAWING(S) - The drawing shows schematic view explaining manufacture of polyimide laminate. (Drawing includes non-English language text)    Glass substrate (1)    Coupling process layer (2)    Ultraviolet light blocking mask (3)    Polyimide film (6)    Varnish layer (8)