NOVELTY - The method comprises employing semi-finished solar cells (1), where each of the solar cells comprises a crystalline silicon thin wafer having a layered stratified doped structure containing a backside emitter layer and a base layer disposed below the emitter layer, laminating the semi-finished solar cells to a module front substrate (2) with their front-side facing the module front substrate in a tessellated-resembling pattern, and forming alternating rectangular emitter- and base regions on the back-side of each cell.    USE - The method is useful for manufacturing a back-contacted back junction silicon solar cell module (claimed) such as a solar panel.    ADVANTAGE - The method enables economical and efficient production of silicon based back-contacted back-junction solar panels with high conversion efficiency thus reducing the production cost of electricity.    DETAILED DESCRIPTION - The method comprises employing semi-finished solar cells (1), where each of the solar cells comprises a crystalline silicon thin wafer having a layered stratified doped structure containing a backside emitter layer and a base layer disposed below the emitter layer, laminating the semi-finished solar cells to a module front substrate (2) with their front-side facing the module front substrate in a tessellated-resembling pattern, forming alternating rectangular emitter- and base regions on the back-side of each cell by locally removing equidistant parallel rectangular sections of the emitter layer from one side to the opposite side of each cell to expose the underlying base layer, depositing an amorphous silicon layer onto the back-side of the alternating rectangular emitter- and base regions of the solar cells, where the amorphous silicon layer covers the back-side of the cells in the laminated semi-finished solar cells, forming a first insulation layer onto the amorphous silicon layer with linear openings defining electric contact access areas running in parallel above each of the linear emitter- and base regions of the interdigitated cell, forming a rectangular metallic electric finger conductor parallel with and more or less directly above each emitter- and base region of each cell, forming a second insulation layer (16) onto the finger conductors with a set of access openings at positions where an electric contact with the underlying finger conductor is intended, forming a via contact in each access opening in the second insulation layer in electric contact with the finger conductor lying below the access opening, electrically interconnecting the finger conductors of the solar module by forming a set of ribbons, where each ribbon is made to be in electric contact with an intended selection of via contacts in the second insulation layer, and laminating a back-side cover substrate onto the back-side of the module front substrate including the solar cells. The semi-finished solar cells are laminated onto the module front substrate by depositing the solar cells in the intended tessellated-resembling pattern onto a lamination board with their back surfaces facing down onto the lamination board, pressing the module front glass, which has a less than 1 mm thick layer of ethylene-vinyl acetate (EVA) facing the semi-finished solar cells, and heating the assembly at a temperature of 175 degrees C until the EVA is cured. The continuous amorphous silicon layer is formed by first out-gassing the EVA by heating the solar module at a temperature of 175 degrees C for 10 minutes in air or in and then immersing the module in a hydrofluoric acid solution having 2.5% of concentration for 60 seconds after rinsing in de-ionized water and drying the solar module, and loading the module into the amorphous silicon deposition chamber for immediate deposition of silicon by chemical vapor deposition (CVD). A layer of silicon nitride (SiNx) is deposited onto the amorphous silicon layer by CVD. The first insulation layers is made by screen printing a polyimide composition to form a patterned layer having thickness of 1-10 mu m and linear contact areas with a width of 50-200 mu m running in parallel and aligned above the centre of each P- and N-type regions of the alternating rectangular emitter- and base regions of each solar cell in the module and then cured at 180-200 degrees C. The contact access area is cleaned by plasma ashing in oxygen/nitrous oxide, and a hydrofluoric etching after formation of the first insulation layer. The finger conductors are made by direct current magnetron sputtering, in a multi-chamber tool, an allayer as a semiconductor contact layer followed by a layer of nickel chromium (Ni(0.8) Cr(0.2), and then a layer of copper using planar targets and argon as a sputtering gas, patterning the metal layers by laser ablation forming linear grooves in the metal layer, and then heating the solar module up to a temperature of 250 degrees C. The second insulation layer is made by applying a patterned adhesive or a printable insulating ink onto the finger conductors such as metallic phase, depositing an un-patterned continuous second insulation layer, and selectively etching through the subsequent patterned print of conductive material to penetrate, melt or dissolve the second insulation layer in selected regions, which have the conductive layer acting as a shadow mask to prevent UV curing of the underlying insulator for allowing the conductor to penetrate the insulator in the selected areas, or printing the via conductor pads directly onto the cell metallization and then flowing a self-leveling insulator layer around the conductor pads to form the second insulating layer by UV curing. The ribbons is formed by applying a suitable length of metal strip or band from a spool, stretch and cut the metal strip or band to size and form a strain relief feature and then place the metal strip or band over the second insulating layer with the correct orientation, and then pressing the metal strip or band into the conductive adhesive or solder paste in the access openings. An INDEPENDENT CLAIM is included for a back-contacted back-junction silicon solar cell module.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic cross-sectional view of a solar cell.    Solar cell (1)    Module front substrate (2)    Patterned layer (10)    Electrically insulated regions (12)    Second insulating layer (16)    Module back substrate. (21)