NOVELTY - The method involves providing a chip carrier substrate including a die attach area. A channel is formed in the substrate. A dam material is formed over the substrate. A semiconductor die (58) is placed over the die attach area of the substrate, where the semiconductor die is selected from a group consisting of a flipchip type semiconductor die or package-on-package semiconductor device. An underfill material e.g. epoxy resin or adhesive, is deposited between the semiconductor die and the substrate, where the channel and the dam material control outward flow of excess underfill material.    USE - Method for making a semiconductor device e.g. flip chip semiconductor device and package-on-package semiconductor device (all claimed), for performing high-speed calculations, transmitting and receiving electromagnetic signals, controlling electronic devices, transforming sunlight to electricity and creating visual projections for TV displays for entertainment applications, communication applications, military applications, aviation applications, automotive applications, industrial applications and office applications. Can also be used for an integrated semiconductor device e.g. microcontroller, microprocessor, charged-coupled device (CCD), solar cell and digital micro-mirror device.    ADVANTAGE - The method allows the channel and the dam material to control outward flow of the underfill material so as to prevent excess underfill material from covering a contact pad area. The method allows contact pads to remain devoid of the underfill material for better electrical connection between the substrate and external components. The method allows the semiconductor device to provide a short electrical conduction path from active devices on the semiconductor die to conduction tracks on the board so as to reduce signal propagation distance, lower capacitance and improve circuit performance in a cost-effective manner.    DETAILED DESCRIPTION - The dam material is selected from a group consisting of solder resist, adhesive, insulation, polymer and metal. An INDEPENDENT CLAIM is also included for a semiconductor device.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a semiconductor package mounted to a printed circuit board.    Semiconductor die (58)    Active region (108)    Bumps (110, 112)    Signal lines (114)    Encapsulant (116)