NOVELTY - Sealing at least two inorganic substrates together using an induction energy source comprises: (a) providing at least two inorganic substrates; (b) applying to at least one of the at least two substrates a paste composition including: (i) a glass frit, and (ii) an induction coupling additive; (c) bringing at least a second substrate into contact with the paste composition; and (d) subjecting the substrates and paste to induction heating, thus forming a hermetic seal between the two inorganic substrates.    USE - The methods and lead-free and cadmium-free sealing glass frit composition are useful for sealing at least two inorganic substrates together using an induction energy source; for sealing a solar cell module in a glass cylinder; for sealing a VIG assembly; for sealing a solar cell assembly; for sealing electronic devices; for sealing an assembly; for bonding first and second glass panels to one another, so as to hermetically seal and isolate a cavity defined between it; and for forming a hermetic seal between two inorganic substrates (all claimed).    ADVANTAGE - The methods and compositions can be efficiently used to selectively heat the seal material alone and to effect the bonding to the base glasses/substrates without significantly heating the base glasses/substrates. Similarly, to selectively heat the seal material alone and to effect the bonding to the base glasses/or glass to metal seals without significantly heating the base glasses.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are:    (1) a lead-free and cadmium-free sealing glass frit composition, comprising, prior to firing, (a) 25-65 mol% bismuth oxide (Bi2O3), (b) 3-60 mol% zinc oxide (ZnO), (c) 4-65 mol% boron oxide (B2O3), (d) 0.1-15 mol% of at least one selected from cupper oxide (CuO), iron oxide (Fe2O3), cobalt oxide (Co2O3), chromium oxide (Cr2O3), and combinations, (e) no intentionally added oxides of silicon, and (f) no intentionally added oxides of aluminum;    (2) a method of sealing a solar cell module in a glass cylinder comprising: (a) positioning a set of solar cells in electrical contact with one another inside a glass cylinder; (b) applying the composition to at least one of the glass cylinder and a conductive metal endcap designed to fit over the end of the cylinder; (c) bringing the cylinder end, composition and endcap into physical contact with one another; and (d) subjecting the seal to induction heating at a power of 1-300 kW to sinter and flow the composition to thus form a hermetic seal;    (3) a solar cell module comprising a glass cylinder having a transmittance of greater than 80% at 550 nm, in which are situated a set of silicon solar cells in electrical contact with one another and a conductive metal endcap, the endcap hermetically sealed to the cylinder by induction heating of a portion of the sealing glass frit composition;    (4) a method of sealing a vacuum insulated glass (VIG) assembly comprising: (a) providing at least two glass plates; (b) applying the glass frit composition to at least one of the glass plates; (c) bringing at least a second glass plate, composition and the top glass plate into physical contact with one another; and (d) subjecting the seal to induction heating at a power of 1-300 kW to sinter and flow the glass frit composition to thus form a hermetic seal;    (5) a method of sealing a solar cell assembly comprising: (a) providing at least two glass plates; (b) applying the glass frit composition to at least one of the glass plates; (c) bringing at least a second glass plate, composition and the top glass plate into physical contact with one another; and (d) subjecting the seal to induction heating at a power of 1-300 kW to sinter and flow the glass frit composition to thus form a hermetic seal;    (6) a method of sealing electronic devices comprising: (a) providing at least two glass plates; (b) applying a glass frit composition to at least a first of the glass plates; (c) placing an electronic device into a cavity formed by at least the first of the glass plates and the glass frit composition; (d) bringing at least a second glass plate into contact with the glass frit composition; and (e) subjecting the glass frit composition to induction heating at a power of 1 watt to 300 kW to sinter and flow the glass frit composition to thus form a hermetic seal such that the electronic device is inside a hollow formed by the at least two glass plates and hermetic seal;    (7) a method of sealing an assembly comprising: (a) providing at least two glass plates where in at least one glass plate is a smart glass; (b) applying a glass frit composition to at least a first of the glass plates; (c) bringing at least a second glass plate into contact with the glass frit composition, and d. subjecting the seal to induction heating at a power of from 1 watt to 300 kW to sinter and flow the glass frit composition to thus form a hermetic seal;    (8) a method of bonding first and second glass panels to one another, so as to hermetically seal and isolate a cavity defined between it, comprising: (a) providing a first homogeneous glass frit composition comprising: (i) 25-65 mol% Bi2O3, (ii) 3-60 mol% ZnO, (iii) 4-65 mol% B2O3, (iv) no intentionally added oxides of silicon, and (v) no intentionally added oxides of aluminum; (b) providing a second homogeneous glass frit composition comprising: (i) 37-45 mol% Bi2O3, (ii) 30-40 mol% ZnO, (iii) 18-35 mol% B2O3, (iv) 0.1-15 mol% of at least one selected from CuO, Fe2O3, Co2O3, Cr2O3, (v) no intentionally added oxides of silicon, and (vi) no intentionally added oxides of aluminum; (c) mixing the first and second glass frits to form a homogeneous mixture; (d) applying the homogeneous mixture to at least one of the first and second glass plates, e. positioning the first and second glass plates such that the first and second glass frits come into contact with both glass plates; (f) subjecting the glass plates and powders to induction heating with an electromagnetic field having a frequency of 60-350 kHz, to sinter and flow the first and second glass frits thus forming a hermetic seal defining a cavity between the first and second plates; and    (9) a method of forming a hermetic seal between two inorganic substrates comprising: (a) applying to a first inorganic substrate a paste composition including a glass frit; (b) positioning a wire within the paste composition; (c) bringing at least a second in substrate into contact with the paste composition; and (d) subjecting the wire to resistive heating thus sintering and flowing the paste composition and forming a hermetic seal between the two inorganic substrates.