NOVELTY - The method comprises forming a flexible metallic board (200) on a motherboard (100) by electroplating, separating the metallic board from the motherboard, contacting the motherboard with an electric component forming surface by isolation plating, contacting acid plating solution and base plating solution with the motherboard, and forming a surface of a flexible metal substrate with scanning range of 10x 10 mu m using atomic force microscope. The motherboard is present in the form of thin plate, strip lamella or roll.    USE - The method is useful for manufacturing flexible metal substrate, which is useful in an electric component including an organic light emitting display device, a solar cell, LCD, electrophoretic display, a plasma-display panel, a thin film transistor, a microprocessor and a random access memory (all claimed).    ADVANTAGE - The method is capable of efficiently manufacturing the flexible metal substrate with excellent handling property and low coefficient of thermal expansion thus improving production throughput of the electronic components.    DETAILED DESCRIPTION - The method comprises forming a flexible metallic board (200) on a motherboard (100) by electroplating, separating the metallic board from the motherboard, contacting the motherboard with an electric component forming surface by isolation plating, contacting acid plating solution and base plating solution with the motherboard, and forming a surface of a flexible metal substrate with scanning range of 10x 10 mu m using atomic force microscope. The motherboard is present in the form of thin plate, strip lamella or roll. The surface roughness of the motherboard is maintained after the motherboard is separated from the flexible printed circuit board. The method further comprises adhering temporary substrate to a bonding layer, and separating a temporary substrate from a flexible metallic board. An interface coherence is placed between the motherboard and the flexible metallic board in order to be smaller than the yield strength of the flexible metallic board. The flexible metallic board has a thickness of 5-500 mu m. INDEPENDENT CLAIMS are included for:    (1) a flexible metal substrate; and    (2) a method for manufacturing a flexible electric component.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic view of a method for manufacturing an electronic component.    Motherboard (100)    Flexible metallic board (200)    Electronic component (300)    Passivation layer. (400)