NOVELTY - A conductive resin composition (4) comprises 100 parts mass epoxy compound, 10-100 parts mass curing agent, 0.1-10 parts mass hardening accelerator, and 800-1500 parts mass electroconductive filler. The epoxy compound comprises 1-200 parts mass silicone-modified epoxy resin and 100 parts mass epoxy compound not having silicon atom. The silicone-modified epoxy resin is obtained by hydrosilylation of an epoxy compound, and an organohydrogenpolysiloxane having 2 or more silane bonds in one molecule and a viscosity of 1000 mPa.second or less at 25 degrees C.    USE - Conductive resin composition is used for forming cured material used as adhesive contact bonding layer for connecting surface electrodes with solar cell elements (all claimed).    ADVANTAGE - The conductive resin composition has excellent adhesiveness, workability, heat resistance, moisture resistance, flexibility, and impact resistance. The conductive resin composition provides reliable solar cell elements, and cured material having excellent electroconductivity. A wiring component can be favorably connected with solar cell element.    DETAILED DESCRIPTION - A conductive resin composition comprises 100 parts mass epoxy compound, 10-100 parts mass curing agent, 0.1-10 parts mass (with respect to a total of 100 mass parts of epoxy compound and curing agent) hardening accelerator, and 800-1500 parts mass electroconductive filler. The epoxy compound comprises 1-200 parts mass silicone-modified epoxy resin and 100 parts mass epoxy compound not having silicon atom. The silicone-modified epoxy resin is obtained by carrying out hydrosilylation of an epoxy compound of formula: R1-CH2-CH=CH2, and an organohydrogenpolysiloxane of formula: (R2)aHbSiO(4-a-b)/2 having 2 or more silane bonds in one molecule and a viscosity of 1000 mPa.second or less at 25 degrees C.    R1=phenyl, naphthyl or isocyanuric group having epoxy group(s);    R2=optionally substituted monovalent hydrocarbyl excluding aliphatic unsaturated hydrocarbyl;    a=0.7-2.1;    b=0.001-1;and    a+b=0.8-2.6.    An INDEPENDENT CLAIM is included for solar cell element (1) provided with the cured material of the conductive resin composition.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the solar cell element formed using the conductive resin composition, from the element upper surface.    Solar cell element (1)    Semiconductor substrate (2)    Transparent conductive film (3)    Conductive resin composition (4)    Surface electrode (5)