TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The microparticles are colloidal silica. Preferred Properties: The tropism rate of microparticles is less than 1.6. The relative standard deviation of particle diameter of microparticles is 50% or less.    TECHNOLOGY FOCUS - POLYMERS - Preferred Process: A biaxial stretching polyester film containing polyethylene naphthalate, is subjected to heat-setting process for relieving contraction of base film of the transparent laminated film. Preferred Properties: The sum total of thickness of hardened layers is 150% or more or 10-150% of the thickness of a base film. Storage elastic modulus of transparent laminated film exceeds 1 time of storage elastic modulus of the base film. The storage elastic modulus of transparent laminated film in at least one direction is 1 GPa or more. The difference of refractive index of the microparticles and resin is less than 0.2. When the transparent laminated film is heated at 220 degrees C for 10 minutes, the contraction rate in its vertical direction and horizontal direction is less than 1%, measured at room temperature (25 degrees C) according to JIS-C 23307.4.6.1 (shrunk-length change rate: A method). The storage elastic modulus of laminated film in vertical direction and horizontal direction is 0.45 GPa or more The linear expansion coefficients of laminated film in vertical direction and horizontal direction at 150-200 degrees C is -40 ppm/ degrees C to 40 ppm/ degrees C. When the transparent laminated film is heated at 200 degrees C for 10 minutes, the contraction percentage in its vertical direction and horizontal direction is less than 0.1%, measured at room temperature (25 degrees C) according to JIS-C 23307.4.6.1 (shrunk-length change rate: A method). The thickness of biaxial stretching polyester film is 10-30 mu m. Preferred Composition: The hardened layer contains photoresist having fluorene structure, preferably photocurable acrylic resin, curable resin, and microparticles (50 vol.% or more) having average particle diameter of 200 nm or less. The base film contains resin chosen from polyetherimide resin, polyphenylene sulfide resin, polyether-sulfone resin, polyethylene naphthalate resin and/or polyimide resin. The hardened layer comprises 20-80 parts mass of inorganic fine particles with average particle diameter of 1-1000 nm, with respect to 100 parts mass of solid content.