NOVELTY - A heat-conductive pressure-sensitive adhesive composition is obtained by mixing (meth)acrylic resin composition (A) containing (meth)acrylic acid ester polymer (A1), (meth)acrylic acid ester monomer (( alpha )1), and polyfunctional monomer (D) having polymerizable unsaturated bonds, heat-conductive filler (B1) which is not titanate treated, titanate-treated heat-conductive filler (B2), heat-conductive filler (B3) other than the heat-conductive filler (B1) and heat-conductive filler (B2), and phosphate ester (C) to obtain mixed composition, polymerizing, and crosslinking.    USE - Heat-conductive pressure-sensitive adhesive composition is used for manufacturing sheet-like molded component for electronic device (all claimed). Uses include but are not limited to personal computer, television, mobile telephone, automatic vending machine, refrigerator, solar cell, organic electroluminescent display, fuel cell, washing machine and rice cooker.    ADVANTAGE - The heat-conductive pressure-sensitive adhesive composition has excellent flame retardance, and suppressed bleed of liquid component.    DETAILED DESCRIPTION - A heat-conductive pressure-sensitive adhesive composition is obtained by mixing 100 parts mass (meth)acrylic resin composition (A) containing (meth)acrylic acid ester polymer (A1), (meth)acrylic acid ester monomer (( alpha )1), and polyfunctional monomer (D) having polymerizable unsaturated bonds, 200-450 parts mass heat-conductive filler (B1) having BET specific surface area of 1 m2/g or more and which is not titanate treated, 120-500 parts mass titanate-treated heat-conductive filler (B2), 200-600 parts mass heat-conductive filler (B3) other than the heat-conductive filler (B1) and heat-conductive filler (B2), and 40-120 parts mass phosphate ester (C) to obtain mixed composition, polymerizing polyfunctional monomer (D) and (meth)acrylic acid ester monomer (( alpha )1) in the mixed composition, and crosslinking (meth)acrylic acid ester polymer (A1) and/or polymer containing structural unit derived from (meth)acrylic acid ester monomer (( alpha )1). INDEPENDENT CLAIMS are included for the following:    (1) sheet-like molded component, which is obtained by molding heat-conductive pressure-sensitive adhesive composition in a sheet-form;    (2) manufacture of heat-conductive pressure-sensitive adhesive composition;    (3) manufacture of sheet-like molded component; and    (4) electronic device, which consists of thermal radiation component and sheet-like molded component which are bonded using heat-conductive pressure-sensitive adhesive composition.