NOVELTY - Manufacturing a solar cell with a silicon substrate (10) comprising a dielectric passivation layer, which is present on the surface of the substrate in the form of a silicon oxide layer, comprises depositing a coated film comprising an anti-reflection layer which is silicon nitride or oxynitride layer on dielectric passivation layer in a process chamber (14) by a plasma-enhanced chemical vapor deposition process. The dielectric passivation layer is formed from the surface of the substrate in the process chamber by plasma containing oxidizing gas.    USE - The method is useful for manufacturing a solar cell.    ADVANTAGE - The method: ensures stability of the solar cells; prevents potentially induced degradation of solar modules; and is cost efficient.    DETAILED DESCRIPTION - Manufacturing a solar cell with a silicon substrate comprising a dielectric passivation layer, which is present on the surface of the substrate in the form of a silicon oxide layer, comprises depositing a coated film comprising an anti-reflection layer which is silicon nitride or oxynitride layer on dielectric passivation layer in process chamber by a plasma-enhanced chemical vapor deposition process. The dielectric passivation layer is formed from the surface of the substrate in the process chamber by plasma containing oxidizing gas, or is formed in the process chamber upstream to pre-process chamber in the presence of an oxidizing gas. The substrate is suspended in the pre-process chamber at a temperature of greater than or equal to 400 degrees C for a time at an oxygen partial pressure of at least 1 kPa. An INDEPENDENT CLAIM is also included for a solar cell manufactured by the above mentioned method, where dielectric passivation layer present on the front panel of the substrate has a thickness of 0.5-3 nm.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic representation of a batch plasma-enhanced chemical vapor deposition reactor (Drawing includes non-English language text).    Silicon substrate (10)    Support (12)    Process chamber (14)