NOVELTY - The system has a set of row elements (204) for supporting a set of substrates. The row elements change a configuration of the substrates from an open configuration to a high-density configuration, where distance between adjacent substrates in the open configuration is greater than distance between the adjacent substrates in the high-density configuration. The row elements include loop portions that glide along a gliding arm to form the high-density configuration. Each substrate is a target substrate for one of ion implantation, deposition, etching, and annealing.    USE - System for handling a set of substrates of large media arrays, utilized for ion implantation, deposition, etching, and annealing (all claimed) for a semiconductor manufacturing equipment. Uses include but are not limited to other equipment e.g. semiconductor substrate, solar cell, LED and data storage disk.    ADVANTAGE - The row elements change the configuration of the substrates from the open configuration to the high-density configuration, where the distance between adjacent substrates in the open configuration is greater than the distance between the adjacent substrates in the high-density configuration, thus allowing the media arrays to be efficiently positioned in an ion implanter for implantation and removed from the ion implanter for transport or processing. The system efficiently and precisely handles the media arrays, thus assuring improved efficiency of ion beam utilization and production during implantation, assuring overall production efficiency and reducing cost of the system.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following:    (1) an apparatus for processing a set of substrates    (2) an apparatus for processing a set of substrates.    DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of a system for handling media arrays.    Media (202)    Row elements (204)    End effector (206)    Transport arms (208)    Posts (210)    Arm ledges (216)    Recesses (218)