NOVELTY - Substrate pad (151), where at least one edge of a body of the substrate pad: is shaped to conform to a corresponding edge of a component pad (153); and further comprises many pad fingers (152) leading away from the substrate pad, is claimed.    USE - The substrate pad is useful for: soldering a self-aligning component on substrate pad or attaching and aligning a component to a substrate; and assembling a concentrated solar photovoltaic module (all claimed).    ADVANTAGE - The substrate pad: prevents a misalignment of the component due to asymmetrical surface tension forces applied to the component while the solder is molten, hence facilitates an accurate alignment of components in a concentrated photovoltaic module; enables the assembly of components onto the substrate without needing any special alignment tools or strategies, hence it is cost effective; and simplifies the manufacturability of the concentrated photovoltaic cell receiver and backplane.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for:    (1) a method (M1) for attaching and aligning a component to a substrate, comprising: (a) providing the substrate pad; (b) providing a solder to at least one of the substrate pad or the component pad; and (c) melting the solder, thus causing the solder to exert force on the component and on the substrate, and to align the component pad to the substrate pad;    (2) a combination of a substrate having the substrate pad for soldering the component on it, and a component, comprising: the substrate comprising the substrate pad; and the component comprising the component pad; and    (3) a method (M2) for assembling a concentrated solar photovoltaic module, comprising: providing a backplane with at least one substrate pad, where at least two opposite edges of a body of the substrate pad are shaped to conform to corresponding edges of a component pad on a first component, a distance between the opposite edges of the body of the substrate pad is equal to a distance between the corresponding edges of the first component pad, and the opposite edges of the body of the substrate pad further comprise many pad fingers leading away from the substrate pad; and soldering the first component to the substrate pad.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of an aligning force acting on the component pad adhering via molten solder to a substrate pad having several pad fingers.    Substrate pad (151)    Pad fingers (152)    Component pad (153)    Aligning force (154)