TECHNOLOGY FOCUS - ELECTRICAL POWER AND ENERGY - Preferred Device: In the back contact crystalline semiconductor solar cell, the second electrically conductive metallization layer is orthogonally aligned to the first electrically conductive metallization layer. The number of electrodes in the interdigitated pattern of emitter electrodes and base electrodes in the second electrically conductive interconnect layer is less than the number of electrodes in the interdigitated pattern of emitter electrodes and base electrodes in the first electrically conductive interconnect layer by a factor in the approximate range of 5-50. The first electrically conductive metallization layer base metal width ratio is in the range of approximately 30-50% and the second electrically conductive metallization layer comprises at least one pair of orthogonal fingers. The first electrically conductive metallization layer base metal width ratio is in the range of approximately 30-50% and the second electrically conductive metallization layer comprises 3-4 pairs of orthogonal fingers. Preferred Method: In forming back contact solar cell, the first electrically conductive metallization layer is deposited by plasma sputtering and patterned using laser ablation; the first electrically conductive metallization layer is deposited using a screen printing process; the first electrically conductive metallization layer is deposited using an inkjet printing process; the first electrically conductive metallization layer is deposited using an aerosol jet printing process; or the first electrically conductive metallization layer is deposited using a stencil printing process. The electrically insulating layer is formed by direct printing of a thin insulating layer; the electrically insulating layer is formed by deposition of a thin insulating layer; or the electrically insulating layer is formed by lamination of a thin prepeg sheet. The holes in the prepeg sheet are drilled through the prepeg sheet. The method further comprises depositing metal pads on the first electrically conductive metallization layer prior to the lamination of the prepeg layer, the metal pads positioned at predetermined locations of the holes. Additionally, the second electrically conductive metallization layer is formed by depositing a seed layer on the electrically insulating layer and plating the seed layer; the second electrically conductive metallization layer is formed by attaching a patterned metal foil sheet; or the second electrically conductive metallization layer is formed by attaching a metal foil sheet and patterning the metal foil sheet using direct cutting.