NOVELTY - The package has a substrate (120) comprising a pad (121a) connected to another substrate (110) formed on sides of a surface and external connection terminals (123) connected to an outer side formed on another surface. A lead frame (140) comprises an end bonded to the latter substrate and another end bonded to the pad of the former substrate to vertically connect the substrates to each other. The former substrate includes a vias (121c) formed to be electrically connected to the connection terminals. A semiconductor chip (130a) is mounted on the frame bonded to the latter substrate.    USE - Power module package for use in home appliances e.g. refrigerators, washing machines and air-conditioners, industrial applications i.e. industrial motors, and next generation applications e.g. hybrid electric vehicles and electric vehicles.    ADVANTAGE - The package is capable of miniaturizing an entire component. The package is capable of reducing product cost by reducing an area of a heat radiation substrate and by reducing usage of the lead frame for connection to the outer side. The package allows an anodized layer to be formed at thickness thinner than that of an insulating layer so as to reduce distance between the metal substrate and the semiconductor chip and to thin the package simultaneously with improving heat radiation performance. The package allows a power unit and a control unit to be separately manufactured so as to improve degree of freedom in design of the circuit. The power unit and the control unit are placed in a three-dimensional structure to miniaturize size of a product based on a plane, thus reducing an area occupied by the package on a main board.    DETAILED DESCRIPTION - The semiconductor chip is a power device. The latter substrate is a metal substrate (110b). The former substrate is a printed circuit board. An INDEPENDENT CLAIM is also included for a method for manufacturing a power module package.    DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a power module package.    Substrates (110, 120)    Pad (121a)    Vias (121c)    External connection terminals (123)    Semiconductor chips (130a, 130b)    Lead frame (140)