NOVELTY - The polymer substrate and back contact structure has a polymer substrate (14) with a device side at which the photovoltaic element is located and a back side opposite the device side. A dielectric film (12) and a metallic film (16) are respectively formed at the back side and device side of polymer substrate. The photovoltaic element contains a copper-indium-gallium-selenide (CIGS) structure (20). The dielectric film contains at least one of silicon dioxide, aluminum oxide and silicone resin. A thin adhesion layer (13) is disposed between dielectric film and back side of polymer substrate.    USE - Polymer substrate and back contact structure for photovoltaic element (claimed).    ADVANTAGE - The overall stress state in the front side metallization is reduced since film is made with the bulk of stress state dictated by aluminum film that is far thicker than molybdenum cap. Reduces interconnects by a factor of two by allowing for cell width of pitch to increase to almost double. Decreases interconnect-related losses since larger cells equate to lesser interconnects. The best electrical properties are retained while providing the proper work function interface to ensure successful photoelectric effect by using molybdenum cap. Obtains approximately 5 percent boost in power output for given module by reducing module losses. The resultant stress experienced by polymer is reduced by decreasing the stress state in the films on either side of the polymer substrate. The molybdenum reduction and substitution of common elements reduces the cost of back contact. The elimination of metal back side film and replacing the metal back side film with dielectric layer provides stress and thermal management in the device.    DETAILED DESCRIPTION - The adhesion layer contains at least one of molybdenum, aluminum, chromium, titanium, titanium nitride, a metal oxide, and a metal nitride. The metallic film has a first metal layer consisting of at least one of aluminum, brass, bronze and copper.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic cross-sectional view of a back contact for a flexible monolithically integrated CIGS photovoltaic device on a polymer utilizing a metallic multilayer as a top contact and an oxide as a back-side coating.    Dielectric film (12)    Adhesion layer (13)    Polymer substrate (14)    Metallic film (16)    CIGS structure (20)