NOVELTY - A polyamic acid is obtained from a monomer component comprising a tetracarboxylic acid component and a diamine component. The monomer component contains 25 mol% or more component (A) chosen from tetracarboxylic acid dianhydride having 9,9'-diphenylfluorene structure and diamine having 9,9'-diphenylfluorene structure, and 25 mol% or more component (B) chosen from specific diamine and tetracarboxylic acid dianhydride compounds.    USE - Polyamic acid for polyamic-acid solution composition for polyimide used for polyimide film for manufacturing flexible device, electric apparatus, electronic apparatus, optical apparatus, display apparatus, touch panel, solar cell and LED lighting apparatus (all claimed), liquid crystal display, organic electroluminescent display and electronic paper.    ADVANTAGE - The polyamic acid provides polyimide having excellent transparency and film-forming property, and polyimide film having excellent heat resistance and reduced optical anisotropy.    DETAILED DESCRIPTION - A polyamic acid is obtained from a monomer component comprising a tetracarboxylic acid component and a diamine component. The monomer component contains 25 mol% or more component (A) chosen from tetracarboxylic acid dianhydride having 9,9'-diphenylfluorene structure and diamine having 9,9'-diphenylfluorene structure, and 25 mol% or more component (B) chosen from amide bond-containing tetracarboxylic acid dianhydride of formula (I), alicyclic tetracarboxylic acid dianhydride, alicyclic diamine, fluorine atom-containing tetracarboxylic acid dianhydride, fluorine atom-containing diamine, sulfur atom-containing tetracarboxylic acid dianhydride, sulfur atom-containing diamine, silicon atom-containing tetracarboxylic acid dianhydride and silicon atom-containing diamine.    R=arylene group having 1-4 benzene rings.    INDEPENDENT CLAIMS are included for the following:    (1) polyamic-acid solution composition formed by dissolving the polyamic acid in a solvent;    (2) polyimide film formed by heat-processing the polyamic acid solution composition and having thickness of 10 mu m, light transmittance of 70% or more at 400 nm; and    (3) manufacture of flexible device as display device or light reception device, which involves applying the polyamic-acid solution composition on a carrier board, heat-processing, forming a solid-state polyimide resin film, forming a circuit on resin film, and peeling the polyimide resin film from carrier board.