TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The metal complex contains a metal chelate of formula ((R1O)nM(XR2Y1)m) (I). The chelate ligand in the metal chelate is formed form the reaction of at least one compound consisting of triethanolamine, 2,4-pentanedione, 2-ethyl-1, 3-hexanediol or lactic acid is formed.M = a metal of 2, 3, 4 and 5 main group of the periodic table of the elements and the transition metals, preferably Al, Ti (both preferred), Sn, Zr, Hf, V, Nb, Cr, Mn, Fe, Co, or Ce;R1 = 1-12C-alkyl or aryl, preferably methyl, ethyl, butyl, isopropyl, or benzyl;n = greater than or equal to 0, preferably 0-4;X, Y1 = O or N, where a ligand in the metal chelate is optionally bonded with a double bond R2;R2 = linear or branched alkylene optionally containing heteroatoms comprising O, N or S; andm = 1, preferably 1-3.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The B-blocks are homopolymers or copolymers from monomers consisting of ethylene, propylene, 1,3-dienes, preferably butadiene and/or isoprene. The A-blocks are homopolymers or copolymers made from monomers consisting of at least one aromatic vinyl compound comprising styrene, styrene-derivatives and/or alpha -methylstyrene. The aromatic vinyl compound is present in an amount of 20-85 wt.%, preferably greater than or equal to 30 to less than or equal to 65 wt.%.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The adhesive composition further comprises (iii) at least one metal complex having a substitutable complexing agent, (iv) 20 wt.% of plasticizers, (v) 0.0-20 wt.% of fillers, additives, photoinitiators, accelerators and/or curing agent, and (vi) 60 wt.%, preferably 5-40 wt.% of a reactive resin, where the block copolymers and/or the mixtures are present in an amount of 100 wt.%, preferably greater than or equal to 25-80 wt.%. The adhesive composition has a shear adhesion failure temperature value of greater than or equal to 150 degrees C, preferably greater than or equal to 200-250 degrees C, and contains at least one hydrogenated resin, preferably a hydrogenated hydrocarbon resin as adhesive resins. A chelate crosslinked adhesive composition has a water vapor transmission rate of less than or equal to 100 g/m2.d, preferably less than or equal to 20 g/m2.d, and/or an oxygen transmission rate of less than or equal to 7000 g/m2.d.bar, preferably less than or equal to 3000 g/m2.d.bar. The adhesive composition is partially crosslinked prior to application or partially or finally crosslinked after application, preferably by heating the adhesive composition and/or the element before, during or after the application of the adhesive on the element. The adhesive composition is partially, thermally crosslinked before the application, and is thermally and/or finally crosslinked with UV light after the application. Preferred Method: The method further comprises adding the metal complex with the substitutable complexing agent and optionally the completely hydrogenated hydrocarbon resin as adhesive resin, the plasticizer, and optionally the filler, additive, accelerators, photoinitiator and/or optionally the reactive resin. Preferred Components: The B is a hydrogenated polymer block of an alkene or diene. The part of the block copolymers is present as sulfonated copolymers, and comprises sulfonated A-blocks whose aromatics greater than or equal to 0.5 mole%, preferably greater than or equal to 0.5-15 mole% per mole of the monomer unit based on the total monomer units of the A blocks are sulfonated in the sulfonated copolymer. The additive component is a diblock copolymer of the form A-B, a copolymer with polymer blocks A' made of polymer blocks of aromatic vinyl compounds and with polymer blocks B' made of an alkene or diene. The A-blocks have a glass transition point of greater than 40 degrees C, and the B-blocks have a glass transition point of less than 0 degrees C. The B-blocks are at least partially hydrogenated, preferably completely hydrogenated. The adhesive resin, preferably hydrocarbon resin and/or an epoxy resin is present in an amount of 10-70 wt.%. A mole ratio between the sulfonated copolymer and the metal complex is 1:3-3:1, preferably 1:1 with a fluctuation range region of plus/minus 0.5, preferably 0.2. The reactive resin contains an epoxy resin, an acrylate and/or methacrylate, and a photoinitiator, preferably photinitiator absorbs UV light of below 350 nm.