NOVELTY - The article (24) for combining two photovoltaic cells and an interconnection component, is claimed. Each of the cells includes a downward facing conductive bottom surface and an upward facing top light incident surface. The interconnection component comprises a substrate having a sheetlike form, length, width and thickness, where the length and width are greater than thickness. The substrate length and width define outer boundaries of the substrate. The substrate further comprises an upward facing top side and a downward facing bottom side.    USE - The article is useful for combining two photovoltaic cells and an interconnection component (claimed) to produce a desired expansive interconnected array.    ADVANTAGE - The article simply and economically achieves a series connection of photovoltaic arrays without overlapping of the cells or separation of the facing terminal edges of the semiconductor layers of the two cells in a direction parallel to the light incident surfaces.    DETAILED DESCRIPTION - The article (24) for combining two photovoltaic cells and an interconnection component, is claimed. Each of the cells includes a downward facing conductive bottom surface and an upward facing top light incident surface. The interconnection component comprises a substrate having a sheetlike form, length, width and thickness, where the length and width are greater than thickness. The substrate length and width define outer boundaries of the substrate. The substrate further comprises an upward facing top side and a downward facing bottom side. A first portion of the substrate comprises polymeric layers, where the first of the layers is a structural polymer selected to supply support to the substrate. The first portion overlays a preponderance of a first cell such that the downward facing bottom substrate side faces the top light incident surface of the first cell. A second portion of the substrate is positioned beneath a second of the cells such that the upward facing top substrate side faces the conductive bottom surface of the second cell. The interconnection component further comprises a first electrically conductive material extending from the downward facing bottom side of the first portion to the upward facing top side of the second portion, and no part of the first electrically conductive material is positioned outside the substrate boundaries. The interconnection component further comprises additional electrically conductive material (30) positioned on and extending over a part of the second portion top side such that the additional conductive material is beneath and faces the conductive bottom surface of the second cell, and no portion of the structural polymer layer overlays the second cell. The conductive bottom surface of the second cell is formed by a metal based foil. The downward facing side of the first portion comprises adhesive material. The top light incident cell surface of the first cell is formed by a window electrode comprising an unbroken layer of light transmitting conductive material. The first electrically conductive material and the additional conductive material comprise a monolithic material common to both the first conductive material and the additional conductive material. The monolithic material comprises a coating over a base form. The coating does not have polymeric material. A photovoltaic semiconductor material overlays all of the first cell metal based foil. The downward facing side of the first substrate portion is formed by a layer of polymeric adhesive. The structural polymer layer does not overlay the second cell of the two cells. The window electrode comprising the unbroken layer of light transmitting conductive metal oxide forms a top light incident cell surface. The bottom surface of the first cell is formed by a metal based layer. The metal based layer having an upward facing top surface and semiconductor material overlays all of the metal based layer top surface. The substrate comprises multiple holes (12) extending through the substrate from the downward facing bottom substrate side to the upward facing top substrate side. The additional electrically conductive material extends through the holes from the downward facing bottom substrate side to the upward facing top substrate side.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic top plan view of an initial article.    Holes (12)    Article (24)    Fingers (26)    Additional electrically conductive material (30)    Buss. (31)