TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The other metal or metalloid is an element comprising silicon, tin, zinc, strontium, lead, antimony, aluminum, or germanium. The molten salt comprises: lithium chloride; and a silicon fluoride salt e.g. a hexafluorosilicate salt preferably potassium hexafluorosilicate (both preferred), and the carbon nanostructures define a cavity containing a lithium silicon alloy. The salt of the other metal or metalloid is a chloride salt. The portion of conductive nanoparticles does not contain lithium or a lithium alloy. Preferred Method: The salt is removed: by washing in a liquid that removes the salt without reacting with the lithium; using methanol, hydrazine, or ethylene carbonate; and by heating the nanostructures under a protective atmosphere or vacuum.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The powder comprises: carbon nanotubes; and a portion of carbon nanoparticles and a portion of other carbon nanostructures such as carbon nanotubes and/or carbon nanofibers. The ratio of number of carbon nanoparticles to number of other carbon nanostructures is greater than 1:1 (preferably greater than 4:1). The carbon nanostructures comprise one or more graphene sheets wrapped around a portion of the metal or alloy. The conductor is an electrically conductive substrate e.g. a metallic film or foil, and the powder is coupled as a layer on the surface of the electrically conductive substrate. Preferred Method: The carbon nanostructures are fabricated by a molten salt electrolysis process. The method further comprises: drying the nanostructures; and controlling the proportion of nanotubes to nanoparticles formed by controlling the temperature of the salt and/or the potential applied to the graphite electrode. The (c) step comprises after removing the salt and mixing the nanostructures with a portion of conductive nanoparticles e.g. a portion of elongated carbon nanostructures (preferably carbon nanotubes or carbon nanofibers). The powder is mixed with a binder prior to being coupled to the electrical conductor. The powder is coupled to the conductive substrate without the use of the binder. The powder is combined with the binder and coupled to the conductive substrate. EXAMPLE - None given.