NOVELTY - The method involves using a pulsating energy with frequency to meter a quantity of ink to a discharge nozzle (180). A metered quantity of ink is received at the discharge nozzle. A carrier liquid from the metered quantity of ink is evaporated to provide a quantity of solid ink particles. The particles are dispensed from the discharge nozzle. The particles are deposited on a substrate, where a portion of the particles is converted to a vapor phase during discharge from the discharge nozzle directed to the substrate as vapor, and condense on a surface of the substrate in solid form.    USE - Method for depositing ink in solid form and passive absorptive or reflective patterns of a uniform thin organic film of a material e.g. organic material, thin metal material such as platinum and alloy, inorganic semiconductor or insulator material such as inorganic oxide e.g. Indium Tin Oxide, Aluminum Oxide, Titanium Oxide and Silicon Oxide, chalcogenide, Group IV semiconductor such as Carbon, Silicon and Germanium, Group III-V compound semiconductor such as Gallium Nitride, Indium Phosphide and Gallium Arsenide, and Group II-VI semiconductor such as Cadmium Selenide, Zinc Selenide, Cadmium Sulfide and Mercury Telluride, on a substrate for a conductor, light emitter, light absorber, charge blocker, exciton blocker for designing and constructing an organic electronic device. Uses include but are not limited to an OLED, a large area transistor, a photodetector, a solar cell and a chemical sensor.    ADVANTAGE - The method enables depositing the high-quality, cost effective, large area scalable film in an accurate manner so as to mechanically confine ink supplied to the discharge nozzle from an ink chamber through a chamber orifice, thus enhancing uniformity of loading of ink into the micro-pores and correcting for positioning errors in a placement of ink material supplied to the discharge nozzle from the ink chamber. The method enables adjusting opening depending on size of a housing, thus providing improved thermal isolation of the discharge nozzle from a surrounding structure. The method enables utilizing nanoparticles for reducing energy required to dislodge the material from micro-pores while delivering inorganic semiconductor or insulator material from the discharge nozzle to the substrate.    DETAILED DESCRIPTION - The carrier liquid is organic carrier liquid e.g. acetone, chloroform, isopropanol, chiorbenzene and toluene, or water.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a print-head including a piezoelectric ink dispensing mechanism.    Bonds (120)    Bottom structure (140)    Nozzle heater (150)    Micro-porous conduits (160)    Discharge nozzle (180)