NOVELTY - The device has a shielding layer (190) formed over a surface of a bonded semiconductor die (172). Another die (182) is placed over the former die, where the former die and the latter die are separated by the shielding layer. An encapsulant or molding compound is deposited around the former die and the latter die. A top-side interconnect structure (200) is formed over the latter die and the encapsulant. A bottom-side interconnect structure (202) is formed over the former die and the encapsulant. A conductive pillar or post (206) is formed between the interconnect structures.    USE - Semiconductor device e.g. discrete semiconductor device such as an LED, transistor, resistor, capacitor, inductor, and power MOSFET and integrated semiconductor devices such as microcontrollers, microprocessors, charged- coupled devices (CCD's), solar cells, and digital micro-mirror devices (DMD's), for use in electronic devices such as a graphics card, a network interface card and a signal processing card. Uses include but are not limited to perform high-speed calculations, transmit and receive electromagnetic signals, control electronic devices, transform sunlight to electricity, and create visual projections for TV displays in entertainment areas, communication areas, power generation areas, network areas, computer areas and consumer products, military applications, aviation applications, automotive applications, industrial controller applications and office equipment applications.    ADVANTAGE - The shielding layer with an optional seed layer is deposited over a back surface of semiconductor wafer opposite to active surface so as to reduce electromagnetic interference (EMI) and radio frequency interference (RFI). The shielding layer can be made of copper, aluminum, soft magnetic materials such as ferrite or carbonyl iron, stainless steel, nickel silver, low-carbon steel, silicon-iron steel, foil, epoxy, conductive resin and composite materials to block or absorb EMI and RFI and inter- device interference. The shielding layer can be a dielectric material such as carbon-black or aluminum flake to reduce the effects of EMI and RFI.    DESCRIPTION OF DRAWING(S) - The drawing shows a top perspective view of a printed circuit board (PCB) with different types of packages mounted on a surface of the PCB.    Bonded semiconductor dies (172, 182)    Shielding layers (190, 196)    Top-side interconnect structure (200)    Bottom-side interconnect structure (202)    Conductive pillar or post (206)