TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The polyimide and teflon composite film is composed of polyimide film and Teflon (RTM: Polytetrafluoroethylene) film which are adhered, and Teflon (RTM: Polytetrafluoroethylene) film is located on the lower surface of the polyimide film. The polyimide and Teflon (RTM: Polytetrafluoroethylene) composite film is polyimide and Teflon (RTM: Polytetrafluoroethylene) co-extruded film. The gas barrier layer is a metal layer. The processing-resistant layer is mutually interlinked synthetic composite film of polyethylene terephthalate film and ethylene-vinyl acetate resin film, co-extruded film of polyethylene terephthalate and ethylene-vinyl acetate resin, polyethylene terephthalate film or ethylene-vinyl acetate resin film, preferably polyethylene terephthalate film. The thickness of the gas barrier layer is 20-50 mu m. The thickness of the processing-resistant layer is 25-300 mu m. The multiple outer coating layers comprise a first adhesive layer, a second adhesive layer and a first outer coating layer. The first outer coating layer is composed of polyimide and Teflon (RTM: Polytetrafluoroethylene) composite film. The first adhesive layer is adhered to the upper surface of the gas barrier layer. The processing-resistant layer is adhered to the first adhesive layer. The second adhesive layer is adhered to the lower surface of the gas barrier layer. The second adhesive layer is adhered to the first outer coating layer. The multiple outer coating layers further comprise a third adhesive layer and a second outer coating layer made of polyimide and Teflon (RTM: Polytetrafluoroethylene). The third adhesive layer is adhered to the first outer coating layer and the second outer coating layer, and the second outer coating layer is adhered to the third adhesive layer. The thickness of the second outer coating layer is 25-65 mu m. The thickness of the polyimide film and Teflon (RTM: Polytetrafluoroethylene) film is 12-30 mu m. The thickness of the first outer covering layer is 25-300 mu m. The processing-resistant layer is adhered to a fourth adhesive layer. The fourth adhesive layer is adhered to an ethylene-vinyl acetate resin layer.