NOVELTY - A heat-conductive pressure-sensitive adhesive composition (F) comprises 100 parts mass (meth)acrylic resin composition (A) containing (meth)acrylic acid ester polymer (A1) and the (meth)acrylic acid ester monomer (A'1), 90-1200 parts mass heat conductive filler (B), 0.2-8 parts mass polyfunctional monomer (D) having two or more polymerizable unsaturated bonds, and 0.3-5 mass parts polyfunctional epoxy compound (E) having 2-10000 functional groups and viscosity of 600 mPa.second or less at 25 degrees C.    USE - Heat-conductive pressure-sensitive adhesive composition is used for manufacturing sheet-type molded product for electronic component (all claimed). Uses include but are not limited to television, automatic bending machine, solar cell, organic electroluminescent display, notebook personal computer, fuel cell, semiconductor device, game machine, capacitor and washing machine.    ADVANTAGE - The sheet-type molded product formed using heat-conductive pressure-sensitive adhesive composition has excellent flexibility and tensile strength, and is thin.    DETAILED DESCRIPTION - A heat-conductive pressure-sensitive adhesive composition (F) comprises 100 parts mass (meth)acrylic resin composition (A) containing (meth)acrylic acid ester polymer (A1) and the (meth)acrylic acid ester monomer (A'1), 90-1200 parts mass heat conductive filler (B), 0.2-8 parts mass polyfunctional monomer (D) having two or more polymerizable unsaturated bonds, and 0.3-5 mass parts polyfunctional epoxy compound (E) having 2-10000 functional groups and viscosity of 600 mPa.second or less at 25 degrees C. The polymerization reaction of (meth)acrylic acid ester monomer (A'1) and polyfunctional monomer (D) is preformed. Crosslinking reaction of polymer containing structural unit derived from (meth)acrylic acid ester polymer (A1) and/or (meth)acrylic acid ester monomer (A'1). INDEPENDENT CLAIMS are included for the following:    (1) heat-conductive pressure-sensitive-adhesive sheet-type molded product, which is obtained by molding the heat-conductive pressure-sensitive adhesive composition (F) in sheet form;    (2) manufacture of heat-conductive pressure-sensitive adhesive composition (F), which involves mixing components (A), (B), (D) and (E);    (3) manufacture of heat-conductive pressure-sensitive-adhesive sheet-type molded object (G); and    (4) electronic component, which has heat conductive pressure-sensitive-adhesive sheet-like molded object (G) and thermal radiation component.