NOVELTY - A heat conductive pressure-sensitive adhesive agent composition comprises a mixed composition comprising 100 parts mass (meth)acrylic resin composition (A), 250-1000 parts mass thermally conductive filler (B1) having BET specific surface area of 1 m2/g or more, and 5-55 parts mass dispersant (C). The component (A) comprises (meth)acrylic ester polymer (A1), (meth)acrylic ester monomer (A2), and polyfunctional monomer (D) having several polymerizable unsaturated bonds. The dispersant (C) is fatty acid ester of polyhydric alcohol polymer.    USE - Heat conductive pressure-sensitive adhesive agent composition is used for molded product for electronic device (all claimed). Uses include but are not limited to television, mobile telephone, refrigerator, organic electroluminescent illumination, semiconductor device, rice cooker, game machine, capacitor, solar cell and automatic wending machine.    ADVANTAGE - The heat conductive pressure-sensitive-adhesive sheet-like molded product formed using heat conductive pressure-sensitive-adhesive agent composition has high thermal conductivity, flexibility and cohesive force.    DETAILED DESCRIPTION - A heat conductive pressure-sensitive adhesive agent composition comprises a mixed composition comprising 100 parts mass (meth)acrylic resin composition (A), 250-1000 parts mass thermally conductive filler (B1) having BET specific surface area of 1 m2/g or more, and 5-55 parts mass dispersant (C). The component (A) comprises (meth)acrylic ester polymer (A1), (meth)acrylic ester monomer (A2), and polyfunctional monomer (D) having several polymerizable unsaturated bonds. The dispersant (C) is fatty acid ester of polyhydric alcohol polymer. The polymerization reaction of (meth)acrylic ester monomer (A2) and polyfunctional monomer (D), and crosslinking reaction of (meth)acrylic ester polymer (A1) and/or polymer comprising structural units derived from (meth)acrylic ester monomer (A2), are carried out. INDEPENDENT CLAIMS are included for the following:    (1) heat conductive pressure-sensitive-adhesive sheet-like molded product, which is obtained by molding heat conductive pressure-sensitive adhesive agent composition in the form of sheet;    (2) manufacture of heat conductive pressure-sensitive adhesive agent composition, which involves mixing components (A), (B1) and (C);    (3) manufacture of heat conductive pressure-sensitive-adhesive sheet-like molded product; and    (4) electronic device, which has heat conductive pressure-sensitive-adhesive sheet-like molded product bonded by heat conductive pressure-sensitive-adhesive agent composition to thermal radiation component.