NOVELTY - The multi-layer structure comprises a polymer substrate (102) having a first coefficient of thermal expansion, a coating (104) having a second coefficient of thermal expansion, and a hybrid organic/inorganic interlayer (106) interposed between the substrate and the coating. The hybrid organic/inorganic interlayer has a first surface and a second surface, and is deposited using molecular layer deposition techniques. The first surface is provided adjacent to the substrate, and the second surface is provided adjacent to the coating.    USE - The multi-layer structure is useful in a device (claimed) such as a solar cell, a thin-film photovoltaic device or an organic light emitting diode.    ADVANTAGE - The improved multi-layer structure including interlayer has reduced stress, strain and/or cracking in layers having different coefficients of thermal.    DETAILED DESCRIPTION - The multi-layer structure comprises a polymer substrate (102) having a first coefficient of thermal expansion, a coating (104) having a second coefficient of thermal expansion, and a hybrid organic/inorganic interlayer (106) interposed between the substrate and the coating. The hybrid organic/inorganic interlayer has a first surface and a second surface, and is deposited using molecular layer deposition techniques. The first surface is provided adjacent to the substrate, and the second surface is provided adjacent to the coating. A coefficient of thermal expansion of the hybrid organic/inorganic interlayer is graded along a thickness of the hybrid organic/inorganic interlayer and is homogeneous along a thickness of the hybrid organic/inorganic interlayer. The coating is formed using atomic layer deposition techniques, and comprises a materials consisting of metal oxide and metal nitride and an amorphous material. A thickness of the hybrid organic/inorganic interlayer is based on substrate material, substrate thickness, coating material and coating thickness. A difference between the first coefficient of thermal expansion and the second coefficient of thermal expansion is 2:1. An INDEPENDENT CLAIM is included for a method of forming a structure.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic view of a multi-layer structure.    Substrate (102)    Coating (104)    Interlayer (106)    Interface of substrate (108)    Interface of coating. (110)