NOVELTY - An addition-curable silicone resin composition comprises organopolysiloxane (A) which has resin structure, organic hydrogen polysiloxane (B) which has resin structure having 10-50 repeating units, platinum metal catalyst (C) contained at effective curing amount, and electroconductive filler (E) which is in solid state or semi-solid form at room temperature. Ratio of number of moles of hydrogen atom bonded to silicon atom in component (B) with respect to total number of moles of vinyl group and allyl group in component (A) is 0.1-4.    USE - An addition-curable silicone resin composition for silicone resin composition sheet used for sheet-like cured material of die-attach material (all claimed) used in photovoltaic cell or silicon wafer of solar cell module.    ADVANTAGE - Addition-curable silicone resin composition can be easily handled, silicone resin composition sheet can be easily positioned to photovoltaic cell or silicon wafer, separation or sedimentation of electroconductive filler during storage of resin composition can be prevented, solar cell module can be mass-produced, and outstanding electrical conductivity of electroconductive filler can be achieved.    DETAILED DESCRIPTION - An addition-curable silicone resin composition comprises organopolysiloxane (A) which has resin structure containing R1SiO3/2 unit, R22SiO2/2 unit, and R3aR4bSiO(4-a-b)/2 unit, in which greater than or equal to 1 part of R22SiO2/2 unit has repeating unit number of 10-50, organic hydrogen polysiloxane (B) which has resin structure having 10-50 repeating units and containing R1SiO3/2 unit, R22SiO2/2 unit, and R3cHdSiO(4-c-d)/2 unit, in which greater than or equal to 1 part of R22SiO2/2 unit is continuously repeated, platinum metal catalyst (C) contained at effective curing amount, and electroconductive filler (E) which is in solid state or semi-solid form at room temperature. Ratio of number of moles of hydrogen atom bonded to silicon atom in component (B) with respect to total number of moles of vinyl group and allyl group in component (A) is 0.1-4.    R1-R3=OH, Me, Et, propyl group, cyclohexyl group, or Ph;    R4=vinyl group or allyl group;    a, c=0, 1, or 2;    b, d=1 or 2; and    a+b, c+d=2 or 3.    INDEPENDENT CLAIMS are included for:    (1) silicone resin composition sheet formed by molding addition-curable silicone resin composition in sheet form; and    (2) sheet-like cured material formed by curing silicone resin composition sheet.