NOVELTY - Soft lithographic method of forming a structure on a substrate for use in an electronic device, comprises: printing a patternable ink onto the surface of the substrate in a predetermined pattern to form patterned ink layer, where the patternable ink comprises aryl functionalized resin component dispersed in an organic solvent; curing patterned ink layer, where the cured patterned ink layer comprises aryl resin layer (I); applying metallization layer to at least a portion of surface of the cured ink layer; and forming a structure on the substrate capable of performing a function in the device.    USE - The method is useful in soft lithographic method of forming a structure on a substrate for use in an electronic device which is an ultra-large scale interconnect structure, a plasma display panel, a thin film transistor liquid crystal display, a semiconductor device, a printed circuit board or a solar cell (all claimed).    ADVANTAGE - The method: forms the structure on the substrate in an economical manner; and provides good reproducibility of the patterned features.    DETAILED DESCRIPTION - Soft lithographic method of forming a structure on a substrate for use in an electronic device, comprises: printing a patternable ink onto the surface of the substrate in a predetermined pattern to form a patterned ink layer, where the patternable ink comprises an aryl functionalized resin component dispersed in an organic solvent and optionally at least one additional component which is a cure accelerator, a catalyst, a low molecular weight crosslinker, an adhesion promoter or an inhibitor, and the aryl functionalized resin component includes a predetermined combination of curable aryl functionalized silsesquioxane resins and linear aryl functionalized polysiloxanes; curing the patterned ink layer, where the cured patterned ink layer comprises an aryl resin layer of formula ((T)a(D)b(M)c(Q)d) (I); applying a metallization layer to at least a portion of the surface of the cured patterned ink layer; and forming a structure on the substrate capable of performing a function in the electronic device.    (T)a = (R)SiO(3/2);    (D)b = (R)2SiO(2/2);    (M)c = (R)3SiO(1/2);    (Q)d = SiO(4/2);    R = aryl, preferably phenyl, tolyl, xylyl and/or naphthyl;    a-d = mole fraction of each structural unit according to the relationship where a+b+c+d is 1; and    a, b = greater than 0.    INDEPENDENT CLAIMS are also included for:    (1) an electronic device comprising: a substrate having a surface; the cured ink layer located proximate the surface of the substrate in a predetermined pattern, where the cured ink layer comprises the aryl resin layer (I); at least one metallization layer; and optionally at least one encapsulation layer, passivation layer, a solder bump or a wire; and    (2) a curable and patternable ink for use in forming a structure in electronic device, comprising: a first portion having siloxane of formula ((R1)SiO(3/2)); a second portion having siloxane of formula ((R1)2SiO(2/2)); an organic solvent; and optionally at least one additional component which is a cure accelerator, a catalyst, a low molecular weight crosslinker, an adhesion promoter, a conductive filler, a nonconductive filler, or an inhibitor.    R1 = CH3, aryl preferably phenyl, tolyl, xylyl and/or naphthyl, or cross-linkable group preferably vinyl, Si-H, silanol, or alkoxy moiety capable of undergoing hydrosilylation, hydrogenative coupling or hydrolysis/condensation reaction, where the aryl groups are present at up to 20 mole% of the aryl resin.