TECHNOLOGY FOCUS - ELECTRICAL POWER AND ENERGY - Preferred Solar Cell: In the solar cell, the soldering pad is formed on the backside of the solar cell. The soldering pad may be removed from the silicon wafer with a pull force greater than or equal to 1 to greater than or equal to 5 Newton. The soldering pad is formed from the electroconductive paste comprising 30-75 wt.%, preferably not greater than 50 wt.% of metallic particles. An electrode is formed on the front side of the silicon wafer, where the front side of the silicon wafer comprises an anti-reflective layer. Alternatively, the solar cell comprises: a silicon wafer having a backside; and at least one soldering pad formed on the backside of the silicon wafer, the soldering pad including: metallic particles; glass frit; and an adhesion enhancer comprising a metal or a metal oxide, or any other metal compound that will convert to a metal or metal oxide at firing temperature, where the adhesion enhancer comprises at least one metal selected from tellurium, tungsten, molybdenum, vanadium, nickel, antimony, magnesium, zirconium, silver, cobalt, cerium, and zinc, or oxides. The adhesion enhancer is tellurium or tellurium dioxide. Preferred Method: In producing the solar cell, the silicon wafer has an antireflective coating on the front side. The method further involves applying an aluminum-comprising paste to the backside of the silicon wafer overlapping the edges of the electroconductive paste composition; and/or applying a silver-comprising paste to the front side of the silicon wafer, where applying the aluminum-comprising paste is by screen printing.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Compositions: Adhesion enhancer is at least one metal selected from tellurium, tungsten, molybdenum, nickel, and zinc, preferably tellurium. Also, the adhesion enhancer is at least one metal oxide selected from tellurium dioxide, nickel oxide, magnesium oxide, zirconium dioxide, tungsten oxide, silver oxide, cobalt oxide and cerium oxide, preferably tellurium dioxide. The adhesion enhancer is 0.01-5 wt.%, preferably 0.01-1 wt.% of the electroconductive paste composition. The metallic particles are 30-75 wt.%, preferably not more than 50 wt.% of the electroconductive paste composition. The metallic particles are at least one of silver, aluminum, gold and nickel, or any alloys, preferably silver. The glass frits are 1-10 wt.% of the electroconductive paste composition, where the glass frits comprise lead oxide. The glass frits comprise no intentionally added lead. The glass frits comprise bismuth oxide and no intentionally added lead. The glass frits comprise at least one of bismuth (Bi)-boron (B)-lithium (Li)-oxide, Bi-zinc (Zn)-B-oxide, Bi-Si-Zn-B-oxide or Bi-Si-oxide. The organic vehicle is 20-60 wt.% of the electroconductive paste composition, preferably 45 wt.%. The organic vehicle comprises a binder, a surfactant, an organic solvent and a thixatropic agent. Preferred Conditions: The adhesion enhancer is dispersed within the glass frits. The adhesion enhancer is dispersed within the paste composition independent from the glass frits.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: Organic solvent is at least one of carbitol, terpineol, hexyl carbitol, texanol, butyl carbitol, butyl carbitol acetate, dimethyladipate or glycol ether.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: Binder is at least one of ethylcellulose or phenolic resin, acrylic, polyvinyl butyral or polyester resin, polycarbonate, polyethylene or polyurethane resins, or rosin derivatives. Surfactant is at least one of polyethylene oxide, polyethylene glycol, benzotriazole, poly(ethyleneglycol)acetic acid, lauric acid, oleic acid, capric acid, myristic acid, linolic acid, stearic acid, palmitic acid, stearate salts, palmitate salts, and mixtures.