NOVELTY - The method comprises depositing thin film transistors on a first glass substrate, joining the first glass substrate to a second glass substrate to form a master glass substrate assembly, where a gap is formed between the first and second glass substrates, separating the master glass substrate assembly into individual glass substrate assemblies, thinning the glass substrate assembly by exposing the assembly to an etchant that removes glass from one of the first or second glass substrates to a depth of 100 mu m, and washing the glass substrate assembly.    USE - The method is useful for manufacturing an electronic device such as a cell phone, a laptop, a pad computer, a TV, a video monitor, a touch sensor, a photovoltaic device such as a solar cell, a lighting device and a display device such as an electronic book and a LCD.    ADVANTAGE - The method ensures rapid manufacture of the electronic device with high strength, reliability and quality, lightweight, long-service life and improved performance and chemical and mechanical durability and without any defects.    DETAILED DESCRIPTION - The method comprises depositing thin film transistors on a first glass substrate, joining the first glass substrate to a second glass substrate to form a master glass substrate assembly, where a gap is formed between the first and second glass substrates, separating the master glass substrate assembly into individual glass substrate assemblies, thinning the glass substrate assembly by exposing the assembly to an etchant that removes glass from one of the first or second glass substrates to a depth of 100 mu m, washing the glass substrate assembly, contacting the glass substrate assembly with an aqueous acidic solution for less than 5 minutes, applying a polymer film to the glass substrate assembly, removing the polymer film and then applying a polarizing material to the glass substrate assembly, and injecting a liquid crystal material into the gap. The contacting step removes less than 5 mu m-thick surface layer of glass from each of the first and second substrates to a depth less than or equal to 20 mu m. One of the first or second glass substrates comprises an alkaline earth boro-aluminosilicate glass comprising less than 5 wt.% of alkali metal oxides. A thickness of the first and/or second glass substrates is less than 500 mu m. The washing step comprises contacting the master glass substrate assembly with a brush. An INDEPENDENT CLAIM is included for a glass substrate assembly.    DESCRIPTION OF DRAWING(S) - The figure shows a flow chart of a glass substrate assembly manufacturing process.    Providing a first glass substrate (38)    Washing the first glass substrate (40)    Applying a polymer coating to the first glass substrate (42)    Rubbing or polishing the cured polymer surface (46)    Providing a second glass substrate. (48)