NOVELTY - The apparatus has a supply unit for supplying viscous solution (404) to a back surface of a screen transfer part (103), which acts as catalyst of the solution. A press unit presses the back surface such that a surface of a semiconductor substrate (100) contacts a surface of the transfer part. An insertion unit (102) inserts the solution supplied to the back surface with horizontal displacement in a round hole of the back surface that penetrates through the surfaces of the transfer part and the semiconductor substrate that are contacted by an insertion part press control part (113).    USE - Apparatus for manufacturing a semiconductor i.e. solar cell, for transferring sheet form shape of a screen transfer part on a surface of a semiconductor substrate e.g. silicon substrate (all claimed) such as silicon wafer. Can also be used for a micro-electro-mechanical system (MEMS) structured device and a large scale integrated circuit device and for a single crystal silicon substrate, polycrystalline silicon substrate, silicon carbide substrate, gallium arsenide substrate and indium gallium arsenide substrate.    ADVANTAGE - The apparatus can transfer the shape of the transfer part on the surface of the semiconductor substrate without immersing the semiconductor substrate in the solution. The apparatus allows a substrate holding part to maintain a position during transfer process so as to avoid the substrate from being damaged by transfer process.    DETAILED DESCRIPTION - The solution is gel formed from mixed solution of hydrogen peroxide solution and hydrogen fluoride water. An INDEPENDENT CLAIM is also included for a semiconductor manufacturing method.    DESCRIPTION OF DRAWING(S) - The drawing shows a partial sectional view of a semiconductor manufacturing apparatus.'(Drawing includes non-English language text)'    Semiconductor substrate (100)    Insertion unit (102)    Screen transfer part (103)    Insertion part press control part (113)    Viscous solution (404)