TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Method: In the method: the step (b) is a continuous process; the metal substrate is removed from the rigid support structure prior to applying the organic layer; the metal substrate is bonded to the rigid support structure with a quartz wax; the organic smoothing layer is applied via solution processing; and the mechanical polishing is performed for a time sufficient to reduce surface roughness below 20 nm, where time sufficient to reduce surface roughness is 15-60 minutes. The method further comprises sonicating the metal substrate in at least one solvent to remove any residual quartz wax. Preferred Components: The metal substrate comprises stainless steel.    TECHNOLOGY FOCUS - INSTRUMENTATION AND TESTING - Preferred Components: The rigid support structure comprises a belt (preferred), disc or plate, where the belt, disc or plate comprises glass, plastic or metal. The device further comprises an exciton blocking layer (125). In the inverted photosensitive device, the transparent electrode permits at least 50% of ambient electromagnetic radiation to be transmitted through the electrode.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The solvent comprises xylene. The organic smoothing layer comprises poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate). In the inverted photosensitive device: the donor of the organic donor-acceptor heterojunction comprises material comprising phthalocyanines, porphyrins, subphthalocyanines or their derivatives or transition metal complexes, preferably boron subphthalocyanine chloride or copper phthalocyanine; and the acceptor of the organic donor-acceptor heterojunction comprises a material comprising polymeric and non-polymeric perylenes, polymeric and non-polymeric naphthalenes, or polymeric and non-polymeric fullerenes, preferably the organic donor-acceptor heterojunction comprises C60 fullerene or 3,4,9,10-perylenetetracarboxylic bis-benzimidazole. EXAMPLE - 76 mu m Thick foil substrates were bonded to a 105 mm glass carrier disc using quartz wax heated to 80 degrees C. After cooling down to room temperature, the glass carrier was mounted onto a vacuum chuck on the lapping jig, and the foils were then polished at 20 rpm and at a force of 1300 g, using a free flowing slurry composed of 1 mu calcined aluminum oxide and deionized water for 30-45 minutes. The foils were removed from the glass carrier by melting the wax. The detached foils were sonicated in xylene to remove the residual wax, and then cleaned in acetone followed by boiling isopropanol. A layer poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) was then spin-casted at 1000 rpm for 30 seconds followed by 6000 rpm for 1 minute to provide a better planarized surface and better wetting for the metal electrode.