NOVELTY - A heat conductive pressure-sensitive adhesive composition comprises 100 parts mass (meth)acrylic resin composition (A) containing (meth)acrylate polymer (A1) and (meth)acrylate monomer ( alpha ) obtained by cross-linking polymer (A1) and (meth)acrylate monomer ( alpha ), 250-1000 parts mass heat-conductive fillers (B1) and (B2) having average particle diameter of 20 mu m or less, 0.1-7 parts mass polyfunctional epoxy compound (C) which has two or more functional groups, and 3-40 parts mass tackifier (D).    USE - Heat-conductive pressure-sensitive adhesive composition is used for forming sheet-like molded product for plasma display panel and integrated circuit chip for electronic device (all claimed). Uses include but are not limited to solar cell, refrigerator, rice cooker, capacitor, game machine, notebook-type personal computer, personal digital assistant, washing machine, fuel cell, motor vehicle, etc.    ADVANTAGE - The heat-conductive pressure-sensitive adhesive composition has high adhesiveness.    DETAILED DESCRIPTION - A heat conductive pressure-sensitive adhesive composition comprises 100 parts mass (meth)acrylic resin composition (A) containing (meth)acrylate polymer (A1) and (meth)acrylate monomer ( alpha ) obtained by cross-linking polymer (A1) and (meth)acrylate monomer ( alpha ), 250-1000 parts mass heat-conductive filler (B1) having average particle diameter of 20 mu m or less and BET specific surface area of less than 1 m2/g, 60-900 parts mass heat-conductive filler (B2) having average particle diameter of 20 mu m or less and BET specific surface area of less than 1 m2/g or more, 0.1-7 parts mass polyfunctional epoxy compound (C) which has two or more functional groups, and 3-40 parts mass tackifier (D). INDEPENDENT CLAIMS are included for the following:    (1) heat-conductive pressure-sensitive adhesive sheet-like molded product;    (2) manufacture of heat-conductive pressure-sensitive adhesive composition; and    (3) electronic device, which has a heat-conductive pressure-sensitive adhesive sheet-like molded component bonded by the heat-conductive pressure-sensitive adhesive composition (F) or thermal radiation component.