NOVELTY - The apparatus has an adjustment part adjusting a space (WA) of blade edge of a knife (20) in vertical direction. A position detection part detects relative position of the blade edge in the vertical direction, and includes a main surface on a side opposite to another main surface (3Ab) of a reinforcement board (3A) with respect to an interface (8A). A board thickness detection part (60A) detects board thickness (DA) of the board. An adjustment process part (84) operates the adjustment part based on detection results of the position and the board thickness detection parts.    USE - Apparatus for peeling a substrate e.g. alkali free glass substrate, ceramic substrate, resin substrate such as crystalline resin substrate e.g. polyamide substrate, polyacetal substrate, polybutylene terephthalate substrate, polyethylene terephthalate substrate, polyethylene naphthalate substrate and syndiotactic polystyrene substrate, amorphous resin substrate, polycarbonate substrate, modified polyphenylene ether substrate, polycyclo hexane substrate, polynorbornene type resin substrate, metal substrate, and a semiconductor substrate, and a lower/ upper reinforcement board affixed on the substrate of an electronic device e.g. display panel such as liquid crystal panel. Can also be used for a plasma panel, organic electroluminescent panel, solar cell and thin film secondary battery.    ADVANTAGE - The apparatus can detect a position of the interfaces precisely, and the knife can be precisely inserted in the interfaces when the position of the interfaces is detected precisely. The apparatus can prevent position shift of the substrate until peeling operation is performed when the substrate closely contacts a resin layer so as to prevent damage to the substrate.    DETAILED DESCRIPTION - The adjustment part is a knife moving part (30). The main surfaces are lower and upper surfaces. An INDEPENDENT CLAIM is also included for a method for manufacturing an electronic device.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a peeling apparatus.    Board thickness (DA)    Space (WA)    Reinforcement boards (3A, 3B)    Main surface (3Ab)    Interface (8A)    Knife (20)    Knife moving part (30)    Board thickness detection part (60A)    Adjustment process part (84)