TECHNOLOGY FOCUS - INSTRUMENTATION AND TESTING - Preferred Components: The connecting material bodies are formed with a solder as solder bumps or a conductive adhesive as adhesive aggregates. The connecting material body comprises a copper-, aluminum-, nickel-, metal- or plastic body that is not melted during subsequent bonding step. The wiring film has a side provided with interconnects, preferably copper-clad-, plastic foil, and contacts with its insulating surface with the solar cells such that the plastic film also forms the insulating film between the interconnects and the solar cell-rear side. A further insulating film (9) is placed between the wiring film and the solar cell-rear side, which optional serves as laminating film. The further insulating film is placed between the interconnect and the solar cell-rear side, at the predetermined connecting points, before contacting the solar cells. The wiring film is provided with openings coordinating the geometric shape of the connecting body material. Preferred Method: The connecting terminals of the solar cell and/or interconnects of the wiring film are formed with a solderable surface for applying a solderable connecting material body, where the solderable surface is coated with a fluxing agent, solvent or a solder paste at least at the predetermined connecting points and a connecting material preform is respectively placed at the connecting points, and is retained by the fluxing agent, solvent or a solder paste, and are generated by a subsequent soldering step, preferably reflow soldering, at the junctions of the fixedly mounted connecting material body; the connecting terminals of the solar cell and/or interconnects of the wiring film are formed with a solderable surface for applying a solderable connecting material body and the connecting material preform is respectively placed at the connecting points, and are generated by a subsequent flux-free soldering step, preferably reflow soldering under protective- or forming gas or a specific atmosphere containing formic acid, at the junctions of the fixedly mounted connecting material body; or the connecting terminals of the solar cells and/or the interconnects of the wiring film are formed with a solderable surface, which is coated with a soldering paste selectively at the predetermined connecting points, and the soldering paste is converted to the connecting material body that is fixedly mounted at the connecting points, during the soldering step, preferably reflow soldering. The application of the fluxing agent takes place from a connecting material-preform with flux depot simultaneously with placing the connecting material preforms. The method comprises performing step of applying the solderable coating on the surface and/or selectively applying a fluxing agent only at the connecting points, before the soldering for forming, or soldering the connecting material body at the connecting points and/or the connecting points are separated by the geometric configuration of the corresponding terminal contact or the interconnect and/or by a pre-applied solder frames. The connecting material body or at least its component is formed by an electroplating, autocatalytic nickel deposition, wire bonding, preferably gold- or copper wire bonding as stud bumps. EXAMPLE - No suitable example given.