TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The junction (j1) and junction (j2) are separated by low-resistance layer comprising transparent conductive oxide containing cadmium-tin oxide, indium tin oxide, fluorine-doped tin oxide, indium-doped cadmium-oxide, cadmium stannate, aluminum-doped zinc-oxide, indium-zinc oxide or zinc tin oxide. The semiconductive material (30) contains silicon, crystalline silicon, multicrystalline silicon, gallium arsenide, indium phosphide, cadmium telluride and/or group IV metal dichalcogenide or tungsten oxide, bismuth-vanadium oxide, iron oxide, gallium phosphide, cadmium selenide and/or amorphous silicon. The group IV metal dichalcogenide is molybdenum sulfide, tungsten sulfide, molybdenum selenide and/or tungsten selenide. The catalyst contains platinum, cobalt, copper, iron, molybdenum sulfide (MoSx, where x is 2), nickel, cobalt molybdate, cobalt tungstate, iron molybdate, nickel-cobalt alloy, nickel-iron alloy, nickel-iron-carbon alloy, nickel-iron-sulfur alloy, nickel-iron-sulfur alloy, nickel-manganese-sulfur alloy, nickel-molybdenum alloy, nickel-molybdenum-phosphorus alloy, nickel-tin alloy, nickel-tungsten alloy, nickel-zinc alloy, nickel-zinc-phosphorus alloy, cobalt-nickel-iron alloy, nickel-cobalt-phosphorus-molybdenum alloy, nickel-cobalt-molybdenum alloy, nickel-copper-molybdenum alloy, nickel-iron-molybdenum alloy, nickel-tungsten-molybdenum alloy, nickel-silicon-molybdenum alloy, nickel-silicon-tungsten alloy, nickel-copper-phosphorus-tungsten alloy, iron oxide (IrOx), platinum, cobalt, cobalt phosphate, cobalt borate, cobalt phosphide, copper, iron, manganese, nickel, nickel borate, nickel phosphide, lead, cobalt-iron alloy, cobalt-phosphorus-scandium complex oxide, iron-manganese alloy, nickel-chromium alloy, nickel-copper alloy, nickel-iron alloy, nickel-lanthanum alloy, nickel-phosphorus-scandium complex oxide, nickel-tin alloy, nickel-zinc alloy and/or nickel-iron-molybdenum alloy. Preferred Process: The hydrogen evolving and/or oxygen evolving catalyst is applied to the elongated structure. The elongate semiconductor structures are embedded in a matrix containing glass, polymer or wax. Preferred Property: The elongated structure has aspect ratio of more than 1.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The elongated structure is embedded in material chosen from glass, polymer and wax. The one or both ends of the elongated structure are coated with a catalyst.