NOVELTY - A resin composition comprises a vinyl resin (A) having weight average molecular weight of 100000 or more and acid value of 10-80, aqueous medium (B) and component (C) chosen from water-soluble resin (c1) and filler (c2). The vinyl resin (A) is dispersed in aqueous medium (B). The content of component (C) with respect to whole quantity of vinyl resin (A) is 0-15 %mass.    USE - Resin composition is used for receiving layer for acceptance base material for printed product for electroconductive pattern (all claimed), radio frequency identification devices e.g. organic solar cell, electronic book terminal, organic electroluminescent device, organic transistor, flexible printed circuit board and noncontact integrated circuit card, periphery wiring of electromagnetic wave shield of plasma display, integrated circuit and printed electronics.    ADVANTAGE - The resin composition has excellent adhesiveness with respect to support and thin-line property without causing bleeding of electroconductive ink even when using aqueous electroconductivity ink at high-temperature and high-humidity conditions. The receiving layer using the resin composition has excellent heat and moisture resistance, thus prevents dissolution of receiving layer, whitening and peeling from support.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) acceptance base material, which is obtained by forming receiving layer having the resin composition, on a support or its portions. The receiving layer accepts the fluid containing an electroconductive substance;    (2) printed product, which is formed by printing the fluid (A) on the receiving layer of acceptance base material;    (3) electroconductive pattern, in which printing is performed on the receiving layer using the fluid (A) and metal is plated on printed receiving layer;    (4) manufacture of printed product, which involves forming receiving layer by coating resin composition on support or its portion and drying, printing fluid on obtained receiving layer and forming crosslinked structure by heating the printed receiving layer; and    (5) manufacture of electroconductive pattern, which involves metal plating the printed portion of printed receiving layer.