NOVELTY - The method involves mounting a semiconductor die to a die attach area of a carrier. A modular interconnect unit is mounted over the carrier in a peripheral region around the die. An encapsulant is deposited over the carrier, the die and the interconnect unit. A portion of the encapsulant is removed to expose the die and the interconnect unit. The carrier is removed. An interconnect structure is formed over the die and the interconnect unit, where the interconnect unit includes a core with a vertical interconnect structure formed through the core.    USE - Method for manufacturing a semiconductor device of an electronic device e.g. microcontroller, microprocessor, charged-coupled device (CCD), solar cell, and digital micro-mirror device (DMD), of network interface card, graphic card, cellular phone, personal digital assistance (PDA), and digital video camera (DVC). Can also be used for military application, aviation application, automotive application, industrial controller, and office equipment.    ADVANTAGE - The method allows forming vertical interconnects in a fan-out package-on-package (Fo-PoP) without laser drilling through the package. The bump is made of material that is immersed in flux solution before placement on the conductive layer to selectively render the region contact by the bump material more wettable than the surrounding area of the conductive layer, thus achieving desired self-confinement property. The method allows forming an encapuslant over the package for environmental protection by preventing moisture and particles from entering the package and the die. The method allows reducing bump pitch and increasing input/output count for a semiconductor die. The method allows providing a short electrical conduction path from the active devices on semiconductor die to conduction tracks on the PCB to reduce signal propagation distance, lower capacitance and improve overall circuit performance.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a semiconductor device.    DESCRIPTION OF DRAWING(S) - The drawing shows a partial sectional perspective view of a printed circuit board with different types of packages mounted to its surface.    Electronic device (50)    Printed circuit board (52)    Signal traces (54)    Bond wire package (56)    Ball grid array (60)    Bump chip carrier (62)    Dual in-line package (64)    Land grid array (66)    Multi-chip module (68)