NOVELTY - A Multilayered structure has base material layer (X), and layer (Y) laminated on the base material layer (X). The layer (Y) contains composition including a reaction product (R). The reaction product (R) is a reaction product obtained by reacting metal oxide (A) containing aluminum, and phosphorus compound (B). The phosphorus compound (B) contains phosphorus compound (B1) having 9 or less phosphorus atom in a molecule, and phosphorus compound (B2) having 10 or more phosphorus atom in a molecule. The mass ratio of phosphorus compound (B2) and phosphorus compound (B1) is 1/99-35/65.    USE - Multilayered structure is used for packaging material for solar cell component and display component (all claimed). Uses include but are not limited to foodstuffs, chemicals, medical equipment, industrial materials and garments.    ADVANTAGE - The multilayered structure has gas barrier property, deformation resistance and impact resistance, favorable external appearance, and is manufactured by simple process.    DETAILED DESCRIPTION - A Multilayered structure has base material layer (X), and layer (Y) laminated on the base material (X) layer. The layer (Y) contains composition including a reaction product (R). The reaction product (R) is a reaction product obtained by reacting metal oxide (A) containing aluminum, and phosphorus compound (B). The phosphorus compound (B) contains phosphorus compound (B1) having 9 or less phosphorus atom in a molecule, and phosphorus compound (B2) having 10 or more phosphorus atom in a molecule. The mass ratio of phosphorus compound (B2) and phosphorus compound (B1) is 1/99-35/65. The ratio of number of moles of the metal atom contained in the metal oxide (A), and number of moles of the phosphorus atom contained in the phosphorus compound (B1) is 1-3.6. An INDEPENDENT CLAIM is included for manufacture of multilayered structure, which involves mixing metal oxide (A), solvent, and compound (B) containing a portion which can react with the metal oxide (A) and solvent, coating obtained coating liquid on base material layer (X) to form precursor layer of layer (Y) on base material layer (X), heat-processing the precursor layer of layer (Y) at 140 degrees C or more, and forming layer (Y).