NOVELTY - A laminate (10) has sequential lamination of a support plate layer (12), a resin layer (14) and a glass substrate layer (16). The peeling strength (y) on the interface between support plate layer and resin layer is higher than the peeling strength (x) on the interface between resin layer and glass substrate or cohesive failure strength (z) of resin layer. Resin contained in the resin layer is crosslinked silicone resin. The crosslinked silicone resin contains an organosiloxy unit (A1) (I) and an organosiloxy unit (B1) (II).    USE - Laminate is used for manufacturing glass substrate with component for electronic device (claimed). Uses include but are not limited to solar cell, liquid crystal panel, organic electroluminescent panel, plasma display panel, field emission panel, mobile telephone and personal digital assistant.    ADVANTAGE - The laminate is manufactured efficiently by maintaining purity of the peeling surface of glass substrate separated by performing cleaning process.    DETAILED DESCRIPTION - A laminate has sequential lamination of a support plate layer, a resin layer and a glass substrate layer. The peeling strength (y) on the interface between support plate layer and resin layer is higher than the peeling strength (x) on the interface between resin layer and glass substrate or cohesive failure strength (z) of resin layer. Resin contained in the resin layer is crosslinked silicone resin. The crosslinked silicone resin contains an organosiloxy unit (A1) of formula (I) and an organosiloxy unit (B1) of formula: R6-SiO2/2(-R7) (II). The ratio of total content of component (A1) and component (B1) is 70-100 mol% with respect to total content of organosiloxy units. The ratio of content of component (A1) with respect to total content of component (A1) and component (B1) is 15-50 mol% in the crosslinked silicone resin.    R1=H or 1-4C alkyl;and    R6,R7=1-4C alkyl.    INDEPENDENT CLAIMS are included for the following:    (1) manufacture of laminate, which involves forming curable silicone resin film obtained by crosslinking and curing crosslinked silicone resin, on the surface of support plate, and laminating glass substrate on the surface of the film of crosslinked silicone resin; and    (2) manufacture of glass substrate having component for electronic device, which involves forming component for electronic device on glass substrate in the laminate, manufacturing laminate with component for electronic device, separating glass substrate with component of electronic device and support plate with resin layer by making glass substrate side interface of resin layer or inside of the resin layer into peeling surface, and cleaning the peeling surface of the glass substrate with electronic device component.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of laminate.    Laminate (10)    Support plate layer (12)    Resin layer (14)    Glass substrate layer (16)    Main surfaces of glass substrate (16a,16b)