NOVELTY - The method involves bonding a first photovoltaic (PV) cell above a second PV cell to form a stack, where the first and second PV cells are coupled in series and positioned such that incident light not absorbed by the first PV cell reaches the second PV cell. A third PV cell is bonded above a fourth PV cell to form another stack, where the third and fourth PV cells are coupled in series and positioned such that the incident light not absorbed by the third PV cell reaches the first PV cell. A patterned conductive layer (402) that interconnects cells of a device is applied.    USE - Method for manufacturing a hybrid stacked-multijunction PV device used in illuminated gunsights, radios, computers, electronic map devices, navigational equipment, sensors and lights by users. Uses include but are not limited to expedition-level hikers, campers, recreational vehicle users and military users.    ADVANTAGE - The method enables manufacturing a hybrid multi-junction PV device that is flexible and rolled for shipment and storage since layers are thin. The method allows isolation laser scribe to be performed to isolate cell rows, and a transparent patterned insulator layer to prevent shorting of a top cell by an interconnect conductor layer. The method allows an III-V upper cell junction and absorber layers to be applied as a sequence of lightly and heavily doped materials to produce N, N-plus, P and P-plus sublayers within the layers to enhance performance of the PV junction and to improve ohmic contact to conductor layers. The method allows a current-spreading conductive layer to be applied and patterned after fabricating a lower cell on top of a transparent conductor, so that the current-spreading conductive layer reduces effective resistance of the transparent conductor layer that collects current from the lower cell.    DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of an alternative tandem, multijunction device including three patterned conductive layers.    Flexible polyimide substrate (102)    Top cell (104)    Metallic back contact layer (110)    Interconnect conductor layer (138)    Patterned conductive layer (402)