NOVELTY - The method comprises applying an adhesive composition to a portion of a first substrate (12), contacting the adhesive on the first substrate with a portion of a second substrate (14), and exposing the adhesive to radiation. The adhesive composition comprises a moisture curable radiation curable prepolymer having a moisture curable functionality and a radiation curable functionality, an additional moisture curable prepolymer, and/or an additional radiation curable component. The first substrate and/or the second substrate comprises an electronic component.    USE - The method is useful for making an electronic assembly.    ADVANTAGE - The method effectively and economically makes the electronic assembly with improved shear strength and high performance.    DETAILED DESCRIPTION - The method comprises applying an adhesive composition to a portion of a first substrate (12), contacting the adhesive on the first substrate with a portion of a second substrate (14), and exposing the adhesive to radiation. The adhesive composition comprises a moisture curable radiation curable prepolymer having a moisture curable functionality and a radiation curable functionality, an additional moisture curable prepolymer, and/or an additional radiation curable component. The first substrate and/or the second substrate comprises an electronic component. The moisture curable radiation curable prepolymer is a reaction product of a moisture curable prepolymer and a radiation curable component. The first and second substrates are made of same or different material. The first substrate and/or the second substrate is a flexible substrate. The electronic component consists of a light-emitting diode, a high brightness light-emitting diode, an organic light-emitting diode, a radio frequency identification tag, an electrochromic display, an electrophoretic display, a battery, a sensor, a solar cell, and a photovoltaic cell. The adhesive further comprises a photoinitiator.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic cross-sectional view of an electronic component.    Electronic assembly (10)    First substrate (12)    Second substrate (14)    Conductive layer (16, 18)    Electronic component. (20)