NOVELTY - An apparatus for forming films comprises film-forming chamber (10) to which film forming is performed, atomization mechanism in which film-forming material is atomized, conveyance path provided so that film-forming chamber might be crossed, conveyance mechanism which moves substrate (100) on conveyance path, 1st exhaust port (24a), 2nd exhaust port (8a), and spraying nozzle (23a) for spraying introduced film-forming material toward conveyance path side in film-forming chamber.    USE - An apparatus for forming films (claimed) used for semiconductor devices, displays, and solar cells.    ADVANTAGE - A film with high quality can be formed at low cost.    DETAILED DESCRIPTION - An apparatus for forming films comprises film-forming chamber (10) to which film forming is performed, atomization mechanism in which film-forming material is atomized, conveyance path provided so that film-forming chamber might be crossed, conveyance mechanism which moves substrate (100) on conveyance path, 1st exhaust port (24a), 2nd exhaust port (8a), and spraying nozzle (23a) for spraying introduced film-forming material toward conveyance path side in film-forming chamber. Part located in spraying nozzle side seeing from conveyance path of wall parts is provided with 1st exhaust port so that it may become possible to form the flow which the film-forming material follows along the parallel direction with respect to to-be-film-formed surface (101) of substrate. Film-forming material atomized by atomization mechanism is introduced into film-forming chamber so that it may become possible to spray along the orthogonal direction with respect to to-be-film-formed surface of substrate at the wall part which regulates film-forming chamber. The film-forming apparatus forms film by spraying atomized film-forming material toward substrate. An INDEPENDENT CLAIM is included for film-forming method.    DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional diagram of the spraying box vicinity of the film-forming apparatus in the state by which the substrate is thrown into the spraying box.    2nd exhaust port (8a)    Film-forming chamber (10)    Spraying nozzle (23a)    1st exhaust port (24a)    Substrate (100)    To-be-film-formed surface (101)