TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The metal oxide layer is more than 50 vol.%, preferably more than 95 vol.% free of voids. The metal oxide layer includes: a mixed-metal oxide; and first and second types of metal oxide, where the first type of metal oxide is different from the second type of metal oxide. The coating further comprises a third type of metal oxide and/or a fourth type of metal oxide, where the third and fourth type of metal oxides are different from each other, and are different from the first and second types of metal oxide. The first and second types of metal oxides: are present in the metal oxide layer to form an amorphous metal oxide layer that is more than 90% amorphous; has a concentration of 5-95 wt.%, preferably 20-60 wt.% of the metal oxide layer; and includes first and second types of metals respectively, where the oxygen is present in the metal oxide layer to react with the first and second types of metal and produce the first and second type of metal oxides, and at least one metal comprising aluminum, silver, silicon, zinc, tin, titanium, tantalum, niobium, ruthenium, gallium, platinum, vanadium or indium. The oxygen is present in the metal oxide layer in an amount of 10-50 wt.%. The metal oxide layer: is 5% crystalline with a thickness 20 nm and 1 mu m and substantially transparent; and transmits 70-99% of light incident on the metal oxide layer. The solar module includes silicon, cadmium telluride, copper indium gallium (di)selenide (cigs), copper indium selenide (cis), organic photovoltaics or dye-sensitized solar cells. The striking involves sputtering, reactive sputtering, chemical vapor deposition or plasma enhanced chemical vapor deposition. The striking is carried out at a temperature of 10-300 degrees C and a pressure of 0.001-30 m Torr.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The flexible substrate includes polyester, polyolefin, polyether-ether ketone, polyimide, polyvinyl chloride, polyvinyl alcohol or fluoropolymer. Preferred Process: The process further comprises: providing a substrate inside the chamber, where the striking includes striking the metal-oxide plasma inside the chamber to fabricate the metal oxide layer adjacent to the substrate and evacuating the chamber to create a substantial vacuum inside the chamber, where the evacuating is carried out before introducing an inert gas inside the chamber. EXAMPLE - No suitable example given.