TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The electrically conductive particles have a core-shell structure, where the core is nickel, nickel alloys, copper, copper alloys, non-noble transition metals, alloys of non-noble transition metals, polymers, silica, glass or graphite and the shell is silver, gold, platinum, palladium, copper and/or nickel. The metallic particles are used at a concentration of 70-92 wt.%, preferably 80 wt.%. The core accounts for 80-95 wt.% of the particle, and the shell accounts for 5-20 wt.% of the particle. The layer has a thickness of 1-100 microns, preferably 10-70 microns. The metallic particles are silver flakes having a surface area of 0.2-5 m2/g, preferably 0.5-2 m2/g, a tap density of 0.1-6 g/cc, preferably 2.5-4.5 g/cc. The layers include a layer of amorphous silicon, a layer of crystalline silicon, a layer of copper indium gallium diselenide, a layer of aluminum or a layer of crystalline silicon material. The layers encompass a positive-negative diode or a positive-intrinsic-negative diode. The transparent conductive oxide is indium tin oxide. Preferred Method: The composition is applied to the substrate to a thickness of 10-70, preferably 15-50 microns. The step of heating is performed at not greater than 200 degrees C or at 200 degrees C for 5 seconds to 20 minutes. The method (II) further comprises thermally post-curing the composition.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Composition: The composition further comprises a reactive diluent including hexane diol diacrylate; urethane catalyst comprising dibutyltin dilaurate, dibutyltin dilauryl mercaptide, cobalt bis(2-ethyl hexanoate), bismuth tris(2-ethyl hexanoate), tertiary amines, dimethylcyclohexylamine, organometallic compounds, bismuth octanoate, 1,4-diazabicyclo(2.2.2)octane, bis-(2-dimethylaminoethyl)ether and/or potassium octoate; a solvent, where the solvent is glycol ethers, diethylene glycol monobutyl ether, glycol ether esters, diethylene glycol monobutyl ether acetate, dimethyl ester of adipic acid, dimethyl ester of glutaric acid, dimethyl ester of succinic acid, terpene alcohol, ester alcohols, texanol, water, xylene, propylene glycol methyl ether acetate, dipropylene glycol methyl ether, butyl acetate, 9C aromatics, ethyltoluenes and/or trimethylbenzenes; a free radical initiator; and fatty acid modified polyester (meth)acrylate monomer(s) or oligomer(s). The blocked isocyanate is malonate blocked aliphatic isocyanates, malonate blocked aromatic isocyanates, pyrazole blocked aliphatic isocyanates, pyrazole blocked aromatic isocyanates, caprolactam blocked aliphatic isocyanates, caprolactam blocked aromatic isocyanates, oxime blocked aliphatic isocyanates or oxime blocked aromatic isocyanates. The blocked isocyanate is aliphatic. The hexane diol diacrylate is used at a concentration of 1-10 wt.%, preferably 2-7 wt.%. The free radical initiator is 2,5-dimethyl-2,5-di(tert-butylperoxy)-3-hexyne and/or dicumyl peroxide. The free radical initiator is present at 0.01-2 wt.%, preferably 0.1 wt.%.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The ethylenically unsaturated monomer or oligomer with hydroxy groups is used at a concentration of 0.1-30 wt.%. The blocked isocyanates are used at a concentration of 0.1-10 wt.%. The combination of ethylenically unsaturated monomer or oligomer with hydroxy groups and blocked isocyanate are used at a concentration of 0.1-30%. The ethylenically unsaturated monomer or oligomer with hydroxy groups are fatty acid modified polyester(meth)acrylate monomer(s) or oligomer(s), 2-hydroxyethyl(meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl(meth)acrylate, glycerol mono(meth)acrylate, N-(2-hydroxypropyl) (meth)acrylamide, pentaerythritol triarylate or hydroxyethoxy allyl ether. EXAMPLE - Typical composition comprised of: 12.5 wt.% of base mixture; 4 wt.% of CN133 (trifunctional aliphatic epoxy acrylate); 1 wt.% of BL7963 (blocked isocyanate); 0.1 wt.% of dicumyl peroxide; and 82.4 wt.% of silver flake 9AL.