TECHNOLOGY FOCUS - ELECTRICAL POWER AND ENERGY - Preferred Components: The layers: include a layer of amorphous or crystalline silicon; encompass a P-I-N diode; include a layer of copper indium gallium (di)selenide; or include a layer of aluminum, and a layer of a crystalline silicon material.    TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The electrically conductive particles are silver coated nickel particles, silver coated copper particles, silver coated polymer particles, silver coated silica particles, silver coated glass particles, silver coated graphite particles, gold coated nickel particles, gold coated copper particles, gold coated polymer particles, gold coated silica particles, gold coated glass particles, gold coated graphite particles, platinum coated nickel particles, platinum coated copper particles, platinum coated polymer particles, platinum coated silica particles, platinum coated glass particles, platinum coated graphite particles, palladium coated nickel particles, palladium coated copper particles, palladium coated polymer particles, palladium coated silica particles, palladium coated glass particles, palladium coated graphite particles, silver coated alumina particles, gold coated alumina particles, platinum coated alumina particles and/or palladium coated alumina particles. The metallic particles are used at a concentration of 70-92 (preferably 85) wt.%. The core accounts for 80-98 (preferably 85-91) wt.% of the particle, and the shell accounts for 2-20 (preferably 9-15) wt.% of the particle. The electrically conductive particles have a D50 particle size of 0.01-50 (preferably 2-10) mu m. The metallic particles are silver flakes with a surface area of 0.2-5 (preferably 0.5-2) m2 /g, and a tap density of 0.1-6 (preferably 2.5-4.5) g/cc. The core is nickel or its alloys, copper or its alloys, non-noble transition metals or their alloys, polymers, silica, alumina, glass or graphite, and the shell is silver, gold, platinum, palladium, copper and/or nickel. The electrically conductive particles comprise a copper core and a silver shell. The substrate is a silicon P-I-N diode. The transparent conducting oxide is indium tin oxide. The silicon substrate is amorphous silicon, macrocrystalline silicon or a silicon P-I-N diode.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The polymer composition: comprises thermoplastics, polypropylene, polyethylene, polystyrene, polycarbonates, thermosets, acrylates, epoxies, isocyanates, blocked isocyanates, polyesters (all preferred), polyolefins, polyesters, polyurethanes, polyvinyl acetates, polyamides, polyimides, polyurea and/or cellulose. EXAMPLE - Typical electrically conductive, thermally curable composition comprised of: 3.53 wt.% hexane diol acrylate; 1.56 wt.% Genomer 2259 (RTM: Fatty acid modified epoxy acrylate oligomer with 2 acrylate functionality); 5.2 wt.% CN133 (epoxy acrylate oligomer with 3 acrylate functionality); 0.1 wt.% dicumyl peroxide; 5.41 wt.% Butyl carbitol (RTM: Butyldiglycol); and 84.2 wt.% silver coated copper flake.