NOVELTY - An alkaline solution with potassium hydroxide, isopropyl alcohol and deionized water is supplied to closed-loop circulation system (15) comprising process chamber (10) and recirculation line (60) with at least one sensor (70) and fluidly coupled to process chamber, to form mixture having predetermined concentration ratio and predetermined volume. The mixture filled in process chamber and overflow is passed into recirculation line. Batch (a) of silicon wafers is submerged in mixture within process chamber to texture at least one surface of silicon wafers, to form solar cell.    USE - Method of texturing surface of silicon wafer used for solar cell.    ADVANTAGE - The method economically textures the surface of silicon wafer having high durability.    DETAILED DESCRIPTION - An alkaline solution comprising potassium hydroxide, isopropyl alcohol and deionized water is supplied to a closed-loop circulation system, to form mixture having predetermined concentration ratio and predetermined volume. The mixture filled in the process chamber and overflow is passed into the recirculation line. Batch (a) of silicon wafers is submerged in the mixture within the process chamber to texture at least one surface of the silicon wafers of the batch (a), to form solar cell. The mixture is circulated through the closed-loop circulation system such that the mixture passes through the sensor. The concentration ratio of the mixture and concentration level of an etch by-product within the mixture is measured. The measured concentration ratio is compared with the predetermined concentration ratio to determine the measured concentration ratio is within a predetermined range of the predetermined concentration ratio. The concentration level of the etch by-product is compared with predetermined threshold, and the measured concentration ratio which is not within the range of the predetermined concentration ratio is determined. The volume of the potassium hydroxide, isopropyl alcohol and/or deionized water is feed into the closed-loop circulation system while reducing equal volume of the mixture from the closed-loop circulation system to return the concentration ratio of the mixture back within the predetermined range and determining that the concentration level of the etch by-product is more than the predetermined threshold. The volume of the potassium hydroxide, isopropyl alcohol and/or deionized water is feed into the closed-loop circulation system while reducing equal volume of the mixture from the closed-loop circulation system to decrease the concentration level of the etch by-product in the mixture less than the predetermined threshold. The closed-loop circulation system has process chamber and recirculation line with at least one sensor and fluidly coupled to the process chamber.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of system for texturing surface of silicon wafer.    Process chamber (10)    Overflow chamber (11)    Closed-loop circulation system (15)    Recirculation line (60)    Sensor (70)