NOVELTY - A semiconductor block adhesive bonding apparatus (1) consists of support (3) provided with in/out component (2), suction pad (32), actuator (33), air apparatus (34), base substrate (7) and application component (4), mount frame (11), conveyance component (12), control apparatus (5) and stage (13). The adhesive agent comprises polyfunctional (meth)acrylate, monofunctional (meth)acrylate, polymerization initiator, hardening accelerator and particulate material.    USE - Semiconductor block adhesive bonding apparatus is used for semiconductor wafer (claimed) for semiconductor integrated circuit and solar cell.    ADVANTAGE - The semiconductor block adhesive bonding apparatus is compact and simple, and provides automation of adhesive application.    DETAILED DESCRIPTION - A semiconductor block adhesive bonding apparatus consists of support provided with in/out component, suction pad, actuator, air apparatus and application component, mount frame, conveyance component, control apparatus and stage. The in/out component carries semiconductor block and a base substrate in and out of apparatus. The suction pad moves up and down by pneumatic pressure and is provided on semiconductor block surface. The actuator is connected to semiconductor block and suction pad. The air apparatus is connected to actuator through support. The application component is provided with coating unit for coating adhesive agent automatically on base substrate. The mount frame is arranged parallel to in/out component, support and application component. The conveyance component is arranged on mount frame and extends between in/out component, support and application component. The conveyance component-top is attached on mount frame so that sliding is possible. The stage is mounted on semiconductor block after semiconductor block, base substrate, or the base substrate is adhered, and moves in parallel with upper surface of mount frame between in/out component, support and application component, on stage. The semiconductor block is arranged and extends to support. After lifting semiconductor block above stage in support, stage is conveyed to in/out component. The application component is conveyed to base substrate mounted on stage. The adhesive agent is coated in the application component and conveyed to semiconductor block of base substrate. A control apparatus controls operation of taking semiconductor block below and attaching with base substrate. The adhesive agent comprises polyfunctional (meth)acrylate, monofunctional (meth)acrylate, polymerization initiator, hardening accelerator and particulate material. INDEPENDENT CLAIMS are included for the following:    (1) semiconductor block adhesion method, which involves mounting semiconductor block on the stage, conveying the semiconductor block from the in/out portion to the support, lifting the semiconductor block above the stage in the support, returning the stage in the in/out portion from the support, conveying the stage from support portion to application component, coating adhesive agent on the base substrate in the application component, conveying mounted base substrate after coating from application component to support, mounting semiconductor block on base substrate coated with adhesive agent, adhering the base substrate and the semiconductor block, and conveying the semiconductor block after adhesion from the support to the in/out portion; and    (2) manufacture of semiconductor wafer, which involves cutting semiconductor block with a base substrate to several thin-plate shape, immersing in warm water, peeling base substrate and immersing semiconductor block in the warm water.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of semiconductor block adhesive bonding apparatus. (Drawing includes non-English language text)    Semiconductor block adhesive bonding apparatus (1)    In/out component (2)    Support (3,31,41)    Application component (4)    Control apparatus (5)    Base substrate (7)    Mount frame (11)    Conveyance component (12)    Stage (13)    Plate-shaped guide (21)    Suction pad (32)    Actuator (33)    Air apparatus (34)