NOVELTY - Electronic component (100) comprises: a unit including an electronic device (1); and an opposite member (2) opposing the electronic device, where the unit and the opposite member are bonded together with an adhering member disposed between the unit and the opposite member, the adhering member has light-cured resin and inorganic particles in the light-cured resin and a particle-diameter distribution of the inorganic particles by volume satisfies the conditions as given in the specification.    USE - The electronic component is useful in an electronic module (claimed).    ADVANTAGE - The electronic component: prevents the occurrence of spot delamination; and utilizes electronic component that prevents degradation of performance and adhesion of foreign substances to the front surface of the electronic device and the lower surface the opposite member.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for:    (1) an electronic module comprising: the electronic component; a circuit member including connection terminals; and a peripheral device connected to the circuit member, where the external terminals and the connection terminals are electrically and mechanically connected together;    (2) manufacturing the electronic module, comprising either: (a) electrically and mechanically connecting the external terminals of the electronic component to connection terminals of a circuit member by reflow soldering; or (b) installing the electronic component to a circuit member by reflow soldering, and heating opposite member to a second temperature higher than the first temperature by the reflow soldering, after heating the opposite member to a first temperature, after exposure and before the reflow soldering; and    (3) manufacturing the electronic component, comprising: interposing an adhesive containing a light-curable liquid composition and inorganic particles dispersed in the liquid composition (a1) between at least part of a fixing member (3) for fixing the electronic device and the opposite member to each other or (b1) between the electronic device and the opposite member; and forming the adhering member by curing the adhesive with an exposure of the adhesive to light via the opposite member.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic plan view of the electronic component.    Electronic device (1)    Opposite member (2)    Fixing member (3)    Electrodes (13)    Electronic component (100)