NOVELTY - A resin paste (10) comprises a mixed solvent containing polar solvent (I) and polar solvent (II), heat-resistant resin (B) soluble in the mixed solvent at room temperature, and heat-resistant resin (3) soluble in solvent (I), and insoluble in solvent (II) and mixed solvent, at room temperature. Resin (3) is dispersed in a solution (2) containing the mixed solvent and resin (B). Resin (3) is an organic filler having an average particle diameter of 0.1-5 mu m. The weight average molecular weight of resin obtained by mixing resin (B,3) is 10000-100000.    USE - Resin paste is used for forming resin films in manufacture of solar cells (claimed) e.g. metal wrap through, emitter wrap through or interdigitated back contact type solar cells. Can also be used for semiconductor devices.    ADVANTAGE - The resin paste is excellent form retentivity and continuous printability. The resin paste forms resin films having excellent sputter-proof property, plating-proof property, insulation property, and alkali resistance. Since curvature of silicon wafer is reduced by using the resin film, yield and productivity are improved in manufacture of semiconductor device.    DETAILED DESCRIPTION - A resin paste comprises a mixed solvent containing polar solvent (I) and polar solvent (II), heat-resistant resin (B) soluble in the mixed solvent at room temperature, and heat-resistant resin (3) soluble in solvent (I), and insoluble in solvent (II) and mixed solvent, at room temperature. Resin (3) is dispersed in a solution containing the mixed solvent and resin (B). Resin (3) is an organic filler having an average particle diameter of 0.1-5 mu m. The weight average molecular weight of resin obtained by mixing resin (B,3) is 10000-100000. The resin paste has a thixotropy coefficient of 2-10 and a viscosity of 30-500 Pa.second at 25 degrees C. An INDEPENDENT CLAIM is included for manufacture of solar cell, which involves screen-printing the resin paste exposed to the electrode-formation surface of substrate (1) having electrode formed on the surface(s), and heat-hardening the resin paste to form a resin film (4).    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic cross-sectional view of the resin paste immediately after screen-printing on the base material, and a schematic cross-sectional view of the resin film obtained by heating the resin paste on base material.    Substrate (1)    Solution containing mixed solvent and heat-resistant resin (2)    Heat-resistant resin (3)    Resin film (4)    Resin paste (10)