TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Method: The method further comprises: selecting the first process condition to achieve a first film haze in the base layer greater than 20%, and selecting the second process condition to achieve a second film haze less than the first film haze; selecting a flow ratio between a flow rate of water vapor and a flow rate of diborane to achieve a film haze less than 10% in the at least one fill layer; purging the vacuum environment of diethyl zinc by evacuating the vacuum environment for a pre-treatment time duration following the terminating and prior to introducing the diborane; and purging the vacuum environment of diborane gas by evacuating the vacuum environment for a post-treatment time duration immediately following the introducing the diborane for the treatment time duration. The providing step comprises depositing a base layer of zinc oxide using diethyl zinc and water in a chemical vapor deposition process at a first process condition, and the depositing at least one fill layer comprises depositing a fill layer of zinc oxide using diethyl zinc and water in a chemical vapor deposition process at a second process condition. The step of depositing at least one fill layer comprises forming many fill layers on the base layer and performing the surface treatment process on at least a portion of each fill layer prior to depositing a subsequent fill layer. In the method, water vapor is introduced with the diborane gas. The step of providing a base layer comprises depositing the base layer by flowing diethyl zinc and water into a vacuum environment and heating the substrate, and the step of performing a surface treatment comprises terminating a flow of the diethyl zinc after depositing the base layer, and introducing diborane gas for a treatment time duration, and the depositing at least one fill layer comprises restarting a flow of diethyl zinc and water. A flow of the diborane gas is increased in excess of 1000 sccm during the treating. A pressure of the vacuum environment is elevated over a pressure of the vacuum environment during the depositing of the base layer. The step of treating the exposed surface of the base layer comprises exposing the base layer to a dopant containing boron or diborane gas. Preferred Components: The fill layer comprises many fill layers comprising a first fill layer having a thickness which is less than a thickness of the base layer, and having a grain size which is less than a grain size of the base layer. A thickness of the base layer is greater than or equal to 1 mu , and the thickness of the first fill layer is less than 500 nm. The thickness of the base layer is 1.4-3 mu , and the thickness of the first fill layer is 6-250 nm. A thickness of the at least one fill layer is less than or equal to one half of a thickness of the base layer. A thickness of each subsequent fill layer is less than or equal to about half of the thickness of a preceding fill layer. An interfacial region between the base layer and the at least one fill layer is doped with boron. EXAMPLE - No suitable example given.