NOVELTY - Electrically conductive, thermally curable composition comprises: an electrically conductive particles; and an ethylenically unsaturated monomer or oligomer with hydroxy groups, and a blocked isocyanate with unblocking temperatures below 200 degrees C.    USE - The composition is useful in: forming electrically conductive layer; layered assembly; and photovoltaic device (all claimed) including solar cells.    ADVANTAGE - The composition: is solvent-free; and utilizes electrically conductive member which exhibits a contact resistivity of less than 20 ohm.cm2 and a bulk resistivity of less than 75 milliohm/square/mil (claimed).    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for:    (1) forming (I) the electrically conductive layer (20) on a substrate, comprising forming the composition and a free radical initiator, applying the composition on the substrate to a thickness of 1-100 microns, and heating the applied composition to a temperature less than 250 degrees C;    (2) forming (II) the electrically conductive layer on a substrate, comprising forming the composition and a free radical initiator, applying the composition on the substrate to a thickness of 1-100 microns, and exposing the applied composition to UV radiation of a sufficient duration and intensity to cure the composition;    (3) substrate having a thin layer of an electrically conductive polymeric material, where the material includes 70-92% of metallic particles dispersed in a polymeric matrix formed from thermally curing a composition comprising ethylenically unsaturated monomer or oligomer having hydroxy groups, blocked isocyanate having an unblocking temperature of less than 200 degrees C, and free radical initiator;    (4) a photovoltaic device comprising many layers, and an electrically conductive member, where the electrically conductive member formed from the composition;    (5) a layered assembly (10) comprising the substrate, the layer of a transparent conducting oxide on the substrate, and the electrically conductive member in electrical communication with the layer of the transparent conducting oxide; and    (6) layered assembly comprising silicon substrate, layer of aluminum on the silicon substrate, and electrically conductive member in electrical communication with layer of aluminum.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of layered assembly.    Layered assembly (10)    Layer (20)    Upper face (22)    Upper layer (30)    Semiconductor material (40)