NOVELTY - The conductive adhesive tape comprises a conductive layer (2), an adhesive layer (3), and a metal layer (4). The adhesive layer is formed at one side in a thickness direction of the conductive layer, and contains an adhesive and a conductive filler. The metal layer is interposed between the conductive layer and the adhesive layer. In a heat cycle test, a maximum resistance value in a first cycle is less than or equal to 0.1 Omega , and a resistance value increase rate is greater than or equal to 100%. An endurance evaluation terminal substrate: is made by bonding the conductive adhesive tape to a silver-plated layer.    USE - The conductive adhesive tape is useful for grounding of printed wiring boards, grounding of exterior shield cases of an electronic device, grounding for static electricity prevention and internal wirings for power source devices or electronic devices such as display devices including liquid crystal display devices, organic electroluminescence display devices plasma display panels, electronic papers and solar batteries.    ADVANTAGE - The cost-effective conductive adhesive tape exhibits long term conductivity retention property, enhanced adhesiveness, excellent appearance, and high reliability, and improves durability of the electrical devices.    DETAILED DESCRIPTION - The conductive adhesive tape comprises a conductive layer (2), an adhesive layer (3), and a metal layer (4). The adhesive layer is formed at one side in a thickness direction of the conductive layer, and contains an adhesive and a conductive filler. The metal layer is interposed between the conductive layer and the adhesive layer. In a heat cycle test, a maximum resistance value in a first cycle is less than or equal to 0.1 Omega , and a resistance value increase rate is greater than or equal to 100%. An endurance evaluation terminal substrate: is made by bonding the conductive adhesive tape to a silver-plated layer having a thickness of 5 mm so that a bonded area is 6 mm2; and is placed in a constant temperature bath, where a resistance value of the bonded portion is measured with a constant current of 2A supplied to the conductive adhesive tape and the silver-plated layer while a cycle is repeated. A temperature in the constant temperature bath is: decreased from 25 degrees C to -40?C to cool; kept at -40 degrees C for 10 minutes; increased to 85 degrees C to heat; further kept at 85 degrees C for 10 minutes; and decreased again till reaching 25 degrees C. The resistance value increase rate is calculated from the maximum resistance value in the 200th cycle and the maximum resistance value in the first cycle using a formula that is expressed by (resistance value increase rate) = 100x ((maximum resistance value in the 200th cycle)-(maximum resistance value in the first cycle))/(maximum resistance value in the first cycle). The metal layer: has a thickness of 0.5-30 mu m; and is a low melting point metal layer comprising a low melting point metal that has a melting point of less than or equal to 180 degrees C.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic cross-sectional view of a conductive adhesive tape.    Conductive layer (2)    Adhesive layer (3)    Metal layer (4)    Release sheet. (5)