NOVELTY - The method comprises directly thermal spraying a first metal onto a first side of a ceramic plate, where the metal comprises aluminum and densifying (520) the thermally sprayed metal. The thermal spraying step comprises arc spraying the metal. The densifying step comprises heating the ceramic plate at a temperature above a melting point of the first metal under an inert cover gas. The method further comprises creating a metallization pattern on the ceramic plate by etching away parts of first and second portions of the metal from the ceramic plate, and applying a mask to the ceramic plate.    USE - The method is useful for forming a metallized ceramic that is useful in a thermoelectric device, which is useful as a heater, a cooler, a fixed-joint, high temperature thermoelectric power generator and/or a temperature sensor and in automotive waste heat recovery applications.    ADVANTAGE - The method allows formation of the metallized ceramic with high tensile strength and increased resiliency to thermal cycling, and allows improved adhesion of metallization on the ceramic plate.    DETAILED DESCRIPTION - The method comprises directly thermal spraying a first metal onto a first side of a ceramic plate, where the metal comprises aluminum and densifying (520) the thermally sprayed metal. The thermal spraying step comprises arc spraying the metal. The densifying step comprises heating the ceramic plate at a temperature above a melting point of the first metal under an inert cover gas. The method further comprises creating a metallization pattern on the ceramic plate by etching away parts of first and second portions of the metal from the ceramic plate, applying a mask to the ceramic plate before thermal spraying step, removing the mask from the ceramic plate after thermal spraying step, plating (540) a second metal onto the ceramic plate after thermal step, thermal spraying the second metal onto a second side of the ceramic plate before densifying step, coupling P-type and N-type thermoelectric elements to the ceramic plate, and coupling a second ceramic plate to the P-type and N-type thermoelectric elements. The first side and the second side are different. The metallization pattern is created by thermal spraying the first portion of metal directly onto a first side of the ceramic plate and thermal spraying the second portion of metal directly onto the second side of the ceramic plate. The plate is heated at a temperature above the melting point of the first portion of metal and above the melting point of the second portion of metal. An INDEPENDENT CLAIM is included for a device such as a thermoelectric device comprising ceramic plate.    DESCRIPTION OF DRAWING(S) - The figure shows a flowchart of a method of forming metallized ceramics.    Depositing aluminum alloy on ceramic plate (510)    Densifying thermally sprayed metal (520)    Applying pattern (530)    Plating second metal onto the ceramic plate. (540)