NOVELTY - A resin mold material composition contains 0.1-10 pts. wt. hardenable curable fluorine-type copolymer (A) with respect to 100 pts. wt. curable monomer or curable resin capable of forming a mold resin or replica mold resin for imprint.    USE - Resin mold material composition is used for manufacturing resin replica mold for manufacturing resin mold for manufacturing patterned silicon semiconductor substrate (all claimed). Uses include but are not limited to transistor, light-emitting diode, solar cell, flexible display, wireless tag, wearable computer, optical device, liquid crystal display light modulator and optical shutter etc.    ADVANTAGE - The resin replica mold having excellent mold release characteristics is economically manufactured using the resin mold material composition, without damage to fine structure pattern.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) manufacture of resin replica mold, which involves coating the resin mold material composition to a silicon substrate, quartz, a resin substrate or a resin film, forming a film, pressing an inorganic material mold negative plate in which micro-pattern is formed on surface on the obtained film, forming a transcription pattern, hardening the transcription pattern, and mold-releasing resin replica mold by which pattern transcription is carried out from the mold negative plate;    (2) manufacture of resin mold, which involves coating the resin mold material composition to a silicon substrate, quartz, a resin substrate or a resin film, forming a film, pressing a resin replica mold in which micro-pattern is formed on surface on the obtained film, forming a transcription pattern, hardening the transcription pattern, and mold-releasing resin mold by which pattern transcription is carried out from the resin replica mold; and    (3) manufacture of patterned silicon semiconductor substrate, which involves coating the resin mold material composition to a silicon substrate as a resist layer, pressing inorganic material mold negative plate or resin mold in which micro-pattern is formed on surface on the obtained product, forming a transcription pattern, obtaining resist hardened material having a fine structure pattern by hardening the transcription pattern, mold-releasing inorganic material mold negative plate or resin mold in which micro-pattern is formed on surface on the obtained resist hardened material by which pattern transcription is carried out, carrying out oxygen ashing of e resist hardened material layer, making only convex portion pattern of resist hardened material layer, and obtaining the silicon semiconductor substrate by subjecting the obtained substrate to etching, and forming fine structure pattern in the silicon substrate surface.