TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Compounds: The organic peroxide is 1-butyl-(2-ethylhexyl)monoperoxy carbonate, 3-butylperoxy-isopropyl carbonate, 3-butylperoxy acetate, 3-butylperoxy benzoate, dicumyl peroxide, 2,5-dimethyl-2,5-bis(3-butylperoxy)hexane, di-3-butylperoxide, 2,5-dimethyl-2,5-bis(3-butylperoxy)hexyne, 1,1-bis(3-butylperoxy)cyclohexane, methyl ethyl ketone peroxide, 2,5-dimethylhexyl-2,5-bisperoxybenzoate, 3-butylhydroperoxide, p-menthane hydroperoxide, benzoyl peroxide, p-chlorobenzoyl peroxide, 3-butylperoxy isobutyrate, hydroxyheptyl peroxide, and/or cyclohexanone peroxide. The hardenable functional group is cyanurate group, vinyl group, and/or (meth)acrylate group. The crosslinking agent is triarylisocyanurate, triarylcyanurate, divinylbenzene, trimethylolpropane trimethacrylate, diaryl phthalate, and/or ethylene glycol dimethacrylate. The sealing material further comprises UV stabilizer chosen from 0.2-5 pts. wt. benzophenone type UV absorber and 0.01-0.1 pts. wt. hindered amine light stabilizer type UV stabilizer. The hindered amine light stabilizer is bis-1,2,2,6,6-pentamethyl-4-pyridyl sebacate, bis-(1-octyloxy-2,2,6,6-tetramethyl-4-piperidinyl)sebacate, tetrakis(2,2,6,6-tetramethyl-4-piperidyl)-1,2,3,4-butanetetracarboxylate, ((4-methoxyphenyl)-methylene)-bis(1,2,2,6,6-pentamethyl-4-piperidinyl)ester, and/or bis(2,2,6,6-tetramethyl-4-piperidinyl)sebacate. The benzophenone type UV absorber is 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxy-2'-carboxybenzophenone, 2-hydroxy-4-octoxybenzophenone, 2-hydroxy-4-n-dodecyloxybenzophenone, 2-hydroxy-4-n-ocatadecyloxybenzophenone, 2-hydroxy-4-benzyloxybenzophenone, 2-hydroxy-4-methoxy-5-sulfobenzophenone, 2-hydroxy-5-chlorobenzophenone, 2,4-dihydroxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, and/or 2,2',4,4'-tetrahydroxybenzophenone. The sealing material further comprises 0.1-1 pt. wt. 10-20C fatty acid amide chosen from lauric acid amide, palmitic amide, stearic acid amide, erucic acid amide, behenic acid amide, ricinolic acid amide, hydroxystearic acid amide, N-oleyl palmitic amide, N-stearyl erucic acid amide, ethylenebis capramide, ethylenebis lauric acid amide, ethylenebis stearamide, and ethylenebis oleic acid amide. The sealing material further comprises 0.01-0.5 pt. wt. phosphate flame retardant. The silane coupling agent is N-( beta -aminoethyl)- gamma -aminopropyltrimethoxysilane, N-( beta -aminoethyl)- gamma -aminopropylmethyldimethoxysilane, gamma -aminopropyltriethoxysilane, gamma -glycidoxypropyltrimethoxysilane, and/or gamma -methacryloxypropyltrimethoxysilane.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The ethylene copolymer is ethylene-vinyl acetate copolymer having a vinyl acetate content of 25-35 wt.% and a melt index of 5-15 g/10 minutes at 190 degrees C under 2160 g load, ethylene-methyl (meth)acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-isobutyl acrylate copolymer, ethylene-n-butyl acrylate copolymer, ethylene-(meth)acrylate copolymer, and/or ethylene-isobutyl acrylate-methacrylic acid copolymer.