NOVELTY - The method comprises obtaining (S102) strippable glass substrate with a surface processing a first main surface as a release agent in a surface treatment process, forming (S104) an uncured hardening property resin composition layer coated above the surface during hardening resin composition layer formation process, performing lamination process (S106) an a fringe area of the upper carrier substrate to obtain the hardening former laminate, obtaining (S108) post-cure laminate with the hardening property resin composition layer in a baking process.    USE - The method is useful for producing an electronic device (claimed) such as photo-voltaic solar cell, LCD panel and organic electro-luminescent panel.    ADVANTAGE - The method produces flat electronic devices with high productivity.    DETAILED DESCRIPTION - The method comprises obtaining (S102) strippable glass substrate with a surface processing a first main surface as a release agent in a surface treatment process, forming (S104) an uncured hardening property resin composition layer coated above the surface during hardening resin composition layer formation process, performing lamination process (S106) on a fringe area of the upper carrier substrate to obtain the hardening former laminate, obtaining (S108) post-cure laminate with the hardening property resin composition layer in a baking process, performing sawing process (S110) for cutting the resin layer and strippable glass substrate according to the outer periphery of the upper carrier substrate within the post-cure laminate, forming the member for an electronic device on the second major surface of the strippable glass substrate in a member formation process and obtaining the laminate equipped with the member for the electronic device, separating the electronic device with the member for the strippable glass substrate from the laminate. The method further comprises performing desaturate processing of the uncured hardening property resin composition layer after the lamination process and before the baking step of the electronic device. The method further comprises contacting the circumference of the upper carrier substrate with the main surface of the carrier substrate. The method further comprises dividing the strippable glass substrate within the post-cure laminate and resin layer.    DESCRIPTION OF DRAWING(S) - The figure shows a flow chart of a method for producing an electronic device (Drawing includes non-English language text).    Obtaining strippable glass substrate with a surface processing a first main surface (S102)    Forming an uncured hardening property resin composition layer coated above the surface (S104)    Performing lamination process (S106)    Obtaining post-cure laminate with the hardening property resin composition layer (S108)    Performing sawing process . (S110)