TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Formulation: The printing formulation further comprises at least one printing suitable liquid carrier; and an additive. The printing formulation is use in coating a substrate surface. The coating is carried out by a method selected from spin coating, roll coating, spray coating, dip coating, flow coating, doctor blade coating, dispensing, ink-jet printing, offset printing, screen printing, pad printing, gravure printing, flexography, nanoimprinting, stencil printing, imprinting, xerography, lithography or stamping. Preferred Method: The metal precursor is in the form of metal salt nanoparticles, and the method involves dispersing the nanoparticles in a liquid medium; or the metal precursor is in the form of a metal complex, and the method involves dissolving the metal complex in a liquid medium. The process (P1) further involves: sintering the metallic pattern. The step of decomposing is achievable by heating, heating in an oven, heating by laser, heating by microwave, heating by electrical voltage, or heating by exposure to light; or by photonic curing by ultra violate (UV) radiation, infra red (IR) radiation or by plasma treatment; or by heating under air, nitrogen, argon or a non-oxidizing atmosphere; or by heating under air or an oxidizing atmosphere; or by a chemical method. Preferred Nanoparticles: The mean particle size of the metal salt nanoparticles is 10- 1000 nm (preferably 50-1000 nm). The metal salt nanoparticles have random shapes, or spherical, crystalline or amorphous. Preferred Components: The nanoparticulate metal salt is obtained by a process selected from bead milling, spray drying and precipitation (preferably bead milling). The bead milling involves milling a mixture of the metal salt, a stabilizer and a solvent at the presence of beads. The nanoparticulate metal salt precursor is obtained by precipitation, by adding a precipitation agent to a solution of a precursor material. The precipitation is carried out in the presence of a stabilizer. The metal precursor is of a metal of Groups IIIB, IVB, VB, VIB, VIIB, VIIIB, IB and IIB of block d of the Periodic Table of Elements. The metal is selected from Sc, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Y, Zr, Nb, Tc, Ru, Mo, Rh, W, Au, Pt, Pd, Ag, Mn, Co, Cd, Hf, Ta, Re, Os, Al, Sn, In, Ga or Ir, (preferably Cu). The metal salt comprises an inorganic anion or an organic anion. The inorganic anion is selected from HO-, F-, Cl-, Br-, I-, NO2-, NO3-, ClO4-, SO4-2, SO3-, PO4- or CO3-2. The metal salt is salt of copper; salt of nickel; salt of silver; or metal salt selected from indium(III) acetate, indium(III) chloride, indium(III) nitrate; iron(II) chloride, iron(III) chloride, iron(II) acetate; gallium(III) acetylacetonate, gallium(II) chloride, gallium(III) chloride, gallium(III) nitrate; aluminum(III) chloride, aluminum(III) stearate; silver nitrate, silver chloride; dimethlyzinc, diethylzinc, zinc chloride, tin(II) chloride, tin(IV) chloride, tin(II) acetylacetonate, tin(II) acetate; lead(II) acetate, lead(II) acetlylacetonate, lead(II) chloride, lead(II) nitrate and PbS. The copper metal salt is copper formate, copper citrate, copper acetate, copper nitrate, copper acetylacetonate, copper perchlorate, copper chloride, copper sulfate, copper carbonate, and/or copper hydroxide. The nickel metal salt is nickel formate, nickel citrate, nickel acetate, nickel nitrate, nickel acetylacetonate, nickel perchlorate, nickel chloride, nickel sulfate, nickel carbonate, and/or nickel hydroxide. The silver metal salt is silver oxalate, silver lactate, and/or silver formate. The nanoparticulate metal salt material is formulated as dispersion in a liquid medium. The dispersion further comprises a stabilizing agent. The stabilizing agent is selected from the liquid medium, a cationic surfactant, an anionic surfactant, a non-ionic surfactant, or a zwitterionic surfactant. The metal precursor is metal salt nanoparticles of copper formate dispersed in glycol ether, and further comprises a stabilizer being a functionalized polymer. The metal complex comprises organic complexing moieties (preferably amino acids). The metallic complex is selected from a copper complex, a nickel complex, an aluminum complex, a cobalt complex, a tin complex, an indium complex, or a zinc complex. The metal is copper and the copper complex is selected to easily decompose at a low temperature. The copper complex comprises amine and hydroxy complexing moieties. The complexing moieties are selected from ethanol amine, di-ethanol amine, triethanol amine, AMP 95 (RTM: amino methyl propanol), 1-amino-2-propanol, 3-amino-1-propanol or diisopropanolamine.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The organic anion is selected from acetate (CH3COO-), formate (HCOC-), citrate (C3H5O(COO)3-3), acetylacetonate, lactate (CH3CH(OH)COO-), oxalate ((COO)2-2) or their derivatives. The liquid medium is water, a water-containing liquid mixture; an organic solvent, or water-containing organic solvent. The organic solvent is selected from glycol ether, alcohol or acetate (preferably terpinol, acetone, ethyl acetate, ethanol, propanol, and/or butanol). The medium in which the metal complexes are dissolved is water, water-containing liquid mixture, or organic solvent. The metal atom is associated to at least two different organic moieties or associated to at least one additive. The additive is conducting metallic particles, conducting metallic nanoparticles, metal precursor, oxidant, anti-oxidant, stabilizer, solvent, humectant, dispersing agent, binder, reducing agent, surfactant, wetting agent, leveling agents, fungicides, rheology modifiers, pH adjusting agents, and/or adhesion promoter.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The stabilizing agent is selected from a polyelectrolyte, a polymeric material, or a cationic polymer; or a copolymer or salt of a copolymer having acidic groups. EXAMPLE - 75 g of Copper formate was mixed with 7.5 g of a cationic polymer (weight average molecular weight (Mw of 2000) and with 67.5 g DPM (Dipropylene glycol methyl ether). The mixture was bead milled (WAB) to obtain copper formate nanoparticles with an average diameter of 290 nm. The formulation was drawn down on a glass slide and heated to 200 degrees C under nitrogen for 20 minutes. A sheet resistance of 20 mOhms per square was measured. The heating was carried out under reducing atmosphere.