NOVELTY - The method comprises plasticizing a conductivity type semiconductor substrate, forming a silver (Ag) pattern on an aluminum film of the substrate using a silver paste composition that comprises the Ag powder, forming the aluminum film with prescribed thickness, coating an aluminum paste composition at a rear side of the substrate in which an emitter layer and a reflection barrier layer are formed using tin powder, glass frit powder and an organic binder. The method further comprises forming an emitter layer in the substrate, and forming a reflection barrier layer on the emitter layer.    USE - The method is useful for manufacturing a back contact electrode of a silicon solar cell (claimed), a compound semiconductor solar cell and stack solar cell i.e. tandem solar cell, where the back contact electrode is useful in an advanced electronic products of the printed circuit board, touch panel, radio-frequency identification part, LCD and programmed data processor.    ADVANTAGE - The method reduces the interface resistance between the electrode and the substrate thus improving the electrical characteristic of the solar cell.    DETAILED DESCRIPTION - The method comprises plasticizing a conductivity type semiconductor substrate, forming a silver (Ag) pattern on an aluminum film of the substrate using a silver paste composition that comprises the Ag powder, forming the aluminum film with prescribed thickness, coating an aluminum paste composition at a rear side of the substrate in which an emitter layer and a reflection barrier layer are formed using tin powder, glass frit powder and an organic binder. The tin powder has thermal expansion coefficient of 21x10-6, the thermal conductivity of 66.8 W/mk and the average particle diameter of 0.1-10. The tin powder (1-20 pts. wt.) is mixed in the Ag powder. The Ag powder has phosphorus with an average particle diameter of 0.1-10 and the tap density of 2-7 g/cubic cm. The plasticizing of the substrate is performed at a temperature of 1,000 degrees C for 5 seconds to 3 minutes, where the substrate is p-type silicon board. The Ag pattern is penetrated into the aluminum film. The glass frit powder comprises lead oxide or bismuth oxide. The organic binder is a mixture consisting of cellulosic resin, acrylic resin, butylcarbitol and terpineol. The method further comprises forming a front electrode in a rear side, forming the emitter layer in the substrate, and forming a reflection barrier layer on the emitter layer. An INDEPENDENT CLAIM is included for manufacturing a silicon solar cell.