NOVELTY - A polyimide precursor aqueous solution composition comprises a polyamic acid obtained by reacting a tetracarboxylic acid component and a diamine component, dissolved in an aqueous solvent together with 1.6 times mole or more imidazole with respect to tetracarboxylic acid component of the polyamic acid. The polyamic acid has a carboxylic acid group-containing repeating unit (I).    USE - Polyimide precursor aqueous solution composition is used for polyimide for polyimide precursor resin composition for polyimide film used as protective film for manufacturing flexible device e.g. display apparatus and light reception device, electric apparatus, electronic apparatus, optical apparatus, touch panel, solar cell and LED lighting apparatus (all claimed), liquid crystal display, organic electroluminescent display, electronic paper and thin film solar cell.    ADVANTAGE - The polyimide film using the polyimide precursor aqueous solution composition has favorable adaptation-to-environment property, high transparency, and excellent flexibility, heat resistance, electrical property and solvent resistance.    DETAILED DESCRIPTION - A polyimide precursor aqueous solution composition comprises a polyamic acid obtained by reacting tetracarboxylic acid component and a diamine component, dissolved in an aqueous solvent together with 1.6 times mole or more imidazole with respect to tetracarboxylic acid component of the polyamic acid. The polyamic acid has a carboxylic acid group-containing repeating unit of formula (I).    A=tetravalent group obtained by removing carboxyl group from aromatic tetracarboxylic acid which does not contain fluorine group, tetravalent group obtained by removing carboxyl group from aliphatic tetracarboxylic acid, and/or tetravalent group obtained by removing carboxyl group from aromatic tetracarboxylic acid containing fluorine group;and    B=bivalent group obtained by removing amino group from aromatic diamine which does not contain fluorine group, in which solubility with respect to 25 degrees C water is 0.1 g/L or more, bivalent group obtained by removing amino group from aliphatic diamine having molecular weight of 500 or less, and/or bivalent group obtained by removing amino group from aromatic diamine containing fluorine group.    (i) 50 mol% or more of A is tetravalent group obtained by removing carboxyl group from aliphatic tetracarboxylic acid and/or tetravalent group obtained by removing carboxyl group from aromatic tetracarboxylic acid containing fluorine group, and 50 mol% or less (0 mol% is included) is tetravalent group obtained by removing carboxyl group from aromatic tetracarboxylic acid which does not contain fluorine group, and/or 50 mol% or more of B is bivalent group obtained by removing amino group from aromatic diamine which does not contain fluorine group, in which solubility with respect to 25 degrees C water is 0.1 g/L or more, and 50 mol% or less (0 mol% is included) is bivalent group obtained by removing amino group from aliphatic diamine having molecular weight of 500 or less, and/or bivalent group obtained by removing amino group from aromatic diamine containing fluorine group. INDEPENDENT CLAIMS are included for the following:    (1) polyimide, which is obtained by heat-processing the polyimide precursor aqueous solution composition;    (2) polyimide film, which is obtained by using the polyimide precursor aqueous solution composition, and has light transmittance of 400 nm of 60% or more in conversion of film thickness of 10 mu m;    (3) manufacture of polyimide precursor aqueous solution composition, which involves reacting tetracarboxylic acid component and diamine component using water as e reaction solvent in presence of imidazole. The tetracarboxylic acid component contains 50 mol% or less aromatic tetracarboxylic dianhydride which does not contain fluorine group and/or 50 mol% or more aliphatic tetracarboxylic dianhydride which optionally contain fluorine group. The diamine component contains 50 mol% or more aliphatic diamine having molecular weight of 500 or less and optionally containing fluorine group, and 50 mol% or less aromatic diamine containing fluorine group and/or aromatic diamine does not contain fluorine group, in which solubility with respect to 25 degrees C water is 0.1 g/L or more;    (4) polyimide precursor resin composition for the flexible device substrate, which is formed by dissolving the polyamic acid in the aqueous medium; and    (5) manufacture of flexible device, which involves coating the polyimide precursor resin composition on a carrier board, heat-processing and forming a solid-state polyimide resin film, forming a circuit on the polyimide resin film, and peeling the polyimide resin film in which the circuit is formed in surface from the carrier board.