TECHNOLOGY FOCUS - CERAMICS AND GLASS - Preferred Components: Cover sheet is formed from glass.    TECHNOLOGY FOCUS - ELECTRICAL POWER AND ENERGY - Preferred Components: Tabbing ribbon is defined as 1st tabbing ribbon and 2nd tabbing ribbon. Preferred Processes: Method of forming PV cell module includes applying pressure to PV cell module for a period of time during and/or after combining substrate and cover sheet to form PV cell module and/or applying heat to PV cell module for a period of time during and/or after combining substrate and cover sheet to form PV cell module. Polymeric composition is dispensed via robotic dispenser. Curing is performed by applying heat to tie layer and/or greater than or equal to 1 polymeric strip.    TECHNOLOGY FOCUS - POLYMERS - Preferred Parameters: Modulus of elasticity of tie layer is 15-2000 kPa. Modulus of elasticity of polymeric strip is 0.5-12.5 kPa. Polymeric strip has parabolic-shaped cross section or rectangular-shaped cross section. Each polymeric strip has average thickness of 0.125-0.75 mm and average width of 5-13 mm. Tie layer has average thickness of 0.25-1.25 mm. Preferred Compositions: Polymeric strip is disposed on rear face of PV cell and/or disposed on front face of substrate opposite the tabbing ribbon and encapsulates greater than or equal to 1 portion of tabbing ribbon. Polymeric strip is defined as 1st polymeric strip and 2nd polymeric strip spaced from 1st polymeric strip, with 1st polymeric strip disposed adjacent to 1st tabbing ribbon and 2nd polymeric strip disposed adjacent to 2nd tabbing ribbon. The 1st polymeric strip is disposed on front face of substrate opposite to 1st tabbing ribbon, and 2nd polymeric strip is disposed on front face of substrate opposite to 2nd tabbing ribbon. Substrate is formed from glass, polymeric material, or composite material. The 1st polymeric composition comprises greater than or equal to 45 pts. wt. diorganopolysiloxane having alkenyl groups, 2.5-7.5 pts. wt. organosilicon hydride having silicon-bonded hydrogen atoms reactive to diorganopolysiloxane, and 25-65 pts. wt. non-reactive organopolysiloxane with respect to 100 pts. wt. 1st polymeric composition. The 2nd polymeric composition comprises greater than or equal to 55 pts. wt. diorganopolysiloxane having alkenyl groups and 5-25 pts. wt. organosilicon hydride having silicon-bonded hydrogen atoms reactive to diorganopolysiloxane with respect to 100 pts. wt. 2nd polymeric composition. The 1st polymeric composition comprises 2 different dimethylvinyl-terminated polydimethylsiloxanes, dimethyl hydrogen-terminated polydimethylsiloxane, and trimethylsiloxy-terminated dimethyl methyl hydrogen siloxane containing greater than or equal to 3 SiH units per molecule. The 2nd polymeric composition comprises dimethylvinyl-terminated polydimethylsiloxane, dimethyl hydrogen-terminated polydimethylsiloxane, and/or trimethylsiloxy-terminated dimethyl methyl hydrogen siloxane containing greater than or equal to 3 SiH units per molecule.