TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: Inorganic filler contains fumed silica, and has hydrophobilized surface. The gross-mass ratio of metallic compound containing alkaline-earth metal or alkali metal in full-non-volatile component of composition is 0.5-95 %mass. The metallic compound containing said alkaline-earth metal or alkali metal, contains magnesium oxide, calcium oxide, potassium oxide, magnesium carbonate, calcium carbonate, magnesium sulfate, calcium sulfate, calcium nitrate, magnesium hydroxide, and/or calcium hydroxide.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Composition: The thixo agent is polyether compound, fatty acid amide, organic filler, inorganic filler, hydrogenation castor oil, urea urethane amide, polyvinylpyrrolidone, silicone-type viscosifying gelatinizer, and/or oil type gelatinizer, preferably polyether compound, fatty acid amide and/or inorganic filler. The fatty acid amide is of formula: R4CONH2 (II), R4CONH-R5-NHCOR4 (III), R4NHCO-R5-CONHR4 (IV) or R4CONH-R5-NR6R6 (V). The fatty acid amide is preferably stearamide, N,N'-methylene bis-stearamide and/or dimethylaminopropylamido stearic acid. The dispersion medium contains water, alcohol solvent, glycol monoether-type solvent, isobornyl cyclohexanol and/or terpene-type solvent.R4,R6=1-30C alkyl or alkenyl;andR5=1-10C alkylene.Preferred Condition: The fatty acid amide evaporates or decomposes at 400 degrees C or less. Preferred Property: The composition has viscosity of 0.5-400 Pa.second at 25 degrees C. Preferred Process: Composition for barrier layer, is provided by printing method or inkjet method.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The polyether compound in thixo agent is of formula: R1-(O-R2)n-O-R3 (I). The polyether compound (I) is polyethyleneglycol, polypropylene glycol and/or poly(ethylene glycol propylene glycol)copolymer, and has number average molecular weight of 10000-50000. The composition further contains organic binder. The organic binder is acrylic resin, cellulosic resin and/or butyral resin.R1,R3=H, methyl or ethyl;n=1 or more;andR2=ethylene group or propylene group.