NOVELTY - A heat-hardening-type electroconductive paste composition comprises electroconductive powder, thermosetting component, a hardening agent and solvent. The electroconductive powder is flake-shaped powder and spherical powder. The thermosetting component contains three ingredients with epoxy resin (A) having viscosities at 25 degrees C of 3000 mPa.second or more 55000 mPa.second or less and a cyclic structure, epoxy resin (B) having viscosities at 25 degrees C of 30 mPa.second or more and 3000 mPa.second or less and cyclic structure, and block forming polyisocyanate compound (C).    USE - Heat-hardening-type electroconductive paste composition is used for forming electrical wiring and electrode e.g. current collection electrode of solar cell (all claimed), exterior electrode of chip-type electronic component, photovoltaic device, electrode for radio frequency identification, electromagnetic wave shield, vibrator adhesion, membrane switch and electroluminescence.    ADVANTAGE - The heat-hardening-type electroconductive paste composition is economical and effective, and has favorable contact resistance with another conductor, wettability and specific resistance. The electroconductive powder contained in the heat-hardening-type electroconductive paste composition has favorable fillability.    DETAILED DESCRIPTION - A heat-hardening-type electroconductive paste composition comprises electroconductive powder, thermosetting component, a hardening agent and solvent. The electroconductive powder is flake-shaped powder and spherical powder. The thermosetting component contains three ingredients with epoxy resin (A) having viscosities at 25 degrees C of 3000 mPa.second or more 55000 mPa.second or less, epoxy equivalent of 160-400 and a cyclic structure, epoxy resin (B) having viscosities at 25 degrees C of 30 mPa.second or more and 3000 mPa.second or less, epoxy equivalent of 140-300, and cyclic structure, and block forming polyisocyanate compound (C). The mass ratio of total amount of epoxy resins (A) and (B) with respect to amount of block forming polyisocyanate compound (C) is 30:70-90:10 or 10:90-70:30. The solid content of electroconductive powder is 90-98 %mass. The heat-hardening-type electroconductive paste composition has viscosity at 25 degrees C of 200-500 Pa.second.