NOVELTY - The method comprises providing an electrically conducting connection strip (6) having first and second lips (7, 8) integrally formed in or extending from the connection strip, and ultrasonic bonding of the first and second lips to contact pads (5) of first and second photo-voltaic cells respectively. Each of the first and second photo-voltaic cells comprises semiconductor substrate (4) printed with the contact pads. A width of the first and second lips is smaller than a width of the strip. The first and second lips are bonded to the contact pads on a side of the cells.    USE - The method is useful for manufacturing a photovoltaic cell assembly.    ADVANTAGE - The method is capable of economically and rapidly manufacturing the photovoltaic cell assembly with high over all efficiency, long lifespan, strong ultrasonic bonds and increased output and without cracks.    DETAILED DESCRIPTION - The method comprises providing an electrically conducting connection strip (6) having first and second lips (7, 8) integrally formed in or extending from the connection strip, and ultrasonic bonding of the first and second lips to contact pads (5) of first and second photo-voltaic cells respectively. Each of the first and second photo-voltaic cells comprises semiconductor substrate (4) printed with the contact pads. A width of the first and second lips is smaller than a width of the strip. The first and second lips are bonded to the contact pads on a side of the cells at which the connection strip is located. The semiconductor substrates comprise further contact pads, and the connection strip has further integrally formed lips. The method further comprises ultrasonically bonding the further integrally formed lips to the further contact pads. The semiconductor substrates comprise interdigitated first and second conductor lines on substrate areas of mutually opposite conductivity type. The contacts pads and the further contact pads lay on the first conductor lines. The connection strip forms an electrical connection between the first conductor lines. The first lip is internal to the strip, is located on an edge of the strip and a part or all of an outline of the first lip, and not borders on the strip. The outline of the first strip has two parallel sections extending from a base of the first lip, and a rounded section connecting the parallel sections on the side of the first lip away from the base of the first lip. An average pore area at a bonding surface (10) of the contact pads is approximately 1.5 mu m2, and a fraction of pores with a pore area of 10 mu m2 at the bonding surface is less than one percent. The contact pad is applied to the semiconductor substrate by printing a contact pad material comprising grains of conductor material onto the semiconductor substrates, sintering the contact pad material on the semiconductor material, and bonding of the contact pad to the sintered contact pad. The connection strip has a thickness of less than a quarter mm and a width of 5 mm. The connection lips each have a width of 3 mm. An INDEPENDENT CLAIM is included for a photovoltaic cell assembly.    DESCRIPTION OF DRAWING(S) - The diagram shows a schematic side sectional view of a photovoltaic cell.    Semiconductor substrate (4)    Contact pads (5)    Electrically conducting connection strip (6)    Lips (7, 8)    Bonding surface (10)    Surface field layer. (11)