TECHNOLOGY FOCUS - POLYMERS - Preferred Method: The polymer is heated at a first temperature, thus promoting flow of the polymer into the film. The method further comprises: while the thickness of the film remains substantially constant, treating the polymer within the pores (without forming covalent bonds between the polymer and the pore surfaces), where the polymer only partially fills the pores following the treating; and a lithographic process to form a component to be used in a processor. The step of treating includes: at least one of heating the polymer in a non-oxidative atmosphere at a second temperature of 150-450 degrees C (preferred), applying radiation to the polymer, and applying a plasma to the polymer; or both heating the polymer and applying radiation to the polymer. In the method: as a result of the treating, the Young's modulus of the film having pores which are partially and homogeneously filled increases by at least a factor of 4, preferably 2 compared to an otherwise identically treated film whose pores remain unfilled; prior to partially filling the pores, the composition in contact with the film has a thickness of 20 nm to 2 mu ; prior to the polymer partially and homogeneously filling the pores, the film has a dielectric constant of 1.4-2.4; and after the pores are partially filled, the fraction of the pore volume that has been filled is 1-75%. The volumetric porosity of the film prior to being partially and homogeneously filled is 20-80%, preferably 25-50%. Preferred Components: The first temperature is greater than 100 degrees C. The polymer has a molecular weight of 500-50000 g/mol. The polymer is polybenzoxazoles, phenol formaldehyde, poly(bisbenzocyclobutene), or polysilazanes. EXAMPLE - Solution of poly(methyl methacrylate) (having a weight average molecular weight of 4700 g/mol) (5 wt.%) in propylene glycol methyl ether acetate was spin coated on top of a pristine porous film (synthesized from a microelectronic grade formulation that included both a thermally stable organosilicate-polyoxycarbosilane polymer and a thermally decomposable organic polymer) at 1500 rpm for 1 minute and heated at 175 degrees C for 1 minute. The polymer remaining on top of the porous film was then removed. Thus the treated porous film density had been changed revealing that the pores were at least partially filled with the polymer.