TECHNOLOGY FOCUS - ELECTRONICS - Preferred Components: The device further comprises a conductive bridge, where the conductive bridge electrically couples one of the electrically conductive interconnect to at least one other electrically conductive interconnect. The conductive bridge is a conductive paste. At least one layer between the top and bottom contact layers comprises lithium phosphorus oxynitride or paper. The electrically conductive interconnects: are completely filled with the melted and solidified material from the top contact layer, the intermediate layers and the bottom contact layer; penetrate through the intermediate layers to the bottom layer or to predetermined depth below the top contact layer; are at least 5, at least 10, at least 15, at least 20, at least 25, at least 30, at least 35, at least 40, at least 45, at least 50, at least 55, at least 60, at least 65, at least 70, at least 75, at least 80, at least 85, at least 90, at least 95, at least 100, or at least 200; include a first set of interconnects and a second set of interconnects, where each interconnect in the first set of interconnects penetrates to a first predetermined depth and each interconnect in the second set of interconnects penetrates to a second predetermined depth different from the first predetermined depth; and are formed by welding a conductive pathway. The percentage of surface that the electrically conductive interconnect material area occupies of the interconnect-top contact area is area: greater than 10%, greater than 15%, greater than 20%, greater than 25%, greater than 30%, greater than 35%, greater than 40%, greater than 45%, greater than 50%, greater than 55%, greater than 60%, greater than 65%, greater than 70%, greater than 75%, greater than 80%, or greater than 85; or area less than 15%, less than 20%, less than 25%, less than 30%, less than 35%, less than 40%, greater than 45%, greater than 50%, less than 55%, less than 60%, less than 65%, less than 70%, less than 75%, less than 80%, less than 85%, or less than 90%. The electrically conductive interconnect has a cross-sectional area of a shape which is a circle, an oval, a rectangle or a predetermined polygon. The top contact material area and the conductive interconnect material area form a predetermined pattern comprising regular pattern, a circular pattern, a grid pattern, or irregular pattern.