NOVELTY - An adhesive, comprises: a) at least one epoxy resin; b) silver-coated particles having a silver content of 2-30 wt.%; and c) at least one amine-epoxy adduct comprising at least one functional group derived from an alkyl-substituted nitrogen-containing heterocycle.    USE - As adhesive for forming a cured product useful in the fabrication and/or assembly of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes (all claimed) used in applications including personal computers, control systems, telephone networks, automotive electronics, displays, semiconductor packages, passive devices, and in handheld devices.    ADVANTAGE - The adhesive contains a reduced amount of expensive conductive metals such as silver, and it exhibits a good electrical conductivity and a sufficient stability at room temperature (22 degrees C). The work-life of the uncured adhesive at 22 degrees C is sufficient to use the adhesive in a broad variety of electronic assembly operations. The adhesive is thermally curable and can preferably be cured in 0.1 second to 180 minutes at 50-250 degrees C, preferably 70-220 degrees C, especially 90-200 degrees C. When cured, the cured products have good adhesion, and low volume resistivity. When cured, the cured product of the adhesive forms a stable electrical conductive interconnection between two surfaces, where the interconnection provides a good resistance to thermo-mechanical or mechanical fatigue and a high electrical conductivity and low contact resistance.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) a cured product of the adhesive; and    (2) a bonded assembly comprising two substrates aligned in a spaced apart relationship, each of which having an inwardly facing surface and an outwardly facing surface, where between the inwardly facing surfaces of each of the two substrates an electrically conductive bond is formed by the cured product.