NOVELTY - The first product (300) comprises a substrate (310), a device (301) arranged over the substrate having a device footprint, and a barrier film arranged over the substrate and along a side of the device footprint. The barrier film comprises a mixture of a polymeric material and non-polymeric material, and has a perpendicular length that is less than or equal to 3 mm from the side of the device footprint. The device footprint comprises an active device area and an inactive device area. The barrier film has the perpendicular length that is less than or equal to 3 mm from the side of the inactive device area.    USE - The first product is useful as a consumer device, a solar cell, a thin film battery, an organic electronic device, a lighting panel or a lighting source having a lighting panel, a display or an electronic device having a display, a mobile phone, a notebook computer, a tablet computer, a television or an organic LED (claimed).    ADVANTAGE - The first product includes the barrier film that: is used as an edge sealant so that any permeation along path-1 corresponding to a bulk permeation across the film does not cause device degradation for a relatively long duration of storage; is used in conjunction with any form of top encapsulation so as to provide an edge seal to increase shelf lifetime of the encapsulated device; and forms the edge seal having dimensions that are smaller than edge sealant layers thus reducing a size of a border area of the first product.    DETAILED DESCRIPTION - The first product (300) comprises a substrate (310), a device (301) arranged over the substrate having a device footprint, and a barrier film arranged over the substrate and along a side of the device footprint. The barrier film comprises a mixture of a polymeric material and non-polymeric material, and has a perpendicular length that is less than or equal to 3 mm from the side of the device footprint. The device footprint comprises an active device area and an inactive device area. The barrier film has the perpendicular length that is less than or equal to 3 mm from the side of the inactive device area or less than or equal to 3 mm from the side of the active device area, and does not extend to a distance of greater than 3 mm from a side of the active device area. The barrier film does not have a perpendicular length that is greater than 3 mm or less than 1 mm. The first product further comprises a conductive layer arranged over the active device area, and a top sealant layer arranged over the conductive layer. A portion of the barrier film is arranged over the conductive layer. The top sealant layer and the barrier film comprise different materials. The first product is manufactured by a process comprising: providing the substrate having a device arranged over the substrate, where the device includes the device footprint; and fabricating the barrier film over the substrate and along the side of the device footprint. The step of fabricating the barrier film comprises depositing a first barrier film using an organosilicon precursor, and performing chemical vapor deposition. The 0.1 mu m thickness of the barrier film is deposited under the same reaction conditions for all the reaction conditions in the deposition process. A water vapor transmission rate is less than 10-6 g/m2/day through the 0.1 mu m thickness of the barrier film. An INDEPENDENT CLAIM is included for a method for manufacturing a first product.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic cross sectional view of a device having a multilayer barrier.    First product (300)    Device (301)    Inorganic layers (302)    Polymer layers (303)    Substrate. (310)