NOVELTY - Forming (F1) a conductive layer on a substrate, comprises: (a) depositing a metal salt containing polymeric material on a surface of a substrate; (b) reducing the pressure in a processing region of a first processing chamber to less than 760 Torr; (c) heating the substrate, which is disposed in the processing region, to a first temperature of 25-250 degrees C; and (d) exposing the deposited metal salt containing polymeric material to an activated process gas delivered from a gas delivery device (289) disposed in the processing region.    USE - The method is useful for forming a conductive layer on a substrate (claimed) which can be directly used to form a portion of an electronic device including solar cells, electronic visual display devices (LCD display, plasma display, organic LED display), or touch screen type technologies.    ADVANTAGE - The method: reduces the number of steps required to form the conductive layer, thus making the method simple; and improves the electrical property of the conductive layer.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for:    (1) forming (F2) a conductive layer on a substrate, comprising (d) step (a) as above per se, (e) delivering a process gas across at least one wire that is heated to a first temperature, and (f) exposing the deposited metal salt containing polymeric material to the process gas after it has been delivered across the heated wires; and    (2) a system for forming a conductive layer on a substrate, comprising a conductive nozzle positioned over a surface of a first substrate support that is disposed in a first processing region, a first power source coupled to the conductive nozzle and an electrode that is disposed adjacent to the surface of a first substrate support, a gas delivery device having many holes (288) formed through a face formed on it, where the holes are in fluid communication with a second processing region, many wires disposed at a distance from the face of the gas delivery device, a second power source coupled to at least one of the wires, and a gas source (285) that is fluidly coupled to the gas delivery device, where the gas source is configured to deliver a reducing gas to the second processing region.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic illustration of an apparatus used to process the deposited nanofiber layer.    Process gas source (285)    Fluid plenum (287)    Holes (288)    Gas delivery device (289)    Filaments (296)