NOVELTY - A polyimide resin composition comprises polar solvent and polyimide resin. The polyimide resin. The resin contains aromatic monomer which does not have 3C or more aliphatic chain in the principal chain, with respect to all the monomers. The aromatic monomer contains monomer (A) having at least one benzophenone skeleton (I) or (II), monomer (B) which does not have biphenyl skeleton but has diphenylether skeleton, and monomer (C) which has a biphenyl skeleton, with respect to all the monomers in the resin.    USE - Polyimide resin composition used for forming film e.g. coverlay film and adhesive agent for flexible printed circuit boards, and bonding sheets, components containing molded products e.g. electronic circuit board component, semiconductor device, lithium ion battery component, solar cell component, fuel cell component, motor winding, engine edge strip, coating material, optical component, thermal radiation material, electromagnetic shielding material, surge components, dentistry material, sliding coat and electrostatic chuck (all claimed).    ADVANTAGE - The polyimide resin composition produces molded products having excellent heat resistance, mechanical strength, workability, flexibility, electric insulation property and adhesiveness.    DETAILED DESCRIPTION - A polyimide resin composition comprises polar solvent and polyimide resin. The polyimide resin has viscosity average molecular weight ( eta ) of 0.6-1.60. The resin contains 95-100 mol% of aromatic monomer which does not have 3C or more aliphatic chain in the principal chain, with respect to all the monomers. The aromatic monomer contains 5-30 mol% monomer (A) having at least one benzophenone skeleton of formula (I) or (II), 40-95 mol% monomer (B) which does not have biphenyl skeleton but has diphenylether skeleton, and 0-45 mol% monomer (C) which has a biphenyl skeleton, with respect to all the monomers in the resin. The monomer (B) is monomer (B-1) in which 20 mol% or more has 3 or more aromatic rings, in all the monomers.