TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Method: At least one of paste-A and paste-B is printed with an ink-jet printer. Preferred Components: The paste-A and paste-B includes a hot melt adhesive. The paste-A comprises: 50-95 wt.% of a metal source comprising silver or a source of silver, and at least one metal or its source comprising nickel, copper, palladium and/or platinum; 0.5-15 wt.% of a glass component; and 5-20 wt.% of an organic vehicle. The metal source comprises an alloy of silver and at least one metal comprising nickel, copper, palladium and/or platinum. The metal source includes nickel, where the nickel is provided in the form of an organonickel compound. The glass component includes at least one lead-containing glass frit having a softening point of 300-550 degrees C, where the glass frit includes an oxide of a transition metal comprising manganese, iron, cobalt, nickel, copper, titanium, vanadium, chromium, tungsten, niobium, tantalum, hafnium, rhodium, ruthenium, palladium and/or platinum to achieve lower contact resistance and a wider firing window. The paste-A includes: 0.01-10 wt.% of a metal acetyl acetonate, where the metal of the metal acetyl acetonate is one of vanadium, antimony, yttrium, cobalt, nickel, zirconium, tin, zinc, lithium, manganese, copper, cerium, ruthenium, rhodium or iron. At least one paste further comprises 0.01-5 wt.% of an organolithium compound. The paste-B comprises: 40-85 wt.% of a metal source; 0.5-15 wt.% of a glass component; and 5-20 wt.% of an organic vehicle. The glass frit is not capable of firing through ARC. The glass transition temperature (Tg) of the glass component of paste-B is not higher than the Tg of the glass component of paste-A. The total proportion of metal and glass in paste-B is less than the total proportion in paste-A. The paste-B excludes glass. The aspect ratio of the lines is 0.1 to 1. The paste-A further comprises: 0.01-10 wt.% of at least one metal silicate, where the metal silicate is of formula (MaSibO(c+2b)); and an organozinc compound.a, b = 1-3;c = a/2, a, or 2a; andM = Zn, Mg, Li, Mn, Co, Ni, Cu, Gd, Zr, Ce, Fe, Al or Y. EXAMPLE - No suitable example given.