NOVELTY - Integrated photovoltaic assembly back plate material having anti-potential induced degradation (PID) effect comprises inner layer i.e. olefin copolymer layer, intermediate substrate layer i.e. polyester layer, and outer layer i.e. heat-UV light double crosslinking and curing polyester coating layer. The olefin copolymer layer is obtained by copolymerizing the main resin e.g. ethylene, adding UV absorbent, light stabilizer, and thermal oxidative aging agent. The intermediate substrate layer is prepared by adding polyethylene glycol terephthalate with inorganic light-shielding filler.    USE - Integrated photovoltaic assembly back plate material having anti-PID effect.    ADVANTAGE - The olefin copolymer inner layer has excellent water vapor barrier property, insulating property, and hydrolytic resistance, can effectively resist a PID phenomenon of a module and can be used for packaging battery pieces, so that a back plate has both a packaging effect of a rear-layer ethylene vinyl acetate glue film and a protection effect of the ordinary back plate. A thermal-UV-light double-crosslinking and curing polyester coating coated on the intermediate substrate layer can form a dense netted fluorine coating, which is taken as the outer layer to be combined with intermediate polyester layer, so that the integrated photovoltaic assembly back plate material has good weather fastness and barrier properties to water, gas, and UV light, excellent mechanical strength, and long service life.    DETAILED DESCRIPTION - Integrated photovoltaic assembly back plate material having anti-PID effect comprises inner layer i.e. olefin copolymer layer, intermediate substrate layer i.e. polyester layer, and outer layer i.e. heat-UV light double crosslinking and curing polyester coating layer. The olefin copolymer layer is obtained by copolymerizing the main resin i.e. ethylene, propylene, octene, pentene, hexene, methyl methacrylate, and/or norbornene monomers, adding UV absorbent, light stabilizer, and thermal oxidative aging agent. It has a thickness of 200-800 mu m. The intermediate substrate layer is prepared by adding one or two of polyethylene glycol terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polybutylene naphthalate, adding inorganic light-shielding filler, hydrolytic stabilizer, UV absorbent, and thermal oxidative aging agent, melting, and casting into a film layer with a thickness of 50-400 mu m. The outer layer is prepared by providing fluorine-containing hydroxy acrylic acid resin as main resin, adding inorganic light-shielding filler, crosslinking and curing agent, catalyst, chain extender, photoinitiator, thermal oxidative aging agent, and light stabilizer, mixing, and obtaining a blended layer with a thickness of 8-50 mu m.