NOVELTY - Manufacture of electronic device (24) involves fixing exposure surface of resin layer (14) and exposure surface of support substrate (12), carrying out close contact lamination to support substrate (18) with resin layer and glass substrate (16), obtaining glass laminate (10), carrying out polishing process to main surface (B) of glass substrate, performing component formation process to form component (22) for electronic devices on main surface (B), subjecting isolation process which obtains electronic device by isolating glass substrate that component is laminated.    USE - Manufacture of electronic device. Uses include but are not limited to solar cell, liquid crystal panel, organic electroluminescent panel, mobile telephone and personal digital assistant.    ADVANTAGE - The method provides electronic device has excellent the flatness on surface of glass substrate, and suppressed fall of production yield.    DETAILED DESCRIPTION - An exposure surface of resin layer and exposure surface of support substrate are fixed to a single side of support substrate which exhibits easy peelability. Close contact lamination of support substrate with resin layer and glass substrate is carried out by making into a lamination surface having main surface (A) of glass substrate of 0.3 mm or less of plate thickness and having main surfaces (A) and (B), to obtain glass laminate. The polishing process is carried out to main surface (B) of the glass substrate in the glass laminate. The component formation process is performed to form component for electronic devices on the main surface (B) by which the glass substrate is polished. The isolation process is subjected which obtains electronic device by isolating glass substrate that the component is laminated. The surface waviness in the exposure surface of resin layer is 0.1 mu m or less in a filtering central-line wave (WCA). An INDEPENDENT CLAIM is included for manufacture of glass laminate.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of the glass laminate with the component for electronic device.    Glass laminate (10)    Support substrate (12)    Resin layer (14)    Glass substrate (16)    Support substrate with resin layer (18)    Component (22)    Electronic device (24)