TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The inorganic particle has lithium ion transfer capability, and has permittivity constant of greater than 5. The inorganic particles include barium titanate, strontium titanium, hafnia, cesium dioxide, tin dioxide, magnesium oxide, nickel oxide, calcium oxide, zinc oxide, zirconium dioxide, silicon dioxide, yttria, alumina, silicon carbide, lithium phosphate, and have a compound of formula (Pb(Zrx,Ti1-x)O3) (I), (Pb1-xLaxZr1-yTiyO3) (II), ((1-x) Pb (Mg(1/3)Nb(2/3))O3-xPbTiO3) (III), (Lix1Tiy1(PO4)3) (IV), (Lix2Aly2Tiz(PO4)3) (V), ((LiAlTiP)x3Oy3) series glass (VI), (Lix4Lay4TiO3) (VII), (Lix5Gey5Pz1Sw) (VIII), (Lix6Ny6) (IX), (SiS2(Lix7Siy7Sz3)) series glass (X), and (P2S5)(Lix8Py8Sz4) series glass (XI),x, y = 0-1;x1 = 0-2;y1 = 0-3;x2 = 0-2;y2 = 0-1;z = 0-3;x3 = 0-4;y3 = 0-13;x4 = 0-2;y4 = 0-3;x5 = 0-4;y5 = 0-1;z2 = 0-1;w = 0-5;x6 = 0-4;y6 = 0-2;x7 = 0-3;y7 = 0-2;z3 = 0-4;x8 = 0-3;y8 = 0-3; andz3 = 0-7.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - The method further comprises forming a second slurry by coating a second solvent and drying the second slurry, forming a thermoplastic film. Preferred Process: The first and second solvents include acetone, tetrahydrofuran, methylene chloride, chloroform, dimethylformamide, N-methypyrrolidone and cyclohexane.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The binder film bonding layer is formed on the porous coating layer in a longitudinal direction by thermal treatment. The binder film bonding layer includes binder microfilm or thermoplastic film. The binder microfilm comprises a second binder polymer compound. The first binder polymer compound includes polyvinylidene fluoride-co-hexafluoro propylene, polyvinylidene fluoride-co-trichloroethylene, polyacrylonitrile, polyvinyl pyrrolidone, polyvinylacetate, polyethylene-co-vinyl acetate, ethylene-acrylic acid copolymer, polyethyleneoxide, cellulose acetate, cellulose acetate butyrate, cellulose acetate propionate, cyanoethylpullulan, cyanoethylpolyvinylalcohol, cyanoethylcellulose, cyanoethylsucrose, pullulan, carboxylmethylcellulose, acrylonitrile styrene butadiene copolymer and polyimide. The separation film is made of thermoplastic resin compound having melting range of 80-110 degrees C. The thermoplastic resin compound includes ethylene/n-butyl acrylate/glycidyl methacrylate terpolymers, ethylene/n-butyl acrylate 2 terpolymer, reformed ethylene/methacrylic acid copolymer, reformed ethylene/acrylic acid copolymer, ethylenevinylacetate resin and reformed ionomer. The binder film bonding layer has formation area of 1-50 % of total surface area of the porous base material, has thickness of 0.01-20 mu m. The porous base material comprises polyethylenenaphthalete, high-density polyethylene, linear low density polyethylene, low density polyethylene, ultra-high molecular weight polyethylene, polypropylene polyethylene terephthalate, polybutylene terephthalate, polyester, polyacetal, polyamide, polycarbonate, polyimide, polyether-ether-ketone, polyethersulfone, polyphenylene oxide, polyphenylenesulfide. The amount of inorganic particles present in the binder film bonding layer is 1-50 pts. wt. The amount of first binder polymer present in the film is 1-50 pts. wt. EXAMPLE - No suitable example given.