TECHNOLOGY FOCUS - ELECTRICAL POWER AND ENERGY - Preferred Components: The electricity supply element further comprises: an electrolyte impregnated into the first active material layer and the second active material layer; and a first package unit and a second package unit, where the first package unit is disposed around the edge of the first active material layer and the second package unit is disposed around the edge of the second active material layer. The electrolyte is a solid electrolyte, a liquid electrolyte or a gelled electrolyte. The substrate further includes an external circuit area adjacent to an area with the holes. The external circuit area includes a first terminal and a second terminal, and is electrically connected with the first and the second current collector layers respectively. The holes of the substrate are formed by through holes, ant holes or porous material. The holes of the substrate are filled with ceramic insulation materials.    TECHNOLOGY FOCUS - INSTRUMENTATION AND TESTING - Preferred Components: The electricity supply system further comprises an electrolyte impregnated into the first active material layer and the second active material layer. The electricity supply elements have the same substrate. In the electricity supply system, each electricity supply element includes: an internal circuit area to electrically connect with the first and the second current collector layers of the adjacent electricity supply elements for parallel or serial connection; and an electrolyte impregnated into the first active material layer and the second active material layer.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The substrate is formed of material including polyimide, polyethylene terephthalate, polyethylene naphthalate, glass fiber or liquid crystal polymer. The material of the first and the second package units is polymer, metal and/or fiberglass. The ceramic insulation materials comprise particulates of titanium dioxide, alumina, silicon dioxide with nanometer and micrometer scale or alkylation. The holes of the substrate are further filled with a polymer adhesive, which is polyvinylidene fluoride, polyvinylidene fluoride co-hexafluoropropylene, polytetrafluoroethene, acrylic acid glue, epoxy resin, polyethylene oxide, polyethylene naphthalate or polyimide. EXAMPLE - No suitable example given.