NOVELTY - A semiaromatic polyamide resin composition comprises dicarboxylic acid component containing 60 mol% or more of terephthalic acid, aliphatic diamine component containing 60 mol% or more 9C aliphatic diamine. 0.01-0.5 parts mass phosphorus thermostabilizer (I), and 0.01-0.5 parts mass hindered phenol-type thermostabilizer (II) with respect to 100 parts mass semiaromatic polyamide resin. The thermal decomposition temperature of the hindered phenol-type thermostabilizer at the time of the 5-weight% decrease at the time of heating at 20 degrees C/minute is 350 degrees C or more.    USE - Semiaromatic polyamide resin composition is used for forming film. Uses include but are not limited to flexible printed wiring board, flexible flat cable, food packaging material e.g. pharmaceutical packaging material, heat-resistant reflector, tape for heat-resistant masking, electrical insulation material for motor, solar cell substrate, liquid crystal board, photographic film, electroconductive film, etc.    ADVANTAGE - The film obtained by the semiaromatic polyamide resin composition has excellent external appearance, heat resistance, color tone, thermal stability, and reduced fisheye.    DETAILED DESCRIPTION - A semiaromatic polyamide resin composition comprises dicarboxylic acid component containing 60 mol% or more of terephthalic acid, aliphatic diamine component containing 60 mol% or more 9C aliphatic diamine 0.01-0.5 parts mass phosphorus thermostabilizer of formula (I), and 0.01-0.5 parts mass hindered phenol-type thermostabilizer of formula (II) with respect to 100 parts mass semiaromatic polyamide resin. The thermal decomposition temperature of the hindered phenol-type thermostabilizer at the time of the 5-weight% decrease at the time of heating at 20 degrees C/minute under nitrogen atmosphere is 350 degrees C or more. The aliphatic diamine component has melting point of 300 degrees C or more.    R1-R4=H, 2,4-di-tert-butyl-5-methylphenyl or 2,4-di-tertbutylphenyl;and    R5,R6=H, methyl or ethyl.