NOVELTY - The method involves forming electrical, optical and fluidic interconnects (302, 402, 504) in a transferred layer of material (212). A processed semiconductor structure (132A) is provided over the transferred layer of material on a side opposite to another semiconductor structure (132B). A thick substrate body (104) of a substrate structure (120) is removed and a thin layer of material (102) of the substrate structure bonded to the latter semiconductor structure is not removed. A through wafer interconnect (112) is coupled to a conductive feature of the latter semiconductor structure.    USE - Method for forming a bonded semiconductor structure using three-dimensional integration techniques. Uses include but are not limited to die, wafer such as carrier substrate and device substrate, high powered semiconductor device i.e. electronic signal processor, memory device, and optoelectronic device such as LED, laser, photo diode and solar cell.    ADVANTAGE - The method enables performing the bonding process at lower temperatures so as to avoid unintentional damage to device structures in the processed semiconductor structures.    DETAILED DESCRIPTION - The conductive feature is a bond pad. The fluid interconnect is a fluid passageway. The through wafer interconnects are selected from a group consisting of through silicon vias, through substrate vias and through wafer vias. An INDEPENDENT CLAIM is also included for a bonded semiconductor structure.    DESCRIPTION OF DRAWING(S) - The drawing shows a cutaway perspective view of three-dimensionally integrated bonded semiconductor structure that includes multiple layers of processed semiconductor structures with interconnect layers including two different types of interconnects.    Thin layer of material (102)    Thick substrate body (104)    Through wafer interconnect (112)    Substrate structure (120)    Processed semiconductor structures (132A, 132B)    Transferred layer of material (212)    Electrical interconnect (302)    Optical interconnect (402)    Fluidic interconnect (504)