NOVELTY - The method involves providing a substrate including a raised die area and multiple conductive bodies extending from the substrate. A semiconductor die (130) is placed over the raised die area between the conductive bodies of the substrate. An encapsulant (172) e.g. epoxy resin with filler, is deposited over the substrate and the die. An interconnect structure (180) is formed over the encapsulant, where the interconnect structure is electrically connected to the conductive bodies. A portion of the substrate is removed to separate the conductive bodies from the raised die area.    USE - Method for making a semiconductor device e.g. discrete semiconductor device such as LED, small signal transistor, resistor, capacitor, inductor and power MOSFET, and integrated semiconductor device such as microcontroller, microprocessor, charged-coupled device (CCD), solar cell and digital micro-mirror device (DMD), that is utilized in an electronic device such as cellular phone, personal digital assistant (PDA) and digital video camera (DVC), for performing perform high-speed calculation, transmitting and receiving electromagnetic signals, controlling the electronic device, transforming sunlight to electricity and creating visual projections for TV displays. Uses include but are not limited to entertainment, communications, power conversion, networks, computers and consumer products fields.    ADVANTAGE - The method enables providing a short electrical conduction path from the active devices on the semiconductor die to conduction tracks on printed circuit board in order to reduce signal propagation distance and lower capacitance so as to improve overall circuit performance. The encapsulant is deposited over the package for environmental protection by preventing moisture and particles from entering the package and contaminating die or wire bonds. The method enables pre-fabricating a copper lead-frame using a lead-frame manufacturing process to reduce manufacturing cost. The method enables avoiding formation of vials by extending conductive pillars or posts completely through the encapsulant to conductive layer of interconnect structure.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a semiconductor device.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of conductive posts extending to interconnect structure and a heat sink over a semiconductor die using a leadframe.    Semiconductor die (130)    Encapsulant (172)    Interconnect structure (180)    Saw blade/laser cutting tool (198)    Fan out wafer level chip scale packing (200)