NOVELTY - A heat-conductive pressure-sensitive adhesive composition is obtained by performing polymerization reaction of (meth)acrylic acid ester monomer and polyfunctional monomer in mixed composition containing (meth)acrylic acid ester polymer, 2-13 parts mass dispersing agent, 0.1-4 parts mass polyacrylonitrile-based carbon fiber and 50-500 parts mass heat-conductive filler other than the polyacrylonitrile-based carbon fiber, and carrying out crosslinking reaction of the (meth)acrylic acid ester polymer and/or polymer containing structural unit derived from (meth)acrylic acid ester monomer.    USE - Heat-conductive pressure-sensitive adhesive composition is used for molded product for electronic device (claimed). Uses include but are not limited to solar cell, battery, mobile telephone, portable information terminal, notebook personal computer, liquid crystal display, plasma display panel, integrated circuit, fuel cell, surface conduction electron-emitter display, etc.    ADVANTAGE - The molded product obtained by the heat-conductive pressure-sensitive adhesive composition has excellent strength and dimensional stability.    DETAILED DESCRIPTION - A heat-conductive pressure-sensitive adhesive composition is obtained by preparing mixed composition containing 100 parts mass (meth)acrylic resin composition containing (meth)acrylic acid ester polymer, (meth)acrylic acid ester monomer, polyfunctional monomer having two or more polymerizable unsaturated bonds, 2-13 parts mass dispersing agent, 0.1-4 parts mass polyacrylonitrile-based carbon fiber and 50-500 parts mass heat-conductive filler other than the polyacrylonitrile-based carbon fiber, performing polymerization reaction of (meth)acrylic acid ester monomer and polyfunctional monomer in the mixed composition, and carrying out crosslinking reaction of the (meth)acrylic acid ester polymer and/or polymer containing structural unit derived from the (meth)acrylic acid ester monomer. The dispersing agent is fatty acid ester of polyhydric alcohol polymer. INDEPENDENT CLAIMS are included for the following:    (1) manufacture of heat-conductive pressure-sensitive adhesive composition; and    (2) electronic device.