TECHNOLOGY FOCUS - POLYMERS - Preferred Method: The method of manufacturing the conductive composition further involves: forming the mixture into a sheet shape while heating the mixture to a temperature lower than the temperature at which the thermosetting resin is cured before heating the mixture to the temperature higher than the temperature at which the thermosetting resin is cured. Preferred Components: The binder resin contains 5-95 pts. wt. thermosetting resin and 1-90 pts. wt. elastomer. The thermosetting resin includes at least one of epoxy resin and phenol resin. EXAMPLE - About 63 parts by weight (pts. wt.) CGC20 (RTM: spherical graphite), 5.5 pts. wt. carbon black (#3030B), 10 pts. wt. YSLV-80XY (RTM: epoxy resin), 11 pts. wt. MEH7851SS (RTM: phenol resin), 10 pts. wt. LA2140e (RTM: acyclic elastomer) and 0.5 pts. wt. 2PHZ-PW (RTM: a catalyst) were dry blended and were kneaded for 30 minutes at 120 degrees C while the rotation speed was kept at 30 revolutions per minute (rpm) by a labo plastomill. The obtained mixture was divided into small pieces of 20 mm squares. The pressure of 3 kgf/cm2 was applied to one of the divided mixtures by a pressing machine for five minutes while the temperature of the divided mixture was kept at 120 degrees C, where the mixture was formed into a sheet shape and a conductive composition sheet was obtained. An average particle diameter of the spherical graphite was 20 mu m and an average particle diameter of the carbon black was 0.8 mu m. Next, copper foil was prepared and the conductive composition sheet that was not cured was bonded on the copper foil by the pressing machine. Thus, the laminate of the copper foil and the conductive composition sheet (a conductive substrate) was obtained. Then, the obtained laminate was thermally processed for four hours while a temperature of the laminate was kept at 175 degrees C by a hot-air drying machine where the conductive composition sheet was cured. Thus, a conductive substrate made of the copper foil and the conductive composition sheet was obtained. In this conductive substrate, the thickness of the copper foil was 18 mu m and the thickness of the conductive composition sheet was 250 mu m.