TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Component: The heat conductive filler contains compound(s) chosen from natural graphite, artificial graphite and hexagonal crystal boron nitride, preferably flaky graphite and/or hexagonal crystal boron nitride. The molded article further consists of laminated layers (A, B). Preferred Properties: The heat conductive filler has thermal expansion coefficient of 3x 10-6-30x 10-6 degrees C-1, heat conductivity of 10-150 W/mk and surface electroconductivity of 5-250 ( Omega .cm)-1, when filler is natural graphite and/or artificial graphite. The heat conductive filler has thermal expansion coefficient of 3x 10-6-30x 10-6 degrees C-1, heat conductivity of 5-50 W/mk and surface electroconductivity of 10-10 ( Omega .cm)-1 or less, when filler is hexagonal crystal boron nitride. The layer (A) has thermal expansion coefficient of 3x 10-6-30x 10-6 degrees C-1, heat conductivity of 15-120 W/mk and surface electroconductivity of 10-200 ( Omega .cm)-1, and the layer (B) has thermal expansion coefficient of 3x 10-6-10x 10-6 degrees C-1, heat conductivity of 5-50 W/mk or more, and surface electroconductivity of 10-11 ( Omega .cm)-1 or less. The layer of highly filled high thermal conductive material is inclination material.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Component: The coating material liquid contains oil-soluble organic medium and water-soluble organic medium.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The organic polymeric particles are chosen from thermoplastic resin, thermoplastic elastomer having crystallinity and/or aromaticity, and unbridged thermoplastic resin, preferably polyphenylene sulfide, polyethylene terephthalate, polybutylene terephthalate, polycarbonate and benzoxazine. Preferred Apparatus: The heat conductive filler is dispersed using ball mill. Preferred Properties: The average particle diameters of organic polymeric particles, heat conductive filler and composition are 1-5000 mu m, 0.5-2000 mu m and 0.5-1000 mu m, respectively. The average particle diameters of heat conductive filler and composition are preferably 3-200 mu m and 1-100 mu m, respectively.