NOVELTY - The sputtering apparatus comprises a chamber, a sputtering target disposed in the chamber, a workpiece support with a heating plate to heat the workpiece placed on a setting plate, a pivot movement assembly arranged for pivoting the workpiece support in a second pivoting position and arranged opposite to the sputtering target in a first pivoting position, a horizontal movement assembly for horizontally moving a surface of the sputtering target in a second rotational position, a rotating assembly, a LM shaft installed along the horizontal movement assembly, and a drive shaft.    USE - The sputtering apparatus is useful for depositing a thin film in the manufacture of a semiconductor integrated circuit, LCD and a solar cell.    ADVANTAGE - The sputtering apparatus can improve the quality, uniformity and permeability of the thin films by horizontally moving a processed article to the direction of a board surface of a sputtering target.    DETAILED DESCRIPTION - The sputtering apparatus comprises a chamber, a sputtering target disposed in the chamber, a workpiece support with a heating plate to heat the workpiece placed on a setting plate, a pivot movement assembly arranged for pivoting the workpiece support in a second pivoting position and arranged opposite to the sputtering target in a first pivoting position, a horizontal movement assembly for horizontally moving a surface of the sputtering target in a second rotational position, a rotating assembly, a LM shaft installed along the horizontal movement assembly, a drive shaft coupled to one side of the LM shaft to rotate the LM shaft, a linear bushing movably connected to the LM shaft, a coupling module that is combined between the workpiece support and linear bushing in a second pivot position, and a part for adjusting the gap between the workpiece support and the coupling plate so that the gap between the workpiece support and the sputtering target is adjusted in a second pivoting position. The coupling module comprises a coupling plate opposite to the workpiece support, and a fastening member for fastening the linear bushing protruding from an edge region of the coupling plate corresponding to the linear bush. The gap adjusting unit comprises an internally threaded nut portion formed in the workpiece support, and a bolt part fastened to the nut portion so that the spacing between the coupling plate and the workpiece support is adjusted and rotatably installed in an engaging plate. The horizontal assembly movement is connected to the pivoting assembly, and comprises a support plate for supporting the workpiece support and the pivot movement assembly to move the workpiece support between the first pivoting position and second rotational position, a guide rail arranged to guide the horizontal movement of the support plate and installed along the horizontal movement direction of the workpiece support, and a horizontal drive unit for horizontally moving the support plate so that the support plate is horizontally moved along the guide rail.