NOVELTY - The method involves providing a semiconductor die (122) which includes multiple bumps (128) formed on a surface of the semiconductor die. An adhesive material (174) is provided that is positioned among the bumps on the semiconductor die. An encapsulant is deposited over the semiconductor die, which extends beyond the surface of the semiconductor die. The adhesive material is provided as a continuous layer among the bumps of the semiconductor die. An interconnect structure (190) is formed over the surface of the semiconductor die.    USE - Method for making semiconductor device (claimed) such as microcontroller, microprocessor, charged-coupled device (CCD), solar cell, and digital micro-mirror device (DMD) for performing functions such as high-speed calculation, transmitting and receiving electromagnetic signal, controlling electronic device, transforming sunlight to electricity, and creating visual projections for television display used in fields of entertainment, communication, power conversion, network, computer, consumer product, military application, aviation, automotive, industrial controller, and office equipment.    ADVANTAGE - The combined mechanical action of the abrasive and corrosive action of the chemical removes any irregular topography, resulting in a uniformly flat surface and the devices with uniformly flat surface are less likely to fail and less expensive to manufacture resulting in a lower cost for consumers. The flip chip semiconductor device provides a short electrical conduction path from the active devices on semiconductor die to conduction tracks on printed circuit board (PCB) so that signal propagation distance is reduced, and capacitance is lowered. Hence, overall circuit performance is improved. The adhesive material serves to retain or hold semiconductor die in place to carrier tape and hence die shifting is avoided during the encapsulation process. Since, there is no need to provide wettable contact pads or reflow bump material post wafer singulation, the manufacturing cost and time are saved.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the semiconductor device during the process of forming continuous layer of adhesive material to secure semiconductor die to carrier.    Semiconductor die (122)    Bump (128)    Adhesive material (174)    Molding compound (176)    Interconnect structure (190)