NOVELTY - Forming (M1) coating on glass, metal, or ceramic substrate involves applying a low volatile organic compound (VOC), heat-curable medium (m1) comprising i) 20-95 wt.% functional acrylate monomer having functionality, ii) 0.1-20 wt.% solvent having boiling point above 150 degrees C at STP, iii) up to 20 wt.% an acrylic resin, and iv) up to 15 wt.% oligomer including at least one of polyester residue and urethane residue, to substrate having thickness of at least 50 microns; and heating to cure the medium and form a cross linked network.    USE - For forming coating on glass, metal, or ceramic substrate; and making solar cell contact, and decorated glass structure (claimed).    ADVANTAGE - The organic (acrylate based) printing medium that can be cured using free-radical initiators without use of low boiling solvents, and which releases low levels of VOCs. The curable acrylate-based printing medium overcomes the drawbacks, both with respect to VOC release and film thickness. The acrylic based curable printing medium that can be cured without the use of special ultraviolet curing equipment. The medium can be cured with heat alone, such as convection heating or infrared heating. The medium can be printed or applied to far greater thicknesses than UV curable mediums and cured quickly with the release of extremely low amounts of VOC. Curing agents, such as photoinitiators are not necessary and are preferably excluded. The formulation can be tailored to achieve desired properties of cured polymer including film hardness, burnout properties, and adhesion to glass. Such properties are adjusted by manipulating the relative proportions of acrylic monomers, oligomers and resins that are used as a ceramic medium or vehicle. The method allows for screen printing, applications (20-50 micron thick) as well as roll coat applications (120-175 micron thick) onto glass and/or ceramic substrates while minimizing the release of VOCs during application and use of coating products.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) making (M2) solar cell contact involving applying a paste to silicon wafer, where the paste comprises metal component including at least one of silver and aluminum, glass component including glass frit, and the medium (m1) that releases not greater than 140 g/l VOCs at wet film thickness of 125 microns; and firing paste; and    (2) forming (M3) decorated glass structure involving applying, to first glass substrate, prior to firing, an enamel composition comprising a glass component and an acrylate based medium; curing the medium; stacking second glass substrate with the first glass substrate, where the glass component and medium lie between the first and second glass substrates; and firing glass substrates, where the glass component fuses to first glass substrate, the medium completely burns out, and the glass substrates do not stick to one another.