NOVELTY - A primary plating process which uses the hydrochloric acid plating solution for the whole surface of stainless steel substrate or a desired portion is carried out. A primary gold plating layer (11) after pre-processing to a stainless steel substrate is formed, and the melting compression-bonding of high molecular compound is carried out. The peeling removal of primary gold plating layer of region is carried out, and high molecular compound layer is provided to a stainless steel substrate, to obtain partial gold plating pattern.    USE - Formation of partial gold plating pattern used for stainless steel for connector, fuel cell, hard disk suspension and device case.    ADVANTAGE - The method efficiently forms the partial gold plating pattern having favorable adhesiveness, and prevents corrosion.    DETAILED DESCRIPTION - A primary plating process which uses the hydrochloric acid plating solution for the whole surface of stainless steel substrate or a desired portion is carried out. A primary gold plating layer after pre-processing to a stainless steel substrate is formed, and the melting compression-bonding of high molecular compound is carried out. A high molecular compound layer is provided in the desired portion on the primary gold plating layer, secondary plating process which forms a secondary gold plating layer by a desired pattern with mask metal plating is carried out on the primary gold plating layer of region where the high molecular compound layer does not exist. The peeling removal of primary gold plating layer of region is carried out where the secondary gold plating layer and the high molecular compound layer does not exist using alkali-type stripping solution, and high molecular compound layer is provided to a stainless steel substrate, to obtain partial gold plating pattern.    DESCRIPTION OF DRAWING(S) - The drawing shows the schematic view of formation of partial gold plating pattern.    Stainless steel (1)    Unit plane (1a,1b)    Through-hole (2)    Wall surface (2a)    Primary gold plating layer (11)