NOVELTY - The method involves providing a backing structure (21). A copper indium gallium sputtering target material is formed on the backing structure by cold spraying by spraying a powder including in a process gas stream (19) and providing the gas stream from a nozzle (15) onto the backing structure such that the powder is not melted and a microstructure of the powder does not change. Water is provided into process gas to form an oxide coating on particles of the powder prior to providing the process gas stream containing the powder from the nozzle onto the backing structure.    USE - Method for making a sputtering target i.e. copper indium gallium target, onto a substrate for fabrication of a solar cell.    ADVANTAGE - The method enables forming the target directly onto the backing structure, where the target includes a tube that forms the target material and a magnet located inside the tube such that circumferentially uniform erosion is achieved at the surface of the sputtering target by continuous displacement of the magnetic flux lines running through the tube wall as the tube is rotated around the magnet and the powder is coarser powder, thus providing higher utilization of the target material, allowing high deposition rates, reducing process time, improving yield in powder atomization and improving deposition efficiency and efficient reclaim of material lost in the process chain in a cost efficient manner.    DETAILED DESCRIPTION - The backing structure is a cylindrical backing tube. The process gas is selected from a group consisting of nitrogen, air, argon and helium. The powder is selected from a group consisting of pre-alloyed/mechanically alloyed copper indium gallium powder, mixed powder blend of elemental copper, elemental indium and elemental gallium powder, mixed powder blend of elemental, binary alloy and ternary alloy powder, and separate elemental or alloy powder.    DESCRIPTION OF DRAWING(S) - The drawing shows a side cross sectional view of a structure illustrating cold spraying method for making a tubular sputtering target backing structure.    Cold/kinetic spray deposition system (1)    Powder feed line (5)    Spray gun (7)    Nozzle (15)    Process gas stream (19)    Backing structure (21)