NOVELTY - The method (300) comprises: positioning (302) a substrate within a radiant energy processing chamber, where the substrate comprises a substrate surface with a first separation energy, metal features with a second separation energy formed on the surface, and a passivation layer formed over the metal features; forming a layer over the metal features and an exposed portion of the surface; focusing (304) a source of transmissive radiant energy at the layer; and pulsing transmissive radiant energy at the substrate surface creating an intact separated portion and an attached portion of the layer.    USE - The method is useful for removing a layer from a substrate (claimed) in solar cells, mobile and home displays and organic LEDs.    ADVANTAGE - The method prevents the formation of debris, while easily and precisely targeting specific areas and limiting cost of processing.    DETAILED DESCRIPTION - The method (300) comprises: positioning (302) a substrate within a radiant energy processing chamber, where the substrate comprises a substrate surface with a first separation energy, metal features with a second separation energy formed on the surface, and a passivation layer formed over the metal features; forming a layer over the metal features and an exposed portion of the surface; focusing (304) a source of transmissive radiant energy at the layer; pulsing transmissive radiant energy at the surface of the substrate creating an intact separated portion and an attached portion of the layer; and removing (310) the intact separated portion of the layer. The method further comprises moving the source of transmissive radiant energy in a stepwise fashion to direct transmissive radiant energy over a field, and directing (306) the transmissive radiant energy toward a portion of the substrate until the second separation energy is reached without reaching the first separation energy so as to create a separated passivation layer over the metal feature, where the separated passivation layer is removed. The pulses of transmissive radiant energy overlap laterally. A power level and a scan rate of the transmissive radiant energy are equal to the separation energy for the metal features. The layer is removed using an adhesive connector or tape. The transmissive radiant energy is a laser.    DESCRIPTION OF DRAWING(S) - The figure shows a flow diagram of a method for removing a layer from a substrate.    Method for removing a layer from a substrate (300)    Positioning substrate within a radiant energy processing chamber (302)    Focusing a source of transmissive radiant energy at a layer (304)    Directing the transmissive radiant energy toward a portion of the substrate (306)    Removing the intact separated portion of the layer. (310)