NOVELTY - A polyimide precursor composition comprises: an organic amine compound and a resin which contains tetracarboxylic dianhydride-diamine compound based repeating unit and has an imidization rate of less than or equal to 0.2 dissolved in a solvent containing water and organic solvent selected from water-soluble ether solvent, a water-soluble ketone solvent, and a water-soluble alcohol solvent.    USE - As coating liquid for forming a polyimide-molded article such as flexible electronic substrate films, copper-clad laminate films, laminate films, electrical insulation films, porous films for fuel cells, separation films, IC package, adhesive films, a liquid crystal alignment layer, resist films, planarizing films, microlens array films, insulation covering films, wire cover films, optical fiber cover films, and belt members (e.g. driving belt and belts for electrophotographic image forming apparatuses (such as intermediate belt, transfer belt, fixing belt, and transport belt)).    ADVANTAGE - The polyimide precursor composition has a high degree of film formability and excellent in environmental suitability. The polyimide resin-molded article obtained by using the polyimide precursor composition provides high mechanical strength and excellent thermal resistance and electrical characteristic and solvent resistance.    DETAILED DESCRIPTION - A polyimide precursor composition comprises: an organic amine compound and a resin which contains tetracarboxylic dianhydride-diamine compound based repeating unit of formula (I) and has an imidization rate of less than or equal to 0.2 dissolved in a solvent containing water and organic solvent selected from water-soluble ether solvent, a water-soluble ketone solvent, and a water-soluble alcohol solvent.    A1=tetravalent organic group;    B1=divalent organic group.    An INDEPENDENT CLAIM is included for preparing (M1) a polyimide precursor composition involving forming a resin by polymerizing a tetracarboxylic dianhydride and a diamine compound in a solvent containing water and organic solvents selected from water-soluble ether solvent, a water-soluble ketone solvent, and a water-soluble alcohol solvent; and adding an organic amine compound to the solvent after the resin is formed.