TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The silver particles have a bimodal diameter distribution having at least one maximum of 100-800 nm or 1-10 mu m. The ratio of the total weight of silver particles with a diameter of 1 nm to 1 mu m to the total weight of silver particles with a diameter of 1 mu m to 1 mm is 1-9. The total weight of silver particles is 60-95 wt.%. The paste does not contain more than 1 wt.% glass. The weight ratio of the first portion to the further portion is 1:1-10:1.    TECHNOLOGY FOCUS - INSTRUMENTATION AND TESTING - Preferred Method: The step of heating is carried out at 70-250 degrees C. Preferred Components: The substrate is temperature sensitive or a silicon wafer, and comprises a p-n junction. The wafer comprises: a first silicon layer, where less than or equal to 50 wt.% of the first silicon layer is crystalline; and a further silicon layer, where at least 50 wt.% of the further silicon layer is crystalline. The substrate comprises a transparent conductive layer. The transparent conductive layer is a conductive polymer or a conductive oxide.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The solvent is: an aprotic polar solvent in the thermoplastic polymer system and a protic polar solvent in the thermosetting system; present in the thermoplastic polymer system in an amount of at least 50 wt.%; and present in the paste in an amount of 0.1-20 wt.%. The solvent comprises an acetate moiety. The solvent (no more than 65 wt. %) is present in the thermosetting system or the solvent (no more than 15 wt. %) is present in the paste.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The polymer system is a thermoplastic polymer system or a thermosetting system comprising a crosslinking compound having at least two unsaturated groups, a radical generator comprising a peroxide moiety, a mono-unsaturated compound, a thermoplastic polymer and a solvent, and comprises a solvent. The thermoplastic polymer system comprises a thermoplastic polymer having at least one of the following parameters including a glass transition temperature of -120 degrees C to 110 degrees C, a melting temperature of at least 5 degrees C higher than the glass transition temperature, or a number average molecular weight of 10000-150000 g/mol; and is a polyester, an acrylate polymer or a phenoxy polymer, and present in the thermoplastic polymer system in an amount of 5-45 wt.%. The polyester comprises a polyester backbone. The crosslinking compound is based on an acrylate or a fatty acid or its derivative, and is present in an amount of 1-10 wt.%. EXAMPLE - 16.9 wt.% of organic vehicle (comprising 54.5 wt.% of Dowanol (RTM: Diethylene glycol mono-n-butyl ether (DB)), 31.4 wt.% of Genomer 3611 (RTM: Acrylate oligomer) and 14.1 wt.% of Miramer M200 (RTM: Acrylate monomer)), 70 wt.% of a smaller spherical silver powder and/or 13 wt.% of a bigger spherical silver powder, and 0.1 wt.% of dicumyl peroxide were homogenized using a mixer to obtain a paste. The paste was passed through a 3-roll mill with stainless steel rolls for several times to obtain a desired paste.