NOVELTY - Forming an electronic article having a perimeter and comprising a superstrate, an optoelectronic element disposed on superstrate, and a silicone encapsulant that is formed from a curable silicone composition and that is disposed as a layer on the element sandwiching the element between superstrate and layer of silicone encapsulant, involves: depositing the composition on the element in a pattern defining at least one passage extending from an interior of the article to a perimeter of the article; and laminating the superstrate, the element, and the composition to form electronic article.    USE - For forming an electronic article, particularly a photovoltaic cell module (claimed).    ADVANTAGE - During the step of laminating, the curable silicone composition cures to form the silicone encapsulant and air escapes from the interior of the electronic article to the perimeter of the electronic article through the passage. Typically, this escape of air allows the electronic article to be formed with minimal or no defects (e.g. air bubbles) in the silicone encapsulant.    DETAILED DESCRIPTION - Forming an electronic article having a perimeter and comprising a superstrate, an optoelectronic element disposed on the superstrate, and a silicone encapsulant that is formed from a curable silicone composition and that is disposed as a layer on the optoelectronic element sandwiching the optoelectronic element between the superstrate and the layer of the silicone encapsulant, involves: depositing the curable silicone composition on the optoelectronic element in a pattern defining at least one passage extending from an interior of the electronic article to a perimeter of the electronic article; and laminating the superstrate, the optoelectronic element, and the curable silicone composition to form the electronic article, where the curable silicone composition has an complex viscosity of 10000-50000000 cPs at 25 degrees C as measured at 1 radian per second at 1-5% strain, and where during the step of laminating the curable silicone composition cures to form the silicone encapsulant and air escapes from the interior of the electronic article to the perimeter of the electronic article through the passage to form a layer of the curable silicone composition and the curable silicone composition cures to form the layer of the silicone encapsulant.