NOVELTY - The method involves immersing desired portion of stainless steel substrate (11) in hydrochloric acid group plating solution (100). First gold plating layer (12) is formed in immersion portion. Second gold plating layer (13) is formed by desired pattern with mask metal plating on first gold plating layer. The edge (12a) of first gold plating layer is set corresponding to position of liquid level (100a) of plating solution during plating process. Second gold plating layer is continuously formed from first gold plating layer to desired position on substrate.    USE - Method for forming gold plating pattern to substrate (claimed) of stainless steel used for lead frame, fuel cell, and hard disk suspension.    ADVANTAGE - Since the desired portion of substrate in hydrochloric acid group plating solution is immersed, so that first gold plating layer is formed, the corrosion of un-immersed portion of stainless steel substrate can be suppressed, while the adhesiveness of stainless steel substrate and first gold plating layer is improved. Since first gold plating layer can be formed only to a required portion, the gold usage-amount can be restrained. Second gold plating layer can be formed on stainless steel substrate across the edge of first gold plating layer, so that the edge portion of second gold plating layer formed by mask metal plating turns into edge portion of metal-plating pattern. Since the difference in ionization tendency does not exist between gold plating layers, the corrosion of second gold plating layer can be avoided. The precision of micro-fabrication can be improved, when the micro-fabrication shape is previously formed in the stainless steel substrate.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a stainless steel substrate.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional views illustrating the process for forming gold plating pattern to substrate of stainless steel.    Stainless steel substrate (11)    Gold plating layers (12,13)    Edge of gold plating layer (12a)    Plating solution (100)    Liquid level (100a)