TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The electrolyte is a material chosen from ammonium chloride (NH4Cl), zinc chloride (ZnCl2), sulfuric acid (H2SO4) and polyvinyl acetate (PVAc) polymer gel. The first conductive material includes a material chosen from graphite, graphitizable carbon, nongraphitizable carbon, lithium titanium oxide (Li4Ti5O12), aluminum (Al), zinc (Zn), manganese oxide (MnO4) and lead (Pb), and the second conductive material includes a material chosen from lithium cobalt oxide (LiCoO2), lithium manganese oxide (LiMn2O4), lithium nickel cobalt manganese oxide (LiNiCoMnO2), lithium nickel dioxide (LiNiO2), copper oxide (CuO2) and lead dioxide (PbO2). The each of the first and second semiconductor substrates includes silicon (Si). The first and second semiconductor substrates are bonded together by one of eutectic bonding, transient liquid phase bonding, diffusion bonding, thermo-compression bonding and fusion bonding. The first and second semiconductor substrates are bonded together through a first bonding pad formed on the first semiconductor substrate and a second bonding pad formed on the second semiconductor substrate, where the first and second bonding pads include a pair of materials chosen from aluminum (Al)/silicon (Si), aluminum (Al)/germanium (Ge), aluminum copper (AlCu)/germanium (Ge), gold (Au)/silicon (Si), gold (Au)/germanium (Ge), gold (Au)/tin (Sn), copper (Cu)/tin (Sn), gold (Au)/indium (In), silver (Ag)/tin (Sn), copper (Cu)/copper (Cu), aluminum (Al)/aluminum (Al), gold (Au)/gold (Au), silicon (Si)/silicon (Si), silicon dioxide (SiO2)/silicon dioxide (SiO2) and silicon (Si)/silicon dioxide (SiO2). The first bonding pad and the second bonding pad are spaced away from the first and second electrodes. The first semiconductor substrate includes a trench, the second semiconductor substrate includes an protruding feature configured at least partially in the trench, and the first and second bonding pads are configured between the protruding feature and a bottom surface of the trench. The first and second electrodes are patterned and configured to form a cavity filled with the electrolyte. The first electrode includes first fin features, the second electrode includes second fin features, and the first fin features and the second fin features are configured to be interdigitated with each other.