NOVELTY - A composition comprises several coated metal particles with a metal core surrounded by nested shells formed by an electrically conductive layer and by a barrier layer, where at least one of the shell is formed by electroless plating.    USE - In conductive paste for producing electrically conductive lines and coatings; for producing light-receiving surface electrode of a solar cell; in conductive paste or ink for producing light-receiving surface electrode of a solar cell; in conductive paste or ink for producing electrically conductive lines and coatings; for producing conductive adhesive, electromagnetic interference coating, electrode for capacitor or transistor, die attachment material, thermal interface material; in a solar cell device; in a semiconductor component; in an electromagnetic interference shield; in composite material of multi-shell core particles; in anti-counterfeiting tag comprising composite material of multi-shell core particles (all claimed); in crystalline-silicon solar cell devices having contact structures formed on at least one surface of a solar cell device, such as those used in back contact solar cell device or emitter wrap through (EWT) solar cell device.    ADVANTAGE - The composition do not use copper which easily inter-diffuses with silver and thus there is no need for the troublesome process of forming a copper layer; provide copper-containing contact structures in printing techniques, such as screen printing and ink-jet printing; provide improved process which has high deposition rate and efficiency; uses new materials e.g. in crystalline-silicon solar cell devices having contact structures formed on at least one surface of a solar cell device, such as those used in back contact solar cell device or emitter wrap through (EWT) solar cell device; provides multi shell metal coated particles with an outer silver layer for conductive paste applications, such as on the front surface electrode of a solar cell; reduces silver consumption in silver coated particles as a thinner layer of silver is coated to provide higher conductivity and the underlaying barrier layer (e.g. nickel layer) eliminates copper oxidation; give even coating of the surfaces and will help in reducing the risk of corrosion or wear of layers.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) producing (M1) composition involving: subjecting a core particle of a metal to a surface treatment, so as to render the metal ion-capturing ability; subjecting the modified particle thus obtained to a catalyzation step; subjecting the particle obtained from the catalyzation step to an initial thin film formation step; and subjecting the particle thus obtained to a electroless plating step;    (2) a conductive paste (p1) for producing electrically conductive lines and coatings, where the conductive paste comprises multi shell copper particles with a nickel barrier coating and silver final surface coat, and there in the conductive paste further comprises resin binder, thinner and optional glass frit;    (3) producing (M2) a light-receiving surface electrode of a solar cell involving: applying on a semiconductor surface a conductive paste which comprises multi shell copper particles with a nickel barrier coating and silver final surface coat, where the paste further comprises resin binder, thinner and optional glass frit;    (4) a conductive paste or ink (p2) for producing light-receiving surface electrode of a solar cell, where the conductive paste or ink is formed by a paste which comprises multi shell metal particles with a conductive barrier coating and conductive final surface coat, and there in the conductive paste further comprises resin binder, thinner and optional glass frit;    (5) a conductive paste or ink (p3) for producing electrically conductive lines and coatings, where the conductive paste or ink comprises a multi shell metal particles with a conductive barrier coating and conductive final surface coat, and there in the conductive paste or ink further comprises low melting point alloy particles, resin binder, thinner and optional glass frit;    (6) producing (M3) a conductive adhesive, electromagnetic interference coating, electrode for capacitor or transistor, die attachment material, thermal interface material, where the conductive paste comprises multi shell metallic particles with metal particles forming a core with barrier layer as a diffusion barrier layer and conductive forming the final surface coat;    (7) a conductive paste or ink (p4) for producing electrically conductive lines and coatings, where the conductive paste or ink comprises a multi shell metal particles with a conductive barrier coating and conductive final surface coat, and there in the conductive paste or ink further comprises at least one secondary metal particle selected from aluminum, nickel, tin, zinc, tantalum or vanadium and/or their alloy combination, a resin binder, thinner and optional glass frit;    (8) a solar cell device comprising front side metallization conductive layers of multi-shell core particles;    (9) a solar cell device comprising rear side metallization conductive layers of multi-shell core particles;    (10) a semiconductor component comprising electrically and/or thermally conductive die attach layer according of multi-shell core particles;    (11) an electromagnetic interference shield comprising composite material of multi-shell core particles; and    (12) anti-counterfeiting tag comprising composite material of multi-shell core particles.