NOVELTY - The method involves providing an optically transparent substrate (200), aligning a laser beam from a back surface region (210) and selectively removing a part of an edge portion to form a remaining side wall portion to expose a conductive layer (305), a P-type semiconductor layer (301) overlying the conductive layer, a N-type semiconductor layer (303) overlying a P-type semiconductor layer, and an electrode layer overlying the N-type semiconductor layer. Exposed edges of a set of layers are free from residue particles. The laser beam is scanned along the exposed area.    USE - Method for processing a thin film device e.g. thin film photovoltaic solar module.    ADVANTAGE - The method allows easy process that relies upon conventional technology that is nanotechnology based. The method can provide a solar module with higher efficiencies in converting sunlight into electrical power using a multiple junction design and improves the efficiency about 10 percent or 20 percent greater. The method provides a process that is compatible with conventional process technology without substantial modifications to conventional equipment and processes. The method can be provided using large scale and environmentally friendly manufacturing techniques, and eliminates the usage of solvent for cleaning the side surface and reduces running costs associated with the manufacture of the photovoltaic devices. The side surface the thin film photovoltaic devices exposed after laser separation process is completely cleaned without any shorting between layers of the thin film.    DETAILED DESCRIPTION - The optically transparent substrate is made of glass, acrylic, quartz, or fused silica. The conductive layer is made of metal, metal alloy and metal oxide. Photovoltaic materials is selcted form the following single crystal silicon, poly-crystal silicon, amorphous silicon, semiconducting metallic oxides, compound semiconductor including copper indium diselenide (CIS), Copper Indium Gallium Selenide (CIGS) Cadium Telluride (CdTe), and nano-structured materials    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional perspective view of a thin film device with edge portion being selectively removed in a final state of the laser separation process.    Optically transparent substrate (200)    Back surface region (210)    P-type semiconductor layer (301)    N-type semiconductor layer (303)    Conductive layer (305)