NOVELTY - The method involves cutting brittle material (201) by applying a laser i.e. femtosecond laser. An edge e.g. tapered edge and curved edge, is formed with a flat surface, where the surface includes predetermined edge shape and roughness, and is formed perpendicular to a body of the brittle material. The edge is formed with an oblique angle between the surface and the body of the brittle material. Apertures are formed by breaking down the brittle material using a laser beam i.e. femtosecond laser beam. Shape of a predetermined profile is formed for cutting.    USE - Method for cutting brittle material such as intrinsic material, borosilicate glass, soda-lime glass, quartz, sapphire, silicon, strengthened glass and tempered glass, of an electronic display of a handheld consumer electronic device i.e. mobile phone (all claimed), using a tool i.e. mechanical saw. Uses include but are not limited to cut amorphous solid materials, crystalline materials, semiconducting materials, crystalline ceramics, polymers and resins of a display screen, a touchscreen, a multi-touch screen, a display rear plane, a display illumination layer, an LED substrate and a transparent conducting layer of the handheld consumer electronic device and solar panel, ITO (indium tin oxide) and soda-lime glasses, window and windscreen of an automobile.    ADVANTAGE - The method enables cutting brittle materials into predetermined shapes while maintaining high level of control over cut edge properties, so that subsequent conditioning processes is eliminated from a overall fabrication protocol, thus reducing time consumption. The macroscopic properties of the brittle material i.e. flexural bending strength are directly related to brittle material edge quality in terms of geometry and/or surface roughness, so that removal of a thin strip from the brittle material produced by the application of a heat source improves macroscopic performance of a brittle material portion. The method enables delivering energy to the brittle material by the tool without making physical contact from a laser beam or acoustic beam.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a device for cutting brittle material.    DESCRIPTION OF DRAWING(S) - The drawing shows a front view of an apparatus for applying a tool to a brittle material substrate.    Apparatus for applying a tool to a brittle material substrate (200)    Brittle material (201)    Tool (202)    Source (204)    Delivery module (206)