NOVELTY - An epoxy resin pouring sealant contains separately stored component A and component B in which component A is epoxy resin containing 85-89 wt.% bisphenol A type epoxy resin, 3-13 wt.% diluent, and 0.15-0.25 wt.% antifoaming agent based on total weight of component A, component B is curing agent containing 1st raw materials i.e. 40 wt.% 1,3-bis(aminomethyl)cyclohexane, 20 wt.% bisphenol A type epoxy resin, and 40 wt.% benzyl alcohol based on total weight of 1st raw materials, and 2nd raw materials i.e. 50 wt.% isophorone diamine, 35 wt.% bisphenol A type epoxy resin, and 15 wt.% benzyl alcohol.    USE - Epoxy resin pouring sealant for storage battery and other electronic device.    ADVANTAGE - Epoxy resin pouring sealant has improved hardness, thermal deformation, and voltage resistance.    DETAILED DESCRIPTION - An epoxy resin pouring sealant contains separately stored component A and component B in which component A is epoxy resin containing 85-89 wt.% bisphenol A type epoxy resin, 3-13 wt.% diluent, and 0.15-0.25 wt.% antifoaming agent based on total weight of component A, component B is curing agent containing 1st raw materials i.e. 40 wt.% 1,3-bis(aminomethyl)cyclohexane, 20 wt.% bisphenol A type epoxy resin, and 40 wt.% benzyl alcohol based on total weight of 1st raw materials, and 2nd raw materials i.e. 50 wt.% isophorone diamine, 35 wt.% bisphenol A type epoxy resin, and 15 wt.% benzyl alcohol based on total weight of 2nd raw materials, component B is obtained by mixing and stirring 1st raw materials with same weight of 2nd raw materials, when component A contains upper limit amount of any 1 component and lower limit amount of other components, total weight of component A is less than or equal to 100%, and when component A contains lower limit amount of any 1 component and upper limit amount of other components, total weight of component A is greater than or equal to 100%, component A and component B are separately stored when not in use, and when needed to be used, epoxy resin pouring sealant is prepared by uniformly mixing while stirring component A and component B in reaction container at 25 degrees C for 2 minutes with weight ratio of 2:1.    DESCRIPTION OF DRAWING(S) - The drawing shows a flow chart of preparing epoxy resin pouring sealant. (Drawing includes non-English language text).