NOVELTY - A transparent conductive film comprises transparent conductive layer which is formed directly or through an undercoat comprising a resin material onto one side or both sides of a cross-linked resin layer of a transparent stacked film having the cross-linked resin layer on at least one surface of a base material film. The transparent stacked film has a thermal shrinkage of 1.5% or less in the vertical direction and in the horizontal direction when heated for 10 minutes at 200 degrees C, and the surface resistance value of the transparent conductive film is 150 ( Omega )/square or less.    USE - Transparent conductive film. Uses include but are not limited to liquid crystal display, organic light-emitting display, electrophoresis display, color filter, backlight, substrate of a solar cell, the organic light emission illumination, and optoelectronic device substrate.    ADVANTAGE - The transparent conductive film has excellent dimensional stability, and transparency and low surface-resistance value. The gas barrier multilayer film has excellent gas-barrier property and dimensional stability.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) transparent laminated film, which comprises multilayer film containing crosslinked resin layer in the front-back both sides of a base film, and formed using the curable composition containing a photopolymerizable compound, photoinitiator, and microparticles, in which the multilayer film has thermal contraction rate of 70% or less, light transmittance of 80% or more and the thickness of base film is 75 mu m or less; and    (2) gas-barrier multilayer film, which comprises crosslinked resin layer with a gas barrier layer on both surfaces of a base film and base film, and has structure in which the total thickness of front-back both sides of the crosslinked resin layer is 8% or more than the thickness of a base film, crosslinked resin layer is formed using the curable composition containing a photopolymerizable compound, a photoinitiator, and microparticles, average particle diameters of microparticles are 1-50 nm, the thickness of gas barrier layer is 5-100 nm, and water-vapor-permeation rate of the whole film is 1x 10-2g/m2/day or less.