NOVELTY - The concentrated photovoltaic cell arrangement has array of photovoltaic cells that are mounted on a patterned conductive backplane to electrically connect the array of photovoltaic cells together. The patterned conductive backplane is provided with a heat sink layer, an insulating layer, a conductive layer and a resist layer (12), such that photovoltaic cell is connected to the conductive layer through exposed regions in the resist layer.    USE - Concentrated photovoltaic (CPV) cell arrangement of CPV module or panel (claimed) mounted on tracking system to keep focus of sun on cell through sky during day time.    ADVANTAGE - The heat sink layer is affixed to the back of the insulating layer, so that efficient thermal management can be enabled. The printed circuit board is used as a baseplate of the CPV module onto which interconnecting circuitry is patterned directly, so that need for subsequent interconnection soldering or welding that would add cost and potentially reduce the reliability of the module can be avoided. Thus need for any additional external heat sinking is avoided. The photovoltaic receiver package can be rapidly assembled onto a backplane using high speed pick and place (PnP) tools. The receiver design is simplified, so that receiver (Rx) can be recognized easily from a PV cell and optionally a secondary optical element (SOE) to form portion of package that can be surface mounted onto a common printed circuit board (PCB) backplane. The small PV cells with a short focal length can be used to focus light onto individual Rx, so that low profile CPV module can be achieved which minimizes the use of materials and provides a beneficial profile for wind resistance. The PV cell can be mounted directly upon pads without the base of a PV cell being first soldered to a metallic leadframe.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) a concentrated photovoltaic module; and    (2) a method of forming photovoltaic cell arrangement.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view explaining the process of soldering receiver package to insulated metal substrate baseplate.    Aspheric lens (6)    Two molded packages (9)    Printed circuit board (10)    Pad (11)    Solder resist layer (12)