NOVELTY - The method involves forming insulator portion (28) on device region (16) relative to component region (18) for placing an optoelectronic component. An insulator portion (30) of a device region (18) is arranged over a contact region (36). An insulator portion (28) is arranged on insulation region (32) remotely from device region (16). An insulator portion (30) is arranged between insulator regions (28,30). A contact region is formed between insulator portions (28). Optically functional layers are formed in device regions (16,18).    USE - Method of manufacturing optoelectronic component such as organic LED used in solar cell. Can also be used in electromagnetic radiation emitting component such as organic electromagnetic radiation emitting diode, organic electromagnetic radiation emitting transistor and organic light-emitting transistor.    ADVANTAGE - The insulator portion is arranged between insulator regions and contact region is formed between insulator portions and optically functional layers are formed in device regions, such that etching process can be performed efficiently. The insulator material can be patterned easily on the electrically conductive layer and can be applied on the substrate. The side surfaces of the second electrically conductive layer can be encapsulated, hence direct physical contact between the optically functional layer and electrically conductive layer can be prevented efficiently. The thermally deformed insulator material can be attained. The optically functional layer can be protected securely from wear and corrosion. The better optical resolution of the optoelectronic assembly can be achieved. The need of photolithography process can be avoided, hence simple manufacture of optoelectronic component with the series of electromagnetic radiation emitting devices can be achieved. The manufacturing cost can be reduced.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for optoelectronic component.    DESCRIPTION OF DRAWING(S) - The drawings show explanatory views of the optoelectronic component manufacturing process.    Substrate (10)    Electrically conductive layers (12,14)    Device regions (16,18)    Insulator regions (28,30,32)    Contact region (36)