NOVELTY - Gas injector for use in a process chamber, comprises: a first set of gas orifices configured to provide a jet flow of a first process gas into the process chamber; and a second set of gas orifices configured to provide a laminar flow of a second process gas into the process chamber, where the first set of gas orifices are disposed between at least two gas orifices of the second set of gas orifices.    USE - The gas injector is useful in a substrate processing tool in a process chamber (claimed) preferably in a semiconductor processing equipment for solar cell manufacturing, and useful as high efficiency single crystal epitaxial film deposition equipment (for epitaxial silicon deposition).    ADVANTAGE - The substrate processing tool provides cost effective and simple manufacturability and an energy and cost efficient usage, as compared to conventional substrate processing tools utilized to perform multi-step substrate processes.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a substrate processing tool, comprising: a substrate carrier having a base and pair of opposing substrate supports having respective substrate support surfaces that extend upwardly from the base and configured to support one or more substrates when disposed thereon; and a first substrate processing module including an enclosure (202) having a lower surface to support the substrate carrier, where the substrate processing module (102D) comprises the gas injector including the first set of gas orifices configured to provide jet flow of a first process gas towards a central area between the pair of opposing substrate supports, and the second set of gas orifices disposed on both sides of the first set of gas orifices and configured to provide a laminar flow of a second process gas over substrates when disposed on the substrate carriers, and an exhaust disposed opposite the gas injector to remove the first and second process gases from the enclosure.    DESCRIPTION OF DRAWING(S) - The figure shows a cross sectional view of a module of a substrate processing tool.    Module (102D)    Enclosure (202)    Gas inlet (208)    First end (216)    Second end (218)