NOVELTY - The device has a handle substrate (417) that is provided by a first coefficient of thermal expansion parallel to a surface. A gallium and nitrogen containing region that is provided by a second coefficient of thermal expansion is parallel to the surface. The second and first coefficients of thermal expansion are similar. The gallium and nitrogen containing region that is formed from a donor gallium and nitrogen containing material is transferred to the handle substrate. An active region (431) is formed overlying the gallium and nitrogen containing region.    USE - Gallium and nitrogen containing device such as optical device to form multi-pixel optical device structure (all claimed) such as LED. Can also be used for laser diode, photodetector, avalanche photodiode, transistor, rectifier, thyristor, p-i-n diode, metal-semiconductor-metal diode, high-electron mobility transistor, metal semiconductor FET, metal oxide FET, power metal oxide semiconductor FET, power metal insulator semiconductor FET, bipolar junction transistor, metal insulator FET, heterojunction bipolar transistor, power insulated gate bipolar transistor, power vertical junction FET, cascode switch, inner sub-band emitter, quantum well infrared photodetector, quantum dot infrared photodetector, solar cell, and diode for photoelectrochemical water splitting and hydrogen generation.    ADVANTAGE - Since the etching is performed through the core region, the defective region of the material is removed to make the devices more reliable and robust. Since the recesses are created in the handle substrate, the thermal conductivity is enhanced without allowing electrical contact between the material in the recess and the semiconductor materials. The chip-to-chip interconnection distance is reduced, thus the power consumption, heating, and the interconnect delay is reduced.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of the device structure.    LED (400)    Inactive adhesion layers (407)    Handle substrate (417)    Active layer (431)    Wire bonds (439)