NOVELTY - A heat-conductive pressure-sensitive adhesive composition is obtained by forming mixed composition containing (meth)acrylic resin composition (A) containing (meth)acrylate polymer (A1) and (meth)acrylate monomer (( alpha )1), expanded graphite powder (B1) and heat-conductive filler (B2) other than the expanded graphite powder (B1), and/or polyfunctional epoxy compound having 10000 or less functional groups, and polymerizing (meth)acrylate monomer (( alpha )1) and (meth)acrylate polymer (A1), and/or crosslinking polymer containing structural unit derived from (meth)acrylate monomer (( alpha )1).    USE - Heat-conductive pressure-sensitive adhesive composition is used for manufacturing sheet-like molded component for electronic device (all claimed). Uses include but are not limited to television, mobile telephone, automatic vending machine, refrigerator, solar cell, organic/inorganic electroluminescent display, notebook personal computer, fuel cell, washing machine and game machine.    ADVANTAGE - The pressure-sensitive adhesive composition has excellent workability and high heat conductivity.    DETAILED DESCRIPTION - A heat-conductive pressure-sensitive adhesive composition is obtained by forming mixed composition containing 100 parts mass (meth)acrylic resin composition (A) containing (meth)acrylate polymer (A1) and (meth)acrylate monomer (( alpha )1), 5-70 parts mass expanded graphite powder (B1) having relative bulk density of 1 g/ml or less and 300-1500 parts mass heat-conductive filler (B2) other than the expanded graphite powder (B1), and/or 0.05-7 parts mass polyfunctional epoxy compound having 10000 or less functional groups, and polymerizing (meth)acrylate monomer (( alpha )1) and (meth)acrylate polymer (A1), and/or crosslinking polymer containing structural unit derived from (meth)acrylate monomer (( alpha )1). INDEPENDENT CLAIMS are included for the following:    (1) sheet-like molded component, which is obtained by molding the mixed composition in a sheet-form;    (2) manufacture of heat-conductive pressure-sensitive adhesive composition;    (3) manufacture of sheet-like molded component; and    (4) electronic device, which consists of heat-dissipating component and radiator which are bonded using sheet-like molded component or heat-conductive pressure-sensitive adhesive composition.