NOVELTY - The method involves processing a front side and a back side of a semiconductor wafer. The semiconductor wafer is sliced into two units in which one unit comprises the front side of the substrate and the other unit comprises the back side of the substrate. The other sides of the two units are processed in which the other sides of the two units are generated by slicing the substrate. Phosphosilicate glass is removed from the front and the back sides, and silicon nitride is deposited on the front and the back sides, during the processing of front and back sides.    USE - Method for fabricating semiconductor wafer for fabrication of electronics, optoelectronics and microelectromechanical systems devices, and two-sided devices e.g. crystalline silicon solar cells. Can also be used in fabricating several types of semiconductor power devices such as power MOSFET used in power supplies, direct current to direct current converters and low voltage motor controllers, insulated-gate bipolar transistor used in power inventers in renewable energy industries and in electric vehicles/trains and energy efficient appliances, and in complementary metal-oxide-semiconductor sensors.    ADVANTAGE - The substrate slicing step can reduce the manufacturing complexity of the two-sided electronic devices. The manufacturing flow of the semiconductor wafer doubles output device units with the same production volume and cost of the double-sided processes prior to a wafer slicing step, so that production cost of each final device can be reduced by half for such double-sided processes prior to the substrate slicing step. Thus overall results are a simpler manufacturing process flow, an opportunity for significant production cost reduction, and a potential improvement in device performance. Also screen printing of front-side metals before substrate slicing step can avoid an increase of wafer breakage rate in front-side metallization screen printing tool.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an apparatus for handling the semiconductor wafer.    DESCRIPTION OF DRAWING(S) - The drawing shows an explanatory view illustrating the manufacturing of two-sided electronics, optoelectronics and microelectromechanical systems devices.