TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The nanoparticle sealing layer(s) of the film layer at least essentially consist(s) of the encapsulated reactive nanoparticles. At least a portion of the encapsulated nanoparticles have an aliphatic, alicyclic, aromatic or arylaliphatic compound immobilized on it, where the aliphatic, alicyclic, aromatic or arylaliphatic compound having a polar group. The polar group is a hydroxyl, a carboxyl, an amido, a thio, a seleno and/or a telluro group. The nanoparticles are at least partially encapsulated by a polymeric material (polymer encapsulated nanoparticles) or the encapsulation material comprises an organometallic compound, an oligomer or a dendrimer. The encapsulation material is an organic polymer, inorganic polymer, a water soluble polymer, organic solvent soluble polymer, biological polymer, synthetic polymer and oligomer. In the encapsulation barrier stack a pre-polymer is used for encapsulation. The pre-polymer is an acrylic oligomer having a molecular weight less than 1000 Da and a viscosity less than 300 cPoise. The encapsulation material is an organic material including a mercapto group, an epoxy group, an acrylic group, a methacrylate group, an allyl group, a vinyl group, a halogen and an amino group. The encapsulation material is, prior to the encapsulation, cross-linked or cross-linkable, a UV curable group, electron beam curable or heat curable material. The nanoparticles are pigment particles, quantum dots and/or colloidal particles. The encapsulation barrier stacks being adapted to be arranged on a substrate. The sealing layers conform substantially to the shape of the defects present on the surface of the substrate. The sealing layers are formed by conformal deposition. The film further comprises at least one sealing layer that comprises many inert nanoparticles. The inert nanoparticles comprise a material including clay, gold, copper, silver, platinum, silica, wollastonite, mullite, monmoriilonite, silicate glass, fluorosilicate glass, fluoroborosilicate glass, aluminosilicate glass, calcium silicate glass, calcium aluminum silicate glass, calcium aluminum fluorosilicate glass, titanium carbide, zirconium carbide, zirconium nitride, silicon carbide, silicon nitride and/or a metal sulfide. The film layer comprises a single nanoparticle sealing layer. The nanoparticles of the nanoparticle layer are capable of interacting with moisture and/or oxygen through chemical reaction. The nanoparticles comprise a material including a metal and/or a metal oxide. The barrier stack comprises at least two nanoparticle sealing layers, where each of the nanoparticle sealing layers comprises a different nanoparticle material. The nanoparticles comprise a metal including aluminum, titanium, magnesium, barium, calcium or their alloys. The nanoparticles comprise a metal oxide including titanium dioxide, aluminum trioxide, zirconium dioxide, zinc oxide, barium oxide, strontium oxide, calcium oxide, magnesium oxide, vanadium(IV) oxide, chromium dioxide, molybdenum oxide or lithium manganese oxide. The nanoparticles comprise a transparent conductive oxide including cadmium stannate, cadmium indate, zinc stannate, and zinc indium oxide, barium titanate or barium strontium titanate. The nanoparticles are capable of interacting with moisture and/or oxygen through adsorption. The nanoparticles comprise carbon nanotubes, graphene nanosheets or graphene nanoflakes. The sealing layers further comprises many inert nanoparticles, where the inert nanoparticles being capable of obstructing the permeation of moisture and/or oxygen. The barrier stack further comprises: a substrate supporting the film layer; a planarizing layer, where the planarizing layer is arranged between the substrate and the film layer; a terminal layer for protecting the film layer, where the terminal layer is facing the ambience; and arranged on the nanoparticle sealing layer a further layer, where the further layer is a polymer layer containing no reactive nanoparticles or a polymer layer in which reactive nanoparticles are distributed in a polymeric matrix. The film layer is orientated such that the nanoparticle sealing layer is arranged on the substrate. The substrate comprises an organic material and/or an inorganic. The substrate comprises a material including polyacetate, polypropylene, polyimide, cellophane, poly(1-trimethylsilyl-1-propyne, poly(4-methyl-2-pentyne), polyimide, polycarbonate, polyethylene, polyethersulfone, epoxy resins, polyethylene terephthalate, polystyrene, polyurethane, polyacrylate, and polydimethylphenylene oxide, styrene-divinylbenzene copolymers, polyvinylidene fluoride, nylon, nitrocellulose, cellulose, glass, indium tin oxide, nano-clays, silicones, polydimethylsiloxanes, biscyclopentadienyl iron or polyphosphazenes. The substrate is flexible or rigid. The terminal layer comprises an acrylic film or the terminal layer is an oxide layer. The acrylic film has distributed in it lithium fluoride and/or magnesium fluoride particles. The sealing layers provide at least one property including moisture and oxygen barrier properties, a UV filter property, an antireflection property, a light extraction property and an anti-static property. The barrier stack defines a base substrate for supporting the electronic device. The encapsulation barrier stack further comprises a covering layer arranged proximally above the electronic device, thus defining a proximal encapsulation, where the electronic device is sandwiched between the covering layer and the encapsulation barrier stack. The shape of the covering layer conforms to the external shape of the electronic device. The electronic device is arranged on a base substrate, and the encapsulation barrier stack forms an encapsulation layer over the electronic device to seal the electronic device from the environment. The sealing mixture obtained comprises less than or equal to 10 wt./vol.% of the polymerizable or crosslinkable compound. The sealing mixture comprises 5 wt./vol.% of the polymerizable or crosslinkable compound. The polymerizable compound is acrylic acid, methyl acrylate, ethyl acrylate and butyl acrylate or the crosslinkable compound is a dendrimer an oligomer or a polymer. Preferred Method: The method further comprises: adding a surfactant to the sealing mixture; adding a surface modifying compound to the sealing mixture, where the surface modifying compound is a silane; carrying out sonication of the sealing mixture prior to polymerization. The conditions and/or the concentration of the polymerizable compound is chosen such that the polymerizable compound is immobilized on the surface of the reactive nanoparticles. The sealing mixture is applied onto the substrate via conformal deposition. The sealing mixture is applied onto the barrier layer by means of spin coating, screen printing, webflight method, slot die, curtain gravure, knife coating, ink jet printing, screen printing, dip coating, plasma polymerization or a chemical vapor deposition method. In the method after being deposited onto the substrate the sealing mixture is exposed to conditions that initiate polymerization of the polymerizable compound or crosslinking the crosslinkable compound. The conditions that initiate polymerization comprise UV radiation or infrared radiation, electron beam curing, plasma polymerization (for curing of the polymerizable compound or crosslinking the crosslinkable compound). The nanoparticle sealing layer(s) formed at least essentially consist(s) of the polymer encapsulated reactive nanoparticles. The sonication is carried out for at least 30 minutes. The nanoparticles are a colloidal dispersion comprising nanoparticles dispersed in an organic solvent. The step of mixing of the polymerizable compound with the nanoparticles is carried out in a polar organic solvent. The polar organic solvent comprises a mixture of isopropanol and ethyl acetate in 1:3 molar ratio. The polymerizable or crosslinkable compound is curable by UV light, infrared light, electron beam curing, plasma polymerization and or heat curing. The step of mixing the polymerizable or crosslinkable compound with the comprises mixing less than or equal to 25 wt.% dry form of the monomer to 100 wt.% dry form of the nanoparticles (weight ratio 1:4). The polymerizable or crosslinkable compound is mixed with the nanoparticle at a weight ratio of less than or equal to 1: 5. EXAMPLE - No suitable example given.