NOVELTY - A laminate (100) consists of a carrier substrate (10), a primary polyimide-based resin layer (20) provided on one side or both sides of the carrier substrate, and a secondary polyimide-based resin layer (30) provided on the primary polyimide-based resin layer. The adhesion of primary polyimide-based resin layer to secondary polyimide-based resin layer is reduced by a physical stimulus which does not cause a chemical change in the primary polyimide-based resin layer.    USE - Laminate is used for manufacturing substrate for manufacturing device e.g. solar cell, organic light-emitting diode lamp, semiconductor device and display device e.g. flexible organic electroluminescent device (all claimed). Uses include but are not limited to flat panel display, liquid-crystal display, organic light-emitting display device and electrophoresis element.    ADVANTAGE - The laminate inhibits reliability degradation or occurrence of defects in element due to laser or light radiation. The device formed using laminate is highly reliable. The laminate is easily manufactured, and secondary polyimide-based resin layer is easily separated from the carrier substrate without conducting laser radiation or light radiation process.    DETAILED DESCRIPTION - A laminate consists of a carrier substrate, a primary polyimide-based resin layer provided on one side or both sides of the carrier substrate, and a secondary polyimide-based resin layer provided on the primary polyimide-based resin layer. The thermal expansion coefficient of the primary polyimide-based resin layer at 100-200 degrees C is equal or less than thermal expansion coefficient of secondary polyimide-based resin layer at same temperature. The adhesion of primary polyimide-based resin layer to secondary polyimide-based resin layer is reduced by a physical stimulus which does not cause a chemical change in the primary polyimide-based resin layer. INDEPENDENT CLAIMS are included for the following:    (1) manufacture of laminate, which involves forming primary polyimide-based resin layer containing polyimide-based resin on one side or both sides of the carrier substrate, curing, and forming secondary polyimide-based resin layer;    (2) manufacture of substrate for device, which involves preparing laminate and separating secondary polyimide-based resin layer from carrier substrate in which the primary polyimide-based resin layer is formed; and    (3) manufacture of device.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of laminate.    Carrier substrate (10)    Polyimide-based resin layers (20,30)    Laminate (100)