NOVELTY - The method comprises applying a cover (4) to an electronic arrangement (1) disposed on a substrate (2) such that the electronic arrangement is completely covered by the cover, bonding the cover over a partial area to the substrate and/or to the electronic arrangement, and producing an adhesive bond by a layer of an adhesive in an adhesive tape. The electronic arrangement comprises organic constituents. The adhesive comprises a getter material, which is capable of sorbing a permeable substance and is present in the adhesive in an amount of less than 0.01-0.05 wt.%.    USE - The method is useful for protecting an electronic arrangement (claimed) that is useful in organic or polymer LEDs, display devices, lighting or electrical chrome superstructures or display, electrical luminescence lamps, light emitting electrochemical cells and organic solar cells such as color or polymer solar cells.    ADVANTAGE - The method is capable of protecting the electronic arrangement by the adhesive layer with high water or oxygen impermeability so that service life of the electronic arrangement can be increased.    DETAILED DESCRIPTION - The method comprises applying a cover (4) to an electronic arrangement (1) disposed on a substrate (2) such that the electronic arrangement is completely covered by the cover, bonding the cover over a partial area to the substrate and/or to the electronic arrangement, and producing an adhesive bond by a layer of an adhesive in an adhesive tape. The electronic arrangement comprises organic constituents. The adhesive comprises a getter material, which is capable of sorbing a permeable substance and is present in the adhesive in an amount of less than 0.01-0.05 wt.%. The adhesive tape is a single tape from the adhesive layer. The getter material is present at a nanoscale level such that an extension in a one dimension is less than 100 nm. The adhesive layer has a thickness of 50 mu m, water permeation rate of less than 50 g/m2d and/or an oxygen permeation rate of less than 5000 g/m2d bar, and comprises a pressure-sensitive adhesive layer that is applied to cover the substrate and/or the electronic arrangement. A region of the substrate is covered around the electronic arrangement. INDEPENDENT CLAIMS are included for:    (1) an adhesive; and    (2) a method for producing an adhesive tape.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of an optoelectronic arrangement.    Electronic arrangement (1)    Substrate (2)    Electronic structure (3)    Cover (4)    Adhesive transfer tape. (6)