NOVELTY - A laminated component (22) is obtained by laminating at least a layer (5) comprising a support material, a primer layer (6), a conductive layer (7), an insulating layer (8), and a conductive layer (9). The insulating layer (8) is a layer formed by coating a resin composition (d) onto all or a portion of the surface of conductive layer (7) and drying. The conductive layer (9) is a layer configured from a plating core layer (E-1) formed by coating a fluid (e-1) containing a conductive substance onto all or a portion of the surface of the insulating layer (8), and a plating layer (E-2).    USE - Laminated component is used for electroconductive pattern for electric circuit (all claimed) for electromagnetic wave shield and organic transistor, organic solar cell, electronic book terminal, organic electroluminescent, organic transistor, flexible printed circuit board, noncontact integrated circuit card and periphery wiring.    ADVANTAGE - The laminated component has excellent adhesiveness even at high temperature and high-humidity environment.    DETAILED DESCRIPTION - A laminated component (22) is obtained by laminating at least a layer (5) comprising a support material, a primer layer (6), a conductive layer (7), an insulating layer (8), and a conductive layer (9). The insulating layer (8) is a layer formed by coating a resin composition (d) onto all or a portion of the surface of conductive layer (7) and drying. The conductive layer (9) is a layer configured from a plating core layer (E-1) formed by coating a fluid (e-1) containing a conductive substance onto all or a portion of the surface of the insulating layer (8), and a plating layer (E-2) provided on the surface of the plating core layer (E-1). An INDEPENDENT CLAIM is included for manufacture of laminated component.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of laminated component.    Layer (5)    Primer layer (6)    Conductive layer (7,9)    Insulating layer (8)    Conductive layer (9)    Laminated component (22)