NOVELTY - The method involves providing a semiconductor die (124). An encapsulant (146) is deposited over and around the semiconductor die. A patterned opening is formed in a surface (154) of the encapsulant. A bump (134) e.g. micro bump, recessed within the opening of the encapsulant is formed. Conductive ink (152) is formed over the surface of the encapsulant, bump and sidewall of the opening. A build-up interconnect structure (160) is formed over a second surface of the encapsulant opposite to the first surface of the encapsulant. A semiconductor package is provided.    USE - Method for making a flipchip semiconductor device e.g. microcontroller, microprocessor, charged-coupled device, solar cell and digital micro-mirror device (DMD), used in entertainment product, communication product, power conversion product, network, computer and consumer product. Can also be used for military applications, aviation, automotive, industrial controllers and office equipment.    ADVANTAGE - The method enables allowing the flipchip semiconductor device to provide short electrical conduction path from active devices on the semiconductor die to conduction tracks on a printed circuit board (PCB) to reduce signal propagation distance, lower capacitance and improve overall circuit performance. The method enables allowing the semiconductor die to be mechanically and electrically connected directly to the PCB using flipchip style level packaging without intermediate carrier. The method enables bonding bump material to conductive layer using suitable attachment or bonding process, so that the bump material is reflowed by heating the material above melting point to form balls or bumps, thus improving electrical contact to the conductive layer.    DETAILED DESCRIPTION - The semiconductor die is flipchip type semiconductor die, memory controller and microprocessor i.e. DSP. The encapsulant is made of layers of polymer composite material such as epoxy resin with filler, epoxy acrylate with filler or polymer with proper filler. An INDEPENDENT CLAIM is also included for a semiconductor device.    DESCRIPTION OF DRAWING(S) - The drawing shows a cross sectional view of a structure illustrating a process for forming a conductive ink layer as a package interconnect structure in flipchip package-on-package molded leadless package.    Semiconductor die (124, 182)    Bumps (134, 170, 190)    Encapsulants (146, 188)    Conductive inks (152, 174)    Surface of encapsulant (154)    Build-up interconnect structure (160)