TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The dendrimer encapsulated nanoparticles are nanoparticles which are either encapsulated by dendrimeric molecule or surrounded by dendrimer or the nanoparticle is a dendrimer core after attachment of dendrons on its surface. The dendrimer encapsulated nanoparticles are crosslinked. The sealing layer(s) at least essentially consist(s) of the dendrimer encapsulated reactive nanoparticles. The nanoparticles are encapsulated by an encapsulating material which comprises or consists of dendrimer or dendron. The encapsulating material further comprises at least one of an organic polymer, inorganic polymer, a water soluble polymer, organic solvent soluble polymer, biological polymer, synthetic polymer, oligomer, surfactant, organic compounds or crosslinker compounds. The organic/crosslinker compounds include any of a mercapto group, an epoxy group, an acrylic group, a methacrylate group, an allyl group, a vinyl group, a halogen or an amino group and the crosslinker compound includes a linker unit comprising thiol groups, disulfide groups, amino groups, isocyanide groups, thiocarbamate groups, dithiocarbamate groups, chelating polyether, or carboxy groups. The encapsulating material comprises, prior to the encapsulation, crosslinked or crosslinkable compounds, a UV curable group, electron beam curable or heat curable material. The nanoparticles are pigment particles, quantum dots and/or colloidal particles. The sealing layers conform substantially to the shape of the defects present on the surface of one of the barrier layers. The sealing layer is formed by conformal deposition. The multilayer film comprises many sealing layers and barrier layers arranged in an alternating sequence, or a single sealing layer and a barrier layer. The nanoparticles: are capable of interacting with moisture and/or oxygen through chemical reaction; and comprise a material consisting of a metal and/or its oxide. The barrier stack comprises many sealing layers, where each of the sealing layers comprises a different material. The metal is aluminum, titanium, magnesium, barium, calcium or their alloys. The metal oxide is titanium oxide, perovskite, zirconium oxide, zinc oxide, barium oxide, strontium oxide, calcium oxide, magnesium oxide, vanadium oxide, chromium oxide, molybdenum oxide or lithium manganate. The nanoparticles comprise a transparent conductive oxide consisting of cadmium stannate, cadmium indate, zinc stannate (Zn2SnO4 and ZnSnO3), zinc indium oxide, barium titanate or barium strontium titanate. The nanoparticles are capable of interacting with moisture and/or oxygen through adsorption. The nanoparticles comprise carbon nanotubes and/or graphene nano-sheets or nanoflakes. The sealing layers further comprise many inert nanoparticles capable of obstructing the permeation of moisture and/or oxygen through the defects present in the barrier layer. The inert nanoparticles comprise a material consisting of gold, copper, silver, platinum, silica, wollastonite, mullite, monmorillonite, silicate glass, fluorosilicate glass, fluoroborosilicate glass, aluminosilicate glass, calcium silicate glass, calcium aluminum silicate glass, calcium aluminum fluorosilicate glass, titanium carbide, zirconium carbide, zirconium nitride, silicon carbide, silicon nitride and/or a metal sulfide. The nanoparticles comprised in the sealing layers have a size that is smaller than the average diameter of defects present in the barrier layers. The average size of the nanoparticles is less than one-half the characteristic wavelength of light produced by an electroluminescent electronic component or absorbed by a solar device. The barrier layer comprises indium tin oxide, titanium aluminum nitride, silicon oxide, silicon carbide, silicon nitride, titanium oxide, hafnium oxide, yttrium oxide, tantalum pentoxide, or alumina.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: The barrier stack further comprises a substrate for supporting the multilayer film. The multilayer film is orientated so that the sealing layer or barrier layer is arranged on the substrate. The substrate comprises a material comprising polyacetate, polypropylene, polyimide, cellophane, poly(1-trimethylsilyl-1-propyne), poly(4-methyl-2-pentyne), polyimide, polycarbonate, polyethylene, polyethersulfone, epoxy resins, polyethylene terephthalate, polystyrene, polyurethane, polyacrylate, polydimethylphenylene oxide, styrene-divinylbenzene copolymers, polyvinylidene fluoride, nylon, nitrocellulose, cellulose, glass, indium tin oxide, nano-clays, silicones, polydimethylsiloxanes, biscyclopentadienyl iron, or polyphosphazenes. The barrier stack further comprises: a planarizing layer that is arranged between the substrate and the multilayer film; a terminal layer for protecting the multilayer film, where the terminal layer is facing the ambience; and a further layer arranged on the sealing layer. The terminal layer comprises an acrylic film or the terminal layer is an oxide layer. The acrylic film has lithium fluoride and/or magnesium fluoride particles distributed in it. The further layer is a polymer layer containing no reactive nanoparticles or a polymer layer in which reactive nanoparticles are distributed in a polymeric matrix. The barrier stack defines a base substrate for supporting the electronic device. The encapsulation barrier stack further comprises a covering layer arranged proximally above the electronic device, thus defining a proximal encapsulation, where the electronic device is sandwiched between the covering layer and the encapsulation barrier stack. The shape of the covering layer conforms to the external shape of the electronic device. The electronic device is arranged on a base substrate, and the encapsulation barrier stack forms an encapsulation layer over the electronic device that seals the electronic device against the base substrate. The dendrimers are dendrimers or hyper-branched polymers comprising at least one of secondary amine or primary amine groups, hydroxy group, carboxylic acid, (aminooxy)carbonyl, chlorocarbonyl, chlorine, bromine, fluorine or thiols, preferably amine or hydroxy group. The amine or hydroxy group are coupled to molecules comprising at least one of carboxylic acid, halo-carbonyl or carboxy-1-20C alkyl provide modified dendrimers. The dendrimers are poly(amidoamines), polyethylene imines, poly(propyleneimines), polypropylene imine dotriacontaamine dendrimers or Frechet dendrimers. Preferred Method: The method further comprises adding a surface modifying compound to the sealing mixture, where the surface modifying compound is a silane. Providing the barrier layers comprises forming the barrier layers. The conditions and/or the concentration of the polymerizable compound are chosen so that the polymerizable compound is immobilized on the surface of the reactive nanoparticles. The sealing mixture is applied onto the barrier layer via conformal deposition. The sealing mixture is applied onto the barrier layer using spin coating, screen printing, a WebFlight method, slot die, curtain gravure, knife coating, inkjet printing, screen printing, dip coating, plasma polymerization or a chemical vapor deposition method. After being deposited onto the barrier layer the sealing mixture is exposed to conditions that initiate polymerization of the polymerizable compound or crosslinking the crosslinkable compound. The conditions that initiate polymerization comprise UV radiation or infrared radiation, electron beam curing, or plasma polymerization (for curing of the polymerizable compound or crosslinking the crosslinkable compound). The sealing layer(s) formed at least essentially consist(s) of the dendrimer encapsulated reactive nanoparticles. The method further comprises: carrying out sonication of the sealing mixture prior to polymerization, for at least 30 minutes; and providing a substrate for supporting the barrier stack, where the substrate comprises the barrier layer and a polymer. The nanoparticle is a colloidal dispersion comprising nanoparticles dispersed in an organic solvent. The encapsulation compound comprises a polar organic solvent and/or the nanoparticles are suspended in a solvent, preferably a polar organic solvent. The polar organic solvent comprises a mixture of isopropanol and ethyl acetate in 1:3 molar ratio. The polymerizable or crosslinkable compound is curable by UV light, infrared light, electron beam curing, plasma polymerization and/or heat curing. Mixing of the encapsulation material with the nanoparticles comprises mixing less than or equal to 20 dry wt.% of the encapsulation material to 80 dry wt.% form of the nanoparticles (weight ratio of less than or equal to 1:4). The encapsulation material is mixed with the nanoparticle at a weight ratio of less than or equal to 1:5. The sealing mixture comprises less than or equal to 10, preferably 5 wt./vol.% of the encapsulation material. Crosslinked dendrimer encapsulated nanoparticles are formed.