TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Process: The coating in step (a) is spin coating (preferred), slot coating, gravure coating, or blade coating. The spin coating has a spin rate of 1000-5000 rpm, preferably 1500-4000 rpm. The process further comprises aging the inorganic filler filled in the film under controller humidity at room temperature to 70 degrees C for 1-6 hours, prior to step (e). In the step (c) the first polymer blocks are selected degraded by hydrolysis. Preferred Components: The coating layer in step (a) has a thickness of 100-200 nm, preferably 130-150 nm. The substrate is quartz, glass, or semiconductor. In the step (d) the inorganic filler is a ceramic oxide or mixed oxide comprising aluminum, silicon, titanium, zinc, zirconium or barium, magnesium fluoride or calcium fluoride. The inorganic filler is silicon dioxide (preferred), titanium dioxide, or barium titanate. The filler precursor is tetraethyl orthosilicate (preferred), titanium(IV) isopropoxide, or barium hydroxide/titanium(IV) isopropoxide.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The organic solvent solution of the block copolymer is at 1.5-10 wt.%, preferably 3 wt.%. The organic solvent is dichlorobenzene (preferred), chlorobenzene, dichloromethane, toluene, or tetrahydrofuran. The non-preferential solvent used in step (b) is dichloromethane (preferred) or chloroform.    TECHNOLOGY FOCUS - POLYMERS - Preferred Process: In the step (e) the second polymer block matrix is removed by using: an organic solvent comprising tetrahydrofuran or toluene; or a UV light exposure with a wavelength of 254 nm and an intensity of 3 mW/cm2. Preferred Components: The organic material used to modify the substrate is hydroxy terminated polystyrene (preferred), hydroxy terminated poly(vinylpyridine), or hydroxy terminated poly(acrylonitrile). The hydroxy terminated polystyrene has a molecular weight of 5000-10000. The block copolymer is poly(styrene)-poly(L-lactide) chiral block copolymer, where the first polymer blocks are poly(L-lactide), and the second polymer blocks are polystyrene. In the process a volume fraction of the first polymer blocks in the block copolymer is 36-50%, preferably 40%. EXAMPLE - Quartz or silicon wafer was cleaned using isopropyl alcohol and acetone solution, and then rinsed with deionized water. The surface of substrate was modified by hydroxy terminated polystyrene with molecular weights of 9000 to increase the adhesion between substrate and polystyrene-poly(L-lactide) thin films for the hydrolysis process. Then an organic solution of hydroxy terminated polystyrene (greater than 5%) was spin coated on the surface of the substrate with a thickness of 5 nm, and was annealed at 170 degrees C for 10 minutes so that hydroxy terminated polystyrene was grafted onto the surface of the substrate. Ungrafted hydroxy terminated polystyrene was removed from the substrate by rinsing with tetrahydrofuran. The polystyrene-poly(L-lactide) thin film was spin-coated on a substrate modified with the hydroxy terminated polystyrene as brushes by spin-coating from 3 wt.% chlorobenzene solution of polystyrene-poly(L-lactide) at 50 degrees C. Spin-coated films were placed in a dichloromethane saturated chamber at room temperature. The dichloromethane vapors swelled the thin films and annealed it to achieve the formation of well-defined gyroid-forming thin films. The poly(L-lactide) blocks of the polystyrene-poly(L-lactide) thin films were removed by hydrolysis, using a 0.5 M basic solution that was prepared by dissolving 2 g of sodium hydroxide in a 40/60 volume solution of methanol/water. After hydrolysis, the hydrolyzed samples were rinsed using a mixture of deionized water and methanol, and then used as templates for the sol-gel reaction. The silica precursor mixture was introduced into the polystyrene templates by immersing the templates in 0.1 M aqueous tetraethyl orthosilicate/hydrochloric acid/0.1 M methanol mixture with stirring at room temperature, and then treated under controlled humidity at 50 degrees C for less than or equal to 3 hours for aging process. After drying, polystyrene/silicon dioxide gyroid nanohybrid samples were prepared. The nanoporous polystyrene template of the polystyrene/silicon dioxide gyroid nanohybrids was degraded by exposure to UV. The degradation was carried out under atmosphere conditions for 24 hours using a UV source. The intensity of the UV source was tuned at a wave length of 254 nm and an intensity of 3 mW/cm2 to obtain nanoporous gyroid silicon dioxide on the quartz or silicon wafer or gyroid-forming silicon dioxide nanostructure.