TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Process: The amine adduct (D) is obtained by reacting amine compound (a1) with epoxy resin (e1), carboxylic acid compound, sulfonic acid compound, urea compound, and isocyanate compound. Preferred Composition: The amine adduct (D) comprises amine adduct (d1) obtained by reacting 1-15C amine compound (a1) having primary amino group and/or secondary amino group with epoxy resin (e1). The amine adduct (D) contains amine adduct (d1) and amine adduct (d2). The content of amine adduct (d2) with respect to 100 parts mass of amine adduct (d1) is 5-95 parts mass. The amine compound (E) has 1 unit of tertiary amino group. The molecular weight of the amine compound (E) is obtained by dividing the number of tertiary amino groups present in the amine compound (E) in one molecule and molecular weight per tertiary amino group of amine compound (E), which is equal to 45-300. The content of amine compound (E) with respect to 100 parts mass of thermosetting liquid resin (B) is 0.1-10 parts mass. Preferred Properties: The molecular weight distribution (ratio of weight-average molecular weight (Mw) to the number-average molecular weight (Mn)) of amine adduct (D) is 1-7. The melting point of amine compound (E) is 30-240 degrees C or less. The amine compound has melt-dissolution at 25 degrees C. The shell has urea-bond group which absorbs infrared rays having wave number of 1630-1680cm-1, buret-bonding group which absorbs infrared rays having wave number of 1680-1725 cm-1, and urethane bond group which absorbs infrared rays having wave number of 1730-1755 cm-1.    TECHNOLOGY FOCUS - POLYMERS - Preferred Composition: The content of microcapsule-type amine hardener (C) with respect to 100 parts mass of epoxy resin (A) is 1-300 parts mass. The thermosetting liquid resin (B) is chosen from liquid oxetane resin, liquid monovalent epoxy resin, and liquid polyvalent epoxy resin. The thermosetting liquid resin (B) is oxetane resin chosen from 3-ethyl-3-(2-ethylhexyl oxymethyl) oxetane, 1,3-bis(3-ethyloxetan-3-yl methoxy)benzene, 1,4-bis(3-ethyloxetan-3-yl methoxy)benzene, 3-ethyl-3( ((3-ethyloxetan-3-yl)methoxy)methyl) oxetane, 3-ethyl-3-(vinyloxymethyl)oxetane, 3-ethyl-3-(methoxy methyl)oxetane, 3-ethyl-3-(phenoxy methyl)oxetane, 3-ethyl-3-(cyclohexyloxymethyl)oxetane and 3-ethyl-3-((benzyloxy)methyl)oxetane, 1,4-cyclohexane dimethanol diglycidyl ether, 1,3-cyclohexane dimethanol diglycidyl ether, diglycidyl ether of polyoxyalkylene bisphenol A, t-butyl hydroquinone diglycidyl ether, resorcinol diglycidyl ether, glycidyl aniline, glycidyl o-toluidine, (3,4-epoxycyclohexyl)methyl-3,4-epoxycyclohexyl carboxylate, ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, trimethylolpropane triglycidyl ether, phenylglycidyl ether, N,N-bis (2,3-epoxypropyl)-4-(2,3-epoxy propoxy)aniline, and anhydrous hexahydrophthalic acid diglycidyl ether, and epoxy resin chosen from group of formula (I)-(III). The liquid resin composition further comprises curing agent (h3) for epoxy resin chosen from thiol-based curing agent, acid anhydride-based curing agent, phenol-based curing agent, hydrazide-based curing agent and guanidine-based curing agent.R=halo, 1-8C alkyl, or aryl;n=0-3;andm=1-3.Preferred Property: The number-average molecular weight (Mn) of thermosetting liquid resin (B) is 150-850. Preferred Process: The shell is obtained by reacting amine compound (E) with isocyanate compound, active hydrogen compound, epoxy-resin curing agent (h2) and epoxy resin (e2).