NOVELTY - A primary curable silicone composition is applied to the surface of a primary substrate, primary curable silicone composition is optionally cured on the surface of primary substrate. A secondary curable silicone composition is applied to the surface of primary silicone composition, and secondary curable silicone composition is cured optionally together with primary curable silicone composition, to obtain multilayer silicone structure.    USE - Multilayer silicone structure is used for manufacturing electronic devices e.g. encapsulated or embedded electronic devices e.g. encapsulated or embedded solar cell modules, encapsulated or embedded integrated circuits, electrical insulators, encapsulated or embedded LEDs, and intermediate layers of displays, monitors or screens, coatings, shaped molded articles, laminates and impression materials (all claimed).    ADVANTAGE - The multilayer silicone structure is efficiently manufactured with excellent adhesion.    DETAILED DESCRIPTION - A primary curable silicone composition is applied to the surface of a primary substrate, primary curable silicone composition is optionally cured on the surface of primary substrate. A secondary curable silicone composition is applied to the surface of primary silicone composition, and secondary curable silicone composition is cured optionally together with primary curable silicone composition, to obtain multilayer silicone structure. The primary silicone composition comprises one or more polyorganosiioxanes having at least two alkenyl groups per molecule, one or more oxidic fillers, optionally hydrophobized by reaction with one or more hydrophobing agents, one or more a metal catalysts and one or more polyorganosiioxanes having at least two silane (SiH) groups per molecule. The molar ratio of all silane (SiH) groups and all alkenyl groups in the composition is 0.25-4. The molar ratio of all silane (SiH) groups and all alkenyl groups in the composition is 1-4. The molar amount of oxidic filler is less than 0.035. The secondary curable silicone composition comprises one or more polyorganosiioxanes having at least two alkenyl groups per molecule, optionally one or more oxidic fillers, optionally hydrophobized by reaction with one or more hydrophobing agents, one or more a metal catalysts, and one or more polyorganosiloxanes having at least two silane (SiH) groups per molecule. The molar ratio of all silane (SiH) groups and all alkenyl groups in the composition is 1-10. An INDEPENDENT CLAIM is included for manufacture of photovoltaic device, which involves providing a substrate, applying primary curable silicone composition on the surface of substrate, providing at least one solar cell into primary curable silicone composition, optionally curing primary curable silicone composition, applying secondary curable silicone composition on the surface of layer formed of primary curable silicone composition and to the surface of solar ceils, optionally applying a back skin substrate to the surface of the structure, curing secondary curable silicone composition optionally together with primary curable silicone composition.