TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Composition: The conductive composition further comprises: at least one additional polymeric binder and/or at least one additive different from the metal particles, glass particles, cellulose derivative, solid organopolysiloxane resin and organic solvent, where the additive is plasticizer, surfactant, coupling agent, defoaming agent, leveling agent, dispersing agent, conductive agent or thixotropic agent; and at least one amide-functional organic oil or wax, preferably an amide modified hydrogenated castor oil, thixotropic agent and/or at least one carbonaceous conductive agent, preferably graphite, a conductive agent. Preferred Components: The metal particles are particles made of aluminum, silver, copper, nickel, platinum, palladium and/or gold or their alloys and the glass particles comprise oxides including silicon dioxide, boron trioxide, aluminum oxide, bismuth(III) oxide, magnesium oxide, antimony trioxide, lead(II) oxide, calcium oxide, barium oxide, zinc oxide, sodium oxide, lithium oxide, potassium oxide, zirconium oxide, titanium dioxide, iridium(IV) oxide and/or tin dioxide. The cellulose derivative is a cellulose ester and/or a cellulose ether, preferably ethyl cellulose. The solid organopolysiloxane resin has a composition containing substituted silicon compounds of formula ((R1R2R3SiO0.5)a(R4R5SiO)b(R6SiO1.5)c(SiO2)d)R1, R2, R3, R4, R5 and R6 = hydrocarbon or functional group including hydroxy, acyloxy or alkoxy group;a = 0-0.4;b = 0.01-0.99;c = 0.01-0.99; andd = 0-0.3.Provided that: at least one hydrocarbon group and at least one functional group are present; sum of a, b, c and d is 1; and sum of b and c is 0.7-1. The solid organopolysiloxane resin is hydroxy-functional, preferably comprising silicon-bound hydroxyl groups present at 0.1-15 wt.% based on the total weight of the organopolysiloxane resin. The solid organopolysiloxane resin has a branched molecular structure, preferably a three-dimensional cross-linked network structure. The solid organopolysiloxane resin has a weight average molecular weight as measured by gel permeation chromatography using polystyrene standards of 1000-300000 g/mol. The organic solvent is an organic solvent having a boiling point of 70-250 degrees C, and includes terpineol, butyl carbitol, ethylene glycol monobutyl ether acetate, propylene phenoxetol and/or texanol. The conductive composition comprises 60-90 wt.% metal particles, 0.5-5 wt.% glass particles, 0.1-5 wt.% of the cellulose derivative, 0.1-5 wt.% of the solid polysiloxane resin, 15-30 wt.% of the organic solvent, 0-3 wt.% of additional polymeric binder and/or 0-2 wt.% of the additives. The conductive composition is a paste and/or having a viscosity of 5000-200000 mPa-s as measured with a Brookfield RV DV-II+ Pro instrument at 23 degrees C using a #51 spindle and a rotational speed of 1 rpm. Preferred Definitions:    hydrocarbon = 1-12C alkyl, cycloalkyl, aryl and/or aralkyl, preferably 1-4C alkyl and/or a phenyl; and    functional group = hydroxy.    EXAMPLE - No suitable example given.