NOVELTY - A photosensitive film laminate consists of base material and photosensitive film (12) provided on the base material. The photosensitive film comprises alkali-soluble resin (A), polymeric compound having unsaturated double bond (B) and photoinitiator (C). The photoinitiator (C) has carboxy-containing structure (I).    USE - Photosensitive film laminate is used for manufacturing flexible printed wiring board (all claimed). Uses include but are not limited to electronic device, semiconductor device, semiconductor chip, semiconductor mounting, tape automation bonding, electric-insulation film, liquid crystal display, organic electroluminescence display board, electronic paper, solar cell, etc.    ADVANTAGE - The photosensitive film laminate has excellent photosensitivity, wiring coating property and visibility of exposure portion and unexposed portion, and favorable developability.    DETAILED DESCRIPTION - A photosensitive film laminate consists of base material and photosensitive film provided on the base material. The photosensitive film comprises alkali-soluble resin (A), polymeric compound having unsaturated double bond (B) and photoinitiator (C). The photoinitiator (C) has carboxy-containing structure of formula (I).    Ar1=monovalent organic group comprising aromatic group;    R1=organic group having alkyl or aryl;and    R2=3-50C monovalent hydrocarbyl chosen from branched chain alkyl, straight alkyl, alkyl having alicyclic structure and alkyl having aromatic structure.    INDEPENDENT CLAIMS are included for the following:    (1) flexible printed wiring board (10), which consists of circuit board (11) having wiring (13), and photosensitive film deposited on circuit board by baking film-forming; and    (2) manufacture of flexible printed wiring board, which involves laminating photosensitive film laminate on wiring surface of circuit board using thermal vacuum roller, and performing baking film-forming.    DESCRIPTION OF DRAWING(S) - The drawing shows schematic view explaining minimum thickness and surface level difference of flexible printed wiring board.    Flexible printed wiring board (10)    Circuit board (11)    Photosensitive film (12)    Wiring (13)    Minimum thickness of film (a)    Maximum value of surface level (b)