NOVELTY - A conductor (10) is positioned in a connective portion (32) on a substrate (20) by a positioning unit (40), a plasma (51) is generated from a plasma source (50), and a bonding material (30) is fed into the plasma. The bonding material is activated by partially changing its characteristics, and directional discharge of plasma jet (52) is carried out on the connective portion. The activated bonding material is applied onto connective portion, so that material-locking of the conductor with the substrate is carried out through a deposit (33) of bonding material.    USE - Method for connecting conductors with substrates, for manufacturing solar cell module. Can also be used in automotive industry, shipbuilding industry, aircraft industry, etc.    ADVANTAGE - Fast, cost-effective, flexible, adaptable, gentle and simple method for preparation of long-term stable connection of conductors or to create traces on substrates or their connection with electrical contacts, is provided. Different types of conductors and substrates can be cohesively combined with each other. Substrates of different shape and surface characteristics can be processed efficiently. The dirt or oxide layers can be removed from substrate. The registered amount of heat can be reduced from substrate and conductor. Parallel execution of connection method on several adjacent portions of substrate is carried out, without exceeding the given threshold value for total heating.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) a device for connecting conductors with substrates; and    (2) a system for parallel processing of substrates.    DESCRIPTION OF DRAWING(S) - The drawings show a schematic sectional view of the connection device, and a schematic sectional view of the connection device with adjustment system.    Conductor (10)    Substrate (20)    Bonding material (30)    Connective portion (32)    Deposit of bonding material (33)    Positioning unit (40)    Plasma source (50)    Plasma (51)    Plasma jet (52)