NOVELTY - A substrate (11) comprises ( alpha )-polyimide having 5% thermal decomposition temperature of 350 degrees C or more, ( beta )-compound (I) and/or (II), ( gamma )-compound (III) and having hydroxyl group, carboxyl group, and/or sulfo group, and ( delta )-compound (IV).    USE - Substrate is used for manufacturing flexible device and semiconductor device (all claimed). Uses include but are not limited to thin film transistor, solar cell, flexible display, organic electroluminescent flexible display.    ADVANTAGE - The substrate provides flexible device having excellent durability and adhesiveness between resin layer and inorganic substrate with reduced variation of film thickness and malfunction.    DETAILED DESCRIPTION - A substrate comprises ( alpha )-polyimide having 5% thermal decomposition temperature of 350 degrees C or more, ( beta )-compound of formula (I) and/or (II), ( gamma )-compound of formula (III) and having hydroxyl group, carboxyl group, and/or sulfo group, and ( delta )-compound of formula (IV).    n=1-5.    INDEPENDENT CLAIMS are included for the following:    (1) flexible device, which contains semiconductor device formed on the substrate;    (2) manufacture of flexible device, which involves forming a semiconductor device on the laminated material, and peeling the semiconductor device from an inorganic substrate;    (3) resin composition, which contains polyimide precursor (a) having 5%-thermal decomposition temperature of 350 degrees C or more, silicone-type surfactant or fluorochemical surfactant (b), and alkoxysilane compound (c) having functional group chosen amino group, carbamate group, carboxyl group, aryl group, acid-anhydride group, amide group, and polymerizable cyclic ether group; and    (4) manufacture of laminated material, which involves deploying the resin composition on an inorganic substrate, and obtaining the laminated material which forms the polyimide resin layer (12) comprising resin composition, and comprises the inorganic substrate and the polyimide resin layer.    DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of manufacture of flexible device.    Substrate (11)    Polyimide resin layer (12)