TECHNOLOGY FOCUS - POLYMERS - Preferred Method: In the method, 0-4 air bubbles are present per square meter of the silicone encapsulant where the air bubbles have a diameter of less than 1 mm. The step of laminating is further defined as laminating the superstrate, the optoelectronic element, the curable silicone composition, and the second curable silicone composition to form the silicone tie layer and to form the electronic article. The step of laminating is further defined as laminating the superstrate, the optoelectronic element, the curable silicone composition, the backsheet, and optionally the second silicone composition, to form the electronic article. The step of laminating is further defined as laminating the superstrate, the optoelectronic element, the curable silicone composition, an optional backsheet, the fibers, and optionally the second curable silicone composition, to form the electronic article, where the fibers are disposed in the silicone encapsulant. The method further involves applying a vacuum to evacuate the air from the interior of the electronic article to the perimeter of the electronic article through the passage to form the layer of the curable silicone composition; and applying heat to heat the curable silicone composition during the step of laminating. The step of laminating is further defined as simultaneously applying a vacuum and a compression force to evacuate the air from the interior of the electronic article to the perimeter of the electronic article through the passage to form a compressed layer of the curable silicone layer and subsequently applying heat to heat the curable silicone composition. The method forms a photovoltaic cell module having a perimeter and comprising a superstrate having a light transmittance of at least 70% as determined by UV/Vis spectrophotometry using ASTM E424-71 (2007), a photovoltaic cell disposed on the superstrate, and a silicone encapsulant disposed as a layer on the photovoltaic cell and sandwiching the photovoltaic cell between the superstrate and the layer of the silicone encapsulant. Preferred Article: The electronic article further comprises a silicone tie layer disposed on the superstrate and sandwiched between the optoelectronic element and the superstrate, where the silicone tie layer is formed from a second curable silicone composition. The electronic article further comprises a backsheet disposed on the silicone encapsulant and sandwiching the silicone encapsulant between the optoelectronic element and the backsheet. The electronic article further comprises several fibers. The electronic article further comprises at least one spacer disposed along the perimeter of the electronic article and disposed on and in direct contact with both the superstrate and the backsheet to provide the electronic article with a uniform thickness across the electronic article of plus minus 15% of a nominal thickness of the spacer. Preferred Components: The complex viscosity of the curable silicone composition is 80000-200000 cPs at 25 degrees C as measured at 1 radian per second at 1-5% strain. The pattern is further defined as comprising at least two rows of the curable silicone composition each disposed on the optoelectronic element approximately parallel to one another. The pattern is further defined as comprising at least two rows of the curable silicone composition each disposed on the optoelectronic element transverse to one another. The superstrate and the backsheet are both silica glass. EXAMPLE - No suitable example given.