NOVELTY - Simple and fast light induced nickel plating method for positive-type (p-type) silicon wafer and negative type/positive type silicon solar cell material, at least comprises: e.g. (a) taking silicon substrate (11) and forming layer of aluminum metallic film (12) on its p-type surface after cleaning to obtain plated sample (1) after sintering; (b) formulating nickel plating bath (21) in translucent container; (c) cleaning surface of plated sample, and removing native oxide layer; (d) immersing plated sample in bath; and (e) emitting light source (3) directly on plated surface of plated sample.    USE - The light induced nickel plating method is useful for forming metallic film on p-type silicon wafer and negative type/positive type silicon solar cell material (claimed), where the obtained silicon wafer or the silicon solar cell material is useful in solar cells or other optoelectronic components.    ADVANTAGE - The method: can be performed in a simple and fast manner (claimed); does not require any surface catalytic processing, reducing agent, or applied voltage; is capable of carrying out the nickel deposition on the specific surface with a high nickel plating rate; is cost effective; and provides a high-quality nickel metallic film.    DETAILED DESCRIPTION - Simple and fast light induced nickel plating method for positive-type (p-type) silicon wafer and negative type/positive type silicon solar cell material, at least comprises: (a) taking a silicon substrate (11), and forming a layer of aluminum metallic film (12) on its p-type surface after cleaning to obtain a plated sample (1) after sintering; (b) formulating a nickel plating bath (21) in a translucent container; (c) cleaning the surface of the plated sample again, and removing a native oxide layer; (d) immersing the plated sample in the nickel plating bath; (e) emitting a light source (3) directly on a plated surface of the plated sample for nickel deposition; and (f) after the scheduled time for the nickel deposition, removing the light source and taking out the plated sample to wash and dry, so that the light induced nickel plating on the plated sample is completed and a metallic film on silicon substrate is obtained.    DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of the step of emitting a light source directly on a plated surface of the plated sample.    Plated sample (1)    Light source (3)    Silicon substrate (11)    Aluminum metallic film (12)    Nickel plating bath (21)