NOVELTY - A curable resin composition is applied to primary main surface of peelable glass substrate (10). The uncured curable resin composition layer on peelable glass substrate is cured. A support substrate (14) which has smaller external dimensions than external dimensions of obtained resin layer (12) is laminated on resin layer. The resin layer and peelable glass substrate are cut. An electronic device material (20) is formed on secondary main surface of peelable glass substrate. An electronic device (26) is separated from laminate having electronic device material.    USE - Manufacture of electronic device e.g. solar cell, liquid crystal panel and organic electroluminescent panel.    ADVANTAGE - The method enables manufacture of electronic device having flat resin layer with excellent productivity.    DETAILED DESCRIPTION - A curable resin composition is applied to a primary main surface of the peelable glass substrate which has primary main surface and a secondary main surface. The uncured curable resin composition layer on the peelable glass substrate is cured, to form a resin layer. A support substrate which has smaller external dimensions than the external dimensions of the resin layer is laminated on the resin layer such that the resin layer retains a peripheral edge region which is not in contact with the support substrate, to obtain a pre-cutting laminate (16). The resin layer and the peelable glass substrate are cut along the outer peripheral edge of the support substrate in the pre-cutting laminate. An electronic device material is formed on the secondary main surface of the peelable glass substrate, to obtain a laminate having electronic device material. An electronic device which has the peelable glass substrate and the electronic device material is separated from the laminate having the electronic device material. An INDEPENDENT CLAIM is included for manufacture of glass laminated material.    DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of manufacture of electronic device.    Peelable glass substrate (10)    Resin layer (12)    Support substrate (14)    Pre-cutting laminate (16)    Electronic device material (20)    Laminate having electronic device material (22)    Support substrate with resin layer (24)    Electronic device (26)