NOVELTY - A resin-layer-equipped support substrate comprises plate-shaped support substrate, and layer of polyimide resin formed on the support substrate. The polyimide resin in the layer of polyimide resin contains repeating unit having residue (X) of tetracarboxylic acid and residue (A) of diamine (I). 50 Mol% or more of the total of residue (X) of the tetracarboxylic acid consists of group chosen from groups (X1)-(X4). 50 Mol% or more total of the residue (A) of the diamine consists of group chosen from groups (A1)-(A7).    USE - Resin-layer-equipped support substrate is used for manufacture of glass laminate for manufacture of electronic device (all claimed). Uses include but are not limited to solar cell and liquid crystal panel, organic electroluminescent panel, plasma display panel, field emission panel of OLED and LCD used in mobile telephone and personal digital assistant.    ADVANTAGE - The glass laminate obtained by the resin-layer-equipped support substrate has excellent peeling resistance between the glass substrate and layer of polyimide resin, even after performing high-temperature heat-processing.    DETAILED DESCRIPTION - A resin-layer-equipped support substrate comprises plate-shaped support substrate, and layer of polyimide resin formed on the support substrate. The polyimide resin in the layer of polyimide resin contains repeating unit having residue (X) of tetracarboxylic acid and residue (A) of diamine of formula (I). 50 Mol% or more of the total of residue (X) of the tetracarboxylic acid consists of group chosen from groups of formulae (X1)-(X4). 50 Mol% or more total of the residue (A) of the diamine consists of group chosen from groups of formulae (A1)-(A7). The layer of polyimide resin is obtained by heat processing a layer of curable resin which turns into polyimide resin by thermosetting or a layer obtained by coating composition containing polyimide resin and solvent, at 60-250 degrees C and then heat processing at 250-500 degrees C.    X=tetracarboxylic acid residue (excluding carboxy from tetracarboxylic acid);and    A=diamine residue (excluding amino from diamine).    INDEPENDENT CLAIMS are included for the following:    (1) glass laminate, which has resin-layer-equipped support substrate, and glass substrate laminated on the surface of the layer of polyimide resin of resin-layer-equipped support substrate;    (2) manufacture of glass laminate;    (3) manufacture of resin-layer-equipped support substrate, which involves forming layer of polyimide resin formed on the support substrate; and    (4) manufacture of electronic device, which involves forming electronic device material on a surface of the glass substrate in the glass laminate, obtaining electronic-device-material-containing laminate, and removing the resin-layer-equipped support substrate from the electronic-device-material-containing laminate.    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of the resin-layer-equipped support substrate.    Plate-shaped support substrate (12)    Layer of polyimide resin (14)    Surface which contacts layer of polyimide resin (14a)    Surface which contacts plate-shaped support substrate (14b)    Resin-layer-equipped support substrate (18)