TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Method: The method further involves adding to the mixture at least one additional molecular precursor compound; adding to the mixture a compound of formula LiM'c(z+)(OR)1+z; adding to the mixture a compound of the formula Li2M'c(z+)(OR)2+z; adding a solvent to form a paste, a liquid, a solution, or an ink; and adding to the mixture at least one compound selected from manganese alkoxide, manganese siloxide, manganese phosphinate, manganese phosphonate, manganese phosphate, nickel alkoxide, nickel siloxide, nickel phosphinate, nickel phosphonate, nickel phosphate, cobalt alkoxide, cobalt siloxide, cobalt phosphinate, cobalt phosphonate, cobalt phosphate, iron alkoxide, iron siloxide, iron phosphinate, iron phosphonate, iron phosphate, vanadium alkoxide, vanadium siloxide, vanadium phosphinate, vanadium phosphonate, and vanadium phosphate. The step of converting is performed: by heating the mixture at a temperature of 100-800 degrees C to convert it to a material; or with exposure to air or oxidizing atmosphere; or under inert atmosphere after exposure to air or oxidizing atmosphere. The method further involves annealing the material at a temperature of 400-800 degrees C. The converting step involves: providing a substrate; depositing the composition onto the substrate; and heating the substrate at a temperature of 100-650 degrees C. The depositing is done with an ink by spraying, spray coating, spray deposition, spray pyrolysis, printing, screen printing, inkjet printing, aerosol jet printing, ink printing, jet printing, stamp printing, transfer printing, pad printing, flexographic printing, gravure printing, contact printing, reverse printing, thermal printing, lithography, electrophotographic printing, electrodepositing, electroplating, electroless plating, bath deposition, coating, wet coating, dip coating, spin coating, knife coating, roller coating, rod coating, slot die coating, meyerbar coating, lip direct coating, capillary coating, liquid deposition, solution deposition, layer-by-layer deposition, spin casting, and/or solution casting. Preferred Compound: The compound has coordinating species L. The source compounds are selected from Ni(OR)2, Ni(OR)3, Mn(OR)2, Mn(OR)3, Fe(OR)2, Fe(OR)3, Co(OR)2, Co(OR)3, or V(OR)3. Preferred Composition: The composition is a mixture of solids. Preferred Components: The mixture further contains at least one dopant source compound having the formula M(OR)q. The substrate is selected from insulators, glass, silicon, mica, ceramics, flexible ceramics, metals, metal foils, aluminum, beryllium, chromium, copper, gallium, gold, lead, manganese, nickel, palladium, platinum, rhenium, rhodium, molybdenum, silver, stainless steel, steel, iron, strontium, tin, titanium, titanium nitride, tungsten, zinc, zirconium, metal alloys, metal silicide, metal carbides, and conductive layer-coated polymers.M=Mg, Y, Ti, Zr, Nb, Cr, Ru, B, Al, Bi, Sb, Sn, or La;q=same as the oxidation state of the atom M;OR=alkoxy, aryloxy, heteroaryloxy, alkenyloxy, siloxy, phosphinate, phosphonate, or phosphate. SPECIFIC COMPOUNDS - Use of 108 compounds are specified as the precursor compounds, e.g. LiNi0.5Co0.5O2; LiNi0.5Mn0.5O2; LiNi0.5Fe0.5O2; LiNi0.5V0.5O2; and LiCo0.5Fe0.5O2.    EXAMPLE - A cathode molecular precursor ink was prepared by dissolving 0.33 g LiCo(OsBu)3 in n-butyl acetate to a concentration of 15 wt.%. The resulting ink was filtered through a 0.2 mu m syringe filter prior to use. The cathode molecular precursor ink of LiCo(OsBu)3 was printed onto a current collector coated substrate via inkjet printing with 3 wet passes of the pattern per layer and 50% overlap line-to-line. Each layer was heated at 400 degrees C for 10 minutes under inert atmosphere. A total of 16 layers were coated. Annealing of the cathode film was done at 500 degrees C for 10 minutes in dry air. The cathode film had an average thickness of approximately 2.8 mu m. The Li/Co stoichiometry was determined to be 1.01:1.00.