TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The sulfate based anionic surfactant comprises ammonium dodecylsulfate, ammonium laureth sulfate, sodium dodecyl sulfate, sodium lauryl sulfate, sodium laureth sulfate, potassium dodecylsulfate, potassium laureth sulfate, ammonium octyl sulfate, sodium octyl sulfate, potassium octyl sulfate, ammonium hexyl sulfate, sodium hexyl sulfate, potassium hexyl sulfate, ammonium stearyl sulfate, sodium stearyl sulfate or potassium stearyl sulfate.    TECHNOLOGY FOCUS - ORGANIC CHEMISTRY - Preferred Components: The sulfonate based anionic surfactant comprises disodium polyethylene glycol (PEG)-12 dimethicone sulfosuccinate, sodium dioctyl sulfosuccinate, sodium benzene sulfonate, disodium lauryl sulfosuccinate, dipotassium PEG-12 dimethicone sulfosuccinate, sodium dihexyl sulfosuccinate, sodium dilauryl sulfosuccinate, potassium dioctylsulfursuccinate, potassium dihexyl sulfosuccinate, potassium dilauryl sulfosuccinate, and dipotassium lauryl sulfosuccinate. An amount of sulfonate based anionic surfactant is 0.000001-1 wt.%. The etchant composition further comprises an alkali compound including potassium hydroxide, sodium hydroxide, ammonium hydroxide, tetrahydroxymethyl ammonium and tetrahyroxy ethyl ammonium, a compound including silica, polysaccharide consisting of glucan compound, fructan compound, mannan compound, galactan compound and their metal salts, a polymer in which the substituted monomer is polymerized to a 4-10C ring compound and nitrogen atom, and an organic solvent. The compound including silica further includes liquid lithium silicate, liquid potassium silicate, liquid sodium silicate, colloid silica solution, a colloid silica solution stabilized to an acidic solution, a colloid silica solution stabilized to potassium oxide, or a colloid silica solution stabilized to sodium oxide. The organic solvent is ethyl alcohol, propyl alcohol, ethylene glycol, or methyl ethyl ketone. The glucan compound consists of cellulose, dimethylaminoethyl cellulose, diethylaminoethyl cellulose, ethyl hydroxyethyl cellulose, methyl hydroxyethyl cellulose, 4-aminobenzyl cellulose, triethylaminoethyl cellulose, cyanoethylcellulose, ethylcellulose, methyl cellulose, carboxymethyl cellulose, carboxyethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, alginic acid, amylose, amylopectin, pectin, starch, dextrin, alpha -cyclodextrin, beta -cyclodextrin, gamma -cyclodextrin, hydroxypropyl beta -cyclodextrin, methyl- beta -cyclodextrin, dextran, dextran sulfate sodium, saponin, glycogen, zymosan, lentinan, and their metal salts. The monomer further includes one of oxygen and sulfur atom in the ring structure. The monomer consists of N-vinyl pyrrolidone, N-acryloyl morpholine, N-vinyl succinimide, N-acryloxy succinimide, N-vinylcaprolactam, and N-vinylcarbazole. A boiling point of the organic solvent is greater than or equal to 100 degrees C. A solubility parameter of the organic solvent is 6-16. Preferred Process: The etching method comprises spraying the composition on the wafer at a temperature of 50-100 degrees C for 30 seconds to 60 minutes, and precipitating the wafer at a temperature of 50-100 degrees C for 30 seconds to 60 minutes.    TECHNOLOGY FOCUS - POLYMERS - Preferred Components: A weight-average molecular weight of the polymer is 1000-1000000. A boiling point of the polymer is greater than or equal to 100 degrees C. An amount of the polymer is 10-12 wt.% to 1 wt.%. EXAMPLE - No suitable example given.