NOVELTY - A curable resin composition containing organopolysiloxane, platinum group metal type-catalyst, reaction inhibitor, and solvent having boiling point higher than boiling point of reaction inhibitor is coated on support substrate. A non-hardened curable resin composition layer is formed (S102) on support substrate. The reaction inhibitor is removed (S104) from composition layer and solvent is removed (S106) from curable resin composition layer, to form resin layer with support substrate. A peelable glass substrate is laminated (S108) on resin layer, to obtain glass laminate.    USE - Manufacture of glass laminate used for manufacturing electronic device (claimed). Uses include but are not limited to solar cell, liquid crystal panel, organic electroluminescent panel, thin-film transistor, sensor, and flexible printed circuit board.    ADVANTAGE - The method provides glass laminate having excellent flatness, and suppressed generation of space between resin layer and glass substrate.    DETAILED DESCRIPTION - A curable resin composition comprising organopolysiloxane having alkenyl group, organopolysiloxane having hydrogen atom bonded with silicon atom, platinum group metal type-catalyst, reaction inhibitor, and solvent having boiling point higher than the boiling point of reaction inhibitor is coated on the support substrate. A non-hardened curable resin composition layer is formed on the support substrate. The reaction inhibitor is removed from the curable resin composition layer and solvent is removed from the curable resin composition layer, to form resin layer with support substrate. A peelable glass substrate is laminated on the resin layer, to obtain glass laminate. An INDEPENDENT CLAIM is included for manufacture of electronic device.    DESCRIPTION OF DRAWING(S) - The drawing shows a flowchart explaining the manufacturing process of electronic device. (Drawing includes non-English language text)    Forming composition layer (S102)    Removal process (S104,S106)    Lamination process (S108)    Material formation process (S110)