NOVELTY - The method involves depositing a metal paste in a pattern on a dielectric layer, where the dielectric layer is deposited between portions of the metal paste and the surface of a substrate (202) i.e. P-type doped substrate. The metal pastes deposited on the dielectric layers are simultaneously heated to form a group of contacts to the substrate through portions of another dielectric layers, where a portion of the metal paste forms a set of contact regions that extend through the dielectric layer from the surface of the dielectric layer to another side of the substrate.    USE - Method for manufacturing a crystalline bifacial solar cell device. Uses include but are not limited to passivated emitter and rear solar cell, passivated emitter rear locally diffused solar cell, passivated emitter rear totally-diffused solar cell, crystalline reduced-cost aluminum fire-through solar cell, pCRAFT solar cell and nCRAFT solar cell.    ADVANTAGE - The method allows depositing a simple patterned metallic conductive regions in the back structure, and using a low cost interconnection layer to connect the patterned back contact regions together and as a light reflector on the back of the substrate such that the light collection of the solar cell devices may also be increased, thus reducing a per-Watt cost of solar cell device production. The method enables co-firing i.e. thermally processing metal-containing layers arranged both on a surface of a bifacial solar cell substrate to complete the metallization process in one step, thus eliminating manufacturing complexity, reducing cycle time, and increasing the power output from a formed bifacial solar cell device.    DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a bifacial solar cell device.    DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a solar cell substrate.    External reflector (190)    Substrate (202)    Back side passivation layer (220)    Rear contact structure (222)    Contact structure (226)