NOVELTY - An electroconductive copper paste containing copper powder, a copper salt of aliphatic monocarboxylic acid, fine copper powder, (dialkylamino)alkylamine, polymer binder and primary organic solvent, is provided on a resin base material. When the residual volume of primary organic solvent is 0.1-5 %mass, light is irradiated on the base material, to form an electroconductive film. The electroconductive copper paste does not contain thermosetting resin component or glass frit. The polymer binder has thermal decomposition temperature of 200-500 degrees C.    USE - Manufacture of electroconductive film used as light-receiving surface, wiring formation material and electrode formation material of solar cell.    ADVANTAGE - The method enables manufacture of electroconductive film having excellent electroconductive characteristics and adhesiveness with respect to glass and silicon wafer, with reduced generation of abrasion.    DETAILED DESCRIPTION - An electroconductive copper paste containing copper powder, a copper salt of aliphatic monocarboxylic acid, fine copper powder, (dialkylamino)alkylamine, polymer binder and primary organic solvent, is provided on a resin base material. When the residual volume of primary organic solvent is 0.1-5 %mass, light is irradiated on the base material, to form an electroconductive film. The electroconductive copper paste does not contain thermosetting resin component or glass frit. The polymer binder has thermal decomposition temperature of 200-500 degrees C. The primary organic solvent has an alcoholic hydroxyl group which is not inherent in any reactive functional groups other than hydroxyl group, is a liquid at room temperature, and has boiling point of 200-400 degrees C (excluding 400 degrees C). The electroconductive copper paste is obtained by dispersing copper powder and fine copper powder in a liquid mixture obtained by mixing a solution formed by dissolving the copper salt of aliphatic monocarboxylic acid in (dialkylamino)alkylamine and the primary organic solvent. The average particle diameter of the copper powder is 2-10 mu m. The average particle diameter of the fine copper powder is 0.2-1 mu m. The copper salt of the aliphatic monocarboxylic acid is a copper salt of aliphatic monocarboxylic acid derived from aliphatic monocarboxylic acid (R-COOH), and has boiling point of 230-400 degrees C (excluding 400 degrees C). (Dialkylamino)alkylamine is liquid at room temperature, and has boiling point of 230-300 degrees C (excluding 300 degrees C). The ratio of content of copper powder and fine copper powder is 80:20-60:40 parts mass. The ratio of total weight of copper powder and fine copper powder with respect to weight of the copper atom contained in the copper salt of aliphatic monocarboxylic acid, is 100:0.15-100:0.7 parts mass. The ratio of total weight of copper powder and fine copper powder with respect to weight of primary organic solvent, is 100:2-100:10 parts mass. The ratio of content of copper salt of aliphatic monocarboxylic acid and (dialkylamino)alkylamine per 1 molecule of copper salt of aliphatic monocarboxylic acid and (dialkylamino)alkylamine, is 2.2-8 molecules.