TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Process: The step of forming the openings in the insulating layer comprises drilling the insulating layer to form the openings in the insulating layer, where the openings being disposed over the corresponding release pads. The step of forming the openings in the insulating layer comprises: cutting the insulating layer to form many cut sections in the insulating layer, where the cut sections being disposed over corresponding release pads and being defined by a cut in the insulating layer; or removing the cut sections in the insulating layer from the insulating layer to provide the openings in the insulating layer in a pattern corresponding to the pattern in which the release pads were adhered to the electrically conductive metal circuit. The release pads are screen printed on the electrically conductive metal circuit. The release pads are formed by casting, extruding or laminating a polymer layer on the electrically conductive metal circuit, cutting the polymer layer to form the release pads in the polymer layer and polymer layer portions between and around the release pads, and removing the polymer layer portions between and around the release pads. The step of cutting the insulating layer to form the cut sections is done by die cutting, laser cutting, or calendering. In the step of filling the openings in insulating layer with electrically conductive material, the electrically conductive material comprises many electrically conductive solid objects that are inserted into corresponding openings in the insulating layer. In the step of filling the openings in insulating layer with electrically conductive material, the electrically conductive material is an electrically conductive adhesive in the form of a liquid, a melt or a powder. Preferred Components: The release pads are comprised of polymer. The insulating layer comprises a polymer insulating layer. The polymer insulating layer is extruded, laminated or cast on the electrically conductive metal circuit. The insulating layer comprises at least two layers. The layers comprise an interlayer dielectric (16) adhered to the electrically conductive metal circuit and an encapsulant layer adhered to the interlayer dielectric. The release pads are comprised of an electrically conductive material, and the peel strength between the release pads and the electrically conductive metal circuit is greater than the peel strength between the release pads and the insulating layer, such that the step of removing the cut sections of the insulating layer over the release pads leaves the release pads adhered to the electrically conductive metal circuit. The release pads are comprised of a polymeric release film, and the peel strength between the release pads and the electrically conductive metal circuit is less than the peel strength between the release pads and the insulating layer, such that the removing the cut sections of the insulating layer over the release pads also removes the release pads from the electrically conductive metal circuit. The electrically conductive adhesive is a polymer filled with conductive metal particles. The electrically conductive metal circuit comprises many electrically conductive circuits formed from an electrically conductive metal foil. EXAMPLE - No suitable example given.