NOVELTY - The back-contact type back plate comprises: a substrate having an inner surface exposed to an outer surface of a photovoltaic module and an upper side opposite to the outer surface of the photovoltaic module and facing an inside of the photovoltaic module; and a conductive material layer, which includes aluminum. The conductive material layer is connected to an electrode connection circuit and directly attached to the inner surface of the substrate. The conductive material layer comprises a metal protective formed on the upper surface of the substrate.    USE - The back-contact type back plate is useful for photovoltaic module (claimed).    DETAILED DESCRIPTION - The back-contact type back plate comprises: a substrate having an inner surface exposed to an outer surface of a photovoltaic module and an upper side opposite to the outer surface of the photovoltaic module and facing an inside of the photovoltaic module; and a conductive material layer, which includes aluminum. The conductive material layer is connected to an electrode connection circuit and directly attached to the inner surface of the substrate. The conductive material layer comprises a metal protective formed on the upper surface of the substrate. The metal protective film has a thickness of 12-200 nm, preferably 40-80 nm. The substrate includes a first insulating layer of a first polymer material, an intermediate layer of a vapor impermeable material, and a second insulating layer of a second polymeric material. The first insulating layer has an outer surface exposed to upper side of the photovoltaic module and an inner surface opposite the outer surface of photovoltaic module. The intermediate layer is coupled to the inner surface of the first insulating layer. The intermediate layer has a lower surface opposite to an upper surface of the first insulating layer. The second insulating layer is connected to the inner surface of the first insulating layer. The second insulating layer is coupled to an upper surface the intermediate layer. The back plate comprises a dielectric material layer. The dielectric material layer faces the lower surface of the substrate, and is deposited onto the inner surface of the substrate and the conductive material layer. The dielectric material layer has through holes. Each of the through-holes is adapted to expose predetermined portions of the conductive material layer.