NOVELTY - Encapsulation barrier stack comprises a film layer, where the film layer comprises at least one nanoparticle sealing layer arranged to be in contact with a surface of at least one substrate. The substrate is not a barrier layer. The nanoparticle sealing layer(s) comprise(s) many encapsulated nanoparticles, and the nanoparticles being reactive in that they are capable of interacting with moisture and/or oxygen to retard the permeation of moisture and/or oxygen.    USE - The encapsulation barrier stack is useful in: encapsulating moisture and/or oxygen sensitive article; food packaging material, where the food packaging is flexible polymer films, card boards, paper, metal foil, metal foil laminated paper, metal foil laminated plastic, plastic laminated paper or plastic laminated card board; and pharmaceutical packaging, medical packaging or encapsulation of electronic device, where the electronic device is organic LED, an LCD, a quantum dot device, an electronic e-ink based display, an electronic paper, a charged coupled device, a solar cell, a thin-film battery, an organic thin film transistor, an organic integrated circuit, an organic sensor, and a micro-electro-mechanical sensor (all claimed).    ADVANTAGE - The encapsulation barrier stack: exhibits a water vapor transmission rate of less than 10-3 g/m2/day or less than 10-4 g/m2/day (claimed); exhibits improved flexibility, gas barrier properties, weatherability; exhibits improved optical and mechanical properties; exhibits a high reliability; and is manufactured in a cost manner.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for:    (1) an electronic module comprising an electronic device that is sensitive to moisture and/or oxygen, where the electronic device is arranged within the encapsulation barrier stack;    (2) manufacturing the encapsulation barrier stack comprising providing the substrate, where the substrate is not a barrier layer, and forming a film layer that comprises the nanoparticle sealing layer(s), where forming the nanoparticle sealing layer(s) comprises (i) mixing a polymerizable compound or a crosslinkable compound with many nanoparticles, where the nanoparticles being reactive in that they are capable of interacting with moisture and/or oxygen, thus forming a sealing mixture, (ii) applying the sealing mixture onto the substrate and polymerizing the polymerizable compound or to crosslink the crosslinkable compound to form a polymer under conditions allowing the nanoparticles to be encapsulated by the formed polymer; and    (3) use of polymer or dendrimer encapsulated reactive nanoparticles for preparing the sealing layer of the encapsulation barrier stack, where the nanoparticles are reactive in that they are capable of interacting with moisture and/or oxygen to retard the permeation of moisture and/or oxygen through the defects present in the substrate.