NOVELTY - A packaging epoxy resin adhesive comprises bisphenol A epoxy resin, nitrile rubber, ethylene vinyl acetate carbon monoxide terpolymer, maleic anhydride grafted compatibilizer, titanate coupling agent, neopentyl glycol diglycidyl ether, dimethylformamide, propylene oxide, polydimethylsiloxane, and p-phenylenediamine as first component and polyether amine, phenolic resin, benzyl alcohol, 1,8-diazobycyclo(5.4.0)undec-7-ene (DBU), resorcinol, and 2,6-di-tert-butyl-4-methylphenol as second component.    USE - Packaging epoxy resin adhesive used for lead-acid battery (claimed).    ADVANTAGE - The adhesive has excellent adhesive performance and acid resistance.    DETAILED DESCRIPTION - A packaging epoxy resin adhesive comprises 60-70 pts. wt. bisphenol A epoxy resin, 10-15 pts. wt. nitrile rubber, 4-6 pts. wt. ethylene vinyl acetate carbon monoxide terpolymer, 0.5-1.5 pts. wt. maleic anhydride grafted compatibilizer, 4-6 pts. wt. titanate coupling agent, 1-1.5 pts. wt. neopentyl glycol diglycidyl ether, 0.3-1 pt. wt. dimethylformamide, 0.8-2 pts. wt. propylene oxide, 0.1-0.5 pt. wt. polydimethylsiloxane, and 0.4-0.6 pt. wt. p-phenylenediamine as first component and 30-35 pts. wt. polyether amine, 5-6 pts. wt. phenolic resin, 3-5 pts. wt. benzyl alcohol, 10-13 pts. wt. 1,8-diazobycyclo(5.4.0)undec-7-ene (DBU), 5-8 pts. wt. resorcinol, and 0.2-0.5 pt. wt. 2,6-di-tert-butyl-4-methylphenol as second component. An INDEPENDENT CLAIM is included for the preparation of packaging epoxy resin adhesive comprising heating bisphenol A epoxy resin, titanate coupling agent, neopentyl glycol diglycidyl ether, dimethylformamide, propylene oxide, polydimethyl siloxane, and p-phenylenediamine at 70-72 degrees C for 4-5 hours under nitrogen gas the protection, where pressure is 0.1 MPa; banburying ethylene vinyl acetate carbon monoxide terpolymer, nitrile rubber, and maleic anhydride grafted compatibilizer for 3-4 hours at 120-130 degrees C temperature; mixing prepared raw materials at 60 degrees C, stirring for 2-2.5 hours, filtering, and packing to obtain first component; and heating polyether amine, phenolic resin, and benzyl alcohol at 35-40 degrees C, stirring, insulating for 1 hour, cooling, adding DBU, resorcinol, and 2,6-di-tert-butyl-4-methylphenol, stirring for 0.5 hour, and filtering to obtain second component.