NOVELTY - An electrically conductive ink (I1) comprises at least one aromatic resin; electrically conductive silver particles having an average particle size of 1-40 mu m, and a tap density of 1.5-6.5 g/cm3; and at least one organic solvent.    USE - As dried product in bonded assembly; also for forming electrically conductive pathway on a substrate, which comprises aluminum; in the fabrication of electronic devices e.g. c-Si solar modules (claimed); also useful as screen-printed electronic circuitry in through hole connection, jumpers, printed board wiring and similar electronic applications to provide stable electrical interconnections.    ADVANTAGE - The electrically conductive ink exhibits good adhesion to various metallic substrates, such as aluminum or aluminum-containing substrates. After having been dried the electrically conductive ink can be soldered directly to further metallic substrates, where a stable and reliable electrical interconnection is formed which exhibits a good bonding strength.    DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:    (1) a dried product (P1) of (I1);    (2) a bonded assembly (A1) comprising electrically connected two substrates, where the first substrate exhibits at least one electrically conductive pathway on its surface, which are formed by (P1) and the electrically conductive pathways are attached to the second substrate by a soldering material forming an electrically conductive connection between the two substrate;    (3) a solar module comprising (A1);    (4) method of forming an electrically conductive pathway on a substrate involving applying (I1) to at least one part of a substrate and exposing the substrate to 70-300 degrees C;    (5) method of forming a bonded assembly involving applying (I1) to at least one part of a first metallic substrate, exposing it to 70-300 degrees C and soldering a second metallic substrate to the electrically conductive pathway to form an electrically conductive connection between the two substrates.