TECHNOLOGY FOCUS - ELECTRICAL POWER AND ENERGY - Preferred Components: The potting material comprises low thermal conductivity foam. The thermoelectric device further includes a hermetic sealing material surrounding the peripheral edges of the potting material, for hermetically sealing the device. The hermetic sealing material comprises glass frit, and the substrates comprise alumina. The paired N-type and P-type elements collectively comprise one of pre-metalized and non-metalized elements. The conductive traces comprise complementary patterns of screen-printed, fired metalizations formed on the substrates. The N-type elements comprise strontium titanate material incorporating doping material comprising at least one of niobium and lanthanum; and the P-type elements comprise nickel oxide material incorporating doping material comprising at least lithium. The N-type and P-type elements comprise at least one of graded and lamellar structures which create non-uniform concentrations of at least one of porosity, metalization, and chemical composition of the elements, to provide selected thermal expansion and bonding properties of the elements. The hermoelectric device further includes bonding material between the elements and the conductive traces, respectively. The N-type and P-type elements each respectively have dimensions in length, width, and height of 125 mu to 3 mm. The structures comprise: at least one of graded and lamellar metallic microstructures including at least one of added metalization on ends of the elements, bond assisting metallic components incorporated into the elements, internal tabs extending from an end surface of the elements, metallic particles proximate respective element ends, and stacked layers of gradually reduced metal particle concentration; at least one of graded and lamellar porosity microstructures of controlled locations and sizes of 1-40 mu in diameter in the elements; relatively heavily doped layers of ceramic material adjacent to surfaces of the elements; and planar constructions capturing the array of paired elements between the substrates. The conductive traces comprise: screen-printed, fired thick paste materials on at least one of the substrates; and complementary patterns of screen-printed, fired metalizations formed on the substrates. The thermoelectric generator module further includes: bonding material adjacent ends of the elements, respectively; and thick film composite terminations between the bonding material and the conductive traces, respectively. The thick film composite terminations comprise ceramic/glass/metal composite structures. The thermoelectric generator module further includes: potting material captured between the substrates in-between the array pairs; and hermetic sealing material surrounding the peripheral edges of the potting material, for hermetically sealing the module. The N-type and P-type elements comprise structures of preselected physical shape, to provide selected average resistance of the elements relative to temperature. The preselected physical shape comprises different cross-sectional areas or tapers of the elements relative to their intended temperature environment. The charging circuit further includes voltage regulation circuitry for regulating the converter higher output voltage. The charging circuit further includes: potting material captured between the substrates of the thermoelectric generator module in-between the array pairs; and hermetic sealing material surrounding the peripheral edges of the potting material, for hermetically sealing the module. Preferred Method: The method further includes hermetic sealing material surrounding the peripheral edges of the potting material, for hermetically sealing the device and using one of thick and thin film manufacturing techniques to selectively produce metalizations serving as electrical interconnections for the individual elements capable of performing with relatively higher temperatures. The individual elements comprise p-type and n-type semiconducting materials prepared using standard ceramic engineering processing using ceramic blanks (102) from which the individual elements are cut, with the ceramic blank formed from green body formation techniques. The green body formation techniques include the use of at least one of graded and lamellar microstructures within the N-type and P-type individual elements so as to selectively create non-uniform concentrations of at least one of porosity, metalization, and chemical composition of the elements, to provide selected thermal expansion and bonding properties of the elements, to facilitate creation of modules adapted for operating with high temperatures of 300-800 degrees C, and with temperature differentials of at least 100 degrees C. The method further includes providing an adhesion layer respectively between the individual elements and their electrical connections. The supporting substrates support selected arrangements of metalized portions on it, and the methodology further includes aligning and placing the individual N-type and P-type elements in respective alternating positions directly inline with their metalized portions on the headers. The paired N-type and P-type elements collectively comprise one of pre-metalized and non-metalized elements. The conductive traces comprise complementary patterns of screen-printed, fired metalizations formed on the substrates. The structures are selectively formed to comprise at least one of graded and lamellar metallic microstructures including at least one of added metalization on ends of the elements, bond assisting metallic components incorporated into the elements, internal tabs extending from an end surface of the elements, metallic particles proximate respective element ends, and stacked layers of gradually reduced metal particle concentration. The structures are selectively formed to comprise at least one of graded and lamellar porosity microstructures of controlled locations and sizes of 1-40 mu in diameter in the elements. The structures are selectively formed to comprise relatively heavily doped layers of ceramic material adjacent to surfaces of the elements. The conductive traces are formed by patterns of screen-printed, fired metalizations formed on the substrates. The method of manufacturing a thermoelectric generator module further includes providing bonding material between the elements and conductive traces, respectively; bonding material adjacent ends of the elements, respectively, and thick film composite terminations between the bonding material and conductive traces, respectively; and potting material captured between the substrates in-between the array pairs and hermetic sealing material surrounding the peripheral edges of the potting material, for hermetically sealing the module. The charging method further includes regulating the converter higher output voltage and providing potting material captured between the substrates of the thermoelectric generator module in-between the array pairs and hermetically sealing the module.