TECHNOLOGY FOCUS - INORGANIC CHEMISTRY - Preferred Components: The auxiliary layer exhibits an absorbed radiation power of 10-40%, preferably 20-30%. The auxiliary layer exhibits an absorbed radiation power of 50-150%, preferably 75-125% radiation power, which is absorbed in the functional coating. The auxiliary layer comprises at least one layer of graphite, silicon carbide and/or boron nitride, preferably with a layer thickness of 10 nm to 10 mu m. The auxiliary layer comprises an absorption layer, which is arranged on the glass substrate, and a protective layer, which is arranged on the absorption layer. The absorption layer comprises metal, preferably aluminum, molybdenum, copper, cobalt, nickel, titanium, tantalum, or a semi-metal compound, preferably silicon carbide, zinc oxide, cadmium sulfide, cadmium telluride, indium antimonide, indium arsenide, zinc antimonide. The protective layer comprises silicon nitride, titanium nitride, molybdenum nitride, aluminum oxide and/or aluminum nitride. The auxiliary layer comprises an adhesive layer, preferably silicon nitride and/or silicon oxynitride between the glass substrate and absorbing layer and the adhesive layer. The functional coating comprises precursor layers made of copper, indium, gallium, sulfur and/or selenium for conversion into a semiconductor layer of a thin film solar cell. The functional coating comprises at least one barrier layer, preferably a silicon nitride layer with a thickness of 50-300 nm, an electrode, preferably a molybdenum layer with a thickness of 200-700 nm, a first precursor layer, preferably a copper-indium-gallium-layer with a thickness of 300-1000 nm, and a second precursor layer, preferably a selenium layer with a thickness of 700-2000 nm.    TECHNOLOGY FOCUS - INSTRUMENTATION AND TESTING - Preferred Method: The auxiliary layer is applied on the glass substrate by evaporation, sputtering or electrochemical deposition, preferably vapor deposition, cathode sputtering, and/or chemical vapor deposition. The auxiliary layer is detachably connected to the glass substrate. The auxiliary layer is applied on a carrier plate, preferably a floor panel or a cover plate of a process box.