NOVELTY - A thermosetting silicone composition comprises phenylmethyl silicone (A) having two or more silicon atoms in one molecule, and hydroxyl group or alkoxy group is bonded with two or more silicon atoms in one molecule through phenylmethyl silicone bond, silane or siloxane compound (B) in which organic group having 3 or more hydroxyl group or alkoxy group in 1 molecule is bonded with silicon atom, and mixture of gallium compound and zirconium compound. The organic group bonded with silicon atom in silane or siloxane compound is methyl group.    USE - Thermosetting silicone composition is used for sealing light-emitting diode chip of light-emitting device. Uses include but are not limited to surface-protection coating of electro-optical display device, electronic light-emitting display device, organic solar cell apparatus and illuminating device, and raw material and adhesive agent for optical device e.g. lens, light-guide plate and light-diffusing plate.    ADVANTAGE - The thermosetting silicone composition has excellent storage stability. The cured material of thermosetting silicone composition has favorable hardenability, high gas-barrier property and reduced tackability.    DETAILED DESCRIPTION - A thermosetting silicone composition comprises phenylmethyl silicone (A) having two or more silicon atoms in one molecule and hydroxyl group or alkoxy group bonded with two or more silicon atoms in one molecule through phenylmethyl silicone bond, silane or siloxane compound (B) in which organic group has 3 or more hydroxyl group or alkoxy group in 1 molecule and is bonded with silicon atom, and mixture of gallium compound and zirconium compound. The organic group bonded with silicon atom in silane or siloxane compound is methyl group. The molar ratio of phenyl group and methyl group which are bonded with silicon atom in phenylmethyl silicone (A) is 2:8-4.5:5.5. INDEPENDENT CLAIMS are included for the following:    (1) liquid (L1), which contains phenylmethyl silicone (A) and silane or siloxane compound (B), and provides thermosetting silicone composition by mixing with liquid containing gallium compound and zirconium compound; and    (2) liquid (L2), which contains diphenyldimethyl silicone in which hydroxyl group is bonded with silicon atom at both terminals, and contains phenyl group and methyl group in molar ratio of 2:8-4.5:5.5, and is used as thermosetting silicone composition when mixed with liquid (L2).    DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of the light-emitting device manufacture using the thermosetting silicone composition.    Package (10)    Lead frame (11)    Reflector (12)    Light-emitting diode chip (20)    Bonding wire (30)