NOVELTY - A liquid resin composition comprises epoxy resin (A), thermosetting liquid resin (B), and microcapsule-type amine hardener (C). The microcapsule-type amine hardener (C) has structure including core comprising amine adduct (D), amine compound (E) and epoxy resin (F) covered by shell comprising synthetic resin and/or inorganic oxide provided in the surface of core. The content of amine compound (E) with respect to 100 parts mass of amine adducts (D) is 0.5-25 parts mass. The content of thermosetting resin (B) with respect to 100 parts mass of epoxy resin (A) is 1-200 parts mass.    USE - Liquid resin composition is used for adhesive agent, joining-paste, electroconductive material, anisotropically conductive material, insulating material, sealing material, coating material, coating composition, prepreg, thermally conductive material, separator material for fuel cell, and overcoat material for flexible wiring board (all claimed) for electrical and electronic component.    ADVANTAGE - The cured material formed using liquid resin composition has excellent storage stability, low-temperature rapid-hardening characteristics, excellent clearance gap permeability, adhesiveness and long-term reliability.    DETAILED DESCRIPTION - A liquid resin composition comprises an epoxy resin (A) chosen from bisphenol-type epoxy resin and naphthalene-type epoxy resin, a thermosetting liquid resin (B) having viscosity of 0.03-3 Pa.second at 25 degrees C, and a microcapsule-type amine hardener (C). The microcapsule-type amine hardener (C) has structure including core comprising amine adduct (D), amine compound (E) and epoxy resin (F) covered by shell comprising synthetic resin and/or inorganic oxide provided in the surface of core. The average particle diameter of core is more than 0.3 to 12 mu m or less. The content of amine compound (E) with respect to 100 parts mass of amine adducts (D) is 0.5-25 parts mass. The content of thermosetting resin (B) with respect to 100 parts mass of epoxy resin (A) is 1-200 parts mass.