NOVELTY - Manufacture of electrolytic copper foil involves preparing additive solution, taking copper sulfate electrolytic solution, heating, adding the additive solution, uniformly stirring, entering the obtained electrolytic solution into an electrolytic cell, carrying out electrochemical reaction process, coating resultant product with silane coupling agent with silicon content of 500 ppm, processing the coated product such that electrolytic copper foil surface formed on silane coupling agent layer, and obtaining electrolytic copper foil.    USE - Manufacture of electrolytic copper foil used for printed circuit board and lithium-ion second secondary battery.    DETAILED DESCRIPTION - Manufacture of electrolytic copper foil involves preparing additive solution containing poly disulfide propane sulfonate with concentration of 10-20 ppm, polyethylene glycol with concentration of 15 ppm, hydrochloric acid with concentration of 1-10 ppm, and 3-mercapto-1-propane sulfonate with concentration of 0-7 ppm, taking copper sulfate electrolytic solution with copper concentration of 50-100 g/L and sulfuric acid concentration of 70-140 g/L, heating the copper sulfate electrolytic solution to 45-60 degrees C, adding the additive solution, uniformly stirring, entering the obtained electrolytic solution into an electrolytic cell with a current density of 40-80 Angstrom /dm2, carrying out electrochemical reaction process, using chromate solution having concentration of 0.1-5 g/L and pH value of less than 6 for copper foil rear electrochemical reaction of surface passivation process, such that electrolytic copper foil surface layer formed on chromium film processing layer, coating resultant product with silane coupling agent with silicon content of 500 ppm, processing the coated product such that electrolytic copper foil surface formed on silane coupling agent layer, and obtaining electrolytic copper foil. The silane coupling agent is amino-based silane coupling agent and epoxy-type silane coupling agent in a ratio of 1:1-3:1.